A modular structure

Abstract

The present application relates to the field of heat dissipation technology, and in particular to a module structure. The module structure includes a circuit board, a heat dissipation housing, and a chip assembly; the heat dissipation housing and the circuit board are arranged to form a receiving space; the chip assembly is arranged on one side of the circuit board and is located in the receiving space; wherein, the heat dissipation housing is provided with a boss, which is thermally connected to the chip assembly, and the heat of the chip assembly can be directly transferred to the heat dissipation housing, thereby improving the heat dissipation efficiency of the chip assembly, improving the problem of poor heat dissipation effect of the chip assembly, and improving the problem of reduced charging efficiency due to excessive temperature of the module structure.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a module structure for wireless charging. Background Art

[0002] In the prior art, the heat conduction path of the chip assembly in the mobile phone wireless charger is mainly: chip assembly - circuit board - heat dissipation housing. Therefore, the heat conduction of the chip assembly needs to pass through the circuit board, and the circuit board is usually made of FR4 material (glass fiber reinforced epoxy resin laminate). The thermal conductivity of FR4 is low, which will lead to poor heat dissipation effect of the chip assembly, heat accumulation and temperature rise. When the temperature of the chip assembly rises, it will cause the chip assembly to overheat and trigger the over-temperature protection mechanism, which will reduce the charging efficiency of the mobile phone wireless charger. Utility Model Content

[0003] The embodiment of the present application aims to provide a module structure, so as to at least improve the problem of poor heat dissipation of chip components.

[0004] In order to solve the above technical problems, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a module structure, which includes a circuit board, a heat dissipation shell and a chip assembly; the heat dissipation shell and the circuit board are arranged to form a accommodating space; the chip assembly is arranged on one side of the circuit board and is located in the accommodating space; wherein the heat dissipation shell is provided with a boss, and the boss is thermally connected to the chip assembly.

[0006] In some embodiments, the module structure further includes a heat-conducting component, which is disposed between the boss and the chip assembly, and is flexible.

[0007] In some embodiments, the heat-conducting component includes at least one of a heat-conducting glue, a heat-conducting layer, and a heat-conducting elastic member.

[0008] In some embodiments, the heat-conducting component includes a heat-conducting glue and a heat-conducting layer, the heat-conducting layer is arranged on the side of the chip component away from the circuit board, and the heat-conducting glue is arranged between the heat-conducting layer and the boss; wherein the thermal conductivity of the heat-conducting layer is greater than the thermal conductivity of the heat-conducting glue.

[0009] In some embodiments, the chip assembly includes a chip and a protection layer, wherein the protection layer covers at least a portion of a side surface of the chip; and the boss is thermally connected to a top surface of the chip assembly.

[0010] In some embodiments, the protection layer also covers at least a portion of the top surface of the chip.

[0011] In some embodiments, the boss is in the shape of a thin-walled shell.

[0012] In some embodiments, the thermal conductivity of the heat dissipation housing is greater than the thermal conductivity of the circuit board.

[0013] In some embodiments, a transmitting coil and a wiring layer are respectively disposed on opposite sides of the circuit board, and the chip component is disposed on a side of the wiring layer away from the transmitting coil.

[0014] In some embodiments, there are multiple bosses, and multiple bosses are thermally connected to one chip component.

[0015] In some embodiments, there are multiple chip components, and multiple chip components are thermally connected to one boss.

[0016] In some embodiments, the number of the bosses and the number of the chip components are both plural, and one of the bosses among the plurality of bosses is thermally connected to one of the chip components among the plurality of chip components.

[0017] In the module structure of the embodiment of the present application, the heat dissipation shell is thermally connected to the chip assembly through a boss, and the heat of the chip assembly can be directly transferred to the heat dissipation shell, thereby improving the heat dissipation efficiency of the chip assembly, improving the problem of poor heat dissipation effect of the chip assembly, and improving the problem of reduced charging efficiency due to excessively high temperature in the module structure.

