Circuit board gluing device

Abstract

A circuit board gluing device, comprising a processing table, a positioning component, a transmission component and a gluing component, wherein the processing table is provided with a transmission slot, the positioning component is mounted on the processing table and located above the transmission slot, the transmission component is movably mounted in the transmission slot, and the gluing component is mounted on the positioning component; the gluing component comprises a gluing cylinder, a gluing needle, a glue supply pipe, an air pressure pipe, a telescopic pressure rod and a puncture needle. The utility model designs the structure of the telescopic pressure rod and the puncture needle in the gluing component, so that when the needle is abnormally blocked during the gluing process, the blocked part can be punctured in time, which greatly reduces the time spent on stopping the machine due to abnormal needle blockage and greatly improves the efficiency of the gluing process; through the cooperation of the positioning component and the transmission component, the application scope of the gluing device is greatly expanded; the utility model has strong practicality and strong promotion significance.

Description

Technical Field

[0001] The utility model relates to a circuit board processing device, in particular to a circuit board gluing device. Background Art

[0002] A circuit board, also known as a circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, must use a circuit board to make electrical interconnections between the various components. The circuit board consists of an insulating base plate, connecting wires, and pads for assembling and welding electronic components. It has the dual functions of a conductive line and an insulating base plate.

[0003] In order to prevent moisture, water and dust, glue coating is often required in the production process of circuit boards. However, during the operation of existing glue coating devices, due to the instability of ambient temperature, the glue coating needle is very likely to be blocked by glue cooling and solidification. Utility Model Content

[0004] Based on this, it is necessary to provide a circuit board gluing device to address the deficiencies in the prior art.

[0005] A circuit board gluing device includes a processing table, a positioning component, a transmission component and a gluing component. The processing table is provided with a transmission slot. The positioning component is installed on the processing table and is located above the transmission slot. The transmission component is movably installed in the transmission slot. The gluing component is installed on the positioning component. The gluing component includes a gluing cylinder, a gluing needle, a glue supply pipe, an air pressure pipe, a telescopic pressure rod and a puncture needle. The gluing cylinder is designed to be a hollow structure, and a accommodating cavity is provided inside it. The gluing needle is integrally arranged at the bottom of the gluing cylinder and is connected to the accommodating cavity. The glue supply pipe and the air pressure pipe are both installed on the gluing cylinder and are connected to the accommodating cavity. The telescopic pressure rod is fixedly installed in the accommodating cavity. The gluing needle is installed at the lower end of the telescopic pressure rod and is opposite to the gluing needle up and down.

[0006] Furthermore, a drilling thread is provided on the side of the puncture needle, and the puncture needle can be rotatable and can generate heat and conduct heat.

[0007] Furthermore, the glue coating assembly also includes an air pressure sensor, which is installed in the accommodating cavity and is connected to the telescopic pressure rod and the puncture needle signal.

[0008] Furthermore, the glue coating assembly also includes a mounting ring, a telescopic adjustment rod and a heating ring sleeve. The mounting ring is fixedly sleeved on the outside of the glue coating cylinder, the telescopic adjustment rod is fixedly mounted on the mounting ring, and the heating ring sleeve is sleeved on the outside of the glue coating needle. Both sides of the heating ring sleeve are also respectively connected to the lower end of the telescopic adjustment rod and can be driven by the lower end to slide up and down. The heating ring sleeve can generate heat and conduct heat.

[0009] Furthermore, the positioning assembly includes a mounting frame and a telescopic positioning rod. The mounting frame stands on the processing table, and is also provided with a sliding positioning slot, in which the telescopic positioning rod is inserted and can slide horizontally or telescope up and down. The glue coating assembly is installed at the lower end of the telescopic positioning rod.

[0010] Furthermore, the transmission assembly includes a sliding bearing plate and a refrigerator. The sliding bearing plate is mounted in the transmission groove and can slide horizontally. The sliding bearing plate is also provided with an internal hollow installation cavity and an upper open engagement groove, and the engagement groove is located above the installation cavity. The refrigerator is installed in the installation cavity and can cool and absorb heat.

