Heat sink and laser
By adopting a three-dimensional design and coolant flow path in the laser's heat sink, the problem of more space occupancy in the existing laser is solved, achieving a smaller design and better heat dissipation efficiency.
Patent Information
- Application Number
- CN202421384645.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-18
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-06-18
AI Technical Summary
The existing lasers adopt a stepped heat sink structure, which makes it difficult to achieve a compact design in a limited space.
A three-dimensional heat sink is adopted, with multiple installation positions arranged in the circumferential side wall of the base, a heat sink is set at the installation position, and a coolant flow channel is set on the base, and the coolant flow channel is connected to the heat sink, realizing the circulating supply of coolant.
By utilizing the axial space, the occupancy of the radial space is reduced, making the laser smaller, and the design of the coolant flow channel improves the heat dissipation efficiency and has better cooling effect.
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Figure CN222735564U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lasers, in particular to a heat sink and a laser. Background Art
[0002] Semiconductor lasers have the advantages of small size, light weight, long life and wide wavelength coverage.
[0003] To increase the total output energy, existing lasers have multiple chips. Each chip often uses a stepped heat sink structure as a welding heat sink to achieve a stepped spatial arrangement of the chips, and a reflector is set at each step to deflect the beam of each laser chip.
[0004] The laser obtained by this setting method occupies more plane space. Utility Model Content
[0005] The purpose of the utility model is to provide a heat sink and a laser, so as to alleviate the technical problem that the existing laser occupies a large amount of plane space.
[0006] In a first aspect, the present invention provides a heat sink, comprising: a base, wherein a plurality of mounting locations distributed along the circumferential direction are provided on a circumferential side wall of the base, wherein the mounting locations are used to mount components; heat dissipation slots are provided at the mounting locations, and the components cover the heat dissipation slots;
[0007] The base is provided with a cooling liquid flow channel, which is communicated with each of the heat dissipation grooves respectively, and is used for circulating and supplying cooling liquid to each of the heat dissipation grooves in a unified manner.
[0008] Furthermore, the cooling liquid flow channel includes a main liquid inlet hole which is opened on the bottom surface of the base and extends toward one side of the top surface of the base;
[0009] The cooling liquid flow channel further includes a liquid inlet branch with one end opening communicating with the main liquid inlet hole and the other end opening communicating with the heat dissipation slot;
[0010] The cooling liquid flow channel further includes a liquid outlet branch with one end opening communicating with the heat dissipation groove and the other end opening communicating with the bottom surface of the base.
[0011] Furthermore, the liquid outlet branch is formed by connecting a first section extending in the radial direction and a second section extending in the axial direction, the first section is connected to the heat dissipation groove, and the second section is connected to the bottom surface of the base.
[0012] Furthermore, the liquid outlets of the liquid outlet branches are arranged on the same circle.
[0013] Furthermore, the base is provided with at least two installation parts distributed along the axial direction, and each installation part is provided with a plurality of installation positions distributed along the circumferential direction.
[0014] Furthermore, the installation positions on the installation parts are staggered in the circumferential direction so that the liquid outlets of all the liquid outlet branches are arranged on the same circle.
[0015] Furthermore, in the axial direction, the liquid inlet of the heat dissipation groove is far away from the bottom surface of the base, and the liquid outlet of the heat dissipation groove is close to the bottom surface of the base.
[0016] Furthermore, the diameter of the total liquid inlet hole is larger than the diameter of the liquid outlet branch.
[0017] Furthermore, the heat dissipation groove is annular.
[0018] In a second aspect, the present invention provides a laser comprising the above-mentioned heat sink.
[0019] The present invention has at least the following advantages or beneficial effects:
[0020] The heat sink provided by the present invention includes: a base, a plurality of mounting positions distributed along the circumferential direction are provided on the circumferential side wall of the base, and the mounting positions are used to install components; a heat sink is provided at the mounting position, and the components cover the heat sink; a coolant flow channel is provided on the base, and the coolant flow channel is respectively connected to each of the heat sinks for uniformly circulating the coolant to each of the heat sinks.
[0021] This solution differs from a flat-surface design by employing a three-dimensional base with components arranged on its circumferential sidewalls. This utilizes axial space and reduces radial space occupancy, making the laser more compact. Furthermore, coolant channels are provided on the base to circulate coolant through the various heat sinks. After flowing through the heat sinks, the coolant exchanges heat with the components, directly dissipating heat from the components for a more effective cooling effect.
