A low-cost copper plating solution recycling device

Abstract

A low-cost copper plating solution recycling device, comprising a processing table, a conveying frame and a material grabbing manipulator, wherein the processing table is provided with a copper plating tank with an upper end opening, a cleaning tank and a purification tank in sequence, the conveying frame is installed on the processing table and is located above the copper plating tank, the cleaning tank and the purification tank, the material grabbing manipulator is installed below the conveying frame and can slide left and right along the conveying frame, and the material grabbing manipulator can also be movable and lifted; the low-cost copper plating solution recycling device also includes a group of recovery pipes and a group of circulation pipes, the two ends of the recovery pipes are respectively connected to the cleaning tank and the purification tank, and the two ends of the circulation pipes are respectively connected to the copper plating tank and the purification tank. The utility model designs a copper plating device with a copper plating tank, a cleaning tank and a purification tank, and cooperates with the recovery pipe and the circulation pipe structure to recycle and purify wastewater for reuse, thereby reducing the cost of circuit board copper plating processing; the utility model has strong practicality and strong promotion significance.

Description

Technical Field

[0001] The utility model relates to a circuit board processing device, in particular to a low-cost copper plating liquid recycling device. Background Art

[0002] A circuit board is also called a circuit board. It is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, must use a circuit board to make electrical connections between the various components. The circuit board consists of an insulating base plate, connecting wires, and pads for assembling and welding electronic components. It has the dual functions of a conductive line and an insulating base plate.

[0003] The copper plating process is widely used in the production and processing of circuit boards. Its main purpose is to deposit a layer of copper on a non-conductive substrate through a series of chemical treatment methods, and then thicken it to a specific designed thickness through a subsequent electroplating method. In the existing copper plating process of circuit boards, there is often a lot of copper plating liquid left on the circuit boards salvaged from the copper plating liquid. In order to better carry out subsequent processing, the circuit boards need to be cleaned, but the wastewater containing the copper plating liquid after cleaning is often directly discharged, which not only causes a waste of copper plating liquid, but also greatly increases the pressure on environmental protection. Utility Model Content

[0004] Based on this, it is necessary to provide a low-cost copper plating solution recycling device to address the deficiencies in the prior art.

[0005] A low-cost copper plating solution recycling device comprises a processing table, a conveying frame and a material grabbing manipulator, wherein the processing table is provided with a copper plating tank with an upper end opening, a cleaning tank and a purification tank in sequence, the conveying frame is installed on the processing table and is located above the copper plating tank, the cleaning tank and the purification tank, the material grabbing manipulator is installed below the conveying frame and can slide left and right along the conveying frame, and the material grabbing manipulator can also be movable and lifted. The low-cost copper plating solution recycling device also comprises a set of recovery pipes and a set of circulation pipes, the two ends of the recovery pipes are respectively connected to the cleaning tank and the purification tank, and the two ends of the circulation pipes are respectively connected to the copper plating tank and the purification tank.

[0006] Furthermore, the recovery pipeline and the circulation pipeline are respectively provided with a first control valve and a second control valve, the first control valve can control the on-off and flow rate of the recovery pipeline, and the second control valve can control the on-off and flow rate of the circulation pipeline.

[0007] Furthermore, the low-cost copper plating solution recycling device also includes two groups of spray cleaning components, and the inner side of the cleaning tank is correspondingly provided with a lifting slide rail. The spray cleaning component includes a spray slide and a plurality of spray heads, the spray slide is mounted on the lifting slide rail and can be moved up and down, and the plurality of spray heads are arranged in sequence on the spray slide.

[0008] Furthermore, the low-cost copper plating solution recycling device also includes two sets of drying air knives, and the drying air knives include a telescopic frame and an air flow nozzle. The telescopic frame is fixedly mounted on the inner wall of the purification tank, and the telescopic frame can be adjusted horizontally, and the air flow nozzle is axially connected to the inner end of the telescopic frame and can be movably rotated.

[0009] Furthermore, the low-cost copper plating solution recycling device also includes three sets of upper covers, which are respectively covered at the upper end openings of the copper plating tank, the cleaning tank and the purification tank. The upper cover includes two sets of mounting seats and cover plates which are symmetrically arranged, the mounting seats are fixedly mounted on the processing table, and the cover plates are axially connected to the mounting seats and can be movably turned over.