[0011] To sum up, the beneficial effects of the circuit board gluing device of the utility model are: by designing the structure of the telescopic pressure rod and the puncture needle in the gluing component, the blocked part can be punctured in time when the needle is blocked abnormally during the gluing process, which greatly reduces the time spent on downtime due to needle blockage and greatly improves the efficiency of the gluing process; through the cooperation of the positioning component and the transmission component, the gluing component can be positioned at any place on the surface of the circuit board for gluing, which greatly expands the application scope of the gluing device; and the cooling and heat-absorbing structure is designed in the transmission component to cool the circuit board, which can make the gluing process quickly solidify and form, further improving the efficiency of the gluing process of the circuit board; the utility model is highly practical and has a strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a structural schematic diagram of a circuit board gluing device of the utility model;

[0013] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0014] Figure 3 for Figure 2 Schematic diagram of the structure of the middle processing table;

[0015] Figure 4 for Figure 2 Schematic diagram of the decomposition structure of the positioning component;

[0016] Figure 5 for Figure 2 Schematic diagram of the exploded structure of the transmission component;

[0017] Figure 6 for Figure 2 Schematic diagram of the cross-sectional structure of the middle glue coating component;

[0018] Figure 7 for Figure 5 Schematic diagram of the decomposition structure;

[0019] Figure 8 for Figure 7 Schematic diagram of the structure of the puncture needle. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0021] like Figures 1 to 8 As shown, the utility model provides a circuit board gluing device 100, which includes a processing table 10, a positioning component 20, a conveying component 30 and a gluing component 40, the processing table 10 is provided with a conveying slot 11, the positioning component 20 is installed on the processing table 10 and is located above the conveying slot 11, the conveying component 30 is movably installed in the conveying slot 11, and the gluing component 40 is installed on the positioning component 20.

[0022] The positioning assembly 20 includes a mounting frame 21 and a telescopic positioning rod 22. The mounting frame 21 stands on the processing table 10, and is also provided with a sliding positioning slot 211. The telescopic positioning rod 22 is inserted into the sliding positioning slot 211 and can slide horizontally or telescope up and down. The gluing assembly 40 is installed at the lower end of the telescopic positioning rod 22. During the gluing process, the telescopic positioning rod 22 can drive the gluing assembly 40 to slide horizontally and position at the gluing position on the surface of the circuit board for precise gluing processing.

[0023] The conveying assembly 30 includes a sliding bearing plate 31 and a refrigerator 32. The sliding bearing plate 31 is mounted in the conveying groove 11 and can slide horizontally. The sliding bearing plate 31 is also provided with an internal hollow installation cavity 311 and an upper open engagement groove 312, and the engagement groove 312 is located above the installation cavity 311. The refrigerator 32 is installed in the installation cavity 311, and the refrigerator 32 can cool and absorb heat. During the gluing process, the sliding bearing plate 31 can carry the circuit board to be processed and transfer it to the bottom of the gluing assembly 40 for gluing. The refrigerator 32 arranged in the sliding bearing plate 31 can keep the circuit board at a low temperature, so that the glue applied on the surface of the circuit board can also be quickly cooled and solidified, thereby improving the efficiency and quality of the gluing process.

[0024] The glue coating assembly 40 includes a glue coating cylinder 41, a glue coating needle 42, a glue supply pipe 43, an air pressure pipe 44, a telescopic pressure rod 45 and a puncture needle 46. The glue coating cylinder 41 is designed as a hollow structure, and a receiving cavity 411 is provided inside it. The glue coating needle 42 is integrally arranged at the bottom of the glue coating cylinder 41 and communicated with the receiving cavity 411. The glue supply pipe 43 and the air pressure pipe 44 are both installed on the glue coating cylinder 41 and communicated with the receiving cavity 411. The telescopic pressure rod 45 is fixedly installed in the receiving cavity 411. The glue coating needle 42 is installed at the lower end of the telescopic pressure rod 45 and is opposite to the glue coating needle 42 in upper and lower directions.

[0025] When the circuit board needs to be glued, the circuit board and the glue coating component 40 are positioned up and down by the positioning component 20 and the transmission component 30, and the glue is transported to the accommodating cavity 411 by the glue supply pipe 43, and the air pressure in the accommodating cavity 411 is controlled by the air pressure pipe 44 to push the glue to be squeezed out along the glue coating needle 42 and coated on the surface of the circuit board. If the glue coating needle 42 is blocked due to the solidification of the glue, the telescopic pressure rod 45 can be activated to push the puncture needle 46 downward until the blocked glue block in the glue coating needle 42 is punctured to clear the glue coating needle 42 again.

[0026] The puncture needle 46 is provided with a drilling thread 461 on the side thereof, and the puncture needle 46 is movable and rotatable and can generate heat and conduct heat. The glue coating component 40 also includes an air pressure sensor 47, which is installed in the accommodating cavity 411 and is connected to the telescopic pressure rod 45 and the puncture needle 46 by signal. The puncture needle 46 that can rotatably drill and generate heat can more easily puncture and melt the hardened glue block to clear the glue coating needle 42 again. The air pressure sensor 47 can monitor the air pressure parameters in the accommodating cavity 411 in real time. If the glue coating needle 42 is blocked, the air pressure in the accommodating cavity 411 will increase abnormally. At this time, the air pressure sensor 47 can automatically determine the blockage abnormality and start the telescopic pressure rod 45 and the puncture needle 46 to clear the blockage.

