Liquid cooling components and electronic equipment

Abstract

The embodiments of the present application relate to the field of liquid cooling and heat dissipation technology, and specifically to a liquid cooling and heat dissipation component and an electronic device, the liquid cooling and heat dissipation component comprising: a substrate and a cover plate; a flow channel is provided on the first surface of the substrate, and a liquid inlet and a liquid outlet are provided on the substrate, which are respectively connected to the two ends of the flow channel; the cover plate is provided on the first surface of the substrate and closes the flow channel; a heat dissipation channel is provided in the flow channel, and a boss is formed on the second surface of the substrate opposite to the first surface of the substrate at a position opposite to the heat dissipation channel, and the boss is used to fit with the power module, so that when the coolant flows through the heat dissipation channel, it contacts the inner wall of the heat dissipation channel, so as to take away the heat of the power module through the boss, and when the coolant flows through other areas of the flow channel, the heat of at least part of other heat-generating devices is taken away through the substrate. In the above manner, the liquid cooling and heat dissipation component provided by the embodiments of the present application can improve the heat dissipation efficiency of the power module.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of liquid cooling and heat dissipation technology, and specifically to a liquid cooling and heat dissipation component and an electronic device. Background Art

[0002] As the power of power modules in electronic devices continues to increase, the heat generated by power modules is getting higher and higher. Ordinary air cooling can hardly meet the heat dissipation requirements of power modules. Liquid cooling has better heat dissipation efficiency than air cooling, so liquid cooling has been more and more widely used in the heat dissipation design of power modules.

[0003] The main body of the existing liquid cooling radiator is generally a plate-shaped rectangular parallelepiped structure. After it is fitted with the heating device on the circuit board, the heat of the heating element is taken away by the cooling liquid flowing inside. However, on the circuit board of the electronic equipment, the height of the power module is lower than other heating devices, which makes it impossible for the main body of the liquid cooling radiator to fit the power module reliably, thus affecting the heat dissipation efficiency of the power module. Utility Model Content

[0004] In view of the above problems, an embodiment of the present application provides a liquid cooling heat dissipation component and an electronic device for improving the heat dissipation efficiency of a power module.

[0005] According to one aspect of an embodiment of the present application, a liquid-cooled heat dissipation component is provided, which is used to dissipate heat for various heat-generating devices on a circuit board. The heat-generating devices include a power module, and the height of the power module is lower than the height of at least some other heat-generating devices on the circuit board. The liquid-cooled heat-dissipating component includes: a substrate and a cover plate; a flow channel is provided on the first surface of the substrate, and a liquid inlet and a liquid outlet are provided on the substrate, which are respectively connected to the two ends of the flow channel, the liquid inlet is used to supply cooling liquid into the flow channel, and the liquid outlet is used to supply cooling liquid from the flow channel; the cover plate is provided on the first surface of the substrate and closes the flow channel; a heat dissipation channel is provided in the flow channel, and a boss is formed on the second surface of the substrate opposite to the first surface of the substrate at a position opposite to the heat dissipation channel, the boss is used to fit with the power module, and other positions on the second surface of the substrate are used to fit with at least some other heat-generating devices, so that when the coolant flows through the heat dissipation channel, it contacts the inner wall of the heat dissipation channel to take away the heat of the power module through the boss, and when the coolant flows through other areas of the flow channel, the heat of at least some other heat-generating devices is taken away through the substrate.

[0006] In an optional manner, the depth of the heat dissipation channel is greater than the depth of other areas in the flow channel; the liquid-cooled heat dissipation assembly also includes a blocking member, which is accommodated inside the heat dissipation channel, one side of the blocking member is sealed to the cover plate, and both sides of the blocking member along the width direction of the heat dissipation channel abut against the inner wall of the heat dissipation channel, and the other side of the blocking member leaves a gap with the inner wall of the heat dissipation channel.

[0007] In an optional manner, a plurality of first plug-in blocking portions are provided on the inner walls on both sides of the heat dissipation channel along the width direction, and a plurality of second plug-in blocking portions are provided on the outer walls on both sides of the blocking member along the width direction. The first plug-in blocking portions correspond to and abut against the second plug-in blocking portions one by one to prevent the coolant from flowing between the inner walls on both sides of the heat dissipation channel along the width direction and the blocking member.

[0008] In an optional manner, a first step portion is provided at the opening of the heat dissipation channel, a second step portion is provided on the blocking member, and the first step portion abuts against the second step portion so that the blocking member is pressed against the cover plate.