[0018] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0020] Figure 1 is a cross-sectional view of a module structure of an embodiment of the present application;

[0021] Figure 2 is a cross-sectional view of a module structure of an embodiment of the present application;

[0022] Figure 3 is a cross-sectional view of a module structure of an embodiment of the present application;

[0023] Figure 4 is a cross-sectional view of a module structure of an embodiment of the present application;

[0024] Figure 5 It is a cross-sectional view of a module structure according to an embodiment of the present application.

[0025] The reference numerals in the specific implementation manner are as follows:

[0026] 100. Module structure;

[0027] 1. Circuit board; 11. Transmitter coil; 12. Wiring layer;

[0028] 2. front panel; 21. extension;

[0029] 3. heat dissipation housing; 31. boss;

[0030] 4. chip assembly; 41. chip; 42. protective layer;

[0031] 5. thermally conductive component; 51. thermally conductive adhesive; 52. thermally conductive layer;

[0032] M. Accommodation space. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0036] In the description of the embodiments of the present application, the use of words such as "first" and "second" to define components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meanings and therefore cannot be understood as limiting the scope of protection of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0038] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0039] The present application embodiment provides a module structure 100, such as Figure 1 As shown, the module structure 100 includes a circuit board 1, a heat dissipation housing 3 and a chip assembly 4. The module structure 100 may also include a front panel 2. The circuit board 1 and the heat dissipation housing 3 are both arranged on the front panel 2, and the heat dissipation housing 3 and the circuit board 1 are surrounded to form an accommodating space M; the chip assembly 4 is arranged on one side of the circuit board 1 and is located in the accommodating space M. Among them, the module structure 100 is used to wirelessly charge the device to be charged, and the device to be charged can be a mobile phone, a watch, a wireless headset, and other devices that can be wirelessly charged.

[0040] For the above circuit board 1, if Figure 1 , the circuit board 1 is in a flat plate shape. The circuit board 1 is used to connect the chip assembly 4. In some embodiments, Figure 1, a transmitting coil 11 and a wiring layer 12 are respectively arranged on opposite sides of the circuit board 1. The transmitting coil 11 is used to generate an electromagnetic field to charge the device to be charged. The transmitting coil 11 is a coil formed by a wire wrapped around a core layer, such as a coil formed by an enameled copper wire. The wiring layer 12 is used to connect electrical components on the circuit board 1, such as connecting the chip assembly 4. The wiring layer 12 includes a copper foil attached to the surface of the circuit board 1. In this embodiment, the side of the circuit board 1 where the transmitting coil 11 is located faces the front panel 2, and the chip assembly 4 is arranged on the side of the wiring layer 12 away from the transmitting coil 11.

[0041] For the above-mentioned front panel 2, if Figure 1 , the front panel 2 is in the shape of a flat plate, and the front panel 2 is used to place the device to be charged. The front panel 2 is made of an insulating material, such as a plastic material, so that the magnetic flux lines can pass through the front panel 2. The edge of the front panel 2 has an extension portion 21, and the extension portion 21 extends toward the side where the circuit board 1 is located, and extends beyond the circuit board 1. The circuit board 1 is installed in the groove formed by the front panel 2, which is conducive to defining the relative position between the circuit board 1 and the front panel 2, so that when the device to be charged is placed in the first preset position of the front panel 2, the device to be charged is in the second preset position relative to the transmitting coil 11, and the second preset position can be the best position for the device to be charged to perform wireless charging, thereby improving the charging efficiency when the user correctly places the device to be charged. It can be understood that in some embodiments, the extension portion 21 can also be located in the heat dissipation housing 3, that is, the relative position between the circuit board 1 and the heat dissipation housing 3 is defined by the extension portion 21, and the extension portion 21 can also be used to connect with the front panel 2, thereby defining the relative position between the circuit board 1 and the front panel 2.

[0042] For the above heat dissipation housing 3, Figure 1 The heat dissipation shell 3 is in the shape of a shell with an opening at one end. The heat dissipation shell 3 is connected to the extension portion 21 of the front panel 2 to form a sealed space between the heat dissipation shell 3 and the front panel 2. The circuit board 1 and the chip assembly 4 are arranged in the sealed space to protect the circuit board 1 and the chip assembly 4 and extend the service life of the circuit board 1 and the chip assembly 4.

