A wave-transmitting heating film and electronic equipment

Abstract

The embodiment of the present application relates to a wave-transmitting heating film, which includes a transparent base film layer, a metal grid layer and a first blackened layer. The metal grid layer includes a first electrode, a second electrode and a circuit area, the circuit area is connected between the first electrode and the second electrode, and conductive metal threads are distributed in the circuit area. The metal grid layer is a transparent micron-level film layer that is invisible to the naked eye and can transmit electromagnetic waves of a specific frequency. The first electrode and the second electrode can be energized by a power source, and the current enters the circuit area through the first electrode and the second electrode, and the current can generate heat through the conductive metal threads. The heat can melt the ice and snow attached to the surface of the film and reduce the impact of the cold environment on the film. The first blackened layer is located on the surface of the metal grid layer that is away from the transparent base film layer. The first blackened layer can reduce light reflection and improve the overall transparency and wave permeability of the film.

Description

Technical Field

[0001] The present application relates to the field of film technology, and in particular to a wave-transmitting heating film and an electronic device. Background Art

[0002] Wave-transmitting membrane technology has been widely used in transportation, military purposes, scientific research and other fields. For example, the surface of an aircraft often has stealth requirements. When the radar emits rays to detect the aircraft, the wave-transmitting material used in the aircraft can allow the radar rays to penetrate the aircraft itself, and the radar cannot detect the existence of the aircraft. However, the application environment of traditional films is limited, especially in cold environments where ice and snow adhere to the surface of the film, affecting the normal use of the film. Utility Model Content

[0003] The present application aims to provide a wave-transmitting heating film, aiming to solve the problem that traditional films are easily frozen.

[0004] In a first aspect, an embodiment of the present application provides a wave-transmitting heating film, comprising a transparent base film layer, a metal grid layer and a first blackened layer, wherein the metal grid layer is arranged on the surface of the transparent base film layer, and the first blackened layer is located on the surface of the metal grid layer away from the transparent base film layer; the metal grid layer comprises a first electrode, a second electrode and a circuit area, and the circuit area is connected between the first electrode and the second electrode.

[0005] In some embodiments, the wave-transmitting heating film further includes a second blackened layer, and the second blackened layer is located on a surface of the metal grid layer facing away from the first blackened layer.

[0006] In some embodiments, the wave-transmitting heating film further includes a protective film layer, and the protective film layer is located on a surface of the first blackened layer facing away from the metal mesh layer.

[0007] In some embodiments, the wave-transmitting heating film further includes a release film layer, and the release film layer is located on a surface of the transparent base film layer that is away from the metal mesh layer.

[0008] In some embodiments, the transparent base film layer includes a PET transparent base film layer and / or a COP transparent base film layer.

[0009] In some embodiments, the protective film layer includes a PE protective film layer.

[0010] In some embodiments, the metal mesh layer includes a copper mesh layer.

[0011] In some embodiments, the release film layer includes a PET release film layer.

[0012] In some embodiments, the surface of the metal mesh layer facing the transparent base film layer has a first protrusion, the surface of the transparent base film layer facing the metal mesh layer has a first recessed portion, and the first protrusion is arranged in the first recessed portion; and / or, the surface of the transparent base film layer facing the metal mesh layer has a second protrusion, the surface of the metal mesh layer facing the transparent base film layer has a second recessed portion, and the second protrusion is arranged in the second recessed portion.

[0013] In a second aspect, an embodiment of the present application further provides an electronic device, comprising the wave-transmitting heating film as described in any one of the first aspects.

[0014] Different from the prior art, the embodiment of the present application provides a wave-transmitting heating film, which includes a transparent base film layer, a metal grid layer and a first blackened layer. The metal grid layer includes a first electrode, a second electrode and a circuit area, the circuit area is connected between the first electrode and the second electrode, and conductive metal threads are distributed in the circuit area. The metal grid layer is a transparent micron-level film layer that is invisible to the naked eye and can transmit electromagnetic waves of a specific frequency. The first electrode and the second electrode can be energized by a power source, and the current enters the circuit area through the first electrode and the second electrode, and the current can generate heat through the conductive metal threads. The heat can melt the ice and snow attached to the surface of the film and reduce the impact of the cold environment on the film. The first blackened layer is located on the surface of the metal grid layer away from the transparent base film layer. The first blackened layer can reduce light reflection and improve the overall transparency and wave permeability of the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of some wave-transmitting heating films provided in the embodiments of the present application;

