PCB board and semiconductor device having the PCB board

Abstract

The embodiment of the utility model proposes a PCB board and a semiconductor device having the PCB board. The PCB board includes a board body, a heat dissipation substrate layer and a heat dissipation plate. The board body is connected to the heat dissipation substrate layer, and a portion of the heat dissipation substrate layer extends out of the board body. The heat dissipation plate is arranged beside the board body, and the heat dissipation plate is connected to the area where the heat dissipation substrate layer extends out of the board body. The PCB board of the embodiment of the utility model, by extending a portion of the heat dissipation substrate layer out of the board body, improves the heat dissipation surface of the heat dissipation substrate, thereby helping to improve the heat dissipation effect of the entire PCB board. In addition, the PCB board further increases the heat dissipation area by additionally providing the heat dissipation plate connected to the heat dissipation substrate layer. The increased heat dissipation area can dissipate the heat on the heat dissipation substrate layer in a timely manner, thereby further improving the heat dissipation effect of the PCB board. Therefore, the PCB board of the embodiment of the utility model has the advantage of improving the heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a PCB board and a semiconductor device having the PCB board. Background Art

[0002] PCB, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. The performance and power consumption of electronic components are getting higher and higher, and the heat generated by the components will be transferred to the PCB board in large quantities, and the density of the chips on the PCB board is also getting higher and higher. Especially with the development of artificial intelligence, high-computing and high-power chips are densely concentrated on a circuit board. The trend of high density and high power consumption of single chips has led to increasing heat dissipation pressure on the entire PCB board. The devices on the PCB board have their own operating environment temperature range. If they exceed this range, the working efficiency of the components will be greatly reduced or fail, resulting in damage to the components. In the related technology, the heat generated by the components will be dissipated in time by setting a heat dissipation substrate layer, but its heat dissipation capacity is limited. Therefore, it is necessary to design a solution to solve the problem of heat dissipation of circuit boards with high-density chips. Utility Model Content

[0003] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, an embodiment of the utility model provides a PCB board. The PCB board has the advantage of improving the heat dissipation effect.

[0004] An embodiment of the utility model further provides a semiconductor device.

[0005] The PCB board of the embodiment of the utility model comprises a board body, a heat dissipation substrate layer and a heat dissipation plate.

[0006] The board body is connected to the heat dissipation substrate layer, and a portion of the heat dissipation substrate layer extends out of the board body; the heat dissipation plate is arranged beside the board body, and the heat dissipation plate is connected to the area of ​​the heat dissipation substrate layer extending out of the board body.

[0007] The PCB board of the utility model embodiment dissipates the heat generated by the components by providing a heat dissipation substrate layer connected to the board body, and a part of the heat dissipation substrate layer is extended out of the board body, which helps to increase the overall heat dissipation surface of the heat dissipation substrate, thereby improving the heat dissipation effect of the entire PCB board. In addition, the PCB board further increases the heat dissipation area by additionally providing the heat dissipation plate connected to the heat dissipation substrate layer. The increased heat dissipation area can dissipate the heat on the heat dissipation substrate layer in a timely manner, thereby further improving the heat dissipation effect of the PCB board.

[0008] Therefore, the PCB board of the embodiment of the utility model has the advantage of improving the heat dissipation effect.

[0009] In some embodiments, the heat dissipation substrate layer includes a main body portion and an extension portion extending outward along the circumference of the main body portion, the main body portion is clamped in the plate body, and the extension portion is connected to the heat dissipation plate.

[0010] In some embodiments, there are a plurality of heat dissipation plates, and the plurality of heat dissipation plates are connected to the extension portion at intervals along the circumference of the heat dissipation substrate layer.

[0011] In some embodiments, along the length direction of the PCB board, the length of the board body and the main body is L, and the length of the extension portion is L1, L1 is 0.25L to 0.50L; along the width direction of the PCB board, the width of the board body and the main body is W, and the width of the extension portion is W1, W1 is 0.25W to 0.50W.

