Electronic circuit board division fixture

Abstract

The present application discloses an electronic substrate panel separation jig. An electronic substrate panel separation jig comprises: an operating table including a first working surface; a clamping assembly is arranged on the first working surface of the operating table; a flap assembly can be rotatably connected to one side of the operating table; in the panel separation working state, an angle is formed between the second working surface of the flap assembly and the first working surface, and force is applied to the electronic substrate to be separated clamped by the clamping assembly to perform the panel separation operation. It is used to solve the problems of low panel separation yield and low efficiency. The electronic substrate panel separation jig of the embodiment of the present application places the electronic substrate to be separated on the first working surface and the second working surface, clamps the electronic substrate to be separated by the clamping assembly, and rotates the flap assembly so that the electronic substrate panel separation jig switches from the pushing plate working state to the panel separation working state, thereby separating the electronic substrate along the pre-splitting groove. During the segmentation process, the probability of the operator accidentally touching the components on the electronic substrate is reduced, thereby reducing the scrap rate. The structure is simple, the operation is convenient, and the panel separation efficiency is high.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing tools, and in particular, relates to an electronic substrate separation jig. Background Art

[0002] Electronic substrates can be divided into many types according to their materials, structures and uses, such as PCB substrates, metal substrates, ceramic substrates, etc. Taking ceramic substrates as an example, ceramic substrates include copper-clad ceramic substrates, also known as DBC (Direct Bond Copper) substrates, which are a basic electronic material composed of ceramics and copper foil directly bonded thereto, realizing the direct bonding of metal and ceramic. It has excellent properties such as excellent thermal cycling, shape stability and rigidity, and is widely used in many fields.

[0003] Before testing the copper-clad ceramic substrate, it is necessary to split the entire copper-clad ceramic substrate along the pre-cut groove into multiple independent units, and test each unit. The existing method of splitting the entire copper-clad ceramic substrate is mostly manual splitting, which is inefficient and easy to accidentally touch the copper-clad ceramic substrate during the splitting process, thereby damaging the aluminum wire or pins of the copper-clad ceramic substrate, resulting in an increase in the scrap rate. Utility Model Content

[0004] The embodiment of the present application provides an electronic substrate panel separation jig, which can improve the panel separation yield and improve the segmentation efficiency.

[0005] An embodiment of the present application provides an electronic substrate depaneling jig, comprising: an operating table, the operating table comprising a first working surface; a clamping assembly, the clamping assembly being arranged on the first working surface of the operating table and used to clamp the electronic substrate to be depaneled; a flip plate assembly, the flip plate assembly being rotatably connected to one side of the operating table; wherein the electronic substrate depaneling jig comprises a depaneling working state, in which an angle is formed between the second working surface of the flip plate assembly and the first working surface, and force is applied to the electronic substrate to be depaneled clamped by the clamping assembly to perform the depaneling operation.

[0006] An embodiment of the present application provides an electronic substrate depaneling jig, which also includes a push plate working state. In the push plate working state, the second working surface is coplanar with the first working surface, so that the specified position of the electronic substrate to be depaneled in the clamping assembly can be pushed to the second working surface.

[0007] The electronic substrate separation jig provided in the embodiment of the present application, wherein the flip plate assembly comprises:

[0008] A plate body, the plate body comprising a first limiting surface opposite to the operating table;

[0009] A rotating assembly connected between the plate body and the operating table;

[0010] When the push plate is in working state, there is a distance between the first limit surface and the operating table. When the plate separation is in working state, a side of the first limit surface parallel to the rotating assembly can abut against the operating table for limiting position.

[0011] The electronic substrate separation jig provided by the embodiment of the present application, wherein the rotating assembly comprises:

[0012] A mounting seat, the mounting seat being connected to a side of the operating table opposite to the plate body;

[0013] A rotating shaft is rotatably connected to the mounting seat, the first limiting surface is provided with a rotating groove in the depth direction of the plate body, the rotating shaft is placed in the rotating groove, and the rotating shaft is connected to the plate body.

[0014] An embodiment of the present application provides an electronic substrate panel separation jig, wherein the flip plate assembly also includes a lifting actuator, which is connected to the flip plate assembly, and the action of the lifting actuator can switch the pushing plate working state and the panel separation working state.