[0043] It is understandable that the chip assembly 4 generates a large amount of heat when working, and the heat can be transferred from the circuit board 1 to the heat dissipation housing 3, or from the air to the heat dissipation housing 3. The thermal conductivity of air is 0.023W / mk, so air is a poor conductor of heat, that is, the heat conduction path of the chip assembly 4 in the module structure 100 is mainly: chip assembly 4-circuit board 1-heat dissipation housing 3. Therefore, the heat conduction of the chip assembly 4 needs to pass through the circuit board 1, and the circuit board 1 is usually FR4 material (glass fiber reinforced epoxy resin laminate), and the thermal conductivity of FR4 is 0.2 to 0.8W / mk. The low thermal conductivity of FR4 will lead to poor heat dissipation of the chip assembly 4, heat accumulation, and temperature rise. When the temperature of the chip assembly 4 rises, it will cause the chip assembly 4 to overheat and trigger the over-temperature protection mechanism, which will reduce the charging efficiency of the wireless charger.

[0044] The heat of the chip assembly 4 is also transferred to the front panel 2, causing the temperature of the front panel 2 to rise, resulting in an increase in the temperature of the device to be charged placed on the front panel 2. The increase in the temperature of the device to be charged will shorten the life of the device to be charged and trigger the over-temperature protection mechanism, reducing the charging efficiency of the device to be charged.

[0045] To improve the above problems, in some embodiments, Figure 2 As shown, the heat dissipation housing 3 is provided with a boss 31, and the boss 31 is thermally connected to the chip assembly 4. Thermal connection means that heat can be transferred between the two, that is, heat can be transferred between the chip assembly 4 and the boss 31. The heat of the chip assembly 4 can be directly transferred to the heat dissipation housing 3, thereby improving the heat dissipation efficiency of the chip assembly 4, improving the problem of poor heat dissipation effect of the chip assembly 4, and improving the problem of reduced charging efficiency of the module structure 100 due to excessive temperature. It can also reduce the heat transfer to the front panel 2, reduce the temperature of the front panel 2, and improve the problem of reduced charging efficiency of the device to be charged due to excessive temperature.

[0046] Among them, the chip component 4 includes a bottom surface, a top surface and a side surface, the bottom surface is a surface of the chip component 4 that contacts the circuit board 1, the top surface is a surface of the chip component 4 that faces away from the circuit board 1, and the side surface is the other surface of the chip component 4 except the top surface and the bottom surface; the heat dissipation housing 3 can be in thermal contact with the top surface and / or side surface of the chip component 4.

[0047] In some embodiments, Figure 2 As shown, the boss 31 is in the shape of a thin-walled shell, and the boss 31 can be stamped and formed on the heat dissipation shell 3. When the heat dissipation shell 3 is manufactured, it is usually formed by stamping a thin sheet, and the boss 31 can be stamped and formed in the stamping process, thereby reducing the production cost of the heat dissipation shell 3.

[0048] In some embodiments, the thermal conductivity of the heat dissipation housing 3 is greater than that of the circuit board 1. The heat dissipation housing 3 can be made of metal, such as aluminum, stainless steel, copper, etc., which has better thermal conductivity than the circuit board 1, which is beneficial to improve the heat dissipation effect of the chip assembly 4.

[0049] In some embodiments, Figure 3 As shown, the number of bosses 31 and chip components 4 are both multiple, and one boss 31 among the multiple bosses 31 is thermally connected to one chip component 4 among the multiple chip components 4. When the number of chip components 4 is multiple, the boss 31 can also be set to multiple accordingly, so that each chip component 4 can be thermally connected to the heat dissipation housing 3, improve the heat dissipation efficiency of each chip component 4, and improve the problem of poor heat dissipation effect of each chip component 4. It can be understood that multiple bosses 31 can also be thermally connected to one chip component 4, which is beneficial to improve the heat dissipation efficiency of a single chip component 4; it can also be that multiple chip components 4 are thermally connected to one boss 31, reducing the number of bosses 31, while increasing the size of the boss 31, thereby reducing the difficulty of stamping the boss 31, reducing the defective rate during the production of the heat dissipation housing 3, and reducing the production cost of the heat dissipation housing 3.