[0012] In some embodiments, the board body includes multiple layers of conductive layers and multiple layers of insulating layers, two adjacent conductive layers form a conductive layer pair, each insulating layer is provided between the conductive layer pairs, and at least two insulating layers are sandwiched between the conductive layers of at least one pair of the conductive layer pairs, the heat dissipation substrate layer is sandwiched in the insulating layer between the same conductive layer pair, the multiple layers of conductive layers are electrically connected, the outermost conductive layer has an insulating coating area and a connection area, the connection area is used for chip mounting, and the insulating coating area is provided with an insulating coating.

[0013] In some embodiments, the outermost conductive layer has an insulating coating area and a connection area, the connection area is used for attaching the chip, and the insulating coating area is provided with an insulating coating.

[0014] In some embodiments, the PCB board has a first via hole, and the first via hole is filled with an insulating material layer;

[0015] The PCB board has a second via hole, and the second via hole is filled with a conductive material layer.

[0016] In some embodiments, the heat dissipation substrate layer is a metal plate layer; the heat dissipation plate is a metal plate.

[0017] In some embodiments, the heat dissipation plate is provided with a slot, and the heat dissipation substrate layer is welded, bonded or clamped in the slot.

[0018] In some embodiments, the thickness of the heat dissipation substrate layer is umm, and u is 0.5 mm to 2 mm; the width of the card slot is y, and y=u-0.1 mm.

[0019] Along the width extension direction of the PCB board, the width of the heat sink is n, and the depth of the card slot is x, n / 2 <x<n。

[0020] The heat sink forms a wing portion z of the heat sink on one side of the card slot, and the wing portion z, z <x。

[0021] The thickness of the heat sink is in the range of 0.3 mm to 1 mm.

[0022] The semiconductor device of the embodiment of the utility model comprises a chip and a PCB board according to any one of the above, wherein the chip is connected to the board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a top view of the PCB board and chip in the embodiment of the utility model.

[0024] Figure 2 It is a side view of the PCB board and chip in the embodiment of the utility model.

[0025] Figure 3 It is a side view of the board body, the heat dissipation substrate layer and the chip in the embodiment of the utility model.

[0026] Figure 4 It is a bottom view of the heat dissipation substrate layer of an embodiment of the utility model.

[0027] Figure 5 It is a top view of the board body and the heat dissipation substrate layer of an embodiment of the utility model.

[0028] Figure 6 It is a front view of the heat dissipation plate of an embodiment of the utility model.

[0029] Reference numerals:

[0030] PCB board 100; chip 200;

[0031] Board body 1; conductive layer 11; insulating layer 12; insulating coating 13;

[0032] Heat dissipation substrate layer 2; main body portion 21; extension portion 22;

[0033] Heat sink 3; card slot 31;

[0034] First via 4;

[0035] The second via hole 5 . DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but cannot be understood as limiting the present invention.

[0037] Reference below Figure 1-Figure 5The PCB board 100 and the semiconductor device having the PCB board 100 according to the embodiment of the present invention are described.

[0038] The PCB board 100 (Printed Circuit Board) of the embodiment of the utility model comprises a board body 1 , a heat dissipation substrate layer 2 and a heat dissipation plate 3 .

[0039] The board body 1 is connected to the heat dissipation substrate layer 2 , and a portion of the heat dissipation substrate layer 2 extends out of the board body 1 ; the heat dissipation plate 3 is arranged beside the board body 1 , and the heat dissipation plate 3 is connected to the area of ​​the heat dissipation substrate layer 2 extending out of the board body 1 .

[0040] The PCB board of the embodiment of the utility model dissipates the heat generated by the components by providing a heat dissipation substrate layer 2 connected to the board body 1, and a part of the heat dissipation substrate layer 2 extends out of the board body 1; this helps to increase the heat dissipation surface of the heat dissipation substrate, thereby improving the heat dissipation effect of the entire PCB board. In addition, the PCB board of the embodiment of the utility model further increases the heat dissipation area by additionally providing the heat dissipation plate 3 connected to the heat dissipation substrate layer 2. The increased heat dissipation area can dissipate the heat on the heat dissipation substrate layer 2 in a timely manner, thereby further improving the heat dissipation effect of the PCB board.

[0041] Therefore, the PCB board 100 of the embodiment of the utility model has the advantage of improving the heat dissipation effect.