[0015] The electronic substrate depaneling jig provided in an embodiment of the present application also includes a base, the base includes a flat third work surface, the operating table and the flip plate assembly are placed on the third work surface, the third work surface is provided with a mounting groove in the depth direction of the base, and the mounting groove is placed below the rotatable connection between the flip plate assembly and the operating table.

[0016] An electronic substrate panel separation jig provided in an embodiment of the present application comprises a clamping assembly including a first clamping portion and a second clamping portion spaced apart along the length direction of the first working surface, the first clamping portion being disposed between the flip plate assembly and the second clamping portion, and an adjustment range of a clamping spacing of the first clamping portion being greater than an adjustment range of a clamping spacing of the second clamping portion.

[0017] In the electronic substrate depaneling jig provided in an embodiment of the present application, the first clamping portion and the second clamping portion have the same structure, and the first clamping portion includes:

[0018] A first fixing block, wherein the first fixing block is mounted on the first working surface, and a length direction of the first fixing block is parallel to a length direction of the first working surface;

[0019] A first slide groove, the first slide groove is arranged on the first working surface in the depth direction of the operating table, and the first slide groove extends from the first fixed block to an edge of a side opposite to the first fixed block;

[0020] The first clamping block is slidably installed in the first sliding groove, the gap between the lower surface of the first clamping block and the first working surface is smaller than the thickness of the electronic substrate to be separated, and the first clamping block and the first fixing block can clamp the electronic substrate to be separated.

[0021] An embodiment of the present application provides an electronic substrate depaneling jig, wherein the first fixing block includes a first limiting groove, the first clamping block includes a second limiting groove, the first limiting groove and the second limiting groove are relatively arranged at the same height, and the first limiting groove and the second limiting groove can limit the electronic substrate to be depaneled.

[0022] An embodiment of the present application provides an electronic substrate panel separation jig, wherein the clamping assembly further includes a clamping actuator, and the clamping actuator is connected to the first clamping portion and the second clamping portion to control the clamping spacing between the first clamping portion and the second clamping portion.

[0023] The electronic substrate depaneling jig provided in an embodiment of the present application further includes a pushing assembly. When the push plate is in a working state, the pushing assembly can move linearly a specified distance toward the direction close to the flip plate assembly; when the depaneling working state, the pushing assembly abuts against the electronic substrate to be depaneled.

[0024] The electronic substrate splitting jig of the embodiment of the present application places the electronic substrate to be split on the first working surface and the second working surface, places the pre-dividing groove of the electronic substrate to be split at the junction of the first working surface and the second working surface, clamps the electronic substrate to be split by a clamping assembly, and rotates the flip assembly to switch the electronic substrate splitting jig from a pushing plate working state to a splitting plate working state, thereby splitting the electronic substrate along the pre-dividing groove. During the splitting process, the probability of the operator accidentally touching the components on the electronic substrate is reduced, thereby reducing the scrap rate. The structure is simple, the operation is convenient, and the splitting efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] Figure 1 This is a schematic diagram of the structure of the electronic substrate separation jig in some embodiments of the present application in a plate pushing working state;

[0027] Figure 2 This is a schematic diagram of the structure of the electronic substrate depaneling jig in some embodiments of the present application in the depaneling working state;

[0028] Figure 3A perspective view of an electronic substrate depaneling jig according to some embodiments of the present application;

[0029] Figure 4 A line chart comparing the yield rates of electronic substrate separation jigs of some embodiments of the present application and traditional separation jigs;

[0030] Figure 5 This is a bar chart comparing the separation efficiency of the electronic substrate separation jig according to some embodiments of the present application and the traditional separation fixture.

[0031] Reference numerals:

[0032] 100: operating table; 101: first working surface; 200: flap assembly; 201: second working surface; 202: first limiting surface; 210: rotating shaft; 211: mounting seat; 212: rotating groove; 220: plate body; 300: clamping assembly; 310: first clamping part; 311: first fixed block; 312: first slide groove; 313: first clamping block; 301: first limiting groove; 302: second limiting groove; 320: second clamping part; 321: second fixed block; 322: second clamping block; 323: second slide groove; 400: base; 401: third working surface; 402: mounting groove. DETAILED DESCRIPTION

[0033] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0035] The initial state of the DBC board is a complete large board with a pre-cut groove on the back. The depth of the pre-cut groove is 30%-40% of the thickness of the DBC board. The DBC board can be pre-divided into small pieces along the pre-cut groove, and there are waste edges all around the DBC board; when the DBC board arrives at the testing station, the waste edges should be removed first, and then the large DBC board should be divided into separate small pieces along the pre-cut groove for testing.