[0022] The laser provided by the present invention includes the above-mentioned heat sink. Since the laser provided by the present invention uses the above-mentioned heat sink, the laser provided by the present invention also has the advantages of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0024] Figure 1 A schematic diagram of a heat sink provided in Example 1 of the present utility model;
[0025] Figure 2 This is a front view of the heat sink provided in Example 1 of the present utility model;
[0026] Figure 3 This is a bottom view of the heat sink provided in Example 1 of the present utility model;
[0027] Figure 4 for Figure 3 Cross-sectional view along the A-A direction;
[0028] Figure 5 A schematic diagram of a heat sink provided in Example 2 of the present utility model;
[0029] Figure 6 This is a bottom view of the heat sink provided in Example 2 of the present utility model;
[0030] Figure 7 for Figure 6 Cross-sectional view along the B-B direction;
[0031] Figure 8 for Figure 6 Cross-sectional view along the C-C direction.
[0032] Icons: 1-installation location; 11-heat sink;
[0033] 2 - main liquid inlet; 3 - liquid inlet branch; 4 - liquid outlet branch; 41 - first section; 42 - second section; 43 - liquid outlet;
[0034] 5-Installation part. DETAILED DESCRIPTION
[0035] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.
[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.
[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.
[0038] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0039] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.
[0040] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0041] Example 1
[0042] The heat sink provided by the utility model can be used in, but is not limited to, handheld welding.
[0043] like Figure 1 - Figure 4 As shown, the heat sink includes a base. The main body of the base can be cylindrical or prismatic.
[0044] The circumferential sidewalls of the base are provided with a plurality of mounting locations 1 distributed circumferentially. Adjacent mounting locations 1 may be connected or spaced apart. In this embodiment, there are 16 mounting locations 1 at the same axial position, which are connected end to end and distributed circumferentially around the base. In other feasible solutions, the number of mounting locations 1 at the same axial position may also be 6, 7, or 8, etc.
[0045] The mounting positions 1 are used to mount components, with each mounting position 1 corresponding to one component. In this embodiment, the number of components mounted is 16. The components include a heat sink and a chip. The heat sink is connected to the mounting position 1, and the chip is connected to the heat sink.
[0046] A heat dissipation groove 11 is provided at the installation position 1. The shape of the heat dissipation groove 11 can be S-shaped or ring-shaped, etc. The device covers the heat dissipation groove 11. The heat dissipation groove 11 and the device form a flow channel. The coolant flows through the flow channel to dissipate heat from the device.
[0047] The base is provided with a cooling liquid flow channel, which is connected to each of the heat dissipation slots 11 respectively, and is used to uniformly circulate the cooling liquid to each of the heat dissipation slots 11, so that each heat dissipation slot 11 can realize the injection and discharge of the cooling liquid to achieve a circulating flow.
[0048] This solution is different from the planar arrangement solution. If 16 devices are arranged on the same plane, a larger plane area will be required. In this solution, a three-dimensional base is used, and the devices are arranged on its circumferential side walls, thereby utilizing the axial space and reducing the occupancy rate of the radial space, so that the laser can be made more compact. At the same time, a coolant flow channel is set on the base, and the coolant flow channel circulates coolant to each heat dissipation slot 11. After the coolant flows through the heat dissipation slot 11, the coolant exchanges heat with the device and directly dissipates heat from the device, resulting in a better cooling effect.
[0049] The coolant flow channel includes a total liquid inlet hole 2 with an opening arranged on the bottom surface of the base and extending toward one side of the top surface of the base; the coolant flow channel also includes a liquid inlet branch 3 with one end opening connected to the total liquid inlet hole 2 and the other end opening connected to the heat dissipation groove 11; the coolant flow channel also includes a liquid outlet branch 4 with one end opening connected to the heat dissipation groove 11 and the other end opening connected to the bottom surface of the base.
[0050] like Figure 4 As shown, the coolant is injected into the main liquid inlet hole 2 from the bottom surface, and then divided into each liquid inlet branch 3. The coolant in the liquid inlet branch 3 flows into the heat dissipation groove 11. After the coolant flows through the heat dissipation groove 11, it exchanges heat with the device and flows into the liquid outlet branch 4, and then is discharged from the base.
[0051] The liquid outlet branch 4 is formed by a first section 41 extending radially and a second section 42 extending axially, which form a 90° angle. The first section 41 is connected to the heat dissipation groove 11, and the second section 42 is connected to the bottom surface of the base. The first section 41 and the second section 42 can be formed by straight drilling, which is convenient for molding.