[0016] Figure 2 It is a schematic diagram of the structure of some metal mesh layers provided in the embodiments of the present application;

[0017] Figure 3 It is a schematic diagram of the structure of some wave-transmitting heating films provided in the embodiments of the present application;

[0018] Figure 4 It is a schematic diagram of the structure of some wave-transmitting heating films provided in the embodiments of the present application;

[0019] Figure 5 It is a schematic diagram of the structure of some first protrusions and first recessed portions provided in the embodiments of the present application.

[0020] Description of reference numerals:

[0021] 100. Wave-transmitting heating film;

[0022] 10. transparent base film layer; 11. first recessed portion;

[0023] 20. Metal mesh layer; 21. First electrode; 22. Second electrode; 23. Circuit area; 24. First protrusion;

[0024] 30. The first black layer;

[0025] 40. The second black layer;

[0026] 50. Protective film layer;

[0027] 60. Release film layer. DETAILED DESCRIPTION

[0028] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0029] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "several" is more than one, unless otherwise clearly and specifically defined.

[0030] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0031] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. In addition, the technical features involved in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.

[0032] In the first aspect, the present application embodiment provides a wave-transmitting heating film 100, please refer to Figure 1 The wave-transmitting heating film 100 comprises a transparent base film layer 10, a metal mesh layer 20 and a first black layer 30. The metal mesh layer 20 is disposed between the transparent base film layer 10 and the first black layer 30.

[0033] For the transparent base film layer 10, please refer to Figure 1The transparent base film layer 10 is a wave-transmissive transparent base film layer 10, and the transparent base film layer 10 is located at the bottom of the wave-transmissive heating film 100, and can provide physical support for the upper structure to enhance the overall stability of the wave-transmissive heating film 100. Specifically, the thickness of the transparent base film layer 10 is 20 μm to 80 μm. For example, the thickness of the transparent base film layer 10 can be 30 μm, 50 μm, or 70 μm.

[0034] In some embodiments, the transparent base film layer 10 includes a PET transparent base film layer 10 and / or a COP transparent base film layer 10 .

[0035] PET stands for polyethylene terephthalate, which is a common polymer material. PET has good mechanical properties, good toughness and folding resistance, and its impact strength is 3 to 5 times that of other film materials. PET also has excellent high and low temperature resistance. It can be used for a long time in the temperature range of 120°C, and can withstand high temperatures of 150°C for short-term use, and low temperatures of -70°C. High and low temperatures have little effect on its mechanical properties. PET has low gas and water vapor permeability, and has excellent gas, water, oil and odor resistance. PET has high transparency, can block ultraviolet rays, and has good gloss. The dielectric constant of PET is about 3.0, and it has good wave transmission performance.

[0036] COP (Cyclo Olefin Polymer) is a high-performance polymer material. COP has the characteristics of high transparency, low water absorption, high heat resistance and high toughness. COP has good dimensional stability, strong wear resistance and chemical resistance. COP has a low density, which helps to make the product lighter, has a low saturated water absorption rate, and has good mechanical and dielectric properties. COP is almost impermeable to water vapor and has good chemical resistance, acid and alkali resistance, and low temperature resistance. It can be widely used in optical devices, medical equipment, electronic products and other fields. The dielectric constant of COP is about 2.3, and it has good wave transmission performance.

[0037] For the metal mesh layer 20, please refer to Figure 1 , the metal mesh layer 20 is arranged on the surface of the transparent base film layer 10. For example, the metal mesh layer 20 can be arranged on the surface of the transparent base film layer 10 by lamination. The metal mesh is a mesh with regular shape formed by densely spreading the threads of conductive metals and their oxides on the transparent base film layer 10. The width of the threads of the conductive metals and their oxides is generally between 2μm and 5μm, and the metal mesh layer is a transparent micron-level film layer that is invisible to the naked eye. Since the threads of the conductive metals and their oxides are very fine, and the pores between the threads are relatively large, the micron-level metal mesh layer is transparent to electromagnetic waves of a specific frequency. The metal mesh layer can be made of metal materials such as copper, aluminum, and silver.

