Oscillation tank for cleaning semiconductor

Abstract

The utility model discloses an oscillation tank for cleaning semiconductors, which relates to the technical field of semiconductor cleaning equipment and comprises a bottom plate and an oscillation tank, four corners of the lower end face of the oscillation tank are respectively provided with an elastic sheet, the four elastic sheets are fixed at the top end of the bottom plate, an ultrasonic oscillator is arranged on the oscillation tank, a detachable support is arranged in the oscillation tank, and the detachable support is fixed on the bottom plate. A fixing assembly is installed on the detachable support, a circulating assembly is installed on the side wall of the oscillation groove, and the detachable support comprises a fixing rod fixed to the inner wall of the bottom end of the oscillation groove. According to the ultrasonic cleaning device for the semiconductor device, the ultrasonic oscillator is installed on the oscillation groove, the detachable support and the fixing assembly are used in cooperation, ultrasonic cleaning is conducted on the semiconductor device, collision can be prevented when the semiconductor device is cleaned, and the semiconductor device is prevented from being damaged; impurities on the semiconductor device can be flushed away from the semiconductor device through the arranged circulating assembly, the impurities with high adhesive force on the semiconductor device are effectively cleaned away, and the practicability is good.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cleaning equipment, in particular to an oscillation tank for semiconductor cleaning. Background Art

[0002] Semiconductor devices need to be cleaned of impurities on the surface before installation, so cleaning of semiconductor devices is the first step in installation and processing. In order to ensure that the semiconductor devices are clean, they need to be cleaned and soaked at least once.

[0003] The prior art can refer to the Chinese patent with the authorization publication number CN206316074U, which discloses a cleaning tank for cleaning semiconductor devices, including a tank body, a support frame is fixed on the inner edge of one side of the top of the tank body, a liquid outlet pipe is fixed on the bottom end of one side of the tank body, and a circulating liquid inlet pipe and a circulating liquid outlet pipe are fixed in the middle part of one side of the tank body. The circulating liquid inlet pipe is placed obliquely above the circulating liquid outlet pipe, and the circulating liquid inlet pipe and the circulating liquid outlet pipe are connected into one by a hydraulic pump. However, the cleaning tank still has shortcomings when used:

[0004] First, the semiconductor device cannot be fixed in the cleaning tank, which may cause the semiconductor device to collide during the cleaning process, causing damage to the semiconductor device;

[0005] Secondly, it is difficult to clean the semiconductor device by only flowing the cleaning liquid to remove the impurities with strong adhesion, which easily leads to incomplete cleaning.

[0006] Therefore, an oscillation tank for semiconductor cleaning is now provided. Utility Model Content

[0007] In view of the deficiencies in the prior art, the utility model provides an oscillation tank for semiconductor cleaning. An ultrasonic oscillator is installed on the oscillation tank, and a detachable bracket and a fixing component are used in combination to perform ultrasonic cleaning on semiconductor devices, and can prevent bumps from occurring during cleaning of semiconductor devices, thereby avoiding damage to the semiconductor devices. Impurities on the semiconductor devices can be flushed away from the semiconductor devices through the provided circulation components, and impurities with strong adhesion on the semiconductor devices can be effectively cleaned off. The utility model has good practicality, overcomes the deficiencies in the prior art, and effectively solves the problems that the existing cleaning tanks for cleaning semiconductor devices cannot fix the semiconductor devices, which easily leads to bumps on the semiconductor devices during the cleaning process, causing damage to the semiconductor devices, and that it is difficult to clean off impurities with strong adhesion when cleaning the semiconductor devices only through the flow of cleaning liquid, which easily leads to incomplete cleaning.

[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0009] An oscillation tank for semiconductor cleaning comprises a bottom plate and an oscillation tank, wherein spring pieces are installed at the four corners of the lower end surface of the oscillation tank, and the four spring pieces are fixed to the top of the bottom plate, an ultrasonic oscillator is installed on the oscillation tank, a detachable bracket is installed inside the oscillation tank, a fixing component is installed on the detachable bracket, and a circulation component is installed on the side wall of the oscillation tank.

[0010] Through the above scheme, by installing an ultrasonic oscillator on the oscillation tank and using a detachable bracket and a fixed component in combination, the semiconductor device can be ultrasonically cleaned, and bumps can be prevented during cleaning of the semiconductor device to avoid damage to the semiconductor device. The impurities on the semiconductor device can be flushed away from the semiconductor device through the set circulation component, and impurities with strong adhesion on the semiconductor device can be effectively cleaned, which has good practicality.