[0009] In an optional manner, the second surface of the substrate and the boss are arranged upward, the second surface of the substrate is used to fit with at least part of other heating devices inverted on the circuit board, and the boss is used to fit with the power module inverted on the circuit board.

[0010] In an optional manner, the base body is surrounded by the second surface to form a limiting wall, and a heat dissipation cavity is formed inside the limiting wall, and the heat dissipation cavity is used to accommodate the circuit board.

[0011] In an optional manner, the liquid inlet and the liquid outlet are arranged on the limiting wall, and the liquid inlet and the liquid outlet are used to be connected to an external coolant pipeline on the outside of the limiting wall.

[0012] In an optional manner, the boss and the base are an integral structure.

[0013] In an optional manner, the inner wall of the heat dissipation channel is provided with heat dissipation teeth, and the heat dissipation teeth are arranged along the extension direction of the heat dissipation channel.

[0014] According to another aspect of the embodiments of the present application, an electronic device is provided, comprising a circuit board and a liquid-cooled heat dissipation assembly as described above, wherein a heat generating device is arranged on the circuit board, the heat generating device comprises a power module, and the height of the power module is lower than the height of at least some other heat generating devices; the liquid-cooled heat dissipation assembly is used to fit with the power module and at least some other heat generating devices for heat dissipation.

[0015] The liquid cooling heat dissipation assembly provided in the embodiment of the present application is adapted to the power module with a lower height on the circuit board by setting a boss on the second surface of the base, so that the boss is tightly fitted with the power module, while other positions on the second surface can be tightly fitted with other heating devices on the circuit board, and then the heat of the power module and other heating devices is efficiently taken away by the coolant flowing in the flow channel and the heat dissipation channel opened on the first surface of the base, so as to achieve efficient heat dissipation of the circuit board, especially efficient heat dissipation of the power module. On this basis, since the first surface with the flow channel and the second surface that is fitted with the circuit board are two opposite surfaces, when liquid leakage occurs on the first surface, the impact on the circuit board can be minimized.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0018] Figure 1 A schematic diagram of the three-dimensional structure of a liquid cooling and heat dissipation assembly provided in an embodiment of the utility model;

[0019] Figure 2 A schematic diagram of an exploded structure of some components of an electronic device provided by an embodiment of the utility model from a perspective;

[0020] Figure 3 The exploded structure of some components of the electronic device provided by the embodiment of the utility model from another perspective;

[0021] Figure 4 A schematic diagram of the cross-sectional structure of some components of an electronic device along the width direction of a heat dissipation channel provided by an embodiment of the utility model;

[0022] Figure 5 A schematic diagram of the cross-sectional structure of some components of an electronic device provided by an embodiment of the utility model along the extension direction of the heat dissipation channel;

[0023] Figure 6 for Figure 4 The enlarged structure at A;

[0024] Figure 7 A schematic diagram of the exploded structure of the heat dissipation channel and the blocking member in the liquid cooling heat dissipation assembly provided by the embodiment of the utility model;

[0025] Figure 8 A schematic diagram of the three-dimensional structure of an electronic device provided by an embodiment of the utility model;

[0026] Fig. 9 A schematic diagram of the structure of the flow channel on the base in the liquid cooling heat dissipation component provided in an embodiment of the utility model.

[0027] The reference numerals in the specific implementation manner are as follows:

[0028] 100. Liquid cooling components;

[0029] 110, base; 1101, first surface; 1102, second surface; 111, flow channel; 1111, heat dissipation channel; 1112, heat dissipation teeth; 1113, first plug-in blocking portion; 1114, first step portion; 112, liquid inlet; 113, liquid outlet; 114, boss; 1141, mounting portion; 115, limiting wall; 116, heat dissipation cavity;

[0030] 120, cover plate;

[0031] 130, blocking member; 131, second plug-in blocking portion; 132, second step portion;

[0032] 200, circuit board; 210, power module; 211, threaded fastener; 212, mounting hole; 220, other heating components;

[0033] 500. Electronic equipment. DETAILED DESCRIPTION

[0034] The following embodiments of the technical solution of the present application will be described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0036] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0037] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0039] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0040] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0041] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0042] In electronic devices, corresponding functions are achieved by integrating electronic devices and circuit structures on circuit boards. The base of the liquid-cooled radiator is generally attached to the heat-generating device on the circuit board. The heat emitted by the heat-generating device is first transferred to the base, and then the heat on the base is taken away by the coolant flowing in the flow channel inside the base, thereby achieving cooling and heat dissipation of the heat-generating device.

