A heat sink suitable for multilayer micro servo controller

Abstract

The utility model relates to the field of controller heat dissipation technology, and discloses a heat sink suitable for a multi-layer board micro servo controller, including a heat sink, a mounting mechanism is arranged on the heat sink, and the mounting mechanism includes a rivet column, the rivet column is fixedly connected to the top outer wall of the heat sink, a recessed groove is provided on the bottom outer wall of the heat sink, the inner wall of the recessed groove runs through the bottom screw, the outer wall of the rivet column away from the heat sink is clamped with a PCB bottom plate, the top outer wall of the PCB bottom plate is fixedly connected with a knurled single-pass stud, and the end of the knurled single-pass stud away from the PCB bottom plate is fixedly connected with a PCB middle plate. In the utility model, by setting rivet columns, recessed grooves, and other structures, the heat sink and assembly process are ensured to adopt a fully automatic integrated method for the PCB board assembly, and the test production and assembly are completed first, thereby ensuring the efficiency and performance of the product.

Description

Technical Field

[0001] The utility model relates to the technical field of controller heat dissipation, in particular to a heat sink suitable for a multi-layer board micro servo controller. Background Art

[0002] The servo controller, also known as the servo drive, is a controller used to control the servo motor. It is part of the servo system and is mainly used in high-precision positioning systems. It generally controls the servo motor in three ways: position, speed, and torque to achieve high-precision transmission system positioning. It is currently a high-end product in transmission technology.

[0003] The current differences between small servos from various manufacturers are mainly reflected in: system stacking and layout, the location and distribution of terminal blocks, the use of axial electrolytic capacitors or decoupling capacitors, the form and distribution of debugging interfaces, power size, main current overcurrent mode, distribution of core components, software usage methods, etc. It is these differences that form the different performance and product strength of each manufacturer. The servo production process, such as ISMC, directly uses copper pillars to connect all PCB boards. The method requires the boards to be soldered layer by layer from bottom to top. That is, first assemble the power board, thermal conductive silicone pad and heat sink, then screw and fix the copper pillars, and then assemble the control board upwards, and so on.

[0004] The above device has the following defects. It adopts the method of bottom-up board-by-board welding to first assemble the power board, heat sink and thermal conductive silicone pad. Since the thermal conductive silicone pad cannot withstand high temperature, all subsequent welding processes cannot be carried out by conventional methods. Therefore, subsequent welding of current columns and other processes rely on special methods such as spot welding. If manual methods are used for disassembly and installation, the efficiency is low. Therefore, a heat sink suitable for a multi-layer board micro servo controller is proposed to solve the above problems. Utility Model Content

[0005] In order to make up for the above deficiencies, the utility model provides a heat sink suitable for a multi-layer board micro servo controller, aiming to improve the problem in the prior art that the thermally conductive silicone pad cannot withstand high temperatures, resulting in all subsequent welding processes cannot be carried out by conventional methods. Therefore, subsequent welding processes such as current columns rely on special methods such as spot welding, and the efficiency is low if manual methods are used for disassembly and installation.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a heat sink suitable for a multi-layer board micro servo controller, comprising a heat sink, a mounting mechanism is arranged on the heat sink, the mounting mechanism comprises a rivet column, the rivet column is fixedly connected to the top outer wall of the heat sink, a recessed groove is opened on the bottom outer wall of the heat sink, the inner wall of the recessed groove passes through the bottom screw, the outer wall of the rivet column away from the heat sink is clamped with a PCB bottom plate, the top outer wall of the PCB bottom plate is fixedly connected with a knurled single-pass stud, the end of the knurled single-pass stud away from the PCB bottom plate is fixedly connected with a PCB middle layer board, the top outer wall of the PCB middle layer board is fixedly connected with a knurled full-through stud, and the top end of the knurled full-through stud is clamped with the PCB top plate.

[0007] As a further description of the above technical solution: a threaded hole is provided on the top outer wall of the PCB bottom plate, and the threaded hole is threadedly connected to the bottom screw.

