A kind of anti-bias diode structure

Abstract

The utility model discloses an anti-biased diode structure, which specifically relates to the field of diodes, including a diode body, pins are fixedly provided at both ends of the diode body, welding holes are provided at positions corresponding to the pins in the circuit board, pads are embedded on the upper surface of the welding holes, two groups of pins are respectively inserted into the corresponding welding holes, a partition assembly is sleeved on the pins, when the pins are inserted into the corresponding welding holes, the partition assembly is located inside the welding holes, and the pins are located at the bottom of the circuit board. The part is bent to form a bending section; the partition assembly includes an outer sleeve, the pins pass through the center of the outer sleeve, and the pins and the pads are welded by a soldering mechanism to form a solder layer. The utility model plays a supporting role between the pins and the bending section through the interference fit between the straight cylinder and the welding hole, and the positioning groove of the truncated cone cylinder limits the pins to prevent the pins located above the circuit board from being reversely bent, thereby solving the problem that the diode body deviates from the position due to the reverse bending force of the bending section.

Description

Technical Field

[0001] The utility model relates to the technical field of diodes, and more particularly to an anti-bias diode structure. Background Art

[0002] The diode is one of the earliest semiconductor devices and is widely used, especially in various electronic circuits. By rationally connecting diodes with components such as resistors, capacitors, and inductors, circuits with different functions can be formed to achieve multiple functions such as rectifying AC power, detecting modulated signals, limiting and clamping, and stabilizing the power supply voltage.

[0003] The prior art uses a diode through-hole soldering method to connect a diode to a printed circuit board. Specifically, the diode pin is passed through a pad hole and soldered to the pad. In order to enhance the soldering strength, the prior art also uses a bending tool to bend the pin through the bottom of the pad hole 90 degrees.

[0004] Since the diodes soldered on the printed circuit board are surface mount diodes, which are characterized by small size, short pins, and small pitch, after the relatively small diameter pins are passed through the relatively large diameter pad holes, when the portion through which the bottom of the pins pass is bent, the bottom of the short pins bends under the action of the joint force, causing the top of the short pins to bend in the opposite direction, thereby causing the chip package between the two pins to deviate from the installation position. However, multiple surface mount diodes need to be soldered on the printed circuit board. If the chip package of one surface mount diode is offset, it will occupy the position of the adjacent surface mount diode. Utility Model Content

[0005] The utility model provides an anti-bias diode structure to solve the problem that when the existing diode structure bends the part through which the bottom of the pin passes, the bending of the bottom of the short pin causes its top to bend in the opposite direction, thereby causing the chip package between the two pins to deviate from the installation position.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an anti-bias diode structure, comprising a diode body, pins fixed at both ends of the diode body, solder holes opened at positions corresponding to the pins inside the circuit board, solder pads embedded on the upper surfaces of the solder holes, two groups of pins respectively inserted into the corresponding solder holes, a partition assembly is sleeved on the pins, when the pins are inserted into the corresponding solder holes, the partition assembly is located inside the solder holes, and the part of the pin located at the bottom of the circuit board is bent to form a bent section; the partition assembly comprises an outer sleeve, the pins pass through the center of the outer sleeve, and the pins and the solder pads are welded by a soldering mechanism to form a solder layer.

[0007] In a preferred embodiment, the outer sleeve includes a straight sleeve, the straight sleeve and the welding hole are interference fit, a through hole is opened in the center of the straight sleeve, and the pin passes through the through hole.

[0008] In a preferred embodiment, a truncated cone cylinder is fixedly provided at the bottom of the straight cylinder, a positioning groove is provided in the middle of the truncated cone cylinder, and the cross section of the positioning groove is truncated cone-shaped, and the pin passes through the interior of the positioning groove.

[0009] In a preferred embodiment, an inner jacket is provided inside the conical cylinder, and the inner jacket includes a fixed disk, and elastic feet are fixedly provided on the outer periphery of the fixed disk, and several groups of elastic feet are arranged along the outer periphery of the fixed disk. The elastic feet are arranged at an angle, and the pins pass through the several groups of elastic feet. A clip is fixed at the bottom end of the elastic foot, and the elastic foot clamps the positioning pin through the clip. A pin hole is opened in the center of the fixed disk, and the pin passes through the inside of the pin hole.

[0010] In a preferred embodiment, an adjusting assembly is provided on the outer sleeve. When the adjusting assembly pushes the fixed plate to move downward, the plurality of groups of elastic legs move closer to the center.