[0043] There are many types of heating devices integrated on the circuit board. The height of each heating device is generally different. For example, the height of the power module is much lower than that of some other heating devices. Therefore, the conventional rectangular liquid cooling radiator cannot meet the requirements of efficient heat dissipation of the power module.

[0044] Based on this, the embodiment of the present application proposes a liquid-cooled heat dissipation component, by opening a flow channel on the first surface of the substrate (that is, the main body of the liquid-cooled heat dissipation component), setting a boss on the opposite second surface, and setting a heat dissipation channel at a position corresponding to the boss in the flow channel, so that when the first surface is in contact with the heating device on the circuit board, the boss can be in close contact with the power module in the heating device, and then when the coolant flows through the heat dissipation channel, the heat of the power module can be efficiently taken away by the boss, thereby improving the heat dissipation efficiency of the power module. Furthermore, the flow channel is closed by covering the first surface of the substrate with a cover plate, because the second surface of the substrate that is in contact with the heating device and the first surface where the flow channel is opened are opposite surfaces, so during operation, when the seal between the cover plate and the substrate fails, the coolant leaks from the first surface, which generally does not cause a significant impact on the circuit board at the second surface.

[0045] First see Figures 1 to 3 , Figure 1 The three-dimensional structure of the liquid cooling heat dissipation component is shown in FIG. Figure 2 The exploded structure of the liquid cooling component in the application scenario is shown in FIG. Figure 3 The exploded structure of the liquid cooling component in another application scenario is shown.

[0046] like Figure 1 and Figure 2 As shown in , the liquid cooling heat dissipation assembly 100 is used to dissipate heat for various heat generating devices on the circuit board 200 , and the heat generating devices include a power module 210 , and the height of the power module 210 is lower than the height of at least some other heat generating devices 220 on the circuit board 200 .

[0047] like Figure 2 As shown in , the liquid cooling heat dissipation component 100 includes a base 110 and a cover plate 120. A flow channel 111 is provided on the first surface 1101 of the base 110. The base 110 is provided with a liquid inlet 112 and a liquid outlet 113 respectively connected to the two ends of the flow channel 111. The liquid inlet 112 is used for supplying cooling liquid into the flow channel 111, and the liquid outlet 113 is used for supplying cooling liquid out of the flow channel 111. The cover plate 120 is covered on the first surface of the base 110 and closes the flow channel 111.

[0048] like Figure 2 and Figure 3As shown in the figure, a heat dissipation channel 1111 is arranged on the flow channel 111, and a second surface 1102 on the substrate 110 opposite to the first surface 1101 forms a boss 114 at a position opposite to the heat dissipation channel 1111, and the boss 114 is used to fit with the power module 210, and other positions on the second surface 1102 of the substrate 110 are used to fit with at least part of other heat-generating components 220. Such an arrangement enables the coolant to contact the inner wall of the heat dissipation channel 1111 when flowing through the heat dissipation channel 1111, so as to take away the heat of the power module 210 through the boss 114, and take away the heat of at least part of other heat-generating components 220 through the substrate 110 when flowing through other areas of the flow channel 111.

[0049] The circuit board 200 can be placed upright or inverted. The boss 114 on the second surface 1102 of the substrate 110 is attached to the power module 210 on the circuit board 200, and the other areas of the second surface 1102 are attached to at least part of other heating devices 220 on the circuit board 200, so that the heat generated by the power module 210 and other heating devices 220 during operation will be first transferred to the boss 114 and the substrate 110. In the accompanying drawings, the circuit board 200 is shown in an inverted manner. The coolant in the flow channel 111 transfers heat with the boss 114 and the substrate 110 during the flow process, so that the heat on the boss 114 and the substrate 110 is transferred to the coolant and taken away by the coolant, thereby achieving cooling and heat dissipation of the power module 210 and other heating devices 220 on the circuit board 200.

[0050] In some embodiments of the present application, a method for installing the liquid cooling heat dissipation assembly 100 when the circuit board 200 is inverted is provided. Figure 2 and Figure 3 As shown in the figure, the second surface 1102 of the base 110 and the boss 114 are arranged upward, the second surface 1102 of the base 110 is used to fit with at least part of the other heating components 220 inverted on the circuit board 200, and the boss 114 is used to fit with the power module 210 inverted on the circuit board 200.