[0036] At present, manual cutting is mainly used to cut DBC boards from large boards into small pieces. The DBC board is placed on a metal plate. The operator first removes the waste edge with a special wrench, then places the DBC board against the positioning block on one side of the metal plate, and then uses a special wrench to cut the DBC board into strips along the pre-cut grooves, and then cuts the strips into small pieces. When cutting the DBC board, it is easy to touch the chip by mistake, causing the aluminum wire on the chip to collapse and the pins to bend; uneven force can easily crack the ceramic edge; the metal plate cannot fix the bent DBC; and the cutting efficiency is low.

[0037] In order to solve the problems in the prior art, the embodiment of the present application provides an electronic substrate depaneling jig. The electronic substrate depaneling jig provided by the embodiment of the present application is first introduced below.

[0038] Figure 1 A schematic diagram of the structure of an electronic substrate separation jig in some embodiments of the present application in a plate pushing working state is shown; Figure 2 A schematic structural diagram of an electronic substrate depaneling jig in some embodiments of the present application in a depaneling working state is shown.

[0039] like Figure 1 and Figure 2 As shown, an electronic substrate depaneling jig comprises: an operating table 100, a clamping assembly 300 and a flip assembly 200, wherein the operating table 100 comprises a first working surface 101; the clamping assembly 300 is arranged on the first working surface 101 of the operating table 100, and is used to clamp the electronic substrate to be depaneled; the flip assembly 200 can be rotatably connected to one side of the operating table 100; wherein, the electronic substrate depaneling jig comprises a depaneling working state, in which the second working surface 201 of the flip assembly 200 forms an angle with the first working surface 101, and force is applied to the electronic substrate to be depaneled clamped by the clamping assembly 300 to perform the depaneling operation.

[0040] Specifically, the electronic substrate to be separated can be a DBC board, and the following description will be made by taking the DBC board as an example. The DBC board is placed on the operating table 100 with one side having the pre-cut groove in contact with the first working surface 101. The DBC board is divided into a first part and a second part with any pre-cut groove as a dividing line. The first part is placed on the first working surface 101 of the operating table 100 or suspended above it, and the second part is placed on the second working surface 201 of the flap assembly 200. Both sides of the second part of the DBC board are clamped by the clamping assembly 300 to fix the DBC board in a specified position to prevent the DBC board from being displaced when the flap assembly 200 applies force to the DBC board, thereby ensuring high efficiency and high quality of the separation operation.

[0041] The flap assembly 200 rotates around one side of the operating table 100, and the rotation direction is the direction in which the second working surface 201 approaches the first working surface 101. After the flap assembly 200 rotates by a preset angle, the first working surface 101 and the second working surface 201 form a preset angle, and the preset angle causes the first part and the second part of the DBC board to be subjected to a bending force, and the first part and the second part are separated along the pre-cut groove.

[0042] The first and second parts of the DBC board are quickly separated along the pre-cut groove by rotating the flap assembly 200, without manual force to break it, which saves effort and has high separation efficiency. The rotation force of the flap assembly 200 avoids touching the aluminum wires, pins and other structures on the DBC board, reduces the scrap rate, and can fix the bent DBC board.

[0043] In addition, the width of the second working surface 201 of the flap assembly 200 is greater than or equal to the width of the first portion of the DBC plate, so that the flap assembly 200 applies uniform force to the DBC plate during rotation, thereby improving the quality of segmentation.

[0044] Continue to refer Figure 1 In one embodiment of the present application, the electronic substrate depaneling jig also includes a pushing plate working state. In the pushing plate working state, the second working surface 201 is coplanar with the first working surface 101, so that the designated position of the electronic substrate to be depaneled in the clamping assembly 300 can be pushed onto the second working surface 201.