[0011] In a preferred embodiment, the adjustment assembly includes a stud, a top block is fixedly provided at the bottom end of the stud, a slot is opened at the end of the fixed disk, and several groups of slots are arranged corresponding to the stud, and the top block is rotatably arranged inside the corresponding slot.

[0012] In a preferred embodiment, screw holes are provided inside the outer sleeve, and a plurality of groups of screw holes are provided corresponding to studs, and the studs are threadedly connected to the corresponding screw holes.

[0013] In a preferred embodiment, a limiting piece is fixedly provided on the outer periphery of the top of the outer sleeve. The cross section of the limiting piece is L-shaped. When the outer sleeve is located at the welding hole, the limiting piece positions the outer sleeve.

[0014] The beneficial effects of the present invention are:

[0015] The utility model plays a supporting role between the pin and the bent section through the interference fit between the straight cylinder and the welding hole. The positioning groove of the frustum cylinder limits the pin, and converts the bending reaction force of the bending section on the pin into the force of the straight cylinder on the welding hole, thereby preventing the pin located above the circuit board from being bent in the reverse direction, and solving the problem of the diode body being deviated from its position due to the reverse bending force of the bending section.

[0016] The utility model inserts the pins into the interior of the partition assembly by first sequentially passing the pins through the through-holes of the straight tube, the conical tube, the pin holes and a plurality of groups of elastic legs, tightening the studs, and pushing the fixing plate downward through the top block to make the plurality of groups of elastic legs converge toward the center, thereby clamping the pins passing through the middle and fixing the partition assembly on the pins. The utility model is suitable for pins of different diameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0018] Figure 2 This is a schematic diagram of the side cross-sectional structure of the soldering pad of the present invention.

[0019] Figure 3 This is a schematic diagram of the pin bending of the present invention.

[0020] Figure 4 This is a schematic diagram of the pins of the present invention after welding.

[0021] Figure 5 This is a schematic diagram of the cross-sectional structure of the outer sleeve of the present utility model.

[0022] Figure 6 This is a schematic diagram of the cross-sectional structure of the inner jacket of the present invention.

[0023] The figures are marked as follows: 1. diode body; 11. pin; 12. bending section; 2. circuit board; 21. soldering pad; 3. partition assembly; 31. outer sleeve; 311. straight cylinder; 312. frustum cylinder; 313. screw hole; 32. inner sleeve; 321. fixing plate; 322. elastic foot; 323. clip; 324. pin hole; 325. stud; 326. top block; 327. slot; 4. limit plate; A. solder layer. DETAILED DESCRIPTION

[0024] The present application is described in further detail below in conjunction with the accompanying drawings. It is necessary to point out that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technicians in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0025] Refer to the instruction manual Figures 1 to 6 A bias-proof diode structure includes a diode body 1, with pins 11 fixed at both ends of the diode body 1, a soldering hole is opened at the position corresponding to the pin 11 inside the circuit board 2, and a soldering pad 21 is embedded on the upper surface of the soldering hole. Two groups of pins 11 are respectively inserted into the corresponding soldering holes, and a partition component 3 is sleeved on the pins 11. When the pins 11 are inserted into the corresponding soldering holes, the partition component 3 is located inside the soldering hole, and the part of the pin 11 located at the bottom of the circuit board 2 is bent to form a bent section 12; the partition component 3 includes an outer sleeve 31, the pin 11 passes through the center of the outer sleeve 31, and the pin 11 and the soldering pad 21 are welded by a soldering mechanism to form a solder layer A.

[0026] It should be noted that the welding section of the pin 11 inserted into the circuit board 2 is vertically arranged, the welding section is perpendicular to the bending section 12, the diameter of the soldering hole of the circuit board 2 is larger than the diameter of the soldering section of the pin 11, the diameter of the soldering pad 21 is larger than the diameter of the soldering hole, and the solder layer A covers the soldering pad 21 and the soldering hole.

[0027] Furthermore, the outer sleeve 31 includes a straight cylinder 311 , and the straight cylinder 311 is interference-fitted with the welding hole. A through hole is provided at the center of the straight cylinder 311 , and the pin 11 passes through the through hole.

[0028] It should be noted that when the straight tube 311 enters the welding hole, it limits the pin 11 in the transverse direction.