[0051] The liquid inlet 112 and the liquid outlet 113 are respectively used to connect to a coolant input pipe and a coolant output pipe in the electronic device to realize the input and output of the coolant in the flow channel 111 .

[0052] Specifically, in Figure 2In the specific embodiment shown, the flow direction of the coolant is the direction of the dotted arrow marked on the flow channel 111. The flow channel 111 is in the form of a serpentine extension to fully increase the flow path of the coolant so that the coolant can fully take away the heat from the base 110 and the various parts on the boss 114. Further, considering that the power module 210 has a large heat generation and a high heat dissipation requirement, in order to better dissipate the heat of the power module 210, the heat dissipation channel 1111 is arranged at a position of the flow channel 111 close to the liquid inlet 112, so that the coolant with a lower temperature just input into the flow channel 111 from the liquid inlet 112 can contact the boss 114 at the first time to take away more heat from the boss 114, thereby achieving more efficient heat dissipation of the power module 210.

[0053] Specifically, the heat dissipation channel 1111 can have the same depth as other areas of the flow channel 111, that is, the boss 114 is a solid structure with a relatively large thickness. Of course, the depth of the heat dissipation channel 1111 can also be greater than other areas of the flow channel 111. Accordingly, guide slopes can be set at the positions where both ends of the heat dissipation channel 1111 are connected to other areas of the flow channel 111 to ensure that the coolant flows smoothly at the junction of the heat dissipation channel 1111 and the flow channel 111.

[0054] The liquid cooling heat dissipation component 100 provided in the embodiment of the present application is adapted to the power module 210 with a lower height on the circuit board 200 by setting a boss 114 on the second surface 1102 of the base 110, so that the boss 114 is closely fitted with the power module 210, and other positions on the second surface 1102 can be closely fitted with other heating devices 220 on the circuit board 200, and then the cooling liquid flowing in the flow channel 111 and the heat dissipation channel 1111 opened on the first surface 1101 of the base 110 can efficiently take away the heat of the power module 210 and other heating devices 220, so as to achieve efficient heat dissipation of the circuit board 200, especially efficient heat dissipation of the power module 210. On this basis, since the first surface 1101 with the flow channel 111 and the second surface 1102 that is fitted with the circuit board 200 are two opposite surfaces, when the first surface 1101 leaks, the impact on the circuit board 200 can be minimized.

[0055] After the boss 114 is arranged on the base 110, in order to ensure that the heat is transferred more efficiently from the power module 210, the boss 114 to the coolant in sequence, the wall of the boss 114 can be arranged to be thinner, but this will cause the heat dissipation channel 1111 corresponding to the boss 114 to form a pit relative to other positions of the flow channel 111. The pit will form a deep flow channel cavity, and the inner walls around it will cause a certain degree of obstruction to the coolant, which may cause the coolant flow rate inside the pit to be slow, and fail to efficiently remove the heat on the boss 114. In addition, for some inverted circuit board situations (the power module 210 is arranged below the circuit board 200, and the second surface 1102 of the base 110 is attached to the bottom surface of the power module 210), the opening of the pit will face downward, which may also cause the coolant to be unable to enter the pit and contact its inner wall, but to flow directly through the flow channel outside the pit opening, thereby failing to remove the heat on the boss 114.

[0056] In view of the above problems, in order to enable the coolant in the flow channel passing through the boss to smoothly and efficiently remove the heat on the boss, the present application further proposes an implementation method, specifically as follows Figure 2 As shown in the figure, the depth of the heat dissipation channel 111 is greater than the depth of other areas in the flow channel 111, and the liquid cooling heat dissipation component 100 also includes a blocking member 130, which is accommodated in the heat dissipation channel 1111, and one side of the blocking member 130 is sealed and connected to the cover plate 120, and the blocking member 130 abuts against the inner wall of the heat dissipation channel 1111 on both sides along the width direction of the heat dissipation channel 1111 (the direction indicated by the double arrow X in the figure), and a gap is left between the inner wall of the heat dissipation channel on the other side of the blocking member 130, specifically, a gap is left between the two ends of the blocking member 130 along the extension direction of the heat dissipation channel 1111 (the direction indicated by the double arrow Y in the figure) and the inner wall of the heat dissipation channel 1111, and a gap is left between the side of the blocking member 130 away from the cover plate 120 and the inner wall of the heat dissipation channel 1111 along the depth direction of the heat dissipation channel 1111 (the direction indicated by the double arrow Z in the figure).