[0042] Optionally, at least one side of the heat dissipation substrate layer 2 along its width and / or length direction extends out of the board body 1; the heat dissipation plate 3 is connected to the area where the heat dissipation substrate layer 2 extends out of the board body 1. It can be understood that at least one side of the heat dissipation substrate layer 2 along its width direction extends out of the board body 1. Or, at least one side of the heat dissipation substrate layer 2 along its length direction extends out of the board body 1. Alternatively, at least one side of the heat dissipation substrate layer 2 along its length and width direction extends out of the board body 1.

[0043] like Figure 2 and Figure 3 As shown, the heat dissipation substrate layer 2 includes a main body 21 and an extension 22 extending outward along the circumference of the main body 21. The main body 21 is clamped in the board body 1, and the extension 22 is connected to the heat dissipation plate 3. It can be understood that the extension 22 surrounds the main body 21.

[0044] The PCB board 100 of the embodiment of the utility model further increases the heat dissipation area of ​​the heat dissipation substrate layer 2 by dividing the heat dissipation substrate layer 2 into a main body portion 21 and an extension portion 22 extending outward along the circumference of the main body portion 21. Thus, the heat dissipation effect of the PCB board 100 is further improved.

[0045] like Figure 1 and Figure 2As shown, there are a plurality of heat dissipation plates 3 , and the plurality of heat dissipation plates 3 are connected to the extension portion 22 at intervals along the circumferential direction of the heat dissipation substrate layer 2 .

[0046] The PCB board 100 of the embodiment of the utility model further increases the heat dissipation area of ​​the PCB board 100 by providing a plurality of heat dissipation plates 3 spaced apart along the circumference of the heat dissipation substrate layer 2 and connected to the extension portion 22. Thus, the PCB board 100 further improves the heat dissipation effect of the PCB board 100.

[0047] like Figure 1 and Figure 5 As shown, along the length direction of the PCB board 100, the length of the board body 1 and the main body 21 is L, and the length of the extension portion 22 is L1, and L1 is 0.25L to 0.50L; along the width direction of the PCB board 100, the width of the board body 1 and the main body 21 is W, and the width of the extension portion 22 is W1, and W1 is 0.25W to 0.50W.

[0048] The PCB board 100 of the embodiment of the utility model has the corresponding length of the extension part 22 set to 0.25 to 0.50 times the length of its main body part 21, which not only avoids the problem of heavy weight caused by the excessive length of this part, but also avoids the problem of poor heat dissipation effect and poor connection stability with the heat dissipation plate 3 caused by too short a length. Therefore, the PCB board 100 of the embodiment of the utility model has the advantages of lightness, good heat dissipation effect and good connection stability.

[0049] For example, L1 may be 0.25 L, 0.30 L, 0.35 L, 0.40 L, 0.45 L, or 0.50 L. W1 may be 0.25 W, 0.30 W, 0.35 W, 0.40 W, 0.45 W, or 0.50 W.

[0050] like Figure 2 and Figure 3 As shown, the board body 1 includes multiple layers of conductive layers 11 and multiple layers of insulating layers 12. Two adjacent conductive layers 11 form a pair of conductive layers 11. An insulating layer 11 is provided between each pair of conductive layers. At least two layers of insulating layers 12 are sandwiched between the conductive layers 11 of at least one pair of conductive layers 11. The heat dissipation substrate layer 2 is sandwiched in the insulating layer 12 between the same pair of conductive layers 11. The multiple layers of conductive layers 11 are electrically connected. The outermost conductive layer 11 has an insulating coating area and a connection area. The connection area is used to attach the chip 200, and the insulating coating area is provided with an insulating coating 13. It can be understood that the conductive layer 11 and the insulating layer 12 can be stacked. In order to space different conductive layers 11, insulating layers 12 are provided on both sides of the conductive layer 11.

[0051] Correspondingly, the heat dissipation substrate layer 2 is usually a metal layer, which has electrical conductivity, so the metal layer is also sandwiched between the two insulating layers 12 .

[0052] The PCB board 100 of the embodiment of the utility model sandwiches the heat dissipation substrate layer 2 between the insulating layers 12, and the multiple conductive layers 11 are electrically connected, that is, the heat dissipation substrate is located in the area of ​​the board body 1 where heat is generated seriously, and the heat dissipated can be discharged in time. Therefore, the heat dissipation effect of the PCB board 100 is further improved.