[0045] That is to say, the electronic substrate panel splitting jig switches between the pushing plate working state and the panel splitting working state. After the panel splitting working state is completed, it enters the pushing plate working state, and the flip plate assembly 200 is reset, so that the second working surface 201 and the first working surface 101 are coplanar, that is, the second working surface 201 and the first working surface 101 are 180 degrees, and the DBC board on the first working surface 101 is pushed toward the second working surface 201 until the position of the next pre-cutting groove of the DBC board is placed between the first working surface 101 and the second working surface 201; in other words, the remaining part of the DBC board that needs to be split, that is, the designated position, is moved to the second working surface 201, and after entering the panel splitting working state, the part of the DBC board that needs to be split is split.

[0046] Among them, when the push plate is in working state, if the width of the DBC plate remains unchanged and only moves a specified distance toward the second working surface 201, the position of the clamping assembly 300 remains unchanged. When the push plate is in motion, the clamping assembly 300 can play a guiding role. The operator can remove his hand from the clamping assembly 300 to reduce the resistance between the clamping assembly 300 and the DBC plate, thereby facilitating the movement of the DBC plate.

[0047] If the width of the DBC board changes, in the push plate working state, the clamping spacing of the clamping assembly 300 needs to be greater than or equal to the DBC board. When the DBC board is placed at the designated positions of the second working surface 201 and the first working surface 101, it enters the board splitting working state, and the clamping assembly 300 is required to clamp the DBC board, and then the flip plate assembly 200 is rotated to realize the board splitting operation.

[0048] In addition, in other embodiments of the present application, when the push plate is in working state, the first working surface 101 and the second working surface 201 may not be coplanar, for example, the angle between the first working surface 101 and the second working surface 201 is greater than 180 degrees, and after the DBC plate is pushed, it is placed above the second working surface 201, with a gap between the first working surface 101 and the second working surface 201. Alternatively, the angle between the first working surface 101 and the second working surface 201 is close to 180, so as not to affect the smooth pushing of the DBC plate.

[0049] Figure 3 A perspective view of an electronic substrate depaneling jig according to some embodiments of the present application is shown.

[0050] like Figure 3 As shown, in other embodiments of the present application, the flip plate assembly 200 includes: a plate body 220 and a rotating assembly, the plate body 220 includes a first limiting surface 202 opposite to the operating table 100; the rotating assembly is connected between the plate body 220 and the operating table 100; in the pushing plate working state, there is a gap between the first limiting surface 202 and the operating table 100, and in the split plate working state, the side of the first limiting surface 202 parallel to the rotating assembly can be abutted against the operating table 100 for limiting.

[0051] Specifically, the flap assembly 200 forms a limit during the rotation process through the plate body 220 and the operating table 100, thereby limiting the rotation angle of the flap assembly 200 and preventing the flap assembly 200 from rotating too much, causing defects such as bending of the DBC board pins and collapse of the aluminum wire during the panel separation operation.

[0052] For example, the second working surface 201 is a surface of the plate body 220, and the first limiting surface 202 is perpendicular to the second working surface 201; when the push plate is in the working state, there is a gap between the first limiting surface 202 and the operating table 100, which provides a rotation space for the plate body 220 to rotate relative to the operating table 100. Since the rotation angle of the plate body 220 is small, for example, the rotation angle is less than or equal to 20 degrees, the gap is also small. Among them, the surface of the operating table 100 opposite to the first limiting surface 202 can also be a flat surface, and is perpendicular to the first working surface 101.

[0053] In the panel splitting working state, the plate body 220 rotates around the rotating assembly toward the first working surface 101 until one side of the first limiting surface 202 contacts the operating table 100, so that the plate body 220 reaches a specified rotation angle, for example, the edge where the first limiting surface 202 intersects with the first working surface 101 contacts the operating table 100, thereby achieving the purpose of limiting.

[0054] Continue to refer Figure 3 In an optional embodiment of the present application, the rotating assembly includes: a mounting seat 211 and a rotating shaft 210, the mounting seat 211 is connected to a side of the operating table 100 opposite to the plate body 220; the rotating shaft 210 is rotatably connected to the mounting seat 211, and the first limiting surface 202 is provided with a rotating groove 212 in the depth direction of the plate body 220, the rotating shaft 210 is placed in the rotating groove 212, and the rotating shaft 210 is connected to the plate body 220.