[0057] like Figure 4 As shown in the cross-sectional view along the width direction of the heat dissipation channel 1111 (the direction indicated by the double arrow X in the figure), both sides of the blocking member 130 along the width direction of the heat dissipation channel 1111 abut against the inner wall of the heat dissipation channel 1111, and the bottom of the blocking member 130 is sealed and connected to the inner wall of the cover plate 120. Figure 5 A cross-sectional view along the extension direction of the heat dissipation channel 1111 (the direction indicated by the double arrow Y in the figure), from Figure 4 and Figure 5 As can be seen from the figure, a gap is left between the top of the blocking member 130 and the inner top wall of the heat dissipation channel 1111, and a gap is left between the two ends of the blocking member 130 and the inner side wall of the heat dissipation channel 1111, so that the Figure 5The coolant input from the liquid inlet 112 in the direction indicated by the dotted arrow on the right side of the middle diagram, after being blocked by the blocking member 130, first climbs a certain height at the right end and then contacts the inner top wall of the heat dissipation channel 1111, that is, contacts the inner wall of the boss 114, and then flows leftward along the extension direction of the heat dissipation channel 1111, thereby contacting the entire inner top wall, and after flowing to the left end, it descends and flows into the position in the flow channel 111 that is connected to the left end of the heat dissipation channel 1111, and then the coolant flows through other areas in the flow channel 111 and takes away the heat on the substrate 110 at the corresponding position, and then is output from the liquid outlet 113.

[0058] It should be noted that in the specific embodiment shown in the figure, in order to save material costs and reduce the overall weight of the liquid-cooled heat dissipation assembly 100, the blocking member 130 adopts a hollow structure. However, the cavity in the middle of the blocking member 130 is sealed with the cover plate 120 on all sides, so that no coolant will enter the cavity in the middle.

[0059] When assembling the liquid cooling heat dissipation assembly 100, firstly, the blocking member 130 and the cover plate 120 are sealed and fixed together by welding, bonding, clamping, threaded fastener connection, etc., and then the whole consisting of the blocking member 130 and the cover plate 120 is assembled with the base 110, specifically, the blocking member 130 is inserted into the heat dissipation channel 1111, and the cover plate 120 and the base 110 are assembled and fixed to the base 110 by welding, bonding, clamping, threaded fastener connection, etc., and the flow channel 111 on the base 110 is closed, and the assembly of the liquid cooling heat dissipation assembly 100 is completed. In addition, the blocking member 130 and the cover plate 120 can also be an integrated structure, so as to further save the number of parts and improve the assembly efficiency.

[0060] In summary, considering that the heat transferred from the power module 210 to the boss 114 is mainly concentrated on the top of the boss 114 (the circuit board 200 is inverted and the boss 114 is attached to the bottom of the power module 210. On the contrary, if the circuit board 200 is upright, the heat is concentrated on the bottom of the boss 114. The same applies to the following, and no further details are given). In order to allow the coolant to be in more sufficient contact with the inner wall of the heat dissipation channel 1111 and the corresponding position of the top of the boss 114, the liquid cooling heat dissipation component 100 provided in the present embodiment has a heat dissipation channel 1111. A blocking member 130 is cleverly designed inside 111. By abutting the bottom of the blocking member 130 against the cover plate 120, and abutting the two sides of the blocking member 130 along the width direction of the heat dissipation channel 1111 against the inner wall of the heat dissipation channel 1111, the coolant flows along the gaps at the two ends and the top of the heat dissipation channel 1111 under the restriction of the blocking member 130, thereby making full contact with the top of the boss 114 to take away more heat on the boss 114, thereby achieving efficient heat dissipation of the power module 210 and meeting the heat dissipation requirements of the power module 210.

[0061] It is considered that if the boss 114 and the base 110 are manufactured and formed separately and fixed by welding or other sealing assembly methods, during use, once the weld fails or cracks appear at the connection between the boss 114 and the base 110, it will directly lead to coolant leakage and easily cause the coolant to flow onto the circuit board 200 and damage the electronic devices thereon.