[0010] In summary, the beneficial effects of the low-cost copper plating liquid recycling device of the utility model are: by designing a copper plating device with a copper plating tank, a cleaning tank and a purification tank, the waste water after the circuit board is cleaned is recycled and purified and recycled again in conjunction with the recovery pipe and the circulation pipe structure, which not only greatly reduces the cost of the circuit board copper plating processing, but also is more friendly to environmental protection; the spray cleaning component designed in the cleaning tank can clean the surface of the circuit board more comprehensively and thoroughly, so that the circuit board after the copper plating processing can enter the next processing flow with higher effect quality; the drying air knife designed in the purification tank can not only speed up the drying efficiency of the circuit board after cleaning, but also further recover the residual cleaning waste water on the circuit board, and improve the recycling rate of the data in the copper plating process; the copper plating tank, the cleaning tank and the purification tank are all designed with a flip-open and closable upper cover, which can effectively reduce the risk of splashing or volatilization of the solution or waste liquid in the tank, and can effectively prevent external dirt from entering the tank to pollute the reaction liquid; the utility model has strong practicality and strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic structural diagram of a low-cost copper plating solution recycling device of the utility model;

[0012] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0013] Figure 3 for Figure 2 The structural diagram of the workbench in the middle;

[0014] Figure 4 for Figure 2 Schematic diagram of the structure of the recovery pipeline and the circulation pipeline;

[0015] Figure 5 for Figure 2 Schematic diagram of the exploded structure of the spray cleaning component;

[0016] Figure 6 for Figure 2 Schematic diagram of the decomposed structure of the drying air knife;

[0017] Figure 7 for Figure 2 Schematic diagram of the exploded structure of the middle upper cover. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0019] like Figures 1 to 7 As shown, the utility model provides a low-cost copper plating solution recycling device 1OO, which includes a processing table 1O, a conveying frame 20 and a grabbing manipulator 30. The processing table 1O is provided with a copper plating tank 11 with an upper end opening, a cleaning tank 12 and a purification tank 13 in sequence. The conveying frame 20 is installed on the processing table 10 and is located above the copper plating tank 11, the cleaning tank 12 and the purification tank 13. The grabbing manipulator 30 is installed below the conveying frame 20 and can slide left and right along the conveying frame 20. The grabbing manipulator 30 can also be movable and raised and lowered.

[0020] The low-cost copper plating solution recycling device 100 also includes a set of recovery pipes 40 and a set of circulation pipes 50, the two ends of the recovery pipes 40 are respectively connected to the cleaning tank 12 and the purification tank 13, and the two ends of the circulation pipes 50 are respectively connected to the copper plating tank 11 and the purification tank 13. Specifically, in this embodiment, the recovery pipes 40 and the circulation pipes 50 are respectively provided with a first control valve 41 and a second control valve 51, the first control valve 41 can control the on-off and flow rate of the recovery pipe 40, and the second control valve 51 can control the on-off and flow rate of the circulation pipe 50.

[0021] When the circuit board is undergoing copper deposition, the circuit board is firstly clamped by the material gripping manipulator 30 and immersed in the copper deposition tank 11. After the copper layer is completely deposited on the surface of the circuit board, it is taken out and placed in the cleaning tank 12. The residual copper deposition liquid on the surface of the circuit board is cleaned by the clean water in the cleaning tank 12, and finally the circuit board is suspended in the purification tank 13 for drying. The cleaning wastewater formed by the mixture of the clean water in the cleaning tank 12 and the copper deposition liquid is pumped into the purification tank 13 through the recovery pipe 40. After adding the copper deposition raw material of the appropriate proportion in the purification tank 13, it becomes a high-concentration copper deposition liquid again. The copper deposition liquid prepared in the purification tank 13 can be sent to the copper deposition tank 11 under the pumping of the circulation pipe 50, and the copper deposition reaction is continuously carried out on the surface of the circuit board. The wastewater generated by the cleaning of the circuit board after copper deposition is purified again in the purification tank 13 as copper deposition liquid for reuse, which not only reduces the waste of resources and reduces the production cost, but also can effectively avoid the problem of wastewater discharge causing pollution to the environment.

[0022] The low-cost copper plating solution recycling device 100 also includes two groups of spray cleaning components 60, and the inner side of the cleaning tank 12 is correspondingly provided with a lifting slide rail 14. The spray cleaning component 60 includes a spray slide 61 and a plurality of spray heads 62, and the spray slide 61 is mounted on the lifting slide rail 14 and can be movably lifted and lowered, and the plurality of spray heads 62 are arranged in sequence and mounted on the spray slide 61. The spray cleaning component 60 installed on the lifting slide rail 14 can be movably lifted and lowered to form a comprehensive brushing and cleaning of the circuit board, so as to avoid incomplete cleaning of the copper plating solution on the circuit board and affect the subsequent processing quality.