[0027] The glue coating assembly 40 also includes a mounting ring 48, a telescopic adjustment rod 49 and a heating ring sleeve 410. The mounting ring 48 is fixedly sleeved on the outer side of the glue coating cylinder 41, the telescopic adjustment rod 49 is fixedly mounted on the mounting ring 48, and the heating ring sleeve 410 is sleeved on the outer side of the glue coating needle 42. The two sides of the heating ring sleeve 410 are also respectively connected to the lower end of the telescopic adjustment rod 49 and can be driven by it to slide up and down. The heating ring sleeve 410 can generate heat and conduct heat. When the telescopic pressure rod 45 and the puncture needle 46 clear the glue coating needle 42 on the inside, the telescopic adjustment rod 49 and the heating ring sleeve 410 will also heat the corresponding position on the outer side of the glue coating needle 42 so that the hardened glue can be softened faster.

[0028] In summary, the beneficial effects of the circuit board gluing device 100 of the utility model are as follows: by designing the structure of the telescopic pressure rod 45 and the puncture needle 46 in the gluing component 40, when the needle is blocked abnormally during the gluing process, the blocked part can be punctured in time, which greatly reduces the time spent on downtime due to needle blockage and greatly improves the efficiency of the gluing process; through the cooperation of the positioning component 20 and the transmission component 30, the gluing component 40 can be positioned at any place on the surface of the circuit board for gluing, which greatly expands the application scope of the gluing device; and the cooling and heat-absorbing structure is designed in the transmission component 30 to cool the circuit board, which can make the gluing process quickly solidify and form, further improving the gluing process efficiency of the circuit board; the utility model is highly practical and has a strong promotion significance.

[0029] The above-mentioned embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A circuit board gluing device, characterized in that: It includes a processing table, a positioning component, a transmission component and a glue coating component. The processing table is provided with a transmission groove, the positioning component is installed on the processing table and is located above the transmission groove, the transmission component is movably installed in the transmission groove, and the glue coating component is installed on the positioning component; the glue coating component includes a glue coating cylinder, a glue coating needle, a glue supply pipe, an air pressure pipe, a telescopic pressure rod and a puncture needle; the glue coating cylinder is designed with a hollow structure, and a accommodating cavity is provided inside it. The glue coating needle is integrally arranged at the bottom of the glue coating cylinder and is connected with the accommodating cavity, the glue supply pipe and the air pressure pipe are both installed on the glue coating cylinder and are connected with the accommodating cavity, the telescopic pressure rod is fixedly installed in the accommodating cavity, and the glue coating needle is installed at the lower end of the telescopic pressure rod and is opposite to the glue coating needle up and down.

2. The circuit board gluing device according to claim 1, characterized in that: A drilling thread is arranged on the side of the puncture needle, and the puncture needle can be movably rotated and can generate heat and conduct heat.

3. The circuit board gluing device according to claim 1, characterized in that: The glue coating assembly also includes an air pressure sensor, which is installed in the accommodating cavity and is connected to the telescopic pressure rod and the puncture needle signal.

4. The circuit board gluing device according to claim 1, characterized in that: The glue coating assembly also includes a mounting ring, a telescopic adjustment rod and a heating ring sleeve; the mounting ring is fixedly sleeved on the outside of the glue coating cylinder, the telescopic adjustment rod is fixedly mounted on the mounting ring, the heating ring sleeve is sleeved on the outside of the glue coating needle, and the two sides of the heating ring sleeve are also respectively connected to the lower end of the telescopic adjustment rod and can be driven by it to slide up and down; the heating ring sleeve can generate heat and conduct heat.

5. The circuit board gluing device according to claim 1, characterized in that: The positioning assembly includes a mounting frame and a telescopic positioning rod; the mounting frame stands on a processing table and is also provided with a sliding positioning groove, the telescopic positioning rod is inserted into the sliding positioning groove and can slide horizontally or telescope up and down; the glue coating assembly is installed at the lower end of the telescopic positioning rod.

6. The circuit board gluing device according to claim 1, characterized in that: The conveying component includes a sliding supporting plate and a refrigerator; the sliding supporting plate is snap-fitted and installed in the conveying groove and can slide horizontally, and the sliding supporting plate is also provided with an internal hollow installation cavity and an opening snap-fit ​​groove at the upper end, and the snap-fit ​​groove is located above the installation cavity; the refrigerator is installed in the installation cavity, and the refrigerator can cool and absorb heat.

Images