[0062] Based on this, in order to improve the reliability of water and electricity isolation of the liquid cooling heat dissipation component 100, this application further proposes an implementation method, please continue to refer to Figure 4 and Figure 5 As shown in the figure, the boss 114 and the base 110 are an integral structure, which can ensure that there is no assembly connection relationship between the boss 114 and the base 110, that is, it is not easy for cracks to appear at the connection between the two, thereby preventing the internal coolant from leaking. Furthermore, the boss 114 and the base 110 are set as an integral structure. For the inverted circuit board 200, the sealing of the coolant in the entire liquid-cooled heat dissipation component 100 depends on the reliability of the sealing assembly between the bottom cover 120 and the base 110. If cracks occur between the cover 120 and the base 110 and cause coolant leakage, the coolant will also flow downward under the influence of gravity, and will not contact the circuit board 200 located above the liquid-cooled heat dissipation component 100, thereby effectively preventing the coolant from leaking and affecting the circuit structure when it is not discovered in time, thereby ensuring the stability and safety of the operation of the electronic equipment.

[0063] In order to dissipate heat more fully and efficiently for the power module 210, the present application further proposes an implementation method. Figure 6 and Figure 7 ,in Figure 6 Shows Figure 4 The enlarged structure at A, Figure 7 The partial structure inside the heat dissipation channel is shown. As shown in the figure, heat dissipation teeth 1112 are arranged in the heat dissipation channel 1111. The heat dissipation teeth 1112 are arranged along the extension direction of the heat dissipation channel 1111 (the direction shown by the double arrow Y in the figure).

[0064] Specifically, the heat dissipation teeth 1112 and the boss 114 can be an integral structure, so that the heat of the power module 210 can be quickly transferred to the boss 114 and the heat dissipation teeth 1112, and the bottom of the heat dissipation teeth 1112 can be arranged in contact with the bottom of the blocking member 130, so that the coolant can better flow through the gaps between adjacent heat dissipation teeth 1112, thereby achieving sufficient contact and heat transfer with the surface of the heat dissipation teeth 1112.

[0065] By providing the heat dissipation teeth 1112, the contact area between the coolant and the inner top wall of the heat dissipation channel 1111 can be increased, so that the coolant can more fully absorb the heat on the boss 114, thereby improving the heat dissipation efficiency of the power module 210. In addition, by providing the heat dissipation teeth 1112 along the extension direction of the heat dissipation channel 1111, the heat dissipation teeth 1112 can also play a certain guiding role in the flow of the coolant, thereby accelerating the flow rate of the coolant in the heat dissipation channel 1111, thereby improving the heat dissipation efficiency.

[0066] Since the heat on the walls on both sides of the heat dissipation channel 1111 along the width direction is less and its temperature is lower, the heat is mainly concentrated on the top wall. In order to prevent the blocking member 130 from not tightly abutting against the inner walls on both sides of the heat dissipation channel 1111 in the width direction, causing the coolant to flow from the side, thereby reducing the amount of coolant flowing from the top, the embodiment of the present application further improves the abutment between the blocking member 130 and the inner walls on both sides of the heat dissipation channel 1111 in the width direction. For details, please continue to refer to Figure 7 As shown in the figure, the inner walls of the heat dissipation channel 1111 on both sides along the width direction (the direction indicated by the double arrow X in the figure) are provided with a plurality of first plug-in blocking portions 1113, and the outer walls of the blocking member 130 on both sides along the width direction are provided with a plurality of second plug-in blocking portions 131. The first plug-in blocking portions 1113 and the second plug-in blocking portions 131 are correspondingly abutted and matched one by one to prevent the coolant from flowing between the inner walls of the heat dissipation channel 1111 on both sides along the width direction and the blocking member 130.

[0067] exist Figure 7 In the specific embodiment shown, the first plug-in blocking portion 1113 is a slot, and the second plug-in blocking portion 131 is a plug-in strip, and a plurality of plug-in strips are inserted into the slots to seal the inner walls on both sides of the width direction of the heat dissipation channel 1111 and the blocking member 130. Of course, the first plug-in blocking portion 1113 can also be a plug-in strip, and the second plug-in blocking portion 131 can be a slot. The specific principles are the same and will not be described in detail. In addition to this method, the first plug-in blocking portion 1113 and the second plug-in blocking portion 131 can also use two sealing pads to squeeze each other and have an interference fit to achieve the sealing between the inner walls on both sides of the width direction of the heat dissipation channel 1111 and the blocking member 130.

[0068] By respectively arranging the first plug-in blocking portion 1113 and the second plug-in blocking portion 131 on the inner walls on both sides of the heat dissipation channel 1111 along the width direction and the blocking member 130, and utilizing the abutment cooperation between the first plug-in blocking portion 1113 and the second plug-in blocking portion 131, it is possible to effectively prevent the coolant from flowing through the inner walls on both sides of the heat dissipation channel 1111 along the width direction and the blocking member 130, so that the coolant is more in contact with the top wall of the heat dissipation channel 1111, thereby improving the heat dissipation efficiency of the power module 210.