[0023] The low-cost copper plating solution recycling device 100 also includes two sets of drying air knives 70, and the drying air knives 70 include a telescopic frame 71 and an air flow nozzle 72. The telescopic frame 71 is fixedly mounted on the inner wall of the purification tank 13, and the telescopic frame 71 can be adjusted horizontally and telescopically, and the air flow nozzle 72 is axially connected to the inner end of the telescopic frame 71 and can be movably rotated. The air flow nozzle 72 can generate a flat strip of high-pressure airflow that is sprayed on the surface of the circuit board, and the moisture on the circuit board is scraped off from the surface and falls into the purification tank 13, which greatly speeds up the drying efficiency of the circuit board. The telescopic frame 71 can drive the adjustment of the distance between the air flow nozzle 72 and the surface of the circuit board, so that the pressure of the high-pressure airflow can just scrape off the moisture on the surface of the circuit board without causing damage to the circuit board.

[0024] The low-cost copper plating solution recycling device 100 also includes three sets of upper covers 80, which are respectively covered at the upper end openings of the copper plating tank 11, the cleaning tank 12 and the purification tank 13. The upper cover 80 includes two sets of mounting seats 81 and a cover plate 82 which are symmetrically arranged. The mounting seats 81 are fixedly mounted on the processing table 10, and the cover plate 82 is axially connected to the mounting seats 81 and can be movably turned over. The three sets of flippable upper covers 80 make the copper plating tank 11 on the processing table 10 more flexible to use, and the port can be opened or closed at any time, which can not only basically isolate the space in the tank from the outside world to play a protective effect during the copper plating process, but also do not hinder the entry or removal of the circuit board.

[0025] In summary, the beneficial effects of the low-cost copper plating liquid recycling device 1OO of the utility model are: by designing a copper plating device with a copper plating tank 11, a cleaning tank 12 and a purification tank 13, the waste water after the circuit board is cleaned is recycled and purified and recycled again by coordinating the recovery pipe 40 and the circulation pipe 50 structure, which not only greatly reduces the cost of the circuit board copper plating processing, but also is more friendly to environmental protection; the spray cleaning component 60 designed in the cleaning tank 12 can clean the surface of the circuit board more comprehensively and thoroughly, so that the circuit board after the copper plating processing can enter the next processing flow with higher effect quality; the drying air knife 70 is designed in the purification tank 13, which can not only speed up the drying efficiency of the circuit board after cleaning, but also further recycle the residual cleaning waste water on the circuit board, and improve the recycling rate of the data in the copper plating process; the copper plating tank 11, the cleaning tank 12 and the purification tank 13 are all designed with a flip-opening and closing cover 80, which can effectively reduce the risk of splashing or volatilization of the solution or waste liquid in the tank, and can effectively prevent external dirt from entering the tank to pollute the reaction liquid; the utility model has strong practicality and strong promotion significance.

[0026] The above-mentioned embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A low-cost copper plating solution recycling device, characterized in that: It includes a processing table, a conveying frame and a material grabbing manipulator. The processing table is provided with a copper deposition tank with an upper end opening, a cleaning tank and a purification tank in sequence. The conveying frame is installed on the processing table and is located above the copper deposition tank, the cleaning tank and the purification tank. The material grabbing manipulator is installed below the conveying frame and can slide left and right along the conveying frame. The material grabbing manipulator can also be moved up and down. The low-cost copper deposition liquid recycling device also includes a group of recovery pipes and a group of circulation pipes. The two ends of the recovery pipes are respectively connected to the cleaning tank and the purification tank, and the two ends of the circulation pipes are respectively connected to the copper deposition tank and the purification tank.

2. The low-cost copper plating solution recycling device according to claim 1, characterized in that: The recovery pipeline and the circulation pipeline are respectively provided with a first control valve and a second control valve. The first control valve can control the on-off and flow rate of the recovery pipeline, and the second control valve can control the on-off and flow rate of the circulation pipeline.

3. The low-cost copper plating solution recycling device according to claim 1, characterized in that: It also includes two groups of spray cleaning components, and the inner side of the cleaning tank is correspondingly provided with a lifting slide rail; the spray cleaning components include a spray slide and a plurality of spray heads, the spray slide is snap-fitted and mounted on the lifting slide rail and can be movably lifted and lowered, and the plurality of spray heads are arranged in sequence and mounted on the spray slide.

4. The low-cost copper plating solution recycling device according to claim 1, characterized in that: It also includes two sets of drying air knives, which include telescopic frames and air flow nozzles. The telescopic frames are fixedly mounted on the inner wall of the purification tank and can be adjusted and extended horizontally. The air flow nozzles are axially connected to the inner end of the telescopic frames and can rotate movably.

5. The low-cost copper plating solution recycling device according to claim 1, characterized in that: It also includes three groups of upper covers, which respectively cover the upper end openings of the copper deposition tank, the cleaning tank and the purification tank; the upper covers include two groups of mounting seats and cover plates which are symmetrically arranged, the mounting seats are fixedly mounted on the processing table, and the cover plates are axially connected to the mounting seats and can be movably flipped.

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