[0053] Optionally, the insulating layer 12 may be a glass fiber resin insulating layer 12 .

[0054] Furthermore, the chip 200 is connected to the connection area of ​​the outermost conductive layer 11, and an insulating coating 13 is provided in the insulating coating area. Optionally, the insulating coating may be a green oil layer.

[0055] like Figure 4 As shown, the PCB board 100 has a first via hole 4, and an insulating material layer is filled in the first via hole 4. The first via hole 4 can block the signal of the same conductive layer 11 to prevent the problem of poor signal stability.

[0056] Furthermore, insulating epoxy resin material may be added into the first via hole 4. For example, the insulating epoxy resin material may be a powder.

[0057] like Figure 4 As shown, the PCB board 100 has a second via hole 5, and the second via hole 5 is filled with a conductive material layer to form a GND pin (GND, Ground represents a ground line or a zero line), so as to realize electrical connection between the multiple conductive layers 11.

[0058] For example, the conductive material layer may be copper material.

[0059] The first via hole 4 and the second via hole 5 can be drilled by laser air drilling, that is, the aluminum of the via hole is first melted by laser, and then the melted metal is blown away by high-pressure and high-speed air, so as to prevent burrs from being easily generated by directly machining via holes on metal.

[0060] Alternatively, the board body 1 includes a plurality of core board layers, that is, the conductive layers 11 are disposed on both sides of the insulating layer 12 in the thickness direction.

[0061] The insulating layer 12 is a PP layer. Therefore, the insulating layer 12 and the conductive layer 11 can be pressed together by overheating and pressure during processing. Therefore, the PCB board 100 of the embodiment of the utility model has the advantage of high processing convenience.

[0062] Furthermore, the PP layer may be NF PP (no flow prepreg).

[0063] Specifically, Figure 2 and Figure 3As shown, along the thickness direction of the PCB board 100, the insulating coating 13, the conductive layer 11, the insulating layer 12, the conductive layer 11, the insulating layer 12, the heat dissipation substrate layer 2, the insulating layer 12, the conductive layer 11, the insulating layer 12, the conductive layer 11, the insulating layer 12 and the insulating coating 13 are arranged in sequence.

[0064] The heat dissipation substrate layer 2 is a metal plate layer; the heat dissipation plate 3 is a metal plate. By setting the heat dissipation substrate layer 2 and the heat dissipation plate 3 to be made of metal material, the PCB board 100 has the advantage of good heat dissipation effect.

[0065] Furthermore, the heat dissipation substrate layer 2 and the heat dissipation plate 3 can both be metal aluminum plates.

[0066] like Figure 6 As shown, the heat sink 3 is provided with a slot 31, and the heat sink substrate layer 2 is welded, bonded or stuck in the slot 31. By providing the slot 31 on the heat sink 3, a part of the extension portion 22 of the heat sink substrate can be inserted into the slot 31. This helps to improve the stability of the connection between the heat sink substrate and the heat sink 3.

[0067] The thickness of the heat dissipation substrate layer 2 is umm, and u is 0.5 mm to 2 mm; the width of the card slot 31 is y, and y=u-0.1 mm.

[0068] The PCB board 100 of the embodiment of the utility model sets the thickness of the heat dissipation substrate layer 2 to 0.5 mm to 2 mm. Thus, the problem of the overall thickness of the PCB board 100 being large due to the excessive thickness is avoided, and the problem of poor heat dissipation effect and poor connection stability to the heat dissipation plate 3 due to the excessively small thickness is also avoided. Therefore, the PCB board 100 of the embodiment of the utility model has the advantages of both lightness and good connection reliability.

[0069] In addition, the width of the card slot 31 is y, y=u-0.1mm; therefore, the problem of the card slot 31 being too wide and causing difficulty in connection can be avoided, and the problem of the card slot 31 being too small and causing the heat dissipation substrate to be difficult to be stuck in the card slot 31 of the heat dissipation plate 3 and causing difficulty in installation can be avoided. Therefore, the PCB board 100 of the embodiment of the utility model has the advantages of easy installation and good connection reliability.

[0070] Optionally, u can be 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2.0mm.