[0052] like Figure 3As shown, the liquid outlets 43 of each of the liquid outlet branches 4 are arranged on the same circle, thereby facilitating unified collection and drainage of the liquid outlets 43 on the same circle. For example, the laser includes an end cap connected to a heat sink, the end cap being connected to the bottom surface of the heat sink, a first opening and a second opening being provided on a surface of the end cap facing away from the heat sink, and a first flow channel inside the end cap connecting the first opening to the main liquid inlet 2, and a second flow channel connecting the second opening to each of the liquid outlets 43. The cross-section of the second flow channel can be annular.
[0053] In the axial direction, the liquid inlet of the heat dissipation groove 11 is far away from the bottom surface of the base, and the liquid outlet 43 of the heat dissipation groove 11 is close to the bottom surface of the base. Such a design can reduce the length of the liquid outlet branch 4 as much as possible, thereby reducing the heat release of the coolant that has undergone heat exchange and affecting the newly injected coolant.
[0054] The diameter of the main liquid inlet hole 2 is larger than the diameter of the liquid outlet branch 4, thereby ensuring the supply of coolant and making each liquid inlet main path full of coolant.
[0055] Example 2
[0056] like Figure 5 - Figure 8 As shown, the base is provided with at least two mounting portions 5 distributed along the axial direction, and each mounting portion 5 is provided with a plurality of mounting positions 1 distributed along the circumferential direction.
[0057] Unlike the single-layer arrangement in Example 1, the heat sink in this embodiment can adopt a double-layer design. That is, the mounting locations 1 are arranged in two layers. Each layer of mounting portion 5 can accommodate eight mounting locations 1, so the total number of mounted components remains at 16. However, since the number of mounting locations 1 along the same circumference is reduced, the area of each mounting location 1 can be increased to accommodate components of different sizes.
[0058] Furthermore, the installation positions 1 on each of the installation parts 5 are staggered in the circumferential direction, that is, any installation position 1 is not aligned with another installation position 1 in the circumferential direction, so that the liquid outlets 43 of all the liquid outlet branches 4 are arranged on the same circle, thereby facilitating the arrangement of the second flow channel on the end cover and achieving unified drainage.
[0059] The laser provided by the present invention includes the above-mentioned heat sink. Since the laser provided by the present invention uses the above-mentioned heat sink, the laser provided by the present invention also has the advantages of the heat sink.
[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A heat sink, characterized in that: include: A base, wherein a plurality of mounting positions (1) distributed along the circumferential direction are arranged on a circumferential side wall of the base, and the mounting positions (1) are used to mount a device; a heat dissipation groove (11) is arranged at the mounting position (1), and the device covers the heat dissipation groove (11); The base is provided with a cooling liquid flow channel, and the cooling liquid flow channel is respectively connected to each of the heat dissipation grooves (11) and is used for uniformly circulating and supplying cooling liquid to each of the heat dissipation grooves (11).
2. The heat sink according to claim 1, characterized in that: The cooling liquid flow channel comprises a total liquid inlet hole (2) which is opened on the bottom surface of the base and extends toward one side of the top surface of the base; The cooling liquid flow channel also includes a liquid inlet branch (3) having one end opening connected to the main liquid inlet hole (2) and the other end opening connected to the heat dissipation groove (11); The cooling liquid flow channel also includes a liquid outlet branch (4) with one end opening communicating with the heat dissipation groove (11) and the other end opening communicating with the bottom surface of the base.
3. The heat sink according to claim 2, characterized in that: The liquid outlet branch (4) is formed by connecting a first section (41) extending radially and a second section (42) extending axially, wherein the first section (41) is connected to the heat dissipation groove (11), and the second section (42) is connected to the bottom surface of the base.
4. The heat sink according to claim 2, characterized in that: The liquid outlets (43) of the liquid outlet branches (4) are arranged on the same circle.
5. The heat sink according to claim 2, characterized in that: The base is provided with at least two installation parts (5) distributed along the axial direction, and each installation part (5) is provided with a plurality of installation positions (1) distributed along the circumferential direction.
6. The heat sink according to claim 5, characterized in that: The installation positions (1) on each of the installation parts (5) are staggered in the circumferential direction so that the liquid outlets (43) of all the liquid outlet branches (4) are arranged on the same circle.
7. The heat sink according to claim 2, characterized in that: In the axial direction, the liquid inlet of the heat dissipation groove (11) is far away from the bottom surface of the base, and the liquid outlet (43) of the heat dissipation groove (11) is close to the bottom surface of the base.
8. The heat sink according to claim 2, characterized in that: The diameter of the total liquid inlet hole (2) is greater than the diameter of the liquid outlet branch (4).
9. The heat sink according to claim 1, characterized in that: The heat dissipation groove (11) is annular.
10. A laser, characterized in that: The heat sink comprises the heat sink described in any one of claims 1 to 9.