[0050] For the above chip assembly 4, if Figure 4 and Figure 5 As shown, the chip assembly 4 includes a chip 41 and a protective layer 42, and the protective layer 42 covers at least part of the surface of the chip 41. The protective layer 42 can protect the surface of the chip 41 and extend the service life of the chip 41. The protective layer 42 can be made of plastic material and covered on the surface of the chip 41 by injection molding, which reduces production costs and improves the fit with the surface of the chip 41. The protective layer 42 can be made of insulating material to enhance the insulation of the chip assembly 4. Optionally, the material of the protective layer 42 is EMC (Epoxy Molding Compound).

[0051] In some embodiments, Figure 4 As shown, the protective layer 42 covers the side of the chip 41. The chip 41 includes a bottom surface, a top surface and a side surface. The bottom surface is a surface of the chip 41 in contact with the circuit board 1, the top surface is a surface of the chip 41 facing away from the circuit board 1, and the side surface is the other surface of the chip 41 except the top surface and the bottom surface. The top surface of the chip 41 is exposed, and the boss 31 is thermally connected to the top surface of the chip assembly 4, that is, the top surface of the chip 41 is thermally connected to the boss 31, so as to reduce the influence of the protective layer 42 on the heat conduction between the chip 41 and the boss 31, and improve the heat conduction efficiency between the chip 41 and the boss 31. It can be understood that the protective layer 42 can cover part of the side surface or the entire side surface of the chip 41.

[0052] In some embodiments, Figure 5As shown, the protective layer 42 also covers the top surface of the chip 41. The protective layer 42 covers the top surface of the chip 41, which can protect the top surface of the chip 41, improve the problem of the boss 31 squeezing the chip 41 and causing damage to the chip 41, and enhance the insulation between the chip 41 and the boss 31. The thickness of the protective layer 42 covering the top surface of the chip 41 can be appropriately reduced to improve the thermal conductivity between the chip 41 and the boss 31. For example, the thickness of the protective layer 42 covering the top surface of the chip 41 can be 10% to 50% of the thickness of the protective layer 42 covering the side of the chip 41. It is understandable that the protective layer 42 can cover part of the top surface or the entire top surface of the chip 41.

[0053] In some embodiments, Figure 4 and Figure 5 As shown, the module structure 100 also includes a heat-conducting component 5, which is disposed between the boss 31 and the chip assembly 4, and the heat-conducting component 5 is flexible. Due to the limitation of the production process, the manufacturing precision of the heat dissipation housing 3 is usually not high. When the heat dissipation housing 3 is installed on the front panel 2, the boss 31 may not contact the chip assembly 4. However, the heat-conducting component 5 is flexible. Under the extrusion of the boss 31 and the chip assembly 4, the heat-conducting component 5 can be deformed to a suitable thickness, so that the heat dissipation housing 3 can be installed on the front panel 2, and the boss 31 and the chip assembly 4 are thermally connected through the heat-conducting component 5, thereby improving the problem that the boss 31 does not contact the chip assembly 4 after the heat dissipation housing 3 is installed due to the low manufacturing precision of the heat dissipation housing 3.

[0054] Among them, Figure 5 As shown, when the protective layer 42 also covers the top surface of the chip 41, the heat conducting member 5 is disposed between the boss 31 and the protective layer 42; Figure 4 As shown, when the protection layer 42 does not cover the top surface of the chip 41 , the heat conducting component 5 is disposed between the boss 31 and the chip 41 , and part of the heat conducting component 5 may also extend between the boss 31 and the protection layer 42 .

[0055] The heat-conducting member 5 includes at least one of a heat-conducting adhesive 51 and a heat-conducting layer 52. The heat-conducting adhesive 51 can be a heat-conducting adhesive such as heat-conducting silicone grease and heat-conducting silica gel; the heat-conducting layer 52 can be a heat-conducting sheet such as a heat-conducting gasket and a silica gel gasket.