[0008] As a further description of the above technical solution: the bottom screw passes through the bottom outer wall of the PCB bottom plate, and the knurled single-pass stud is threadedly connected to the bottom screw.

[0009] As a further description of the above technical solution: a limiting groove is provided on the top outer wall of the PCB top plate.

[0010] As a further description of the above technical solution: a top screw passes through the inner wall of the limiting groove, and one end of the top screw is threadedly connected to the inner wall of the inner ring of the knurled full-through stud.

[0011] As a further description of the above technical solution: a thermal conductive silicone pad is clamped on the top outer wall of the heat sink, and the length and width of the thermal conductive silicone pad are adapted to the PCB bottom plate.

[0012] As a further description of the above technical solution: a mounting hole is provided on the top outer wall of the heat sink.

[0013] In the utility model, by setting structures such as rivet columns, recessed grooves, and bottom screws, the heat sink and assembly process are ensured to adopt a fully automatic integrated method for the PCB board assembly, and the test production and assembly are completed first, thereby ensuring the efficiency and performance of the product and avoiding the undesirable problems of manual welding. At the same time, the connection between the board layers is improved by only using simple studs, which simplifies the structural complexity, ensures the structural strength, and saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the Z-front view of a heat sink suitable for a multilayer micro servo controller proposed by the utility model;

[0015] Figure 2A schematic side view of a heat sink suitable for a multi-layer board micro servo controller proposed by the utility model;

[0016] Figure 3 The utility model is a schematic diagram of a heat sink installation mechanism suitable for a multi-layer board micro servo controller.

[0017] Legend:

[0018] 1. Heat sink; 2. Mounting hole; 4. Mounting mechanism; 40. Rivet stud; 41. Recessed groove; 42. Bottom screw; 43. Threaded hole; 44. PCB bottom plate; 45. PCB middle plate; 46. PCB top plate; 47. Limiting groove; 48. Top screw; 49. Knurled single-pass stud; 410. Knurled full-pass stud; 411. Thermal conductive silicone pad. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Reference Figure 1-Figure 3 The utility model provides an embodiment: a heat sink suitable for a multi-layer board micro servo controller, comprising a heat sink 1, characterized in that: a mounting mechanism 4 is arranged on the heat sink 1, the mounting mechanism 4 comprises a rivet post 40, another feature of the rivet post hole is that it is hollow, the hollow inner wall comprises a thread, and can be adapted with a corresponding screw, the rivet post 40 is fixedly connected to the top outer wall of the heat sink 1, the bottom outer wall of the heat sink 1 is provided with a recessed groove 41, the inner wall of the recessed groove 41 passes through the bottom screw 42, the outer wall of the rivet post 40 away from the heat sink 1 is clamped with a PCB bottom plate 44, by arranging the PCB bottom plate 44, the PCB middle plate 45, and the PCB top plate 46, the PCB board assembly includes each layer of PC B-board interface board, control board, power board, etc. can be completed by automated methods such as reflow soldering, without the need for manual soldering and other operations. The top outer wall of the PCB bottom plate 44 is fixedly connected with a knurled single-pass stud 49, and the end of the knurled single-pass stud 49 away from the PCB bottom plate 44 is fixedly connected with a PCB middle layer plate 45, and the top outer wall of the PCB middle layer plate 45 is fixedly connected with a knurled full-through stud 410. By setting the knurled stud 410, the top screw 48 is screwed into the knurled full-through stud 410, and the top of the knurled full-through stud 410 is clamped with the PCB top plate 46. The top outer wall of the PCB bottom plate 44 is provided with a threaded hole 43, and the threaded hole 43 is threadedly connected with the bottom screw 42. The top outer wall of the heat sink 1 is provided with a mounting hole 2.