[0011] Preferably, the detachable bracket includes a fixing rod fixed to the inner wall of the bottom end of the oscillation groove, vertical rods are fixed to both ends of the fixing rod, and support plates are slidably sleeved on the two vertical rods.

[0012] Preferably, a magnet block is fixed to the upper end of the fixing rod, and a metal sleeve is fixed to the lower end surface of the supporting plate.

[0013] Preferably, the fixing assembly includes an L-shaped support rod fixed to the upper end surface of the support plate, the vertical section of the L-shaped support rod is provided with a strip hole, the horizontal section of the L-shaped support rod is threaded with a screw, the bottom end of the screw is rotatably connected to a pressure rod through a bearing, the pressure rod is slidably engaged with the strip hole, and a handle is installed at the top of the screw.

[0014] Preferably, the circulation component includes a pump body on the outer wall of the oscillation tank, one end of a water pumping pipe connected to the water pumping end of the pump body is connected to one side of the oscillation tank, and one end of a water outlet pipe connected to the water outlet end of the pump body is connected to one side of the oscillation tank.

[0015] Preferably, the connection between the water outlet pipe and the oscillation groove is located on one side of the L-shaped support rod, and a control switch is installed on the outer wall of the oscillation groove.

[0016] The beneficial effects of the utility model are:

[0017] 1. Place the semiconductor device on the support plate, and use the handle to turn the screw to make the pressure rod descend along the strip hole to fix the semiconductor device. When the support plate is sleeved on the two vertical rods and placed in the oscillation groove, the magnet block is adsorbed in the metal sleeve, making the support plate more stable, thereby preventing bumps when cleaning the semiconductor device and avoiding damage to the semiconductor device.

[0018] 2. Use an ultrasonic oscillator to drive the oscillation tank to vibrate, so that impurities on the semiconductor device are separated from the semiconductor device, thereby achieving the purpose of quickly cleaning the semiconductor device. Use a pump body to pump the cleaning liquid in the oscillation tank to make the cleaning liquid flow, which can flush the impurities on the semiconductor device away from the semiconductor device.

[0019] In summary, by installing an ultrasonic oscillator on the oscillation tank and using a detachable bracket and a fixed component in combination, the semiconductor device can be ultrasonically cleaned, and bumps can be prevented during cleaning of the semiconductor device to avoid damage to the semiconductor device. The impurities on the semiconductor device can be flushed away from the semiconductor device through the set circulation component, and impurities with strong adhesion on the semiconductor device can be effectively cleaned off, which has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure from a first-view perspective of an oscillation tank for semiconductor cleaning proposed by the utility model.

[0021] Figure 2 This is a schematic diagram of the three-dimensional structure from a second perspective of an oscillation tank for semiconductor cleaning proposed by the utility model.

[0022] Figure 3 The utility model is a schematic diagram of a detachable bracket structure of an oscillation tank for semiconductor cleaning.

[0023] In the figure: 1. bottom plate; 2. oscillation groove; 3. spring; 4. pump body; 5. water outlet pipe; 6. water suction pipe; 7. vertical rod; 8. support plate; 9. screw rod; 10. pressure rod; 11. L-shaped support rod; 12. strip hole; 13. magnet block; 14. metal sleeve; 15. fixing rod. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Example 1, reference Figure 1-3 , an oscillation tank for semiconductor cleaning, comprising a bottom plate 1 and an oscillation tank 2, springs 3 are installed at the four corners of the lower end surface of the oscillation tank 2, and the four springs 3 are fixed to the top of the bottom plate 1, an ultrasonic oscillator is installed on the oscillation tank 2, and a detachable bracket is installed inside the oscillation tank 2, and the detachable bracket includes a fixed rod 15 fixed to the inner wall of the bottom end of the oscillation tank 2, and vertical rods 7 are fixed at both ends of the fixed rod 15, and a support plate 8 is slidably sleeved on the two vertical rods 7. Through the plug-in cooperation formed by the two vertical rods 7 and the support plate 8, the support plate 8 can be placed in the oscillation tank 2 and is convenient to take out;

[0026] A magnet block 13 is fixed to the upper end of the fixing rod 15, and a metal sleeve 14 is fixed to the lower end surface of the support plate 8. When the support plate 8 is sleeved on the two vertical rods 7 and placed in the oscillation groove 2, the magnet block 13 is adsorbed in the metal sleeve 14, making the support plate 8 more stable;

[0027] A fixing component is installed on the detachable bracket, and the fixing component includes an L-shaped support rod 11 fixed to the upper end surface of the support plate 8. The vertical section of the L-shaped support rod 11 is provided with a strip hole 12. The horizontal section of the L-shaped support rod 11 is screwed with a screw rod 9. The bottom end of the screw rod 9 is rotatably connected to a pressure rod 10 through a bearing. The pressure rod 10 is slidably engaged with the strip hole 12, and a handle is installed at the top of the screw rod 9.