[0056] When the heat-conducting component 5 includes the heat-conducting adhesive 51. Due to the limitation of the production process, the flatness of the boss 31 is usually not high. When the boss 31 directly contacts the chip component 4, there will be more gaps between the two, so that the effective contact area between the two is not large, and the heat conduction efficiency between the boss 31 and the chip component 4 is reduced. The heat-conducting adhesive 51 has plasticity. When the boss 31 and the chip component 4 squeeze the heat-conducting component 5, the heat-conducting adhesive 51 can extend into the depression on the boss 31 to increase the effective contact area between the boss 31 and the chip component 4, improve the heat conduction efficiency between the boss 31 and the chip component 4, and then improve the heat dissipation efficiency of the chip component 4.

[0057] In some embodiments, Figure 4 and Figure 5 As shown, the heat-conducting component 5 includes a heat-conducting glue 51 and a heat-conducting layer 52, the heat-conducting layer 52 is arranged on the side of the chip component 4 away from the circuit board 1, and the heat-conducting glue 51 is arranged between the heat-conducting layer 52 and the boss 31. Among them, the thermal conductivity of the heat-conducting layer 52 is greater than the thermal conductivity of the heat-conducting glue 51. Since the thermal conductivity of the heat-conducting layer 52 is greater than the thermal conductivity of the heat-conducting glue 51, compared with the heat-conducting component 5 not including the heat-conducting layer 52, the overall thermal conductivity of the heat-conducting component 5 is greater than the thermal conductivity of the heat-conducting glue 51, thereby improving the heat conduction efficiency between the boss 31 and the chip component 4, and at the same time improving the problem that the effective contact area between the boss 31 and the chip component 4 is not large and the problem that the boss 31 does not contact the chip component 4 after the heat dissipation housing 3 is installed. Optionally, the heat-conducting layer 52 is a metal layer, such as a copper sheet or copper plating.

[0058] In some embodiments, the heat-conducting component 5 includes a heat-conducting elastic member (not shown). The heat-conducting elastic member can be a mechanical structure with a deformation effect such as a metal spring and a metal spring. The heat-conducting elastic member can also be a composite mechanical structure, such as a scissor-type structure composed of metal rods. The heat-conducting component 5 can include a heat-conducting elastic member and a heat-conducting adhesive 51 at the same time, or include a heat-conducting elastic member and a heat-conducting layer 52 at the same time. The heat-conducting component 5 can also include a heat-conducting elastic member, a heat-conducting adhesive 51 and a heat-conducting layer 52 at the same time. For example, the heat-conducting adhesive 51 and / or the heat-conducting layer 52 are arranged on the heat-conducting elastic member. Among them, the heat-conducting adhesive 51 and / or the heat-conducting layer 52 can be arranged on the side of the heat-conducting elastic member facing the boss 31.

[0059] In order to evaluate the performance of the module structure 100 of the embodiment of the present application, a heat dissipation simulation test is performed using the chip QFN4X4 as an example.

[0060]

Test object

[0061] Comparative Example: Figure 1 The module structure 100 shown, that is, the heat dissipation housing 3 does not include the boss 31 .

[0062] Example: Figure 2The module structure 100 shown, that is, the heat dissipation housing 3 includes a boss 31 , and the boss 31 is thermally connected to the chip assembly 4 .

[0063]

Test method

[0064] The following tests were performed on the module structure 100 of the above embodiment and comparative example, and the test results are shown in Table 1 below.

[0065] (1) Measure the T of the chip j , R JA and R JC .

[0066] T j (Junction temperature) represents the junction temperature of the transistor, that is, the temperature of the semiconductor bare chip inside the package, that is, the temperature of the chip 41 in the embodiment of the present application.

[0067] R JC (Juncion-to-Case) represents the thermal resistance between the internal silicon chip and the packaging shell, that is, the thermal resistance between the protective layer 42 and the chip 41 in the embodiment of the present application.