[0029] Furthermore, a truncated cone cylinder 312 is fixedly provided at the bottom of the straight cylinder 311 , a positioning groove is provided in the middle of the truncated cone cylinder 312 , and the cross section of the positioning groove is truncated cone-shaped, and the pin 11 passes through the interior of the positioning groove.

[0030] It should be noted that the end of the frustum tube 312 with a smaller diameter and the end of the frustum tube 312 with a relatively larger diameter are fixed to the straight tube 311 .

[0031] Furthermore, a limiting piece 4 is fixedly provided on the top periphery of the outer sleeve 31 . The cross section of the limiting piece 4 is L-shaped. When the outer sleeve 31 is located in the welding hole, the limiting piece 4 positions the outer sleeve 31 .

[0032] It should be noted that when the outer sleeve 31 is inserted into the welding hole, the L-shaped limiting piece 4 is clamped with the welding pad 21 to play a limiting role.

[0033] Refer to the instruction manual Figures 4 to 6 When the diameter of the pin 11 of the diode body 1 of different specifications is reduced, there is a gap between the pin 11 and the positioning groove of the conical cylinder 312, which affects the limiting of the positioning groove of the conical cylinder 312 on the pin 11. In order to solve this problem, the utility model also provides the following technical solutions: an inner jacket 32 ​​is provided inside the conical cylinder 312, and the inner jacket 32 ​​includes a fixed disk 321. The outer periphery of the fixed disk 321 is fixed with elastic feet 322, and several groups of elastic feet 322 are arranged along the outer periphery of the fixed disk 321. The elastic feet 322 are inclined. The pin 11 passes through several groups of elastic feet 322. The bottom end of the elastic foot 322 is fixed with a clip 323. The elastic foot 322 clamps the positioning pin 11 through the clip 323. A pin hole 324 is opened in the center of the fixed disk 321, and the pin 11 passes through the inside of the pin hole 324.

[0034] It should be noted that the elastic foot 322 clamps the pin 11 under the support of the inner inclined surface of the conical cylinder 312, and the clip 323 increases the contact area between the elastic foot 322 and the pin 11, making the clamping and positioning more stable.

[0035] Furthermore, an adjusting assembly is provided on the outer sleeve 31 . When the adjusting assembly pushes the fixing plate 321 to move downward, the plurality of elastic legs 322 move closer to the center.

[0036] It should be noted that the adjustment assembly pushes the fixing plate 321 downward, and under the influence of the cone cylinder 312 with a gradually decreasing diameter, the groups of elastic legs 322 move toward the center and tighten, thereby clamping the pins 11 with a smaller diameter.

[0037] Furthermore, the adjustment component includes a stud 325, a top block 326 is fixed to the bottom end of the stud 325, a slot 327 is opened at the end of the fixed plate 321, and several groups of slots 327 are arranged corresponding to the stud 325, and the top block 326 is rotatably arranged inside the corresponding slot 327.

[0038] It should be noted that pushing the stud 325 downward causes the fixing plate 321 to move downward as a whole.

[0039] Furthermore, screw holes 313 are provided inside the outer sleeve 31 , and a plurality of groups of screw holes 313 are provided corresponding to studs 325 . The studs 325 are threadedly connected to the corresponding screw holes 313 .

[0040] It should be noted that the screw hole 313 and the stud 325 are threadedly connected to limit the position of the stud 325 .

[0041] In this embodiment, the implementation scenario is specifically as follows:

[0042] When soldering, first insert the pin 11 into the soldering hole of the circuit board 2. The outer side surface of the conical cylinder 312 is inclined. The end with the smaller diameter of the conical cylinder 312 enters the soldering hole first, and then the inclined surface of the conical cylinder 312 gradually slides into the soldering hole along the edge of the soldering hole. When the distance between the two groups of pins 11 is inconsistent with the distance between the two groups of soldering holes, the conical cylinder 312 can make the pin 11 accurately enter the corresponding soldering hole. When the L-shaped limit piece 4 is fixed to the soldering pad 21, the pin 11 can no longer be inserted, indicating that the outer sleeve 31 is installed in place. After the partition component 3 enters the soldering hole, the bending mechanism is used to move the bottom of the circuit board 2. The pin 11 is bent into a bent section 12. At this time, the interference fit between the straight cylinder 311 and the soldering hole plays a supporting role between the pin 11 and the bent section 12. The positioning groove of the conical cylinder 312 limits the pin 11, and converts the bending reaction force of the bent section 12 on the pin 11 into the force of the straight cylinder 311 on the soldering hole, thereby preventing the pin 11 located above the circuit board 2 from being bent in the reverse direction, and solves the problem of the diode body 1 being deviated from its position due to the reverse bending force of the bent section 12. After the pin 11 is assembled, a soldering device is used to solder the pin 11 to the soldering pad 21, and the soldering is completed when the solder layer A is formed.