[0038] Further, please combine Figure 2 The metal mesh layer 20 includes a first electrode 21, a second electrode 22 and a circuit area 23. The circuit area 23 is connected between the first electrode 21 and the second electrode 22. The circuit area 23 is distributed with wires of conductive metal and its oxide. The first electrode 21 and the second electrode 22 can be powered by a power source, and the current enters the circuit area 23 through the first electrode 21 and the second electrode 22. The current can generate heat through the metal wires. The heat can melt the ice and snow attached to the surface of the film and reduce the impact of the cold environment on the film. Optionally, the metal mesh layer 20 includes a copper mesh layer.

[0039] The first electrode 21 , the second electrode 22 and the circuit region 23 in the metal grid layer 20 can be obtained through conventional preparation processes of exposure, development and etching.

[0040] For the first black layer 30, please refer to Figure 1 The first black layer 30 is located on the surface of the metal mesh layer 20 away from the transparent base film layer 10. The first black layer 30 can be an oxide layer formed after the surface of the conductive metal is oxidized. For example, the conductive metal is copper, and the first black layer 30 is a copper oxide layer formed by oxidation of copper on the surface after oxygen is introduced. The first black layer 30 can reduce light reflection and improve the transparency and optical properties of the film as a whole.

[0041] In some embodiments, copper foil is selected as the preparation material of the metal mesh layer 20, oxygen is passed into the copper foil to oxidize the surface of the copper foil, so that a copper oxide layer is formed on the surface of the copper foil, and the copper oxide layer is the first black layer 30, and the oxidized copper foil is pressed on the surface of the transparent base film layer 10. The copper foil is subjected to conventional exposure, development and etching processes to obtain the circuit area 23 and the first electrode 21 and the second electrode 22 on both sides of the circuit area 23. Among them, the first electrode 21 and the second electrode 22 are both copper electrodes. The wave transmission simulation results show that the metal mesh layer 20 can transmit waves of a specific frequency.

[0042] The embodiment of the present application provides a wave-transmitting heating film 100, which includes a transparent base film layer 10, a metal grid layer 20 and a first black layer 30. The metal grid layer 20 includes a first electrode 21, a second electrode 22 and a circuit area 23, the circuit area 23 is connected between the first electrode 21 and the second electrode 22, and the circuit area 23 is distributed with conductive metal and its oxide threads. The metal grid layer 20 is a transparent micron-level film layer that is invisible to the naked eye and can transmit electromagnetic waves of a specific frequency. The first electrode 21 and the second electrode 22 can be energized with a power supply, and the current enters the circuit area 23 through the first electrode 21 and the second electrode 22, and the current can generate heat through the conductive metal and its oxide threads. The heat can melt the ice and snow attached to the surface of the film and reduce the impact of the cold environment on the film. The first black layer 30 is located on the surface of the metal grid layer 20 away from the transparent base film layer 10, and the first black layer 30 can reduce light reflection and improve the transparency and wave permeability of the film as a whole.

[0043] In some embodiments, please refer to Figure 3 The wave-transmitting heating film 100 also includes a second black layer 40, which is located on the surface of the metal mesh layer 20 away from the first black layer 30. Similar to the function of the first black layer 30, the second black layer 40 is also an oxide layer formed after the conductive metal surface is oxidized. It is arranged opposite to the first black layer 30 on the copper mesh layer. The second black layer 40 can also reduce light reflection and improve the overall transparency and optical properties of the film.

[0044] In some embodiments, please refer to Figure 4 The wave-transmitting heating film 100 also includes a protective film layer 50, which is located on the surface of the first blackened layer 30 away from the metal mesh layer 20. The protective film layer 50 is a transparent protective film layer 50 that can transmit waves. The protective film layer 50 is located on the outermost side of the wave-transmitting heating film 100, which can protect the metal mesh layer 20 and reduce the wear and scratches of the internal circuits of the metal mesh layer 20. The protective film can also reduce the entry of dirt and dust into the interior of the wave-transmitting heating film 100. The thickness of the protective film layer 50 is 20μm to 80μm. For example, the thickness of the protective film layer 50 can be 30μm, 50μm or 70μm.