[0055] There is a gap between the rotation groove 212 and the mounting seat 211, so that the mounting seat 211 can rotate around the rotation shaft 210 in the rotation groove 212. For example, a through hole is provided in the plate body 220, the through hole is connected with the rotation groove 212, the axis of the through hole is formed with the second working surface 201, and the rotation shaft 210 is placed in the through hole. The mounting seat 211 can be placed in the middle of the first limiting surface 202, so that the rotation of the plate body 220 is more stable.

[0056] like Figures 1 to 3 As shown, in some other optional embodiments of the present application, the electronic substrate panel separation jig also includes a base 400, the base 400 includes a flat third work surface 401, the operating table 100 and the flip plate assembly 200 are placed on the third work surface 401, and the third work surface 401 is provided with a mounting groove 402 in the depth direction of the base 400, and the mounting groove 402 is placed below the rotatable connection between the flip plate assembly 200 and the operating table 100.

[0057] Specifically, the base 400 can place the operating table 100 and the flap assembly 200 on the same horizontal plane, ensuring the levelness of the first working surface 101 and the second working surface 201. Since the flap assembly 200 can rotate, in order to facilitate the rotation of the flap assembly 200, the installation groove 402 is provided to avoid the rotation of the flap assembly 200. Figure 2 As shown, in the panel splitting working state, part of the plate body 220 of the flip plate assembly 200 is placed in the mounting groove 402; when the panel splitting operation is completed, the back side of the second working surface 201 of the plate body 220 falls back onto the third working surface 401 of the base 400, so that in the pushing plate working state, the first working surface 101 is coplanar with the second working surface 201 and is level with the third working surface 401.

[0058] The operating table 100 is completely placed on the base 400, the flap assembly 200 is partially placed on the base 400, and the plate body 220 of the flap assembly 200 is suspended away from one side of the operating table 100, so as to facilitate manual lifting of the plate body 220 or installation of automatic devices.

[0059] like Figure 2 As shown, in a specific embodiment of the present application, the clamping assembly 300 includes a first clamping portion 310 and a second clamping portion 320 spaced apart along the length direction of the first working surface 101, the first clamping portion 310 is placed between the flap assembly 200 and the second clamping portion 320, and the adjustment range of the clamping spacing of the first clamping portion 310 is greater than the adjustment range of the clamping spacing of the second clamping portion 320.

[0060] That is, the first clamping part 310 and the second clamping part 320 can be used simultaneously or separately. When the length of the DBC board is long, the first clamping part 310 and the second clamping part 320 can be used simultaneously to clamp a DBC board for the board separation operation. When the length of the DBC board is short, only the first clamping part 310 close to the flap assembly 200 can be used for clamping.

[0061] The clamping distance between the first clamping portion 310 and the second clamping portion 320 is used to place the DBC board, and the adjustment range of the clamping distance determines the width range of the DBC board that can be clamped by the first clamping portion 310 and the second clamping portion 320 .

[0062] Furthermore, in a specific embodiment of the present application, the first clamping portion 310 and the second clamping portion 320 have the same structure, and the first clamping portion 310 includes: a first fixed block 311, a first slide groove 312 and a first clamping block 313, the first fixed block 311 is installed on the first working surface 101, and the length direction of the first fixed block 311 is set parallel to the length direction of the first working surface 101; the first slide groove 312 is opened in the depth direction of the first working surface 101 toward the operating table 100, and the first slide groove 312 extends from the first fixed block 311 to the side edge opposite to the first fixed block 311; the first clamping block 313 is slidably installed in the first slide groove 312, and the gap between the lower surface of the first clamping block 313 and the first working surface 101 is smaller than the thickness of the electronic substrate to be separated, and the electronic substrate to be separated can be clamped between the first clamping block 313 and the first fixed block 311.

[0063] Among them, the first fixed block 311 is arranged in a strip shape on one side edge of the first working surface 101, and the first slide groove 312 extends from the first fixed block 311 to the opposite edge of the other side of the first working surface 101, and the first slide groove 312 is parallel to the rotating shaft 210. The first clamping block 313 slides on the first slide groove 312 to adjust the distance between the first clamping block 313 and the first fixed block 311, and then the clamping spacing can be adjusted to clamp DBC boards of different sizes. The setting of the first slide groove 312 facilitates the DBC board to be laid flat on the first working surface 101 to ensure the flatness of the DBC board. The sliding of the first clamping block 313 on the first slide groove 312 can be flexibly compatible with DBC boards of different sizes, reducing the time for replacing the kit during the production process, and is not affected by the warping of the DBC board.