[0069] Similarly, in order to prevent the coolant from flowing through the gap due to the assembly gap between the blocking member 130 and the cover plate 120, thereby affecting the flow of the coolant flowing through the top of the heat dissipation channel 1111, the present application further improves the assembly relationship between the blocking member 130 and the cover plate 120. Figure 4 and Figure 7 As shown in the figure, a first step portion 1114 is provided at the opening of the heat dissipation channel 1111, and a second step portion 132 is provided on the blocking member 130. The first step portion 1114 abuts against the second step portion 132 so that the blocking member 130 is pressed against the cover plate 120.

[0070] After the blocking member 130 is inserted into the heat dissipation channel 1111, the first step portion 1114 and the cover plate 120 squeeze the second step portion 132 on the upper and lower surfaces, so that the blocking member 130 and the cover plate 120 form an interference fit, thereby reducing the probability of an assembly gap between the blocking member 130 and the cover plate 120, ensuring that the coolant can better flow through the top of the heat dissipation channel 1111 to absorb more heat on the boss 114.

[0071] In order to reliably protect the circuit board 200, the present application further proposes an implementation method, specifically combining Figure 3 and Figure 8 The figure shows the structure after the circuit board 200 and the liquid cooling heat dissipation component 100 are assembled. As shown in the figure, the base 110 forms a limiting wall 115 around the second surface 1102, and a heat dissipation cavity 116 is formed inside the limiting wall 115. The heat dissipation cavity 116 is used to accommodate the circuit board 200.

[0072] In this embodiment, limiting walls 115 are arranged around the second surface 1102 of the base 110, so that a heat dissipation cavity 116 for accommodating the circuit board 200 is formed inside the limiting walls 115. On the one hand, the limiting walls 115 can play a certain protective role for the circuit board 200. On the other hand, the heat generated by the circuit board 200 can be well controlled within the heat dissipation cavity 116, and then through the heat transfer between the air in the heat dissipation cavity 116, the limiting walls 115, the boss 114, the base 110 and the internal coolant, the heat generated by the circuit board 200 as a whole can be more transferred to the coolant and the heat is taken away by the coolant.

[0073] On the basis of setting the limiting wall 115, in order to achieve a better water and electricity isolation effect, the present application further proposes an implementation method, which is described in detail in detail. Figure 8 and Fig. 9 , Fig. 9The structure of the flow channel 111 on the base 110 is shown in the figure. As shown in the figure, the liquid inlet 112 and the liquid outlet 113 are arranged on the outside of the limiting wall 115, and the liquid inlet 112 and the liquid outlet 113 are used to connect to the external coolant pipeline (not shown) on the outside of the limiting wall 115.

[0074] By arranging the liquid inlet 112 and the liquid outlet 113 on the limiting wall 115 and connecting them to the external coolant pipeline on the outer side of the limiting wall 115, the space where the external coolant pipeline is located and the connection between the external liquid cooling pipeline and the liquid inlet 112 and the liquid outlet 113 are separated from the heat dissipation cavity 116 where the circuit board 200 is located, forming a water-electricity isolation structure. Therefore, when the external coolant pipeline leaks or the connection between the external coolant pipeline and the liquid inlet 112 or the liquid outlet 113 leaks, it will not have a significant impact on the circuit board 200, thereby ensuring the stability and reliability of the operation of the circuit board 200.

[0075] Please combine Figure 3 and Figure 6 In order to ensure that the power module 210 and the boss 114 are tightly fitted, the present application further proposes an implementation method. For details, please refer to Figure 3 As shown in the figure, a mounting portion 1141 is provided on the boss 114 , and the mounting portion 1141 is used to be fixedly connected to the power module 210 so that the power module 210 is fitted and fixed to the boss 114 .

[0076] like Figure 6 As shown in , the mounting portion 1141 can be a threaded hole, and the threaded fastener 211 passes through the mounting hole 212 on the power module 210 and is fixedly connected to the threaded hole to press and fix the power module 210 on the boss 114, ensuring that the heat generated by the power module 210 can be efficiently transferred to the boss 114.