[0045] Furthermore, the protective film layer 50 includes a PE protective film layer 50. PE is polyethylene, which is a thermoplastic resin obtained by polymerization of ethylene monomers. PE is odorless, non-toxic, and has excellent low temperature resistance (the lowest operating temperature can reach -100°C to -70°C). It has good chemical stability, because the polymer molecules are connected by carbon-carbon single bonds, and can withstand corrosion from most acids and alkalis. It is insoluble in general solvents at room temperature, has low water absorption, and has excellent electrical insulation. The dielectric constant of PE is about 2.2, and it has good wave transmission performance.

[0046] In some embodiments, the wave-transmitting heating film 100 further includes a release film layer 60, which is located on the surface of the transparent base film layer 10 away from the metal grid layer 20. The release film layer 60 can be peeled and bonded to the transparent base film layer 10. The release film layer 60 can reduce the influence of dust particles and impurities on the optical properties of the film. When in use, the release film can be torn off, and the remaining part can be directly bonded to the surface of the device to be used. For example, the release film layer 60 includes a PET release film layer 60.

[0047] In some embodiments, the release film layer 60 may also be located on the surface of the transparent base film layer 10 facing away from the second blackening layer 40 .

[0048] In some embodiments, please refer to Figure 4 and Figure 5 , the surface of the metal mesh layer 20 facing the transparent base film layer 10 has a first protrusion 24, the surface of the transparent base film layer 10 facing the metal mesh layer 20 has a first depression 11, and the first protrusion 24 is arranged in the first depression 11. By providing the first protrusion 24 and the first depression 11, the adhesion between the metal mesh layer 20 and the transparent base film layer 10 can be enhanced, so that the connection between the metal mesh layer 20 and the transparent base film layer 10 is more stable. And / or, the surface of the transparent base film layer 10 facing the metal mesh layer 20 has a second protrusion, the surface of the metal mesh layer 20 facing the transparent base film layer 10 has a second depression, and the second protrusion is arranged in the second depression. By providing the second protrusion and the second depression, the adhesion between the metal mesh layer 20 and the transparent base film layer 10 can be further enhanced, so that the connection between the metal mesh layer 20 and the transparent base film layer 10 is more stable.

[0049] In a second aspect, an embodiment of the present application further provides an electronic device, which includes a wave-transmitting heating film 100 as described in any one of the first aspects.

[0050] The following provides a method for preparing a wave-transmitting heating film, and tests the wave-transmitting performance, optical performance, and heating performance of the prepared wave-transmitting heating film.

[0051] Example 1

[0052] (1) A transparent base film layer with a thickness of 50 μm is prepared using COP, and a circuit diagram for wave transmission at a specific frequency is obtained in combination with the wave transmission simulation results. Copper foil is selected as the material for making the metal grid layer, and oxygen is passed into the copper foil to oxidize one side of the copper foil to obtain a first blackened layer set on the surface of the copper foil. The oxidized copper foil is pressed onto the surface of the COP transparent base film layer, and the oxidized copper foil is exposed, developed and etched to obtain a metal grid layer having a first electrode, a second electrode and a circuit area. To form a wave-transmitting heating film A.

[0053] (2) The wave transmission performance, optical performance and heating performance of the wave transmission heating film A were tested. The test results are shown in Table 1.

[0054] Example 2

[0055] (1) COP is used to prepare a transparent base film layer with a thickness of 50 μm, and the circuit diagram of wave transmission at a specific frequency is obtained in combination with the wave transmission simulation results. Copper foil is selected as the material for making the metal grid layer, and oxygen is passed into the copper foil to oxidize both sides of the copper foil to obtain a first black layer and a second black layer set on the surface of the copper foil. The oxidized copper foil is pressed on the surface of the COP transparent base film layer, and the oxidized copper foil is exposed, developed and etched to obtain a metal grid layer with a first electrode, a second electrode and a circuit area. To form a wave-transmitting heating film B.

[0056] (2) The wave transmission performance, optical performance and heating performance of the wave transmission heating film B were tested. The test results are shown in Table 1.

[0057] Example 3

[0058] (1) A transparent base film layer with a thickness of 50 μm was prepared using PET, and a circuit diagram for wave transmission at a specific frequency was obtained in combination with the wave transmission simulation results. Copper foil was selected as the material for making the metal grid layer, and oxygen was passed into the copper foil to oxidize both sides of the copper foil to obtain a first black layer and a second black layer disposed on the surface of the copper foil. The oxidized copper foil was pressed onto the surface of the PET transparent base film layer, and the oxidized copper foil was subjected to exposure, development and etching processes to obtain a metal grid layer having a first electrode, a second electrode and a circuit area.