[0064] Similarly, the second clamping portion 320 includes: a second fixed block 321, a second slide groove 323 and a second clamping block 322. The second fixed block 321 is installed on the first working surface 101, and the length direction of the second fixed block 321 is set parallel to the length direction of the first working surface 101; the second slide groove 323 is opened in the depth direction of the first working surface 101 toward the operating table 100, and the second slide groove 323 extends from the second fixed block 321 to the side edge opposite to the second fixed block 321; the second clamping block 322 is slidably installed in the second slide groove 323, and the gap between the lower surface of the second clamping block 322 and the first working surface 101 is smaller than the thickness of the electronic substrate to be separated, and the second clamping block 322 and the second fixed block 321 can clamp the electronic substrate to be separated. The first slide groove 312 is parallel to the second slide groove 323, and the length of the first slide groove 312 is greater than the length of the second slide groove 323; the first fixing block 311 and the second fixing block 321 are collinear, and the working principle of the second clamping part 320 is the same as the working principle of the first clamping part 310, which will not be repeated.

[0065] In addition, if Figure 3As shown, in other embodiments of the present application, the first fixed block 311 includes a first limiting groove 301, the first clamping block 313 includes a second limiting groove 302, the first limiting groove 301 and the second limiting groove 302 are relatively arranged at the same height, and the first limiting groove 301 and the second limiting groove 302 can limit the electronic substrate to be separated.

[0066] For example, the bottom of the first limiting groove 301 and the second limiting groove 302 is the first working surface 101, one side of the pre-cut groove of the DBC board contacts the first working surface 101, one side of the chip of the DBC board is engaged with the first limiting groove 301 and the second limiting groove 302, and in the board splitting working state, the first limiting groove 301 and the second limiting groove 302 give the DBC board a force toward the first working surface 101. In the pushing plate working state, the first limiting groove 301 and the second limiting groove 302 have a guiding effect on the DBC board.

[0067] Figure 4 A line chart comparing the yield of the electronic substrate separation jig in some embodiments of the present application and the traditional separation jig; Figure 5 This is a bar chart comparing the separation efficiency of the electronic substrate separation jig in some embodiments of the present application and the traditional separation fixture.

[0068] like Figure 4 and Figure 5 The electronic substrate splitting fixture of the present application is more uniform than the traditional splitting fixture, reduces the problems of burrs and edge collapse, improves the yield rate of DBC board splitting, and at the same time improves the efficiency of DBC board splitting.

[0069] With the advancement of automation equipment, electronic substrate splitting jigs can also be automated. In one embodiment of the present application, the flap assembly 200 also includes a lifting actuator, which is connected to the flap assembly 200, and the action of the lifting actuator can switch the push plate working state and the split plate working state. For example, the lifting actuator is a telescopic cylinder, and the telescopic end of the telescopic cylinder is in contact with the plate body 220. By setting the telescopic distance of the telescopic cylinder, the rotation angle of the plate body 220 in the split plate working state is achieved, and in the push plate working state, the horizontal coplanarity of the first working surface 101 and the second working surface 201 is ensured.

[0070] In addition, in another embodiment of the present application, the clamping assembly 300 further includes a clamping actuator connected to the first clamping portion 310 and the second clamping portion 320 to control the clamping distance between the first clamping portion 310 and the second clamping portion 320 .

[0071] For example, the clamping actuator is an electric cylinder, which pushes the first clamping block 313 and the second clamping block 322 to achieve clamping and loosening of the DBC board.

[0072] In other embodiments of the present application, the electronic substrate depaneling jig further comprises a pushing assembly which, when in the pushing plate working state, can move linearly a specified distance toward the direction close to the flip plate assembly 200; in the depaneling working state, the pushing assembly abuts against the electronic substrate to be depaneled.