[0077] According to another aspect of the embodiment of the present application, an electronic device is provided. Figure 2 and Figure 8 , Figure 2 The exploded structure of some parts of the electronic equipment is shown in Figure 8 The three-dimensional structure of some components of the electronic device is shown in FIG. As shown in the figure, the electronic device 500 includes a circuit board 200 and a liquid cooling and heat dissipation assembly 100 in any of the above embodiments. A heating device is arranged on the circuit board 200. The heating device includes a power module 210 and other heating devices 220. The height of the power module 210 is lower than the height of at least some of the other heating devices 220. The liquid cooling and heat dissipation assembly 100 is used to fit with the power module 210 and at least some of the other heating devices 220 for heat dissipation.

[0078] The electronic device 500 provided in the embodiment of the present application adopts the liquid cooling and heat dissipation assembly 100 provided in any of the above embodiments to dissipate heat from the power module 210 and other heat-generating devices 220 on the circuit board 200, thereby meeting the high heat dissipation requirements of the power module 210 and improving the reliability of the operation of the power module 210.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way.

Claims

1. A liquid cooling heat dissipation assembly, used for dissipating heat from a plurality of heat generating devices on a circuit board, wherein the heat generating devices include a power module, the height of the power module is lower than the height of at least some other heat generating devices on the circuit board, and is characterized in that: The liquid cooling heat dissipation assembly comprises: a base and a cover plate; A flow channel is provided on the first surface of the base, and a liquid inlet and a liquid outlet are provided on the base, which are respectively connected to two ends of the flow channel, the liquid inlet is used for supplying coolant into the flow channel, and the liquid outlet is used for supplying coolant out of the flow channel; The cover plate is disposed on the first surface of the base body and closes the flow channel; A heat dissipation channel is arranged in the flow channel, and a boss is formed on the second surface of the substrate opposite to the first surface of the substrate at a position opposite to the heat dissipation channel, and the boss is used to fit with the power module, and other positions on the second surface of the substrate are used to fit with at least some of the other heat-generating devices, so that when the coolant flows through the heat dissipation channel, it contacts the inner wall of the heat dissipation channel, so as to take away the heat of the power module through the boss, and when the coolant flows through other areas of the flow channel, the heat of at least some of the other heat-generating devices is taken away through the substrate.

2. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The depth of the heat dissipation channel is greater than the depth of other areas in the flow channel; The liquid-cooled heat dissipation component also includes a blocking member, which is accommodated inside the heat dissipation channel. One side of the blocking member is sealed to the cover plate, and both sides of the blocking member along the width direction of the heat dissipation channel abut against the inner wall of the heat dissipation channel, and the other side of the blocking member leaves a gap with the inner wall of the heat dissipation channel.

3. The liquid cooling heat dissipation assembly according to claim 2, characterized in that: The inner walls of the heat dissipation channel on both sides along the width direction are provided with a plurality of first plug-in blocking parts, and the outer walls of the blocking member on both sides along the width direction are provided with a plurality of second plug-in blocking parts, and the first plug-in blocking parts and the second plug-in blocking parts are abutted and matched one by one to prevent the coolant from flowing between the inner walls of the heat dissipation channel on both sides along the width direction and the blocking member.

4. The liquid cooling heat dissipation assembly according to claim 3, characterized in that: A first step portion is provided at the opening of the heat dissipation channel, and a second step portion is provided on the blocking member. The first step portion abuts against and cooperates with the second step portion, so that the blocking member is pressed tightly against the cover plate.

5. The liquid cooling heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The second surface of the base and the boss are arranged upward, the second surface of the base is used to fit with at least part of the other heating components inverted on the circuit board, and the boss is used to fit with the power module inverted on the circuit board.

6. The liquid cooling heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The base body is surrounded by the second surface to form a limiting wall, and a heat dissipation cavity is formed inside the limiting wall. The heat dissipation cavity is used to accommodate the circuit board.

7. The liquid cooling heat dissipation assembly according to claim 6, characterized in that: The liquid inlet and the liquid outlet are arranged on the limiting wall, and the liquid inlet and the liquid outlet are used to be connected to an external coolant pipeline on the outer side of the limiting wall.

8. The liquid cooling heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The boss and the base are an integral structure.

9. The liquid cooling heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The inner wall of the heat dissipation channel is provided with heat dissipation teeth, and the heat dissipation teeth are arranged along the extension direction of the heat dissipation channel.

10. An electronic device, characterized in that: A liquid cooling and heat dissipation assembly comprising a circuit board and any one of claims 1 to 9, wherein a heating device is arranged on the circuit board, the heating device comprises a power module, and the height of the power module is lower than the height of at least part of other heating devices; The liquid-cooled heat dissipation component is used to fit together with the power module and at least part of the other heat-generating devices to dissipate heat.

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