[0028] Place the semiconductor device on the support plate 8, and use the handle to turn the screw 9 so that the pressure rod 10 descends along the strip hole 12 to fix the semiconductor device;

[0029] A circulation component is installed on the side wall of the oscillation tank 2, and the circulation component includes a pump body 4 on the outer wall of the oscillation tank 2. One end of a water suction pipe 6 connected to the water suction end of the pump body 4 is connected to one side of the oscillation tank 2, and one end of a water outlet pipe 5 connected to the water outlet end of the pump body 4 is connected to one side of the oscillation tank 2. The connection between the water outlet pipe 5 and the oscillation tank 2 is located on one side of the L-shaped support rod 11. A control switch is installed on the outer wall of the oscillation tank 2. The cleaning liquid in the oscillation tank 2 is pumped by the pump body 4 to make the cleaning liquid flow, so that impurities on the semiconductor device can be flushed away from the semiconductor device.

[0030] Working principle: place the semiconductor device on the support plate 8, turn the screw rod 9 by the handle, so that the pressure rod 10 descends along the strip hole 12 to fix the semiconductor device, and when the support plate 8 is sleeved on the two vertical rods 7 and placed in the oscillation tank 2, the magnet block 13 is adsorbed in the metal sleeve 14, making the support plate 8 more stable, and use the ultrasonic oscillator to drive the oscillation tank 2 to vibrate, so that impurities on the semiconductor device are separated from the semiconductor device, so as to achieve the purpose of quickly cleaning the semiconductor device, and use the pump body 4 to pump the cleaning liquid in the oscillation tank 2, so that the cleaning liquid flows, and the impurities on the semiconductor device can be flushed away from the semiconductor device.

[0031] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An oscillation tank for semiconductor cleaning, comprising a bottom plate (1) and an oscillation tank (2), characterized in that: Spring sheets (3) are installed at the four corners of the lower end surface of the oscillation groove (2), and the four spring sheets (3) are fixed to the top of the bottom plate (1); an ultrasonic oscillator is installed on the oscillation groove (2); a detachable bracket is installed inside the oscillation groove (2); a fixing component is installed on the detachable bracket; a circulation component is installed on the side wall of the oscillation groove (2); the fixing component includes an L-shaped support rod (11) fixed to the upper end surface of the support plate (8); a strip hole (12) is opened in the vertical section of the L-shaped support rod (11); a screw rod (9) is screwed to the horizontal section of the L-shaped support rod (11); the bottom end of the screw rod (9) is rotatably connected to a pressure rod (10) through a bearing; the pressure rod (10) is slidably engaged with the strip hole (12); and a handle is installed at the top of the screw rod (9); The circulation component comprises a pump body (4) on the outer wall of the oscillation groove (2), one end of a water pumping pipe (6) connected to the water pumping end of the pump body (4) is connected to one side of the oscillation groove (2), and one end of a water outlet pipe (5) connected to the water outlet end of the pump body (4) is connected to one side of the oscillation groove (2).

2. The semiconductor cleaning oscillation tank according to claim 1, characterized in that: The detachable bracket comprises a fixing rod (15) fixed to the inner wall of the bottom end of the oscillation groove (2), vertical rods (7) are fixed to both ends of the fixing rod (15), and support plates (8) are slidably sleeved on the two vertical rods (7).

3. The semiconductor cleaning oscillation tank according to claim 2, characterized in that: A magnet block (13) is fixed to the upper end of the fixing rod (15), and a metal sleeve (14) is fixed to the lower end surface of the supporting plate (8).

4. The semiconductor cleaning oscillation tank according to claim 1, characterized in that: The connection point between the water outlet pipe (5) and the oscillation groove (2) is located on one side of the L-shaped support rod (11), and a control switch is installed on the outer wall of the oscillation groove (2).

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