[0021] Reference Figure 2-Figure 3 The bottom screw 42 passes through the bottom outer wall of the PCB bottom plate 44, and the knurled single-pass stud 49 is threadedly connected to the bottom screw 42. By setting the bottom screw 42, the bottom screw 42 passes through the heat sink from the bottom and is connected to the knurled single-pass stud 49, thereby achieving the stability of the whole machine. The top outer wall of the PCB top plate 46 is provided with a limiting groove 47. The inner wall of the limiting groove 47 is penetrated by a top screw 48, and one end of the top screw 48 is threadedly connected to the inner wall of the inner ring of the knurled full-pass stud 410. The top outer wall of the heat sink 1 is clamped with a thermal conductive silicone pad 411, and the length and width of the thermal conductive silicone pad 411 are mutually adapted to the PCB bottom plate 44. The PCB assembly board is cooled by setting the thermal conductive silicone pad 411.

[0022] Working principle: The PCB top plate 46 is assembled, and the knurled full-through stud 410 is screwed into the top screw 48, wherein the rivet column 40 of the heat sink 1 and the knurled single-through stud 49 of the PCB bottom plate 44 are positioned and assembled. The bottom screw 42 passes through the heat sink from the bottom and is connected to the knurled single-through stud 49, thereby achieving the stability of the whole machine. Then, the knurled single-through stud 49 and the knurled full-through stud 40 are assembled to the control board, and then the welding and assembly of multiple PCB boards are performed, so that the connectors, current columns and studs between the PCB boards play a role in positioning and stabilization. The whole machine reflow soldering method can be adopted here, and manual operation is not required, thereby ensuring the quality of the assembled whole machine. After the PCB board assembly is completed, only the thermal conductive silicone pad 411 and the heat sink 1 need to be assembled, and the bottom screw 42 is screwed upward from the bottom of the heat sink to the stud of the PCB bottom plate 44 team, thereby achieving the fixation of the whole machine. Finally, the tightening of the top screw 48 is completed.

[0023] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat sink suitable for a multilayer micro servo controller, comprising a heat sink (1), characterized in that: The heat sink (1) is provided with a mounting mechanism (4), the mounting mechanism (4) comprising a rivet post (40), the rivet post (40) being fixedly connected to the top outer wall of the heat sink (1), the bottom outer wall of the heat sink (1) being provided with a recessed groove (41), the inner wall of the recessed groove (41) passing through a bottom screw (42), the outer wall of the rivet post (40) on one side away from the heat sink (1) being clamped with a PCB bottom plate (44), the top outer wall of the PCB bottom plate (44) being fixedly connected with a knurled single-pass stud (49), one end of the knurled single-pass stud (49) away from the PCB bottom plate (44) being fixedly connected with a PCB middle layer plate (45), the top outer wall of the PCB middle layer plate (45) being fixedly connected with a knurled full-pass stud (410), the top end of the knurled full-pass stud (410) being clamped with a PCB top plate (46).

2. A heat sink suitable for a multilayer micro servo controller according to claim 1, characterized in that: A threaded hole (43) is provided on the top outer wall of the PCB bottom plate (44), and the threaded hole (43) is threadedly connected to the bottom screw (42).

3. The heat sink suitable for a multilayer micro servo controller according to claim 1, characterized in that: The bottom screw (42) passes through the bottom outer wall of the PCB bottom plate (44), and the knurled single-pass stud (49) is threadedly connected to the bottom screw (42).

4. The heat sink suitable for a multilayer micro servo controller according to claim 1, characterized in that: A limiting groove (47) is provided on the top outer wall of the PCB top plate (46).

5. The heat sink suitable for a multilayer micro servo controller according to claim 4, characterized in that: A top screw (48) passes through the inner wall of the limiting groove (47), and one end of the top screw (48) is threadedly connected to the inner wall of the inner ring of the knurled full-through stud (410).

6. The heat sink suitable for a multilayer micro servo controller according to claim 1, characterized in that: A thermally conductive silicone pad (411) is clamped on the top outer wall of the heat dissipation plate (1), and the length and width of the thermally conductive silicone pad (411) are adapted to the PCB bottom plate (44).

7. The heat sink suitable for a multilayer micro servo controller according to claim 1, characterized in that: The top outer wall of the heat dissipation plate (1) is provided with a mounting hole (2).

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