LED integrated chip structure

Abstract

The present application discloses an LED integrated chip structure, comprising a patterned transparent substrate; a groove is provided on one side of the patterned transparent substrate; an LED chip is arranged in the groove; an insulating filling layer is filled in the gap between the groove and the LED chip; an electrode layer is provided on the LED chip; the electrode layer is connected to the patterned transparent substrate through a lead layer; a protective layer is also provided on the patterned transparent substrate, the LED chip and the lead layer; an adhesive layer is connected to the connection end of the lead layer and the patterned transparent substrate through the protective layer; the present application can avoid the strict matching of the planarization layer, improve the adhesion between the film layers, the aging performance, the planarization performance, and the coverage of the lead layer, etc., ensure the yield of the LED integrated chip (and the LED chip inside it), thereby reducing the requirements for the yield and uniformity of subsequent processes such as mass transfer, and reducing the maintenance cost.

Description

Technical Field

[0001] The utility model relates to the technical field of light emitting diodes, in particular to an LED integrated chip structure. Background Art

[0002] Micro light emitting diode (LED) display technology is a display technology that uses self-luminous micron-sized LEDs as light-emitting pixels and assembles them on a driving panel to form a high-density LED array. In the existing Micro LED chip display application industry chain, three-color Micro LED chips are usually transferred in batches to a temporary substrate, and then combined with flattening, lead layers and other film layers to provide detection signals to the LED chips. This solution requires highly matched flattening materials, high-quality lead film layers, etc. to reduce the abnormality rate of subsequent products.

[0003] Based on the above situation, an LED integrated chip structure was developed and designed. Utility Model Content

[0004] The utility model aims to provide an LED integrated chip structure, which can reduce the requirements of subsequent processes such as mass transfer on yield and uniformity, and reduce maintenance costs.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an LED integrated chip structure, including a patterned transparent substrate;

[0006] A groove is provided on one side of the patterned transparent substrate;

[0007] An LED chip is arranged in the groove;

[0008] The gap between the groove and the LED chip is filled with an insulating filling layer;

[0009] The LED chip is provided with an electrode layer;

[0010] The electrode layer is connected to the patterned transparent substrate through a lead layer;

[0011] A protective layer is also provided on the patterned transparent substrate, the LED chip and the lead layer;

[0012] The lead layer and the patterned transparent substrate connection end are connected with an adhesive layer through a protective layer.

[0013] In a preferred solution, a plurality of grooves are provided on the patterned transparent substrate, and the size of the grooves is greater than or equal to the size of the LED chip.

[0014] Preferably, the height of the groove is equal to the sum of the heights of the LED chip and the electrode layer.

[0015] Preferably, the insulating filling layer is filled to a height consistent with the groove.

[0016] In a preferred solution, the insulating material of the insulating filling layer is an organic material or an inorganic material.

[0017] Due to the application of the above technical solution, the beneficial effects of the present application compared with the prior art are:

[0018] An LED integrated chip structure of the present application can avoid the strict matching of the planarization layer, improve the adhesion between film layers, aging performance, flatness performance, and lead layer coverage, etc., to ensure the yield of the LED integrated chip (and the LED chip inside it), thereby reducing the requirements for yield and uniformity of subsequent processes such as mass transfer and reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Attached Figure 1 This is a schematic diagram of the structure of the LED integrated chip of the utility model;

[0021] Among them: 1. patterned transparent substrate; 2. groove; 3. LED chip; 4. insulating filling layer; 5. electrode layer; 6. lead layer; 7. protective layer; 8. bonding layer. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] In this application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the utility model and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0025] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0026] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0027] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] Embodiment 1

[0029] Attached Figure 1 The LED integrated chip structure described in the utility model comprises a patterned transparent substrate 1;

[0030] A groove 2 is provided on one side of the patterned transparent substrate 1, and the desired groove 2 is dry-etched or wet-etched after photolithography. A plurality of grooves 2 are provided on the patterned transparent substrate 1, and the size of the groove 2 is greater than or equal to the size of the LED chip 3; the height of the groove 2 is equal to the sum of the heights of the LED chip 3 and the electrode layer 5;

[0031] An LED chip 3 is arranged in the groove 2;

[0032] The gap between the groove 2 and the LED chip 3 is filled with an insulating filling layer 4 to achieve a flattening effect; the insulating filling layer 4 is filled to the same height as the groove 2; the insulating material of the insulating filling layer 4 is an organic material or an inorganic material; it can be an organic material, such as a photoresist material, benzocyclobutene, polyimide, and organic silica gel, etc.; it can also be an inorganic material, such as a silicon-glass bonding structure (Silicon On Glass, SOG) material, Al2O3, SiO2, TiO2, and SiNx, etc.;

[0033] The LED chip 3 is provided with an electrode layer 5;

[0034] The electrode layer 5 is connected to the patterned transparent substrate 1 through the lead layer 6;

[0035] The LED chip 3 and the lead layer 6 are located between the electrode layer 5 and the patterned transparent substrate 1, and the electrodes of the electrode layer 5 are connected to the corresponding lead layer 6, so as to provide a first detection signal to the LED chip 3 through the lead layer 6;

[0036] A protective layer 7 is also provided on the patterned transparent substrate 1, the LED chip 3 and the lead layer 6 to play a corresponding protective role;

[0037] The connection end between the lead layer 6 and the patterned transparent substrate 1 is connected with an adhesive layer 8 through a protective layer 7 for subsequent connection.

[0038] An LED integrated chip structure of the present application can avoid the strict matching of the planarization layer, improve the adhesion between film layers, aging performance, flatness performance, and coverage of the lead layer 6, etc., to ensure the yield of the LED integrated chip (and the LED chip 3 inside it), thereby reducing the requirements for yield and uniformity of subsequent processes such as mass transfer and reducing maintenance costs.

[0039] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED integrated chip structure, characterized in that: including a patterned transparent substrate; A groove is provided on one side of the patterned transparent substrate; An LED chip is arranged in the groove; The gap between the groove and the LED chip is filled with an insulating filling layer; The LED chip is provided with an electrode layer; The electrode layer is connected to the patterned transparent substrate through a lead layer; A protective layer is also provided on the patterned transparent substrate, the LED chip and the lead layer; The lead layer and the patterned transparent substrate connection end are connected with an adhesive layer through a protective layer.

2. The LED integrated chip structure according to claim 1, characterized in that: The patterned transparent substrate is provided with a plurality of grooves, and the size of the grooves is greater than or equal to the size of the LED chip.

3. The LED integrated chip structure according to claim 2, characterized in that: The height of the groove is equal to the sum of the heights of the LED chip and the electrode layer.

4. The LED integrated chip structure according to claim 1, characterized in that: The insulating filling layer is filled to the same height as the groove.

5. The LED integrated chip structure according to claim 4, characterized in that: The insulating material of the insulating filling layer is an organic material or an inorganic material.

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