[0059] (2) A PE protective film with a thickness of 50 μm is prepared by using PE, and the PE protective film is attached to the surface of the first blackened layer away from the metal grid layer to form a PE protective film layer. In this way, a wave-transmitting heating film C is formed.

[0060] (3) The wave transmission performance, optical performance and heating performance of the wave transmission heating film C were tested. The test results are shown in Table 1.

[0061] Wave transmittance testing method: The wave transmittance of wave-transmitting heating films A to C is tested by transmission spectroscopy.

[0062] Test method for light transmittance: The light transmittance of the wave-transmitting heating films A to C is tested by the transmission method.

[0063] Haze testing method: haze testing was performed on the wave-transmitting heating films A to C using a haze meter method.

[0064] The test method for heating performance is to energize wave-transmitting heating films A to C, and measure the temperature of the film surface after 20 seconds.

[0065] Table 1: Results of the wave transmission performance, optical performance and heating performance of the wave transmission heating film.

[0066] Example Wave transmittance Light transmittance Haze Surface temperature Example 1 95％ 83％ 1.2％ 70℃ Example 2 96％ 88％ 1.7％ 75℃ Example 3 95％ 85％ 1.8％ 73℃

[0067] According to Table 1, the wave transmittance of the wave-transmitting heating film prepared in the embodiment of the present application is above 95%, the light transmittance is above 80%, and the haze is less than 2%, indicating that the film prepared in the present application has good wave transmittance and light transmittance. And 20s after the film prepared in the present application is powered on, the surface temperature of the film can reach above 70°C, which can effectively remove the frozen material on the surface of the film. It should be noted that the preferred embodiments of the present invention are given in the specification and drawings of the present utility model, but the present utility model can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not intended to be additional restrictions on the content of the present utility model. The purpose of providing these embodiments is to make the understanding of the disclosure of the present utility model more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the present utility model specification; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the present utility model.

Claims

1. A wave-transmitting heating film, characterized in that: include: A transparent base film layer, a metal grid layer and a first black layer, wherein the metal grid layer is disposed on a surface of the transparent base film layer, and the first black layer is located on a surface of the metal grid layer away from the transparent base film layer; The metal grid layer includes a first electrode, a second electrode and a circuit area, and the circuit area is connected between the first electrode and the second electrode.

2. The wave-transmitting heating film according to claim 1, characterized in that: The wave-transmitting heating film further includes a second blackened layer, and the second blackened layer is located on a surface of the metal mesh layer away from the first blackened layer.

3. The wave-transmitting heating film according to claim 1, characterized in that: The wave-transmitting heating film further comprises a protective film layer, and the protective film layer is located on a surface of the first blackened layer away from the metal mesh layer.

4. The wave-transmitting heating film according to claim 1, characterized in that: The wave-transmitting heating film further comprises a release film layer, and the release film layer is located on a surface of the transparent base film layer away from the metal mesh layer.

5. The wave-transmitting heating film according to claim 1, characterized in that: The transparent base film layer includes a PET transparent base film layer and / or a COP transparent base film layer.

6. The wave-transmitting heating film according to claim 3, characterized in that: The protective film layer includes a PE protective film layer.

7. The wave-transmitting heating film according to claim 1, characterized in that: The metal mesh layer includes a copper mesh layer.

8. The wave-transmitting heating film according to claim 4, characterized in that: The release film layer comprises a PET release film layer.

9. The wave-transmitting heating film according to claim 1, characterized in that: The surface of the metal mesh layer facing the transparent base film layer has a first protrusion, and the surface of the transparent base film layer facing the metal mesh layer has a first concave portion, and the first protrusion is arranged in the first concave portion; And / or, the surface of the transparent base film layer facing the metal mesh layer has a second protrusion, the surface of the metal mesh layer facing the transparent base film layer has a second depression, and the second protrusion is arranged in the second depression.

10. An electronic device, characterized in that: The electronic device comprises the wave-transmitting heating film as claimed in any one of claims 1 to 9.

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