[0071] like Figure 6As shown, along the width extension direction of the PCB board 100, the width of the heat dissipation plate 3 is n, and the depth of the card slot 31 is x, where n / 2 < x < n. Thus, it avoids the problem that the excessive depth of the card slot 31 causes the heat dissipation substrate layer 2 to penetrate out of the card slot 31 and break the heat dissipation plate 3, and also avoids the problem that the too small slot depth causes a small connection area between the heat dissipation substrate layer 2 and the heat dissipation plate 3 and poor heat exchange effect.

[0072] As Figure 6 shown, one side of the heat dissipation plate 3 where the card slot 31 is formed is the wing part z of the heat sink fin, and the wing part z, z < x. Furthermore, it avoids the problem that the excessive length of the heat dissipation plate 3 along the thickness direction of the PCB board 100 causes the heat dissipation plate 3 to be prone to deflection.

[0073] The thickness range of the heat dissipation plate 3 is from 0.3 mm to 1 mm.

[0074] Optionally, u can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or 1.0 mm.

[0075] The semiconductor device according to an embodiment of the present invention may include a chip 200 and a PCB board 100 according to any one of the above, and the chip 200 is connected to the board body 1.

[0076] Therefore, the semiconductor device according to the embodiment of the present invention has the advantage of improving the heat dissipation effect.

[0077] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention.

[0078] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0079] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0080] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0081] In the present utility model, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0082] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A PCB board, characterized in that: include: A plate body and a heat dissipation substrate layer, wherein the plate body is connected to the heat dissipation substrate layer, and a portion of the heat dissipation substrate layer extends out of the plate body; The heat dissipation plate is arranged beside the plate body and is connected to the area of ​​the heat dissipation substrate layer extending out of the plate body.

2. The PCB board according to claim 1, characterized in that: The heat dissipation substrate layer includes a main body and an extension portion extending outward along the circumference of the main body, the main body is clamped in the plate body, and the extension portion is connected to the heat dissipation plate.

3. The PCB board according to claim 2, characterized in that: There are a plurality of heat dissipation plates, and the plurality of heat dissipation plates are connected to the extension portion at intervals along the circumferential direction of the heat dissipation substrate layer.

4. The PCB board according to claim 2, characterized in that: Along the length direction of the PCB board, the length of the board body and the main body is L, and the length of the extension portion is L1, L1 is 0.25L to 0.50L; along the width direction of the PCB board, the width of the board body and the main body is W, and the width of the extension portion is W1, W1 is 0.25W to 0.50W.

5. The PCB board according to claim 1, characterized in that: The board body comprises a plurality of conductive layers and a plurality of insulating layers, two adjacent conductive layers form a conductive layer pair, an insulating layer is provided between each conductive layer pair, and at least two insulating layers are sandwiched between the conductive layers of at least one pair of conductive layer pairs, the heat dissipation substrate layer is sandwiched in the insulating layer between the same conductive layer pair, and the plurality of conductive layers are electrically connected; The outermost conductive layer has an insulating coating area and a connecting area. The connecting area is used for attaching the chip, and the insulating coating area is provided with an insulating coating.

6. The PCB board according to claim 1, characterized in that: The PCB board has a first via hole, and the first via hole is filled with an insulating material layer; The PCB board has a second via hole, and the second via hole is filled with a conductive material layer.

7. The PCB board according to claim 1, characterized in that: The heat dissipation substrate layer is a metal plate layer; the heat dissipation plate is a metal plate.

8. The PCB board according to claim 1, characterized in that: The heat dissipation plate is provided with a slot, and the heat dissipation substrate layer is welded, bonded or clamped in the slot.

9. The PCB board according to claim 8, characterized in that: The thickness of the heat dissipation substrate layer is umm, and u is 0.5mm to 2mm; the width of the card slot is y, and y=u-0.1mm; Along the width extension direction of the PCB board, the width of the heat sink is n, and the depth of the card slot is x, n / 2 <x<n; The heat sink forms a wing portion z of the heat sink on one side of the card slot, and the wing portion z, z <x; The thickness of the heat sink is in the range of 0.3 mm to 1 mm.

10. A semiconductor device, characterized in that: It comprises a chip and a PCB board according to any one of claims 1 to 9, wherein the chip is connected to the board body.

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