[0073] For example, the pushing assembly is an electric cylinder, and the telescopic end of the electric cylinder contacts the side of the DBC plate away from the flap assembly 200. When the pushing plate is in working state, the DBC plate is pushed to move a specified distance toward the flap assembly 200 to realize automatic pushing of the plate.

[0074] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. An electronic substrate separation jig, characterized in that: include: An operating table, the operating table comprising a first working surface; A clamping assembly, the clamping assembly is arranged on the first working surface of the operating table and is used to clamp the electronic substrate to be separated; A flap assembly, the flap assembly being rotatably connected to one side of the operating table; Among them, the electronic substrate panel separation jig includes a panel separation working state. In the panel separation working state, an angle is formed between the second working surface of the flip plate assembly and the first working surface, and force is applied to the electronic substrate to be separated clamped by the clamping assembly to perform the panel separation operation.

2. The electronic substrate depaneling jig according to claim 1, characterized in that: The electronic substrate depaneling jig also includes a push plate working state, in which the second working surface is coplanar with the first working surface, so that the designated position of the electronic substrate to be depaneled in the clamping assembly can be pushed to the second working surface.

3. The electronic substrate depaneling jig according to claim 2, characterized in that: The flap assembly comprises: A plate body, the plate body comprising a first limiting surface opposite to the operating table; A rotating assembly connected between the plate body and the operating table; When the push plate is in working state, there is a distance between the first limit surface and the operating table. When the plate separation is in working state, a side of the first limit surface parallel to the rotating assembly can abut against the operating table for limiting position.

4. The electronic substrate depaneling jig according to claim 3, characterized in that: The rotating assembly comprises: A mounting seat, the mounting seat being connected to a side of the operating table opposite to the plate body; A rotating shaft is rotatably connected to the mounting seat, the first limiting surface is provided with a rotating groove in the depth direction of the plate body, the rotating shaft is placed in the rotating groove, and the rotating shaft is connected to the plate body.

5. The electronic substrate depaneling jig according to claim 2, characterized in that: The flap assembly also includes a lifting actuator, which is connected to the flap assembly. The action of the lifting actuator can switch the push plate working state and the split plate working state.

6. The electronic substrate separation jig according to any one of claims 1 to 5, characterized in that: It also includes a base, which includes a flat third work surface, the operating table and the flap assembly are placed on the third work surface, the third work surface is provided with a mounting groove in the depth direction of the base, and the mounting groove is placed below the rotatable connection between the flap assembly and the operating table.

7. The electronic substrate separation jig according to claim 1 or 5, characterized in that: The clamping assembly includes a first clamping portion and a second clamping portion spaced apart along the length direction of the first working surface, the first clamping portion is placed between the flap assembly and the second clamping portion, and the adjustment range of the clamping spacing of the first clamping portion is greater than the adjustment range of the clamping spacing of the second clamping portion.

8. The electronic substrate depaneling jig according to claim 7, characterized in that: The first clamping portion and the second clamping portion have the same structure, and the first clamping portion includes: A first fixing block, wherein the first fixing block is mounted on the first working surface, and a length direction of the first fixing block is parallel to a length direction of the first working surface; A first slide groove, the first slide groove is arranged on the first working surface in the depth direction of the operating table, and the first slide groove extends from the first fixed block to an edge of a side opposite to the first fixed block; The first clamping block is slidably installed in the first sliding groove, the gap between the lower surface of the first clamping block and the first working surface is smaller than the thickness of the electronic substrate to be separated, and the first clamping block and the first fixing block can clamp the electronic substrate to be separated.

9. The electronic substrate depaneling jig according to claim 8, characterized in that: The first fixing block includes a first limiting groove, the first clamping block includes a second limiting groove, the first limiting groove and the second limiting groove are relatively arranged at the same height, and the first limiting groove and the second limiting groove can limit the electronic substrate to be separated.

10. The electronic substrate depaneling jig according to claim 7, characterized in that: The clamping assembly further includes a clamping actuator connected to the first clamping portion and the second clamping portion to control a clamping distance between the first clamping portion and the second clamping portion.

11. The electronic substrate depaneling jig according to claim 2, characterized in that: It also includes a pushing assembly. When the push plate is in the working state, the pushing assembly can move linearly a specified distance toward the flip plate assembly. When the panel is separated in the working state, the pushing assembly abuts against the electronic substrate to be separated.

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