[0043] When inserting the pin 11 into the partition assembly 3, first pass the pin 11 through the through hole of the straight cylinder 311, the conical cylinder 312, the pin hole 324 and the several groups of elastic feet 322 in sequence, tighten the stud 325, and push the fixing plate 321 downward through the top block 326 to make the several groups of elastic feet 322 converge toward the center, thereby clamping the pin 11 passing through the middle, and fixing the partition assembly 3 on the pin 11 to adapt to pins 11 of different diameters.

[0044] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the scope of the present invention, all of which fall within the scope of protection of the present invention.

Claims

1. An anti-bias diode structure, comprising a diode body (1), pins (11) are fixedly provided at both ends of the diode body (1), a welding hole is provided inside a circuit board (2) at a position corresponding to the pin (11), a welding pad (21) is embedded on the upper surface of the welding hole, and two groups of the pins (11) are respectively inserted into the corresponding welding holes, characterized in that: The pin (11) is sleeved with a partition component (3); when the pin (11) is inserted into the corresponding welding hole, the partition component (3) is located inside the welding hole, and the portion of the pin (11) located at the bottom of the circuit board (2) is bent to form a bent section (12); The partition assembly (3) comprises an outer sleeve (31), the pin (11) passes through the center of the outer sleeve (31), and the pin (11) and the pad (21) are welded by a soldering mechanism to form a solder layer (A).

2. The anti-bias diode structure according to claim 1, characterized in that: The outer sleeve (31) comprises a straight sleeve (311), the straight sleeve (311) and the welding hole are interference-fitted, a through hole is provided at the center of the straight sleeve (311), and the pin (11) passes through the through hole.

3. The anti-bias diode structure according to claim 2, characterized in that: A truncated cone cylinder (312) is fixedly provided at the bottom of the straight cylinder (311), a positioning groove is provided in the middle of the truncated cone cylinder (312), and the cross section of the positioning groove is truncated cone-shaped, and the pin (11) passes through the interior of the positioning groove.

4. The anti-bias diode structure according to claim 3, characterized in that: An inner jacket (32) is provided inside the truncated cone cylinder (312), and the inner jacket (32) includes a fixed disk (321). An elastic foot (322) is fixedly provided on the outer periphery of the fixed disk (321), and a plurality of groups of the elastic feet (322) are arranged along the outer periphery of the fixed disk (321). The elastic feet (322) are arranged obliquely, and the pin (11) passes through the plurality of groups of elastic feet (322). A clip (323) is fixedly provided at the bottom end of the elastic foot (322), and the elastic foot (322) clamps the positioning pin (11) through the clip (323). A pin hole (324) is opened at the center of the fixed disk (321), and the pin (11) passes through the inside of the pin hole (324).

5. The anti-bias diode structure according to claim 4, characterized in that: The outer sleeve (31) is provided with an adjustment component, and when the adjustment component pushes the fixed plate (321) to move downward, a plurality of groups of elastic feet (322) move closer to the center.

6. The anti-bias diode structure according to claim 5, characterized in that: The adjustment assembly comprises a stud (325), a top block (326) is fixedly provided at the bottom end of the stud (325), a clamping groove (327) is opened at the end of the fixed plate (321), and a plurality of groups of clamping grooves (327) are arranged corresponding to the stud (325), and the top block (326) is rotatably arranged inside the corresponding clamping groove (327).

7. The anti-bias diode structure according to claim 6, characterized in that: The outer sleeve (31) is provided with screw holes (313) inside, and a plurality of groups of screw holes (313) are arranged corresponding to studs (325), and the studs (325) are threadedly connected to the corresponding screw holes (313).

8. The anti-bias diode structure according to claim 7, characterized in that: A limiting plate (4) is fixedly provided on the outer periphery of the top of the outer sleeve (31); the cross section of the limiting plate (4) is L-shaped; when the outer sleeve (31) is located in the welding hole, the limiting plate (4) positions the outer sleeve (31).

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