[0068] R JA (Junction-to-Ambient) represents the thermal resistance between the junction and the environment, that is, the thermal resistance between the chip 41 and the environment outside the heat dissipation housing 3 in the embodiment of the present application.

[0069] T j , R JA and R JC All of them can be directly obtained in the simulation software.

[0070] Table 1

[0071] power Ambient temperature <![CDATA[T j ]]> <![CDATA[R JA ]]> <![CDATA[R JC ]]> Comparative Example 1W 20℃ 71.4℃ 51.4℃ / W 19℃ / W Example 1W 20℃ 62.4℃ 42.4℃ / W 9℃ / W

[0072] According to the above Table 1, combined with the embodiments and the comparative examples, it can be seen that the embodiments are compared with the comparative examples. j The temperature dropped by nearly 13%, R JA Reduced by nearly 18%, R JC The reduction is nearly 50%, which greatly improves the heat dissipation capacity of the chip 41 in the module structure 100 and improves the overall charging efficiency. It can be understood that the larger the volume of the chip 41, the more obvious the heat dissipation effect of the boss 31 on the chip 41.

[0073] In the module structure 100 of the embodiment of the present application, the heat dissipation housing 3 is thermally connected to the chip assembly 4 through the boss 31. The heat of the chip assembly 4 can be directly transferred to the heat dissipation housing 3, thereby improving the heat dissipation efficiency of the chip assembly 4, improving the problem of poor heat dissipation effect of the chip 41, and improving the problem of reduced charging efficiency due to excessive temperature in the module structure 100. When the module structure 100 includes a front panel 2, it can also reduce the heat transfer to the front panel 2, reduce the temperature of the front panel 2, and improve the problem of reduced charging efficiency of the device to be charged due to excessive temperature. The heat-conducting member 5 can improve the problem that the boss 31 does not contact the chip assembly 4 after the heat dissipation housing 3 is installed due to the low manufacturing precision of the heat dissipation housing 3.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Under the concept of the present application, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present application as above, which are not provided in detail for the sake of simplicity. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A module structure, characterized in that: include: Circuit boards; A heat dissipation housing and the circuit board are arranged to form an accommodating space; A chip assembly is arranged on one side of the circuit board and is located in the accommodating space; Wherein, the heat dissipation housing is provided with a boss, and the boss is thermally connected to the chip assembly.

2. The module structure according to claim 1, characterized in that: The module structure further includes a heat-conducting component, which is disposed between the boss and the chip assembly and is flexible.

3. The module structure according to claim 2, characterized in that: The heat-conducting component includes at least one of a heat-conducting glue, a heat-conducting layer and a heat-conducting elastic member.

4. The module structure according to claim 2, characterized in that: The heat-conducting component comprises a heat-conducting adhesive and a heat-conducting layer, wherein the heat-conducting layer is arranged on a side of the chip component away from the circuit board, and the heat-conducting adhesive is arranged between the heat-conducting layer and the boss; Wherein, the thermal conductivity of the heat-conducting layer is greater than the thermal conductivity of the heat-conducting adhesive.

5. The module structure according to any one of claims 1 to 4, characterized in that: The chip assembly comprises a chip and a protective layer, wherein the protective layer covers at least a portion of a side surface of the chip; The boss is thermally connected to the top surface of the chip assembly.

6. The module structure according to claim 5, characterized in that: The protection layer also covers at least a portion of the top surface of the chip.

7. The module structure according to claim 1, characterized in that: The boss is in the shape of a thin-wall shell.

8. The module structure according to claim 7, characterized in that: The thermal conductivity of the heat dissipation housing is greater than the thermal conductivity of the circuit board.

9. The module structure according to claim 1, characterized in that: A transmitting coil and a wiring layer are respectively arranged on opposite sides of the circuit board, and the chip component is arranged on a side of the wiring layer away from the transmitting coil.

10. The module structure according to claim 1, characterized in that: There are multiple bosses, and multiple bosses are thermally connected to one chip component; And / or, there are multiple chip components, and multiple chip components are thermally connected to one boss; And / or, there are multiple bosses and multiple chip components, and one of the bosses is thermally connected to one of the chip components.

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