A local electroplating device

Abstract

The utility model discloses a local electroplating device, which relates to the field of electroplating, including: a substrate, an electroplating wheel, a nozzle, a pressing belt, a first roller and a second roller, a cavity is concavely provided at one end of the electroplating wheel, the electroplating wheel is provided with a plurality of first holes along the radial direction of the electroplating wheel, the nozzle is provided at one end of the cavity, the nozzle is evenly spaced around the center line of the electroplating wheel, the nozzle is provided with a second hole along the radial direction of the electroplating wheel, the first hole includes a first inner hole and a first outer hole in sequence along the radial direction of the electroplating wheel, the second hole includes a second inner hole and a second outer hole in sequence along the radial direction of the electroplating wheel, the first inner hole and the second inner hole are both chamfered, and the projection of the second outer hole along the radial direction of the electroplating wheel is provided on the motion track of the first inner hole. A silicone mold dedicated to the product is used to cover the area where the product does not need to be electroplated with precious metals, and the area where the precious metals need to be electroplated is exposed, so that the electroplating cost can be well controlled.

Description

Technical Field

[0001] The utility model relates to the field of electroplating, in particular to a local electroplating device. Background Art

[0002] Spot plating wheel is a kind of spot plating mold, also known as selective plating ring, spray head, spot plating jig or spot plating fixture small wheel plating. It is a special tool used for selective electroplating of lead frames of specific electronic products on a general reel-to-reel spot plating machine. Spot plating by spot plating wheel is a high-speed and economical electroplating method of local electroplating device, suitable for lead frame electroplating of electronic components such as IC, diode, triode, connector and LED. Because it can achieve targeted selective electroplating of functional areas, the electroplating area is small, which can achieve the purpose of saving precious metals such as gold and silver.

[0003] The spot plating wheel is usually set on the spot plating machine panel through the anode shaft. The outer ring of the spot plating wheel is provided with spot plating holes along the circumferential direction. An anode water bag for storing the electroplating liquid is provided on the anode shaft. The anode water bag is disc-shaped. The outer peripheral side of the anode water bag is provided with spray holes. When electroplating is carried out, the anode water bag radially sprays the electroplating liquid, and the electroplating liquid is sprayed to the electroplating area on the product to be electroplated through the spot plating holes.

[0004] The spot plating wheel has a certain volume, and the anode axis is set at the center of the spot plating wheel. In order to save precious metals, the aperture of the spot plating holes is usually smaller. During use, the spot plating solution is easy to adhere to the edge of the spot plating hole, and crystals grow in the spot plating hole, causing the spot plating hole to be blocked. The solution cannot be sprayed out, or the spraying force is not enough, resulting in abnormal batch gold plating and reduced output.

[0005] With respect to the above-mentioned related technologies, the inventor believes that there are the following technical defects: the plating liquid splashes out from the gap between the spot plating wheel and the product to be plated through the spot plating holes, causing waste of plating liquid and even contaminating the non-plating area on the product. Further improvements are needed. Utility Model Content

[0006] The purpose of the utility model is to provide a local electroplating device to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a local electroplating device, comprising: a substrate, an electroplating wheel, a pressing belt, a first roller for the pressing belt and a second roller for conveying the material belt, the electroplating wheel, the pressing belt, the first roller and the second roller are all arranged on the upper surface of the substrate, the material belt is clamped between the electroplating wheel and the outer circumferential surface of the pressing belt, a cavity is concavely provided at one end of the electroplating wheel, a groove is provided on the outer surface of the electroplating wheel around the center line of the electroplating wheel, the pressing belt is arranged in the groove, and the electroplating wheel is provided with a plurality of first rollers along the radial direction of the electroplating wheel The first hole has two ends connected to the cavity and the groove respectively, the nozzle is arranged at one end of the cavity, the nozzles are evenly spaced around the center line of the electroplating wheel, the nozzle is provided with a second hole along the radial direction of the electroplating wheel, the first hole includes a first inner hole and a first outer hole in sequence along the radial direction of the electroplating wheel, the second hole includes a second inner hole and a second outer hole in sequence along the radial direction of the electroplating wheel, the first inner hole and the second inner hole are both chamfered, and the projection of the second outer hole along the radial direction of the electroplating wheel is arranged on the motion trajectory of the first inner hole; during electroplating, the first hole and the second hole are coaxially arranged.

[0008] Preferably, the local electroplating device also includes a platinum wire and a power supply, the platinum wire and the material strip are respectively connected to the anode and cathode of the power supply, the platinum wire is arranged at one end of the nozzle, the platinum wire is cross-arranged on the side of the second hole away from the center line of the electroplating wheel, and the intersection point of the platinum wire is colinear with the center line of the second hole.

[0009] Preferably, the nozzle comprises a nozzle body and a fixing element, four of the fixing elements are fixed to the nozzle body in sequence around the second hole, the fixing element comprises a rod body, one end of the rod body is threadedly connected to the nozzle body, and the platinum wire is wound around the rod body.

[0010] Preferably, the fixing element further comprises a protrusion, which is a cylinder, and is integrally formed with the other end of the rod body. The protrusion is coaxially arranged with the rod body, and the diameter of the rod body is smaller than the diameter of the protrusion.

[0011] Preferably, the local electroplating device also includes a first positioning pin, which is embedded in the groove. A first threaded hole is opened in the groove. One end of the first positioning pin is threadedly connected to the first threaded hole, and the other end of the first positioning pin passes through the material strip.

[0012] Preferably, the electroplating wheel comprises a wheel body, a spindle and a panel, the wheel body is a cylindrical structure, the panel is detachably arranged at one end of the cylinder by screws, both ends of the cylinder are provided with second threaded holes matching the screws, the spindle is arranged through the center of the panel, and the spindle is fixedly connected to the panel. The panel is a transparent plate.

[0013] Preferably, the local electroplating device also includes a water pump and a liquid medicine tank, the nozzle, the water pump and the liquid medicine tank are connected in sequence through pipes, the substrate is arranged at the upper end of the liquid medicine tank, and the substrate array is provided with a plurality of through holes.

[0014] Preferably, the local electroplating device also includes a micro switch, and the micro switch and the nozzle are respectively arranged at two ends of the cavity, and one end of the driving rod of the micro switch is arranged on the motion trajectory of one end of the first hole close to the center line of the electroplating wheel.

[0015] Preferably, the local electroplating device further comprises a supporting element, the supporting element is arranged on the substrate, the supporting element is arranged inside the cavity, the supporting element is a cylindrical structure, the main shaft passes through the supporting element, the surface of the supporting element away from the substrate is provided with a plurality of through grooves around the center line array of the electroplating wheel, and the middle of the nozzle is arranged inside the through groove. The wheel body and the supporting element are both made of insulating materials, such as PEEK material.

[0016] Preferably, the local electroplating device also includes a second positioning pin, which is embedded in the groove. A second threaded hole is opened in the groove. One end of the second positioning pin is threadedly connected to the second threaded hole. The pressing belt is provided with a positioning groove, and the other end of the second positioning pin is arranged in the positioning groove.

[0017] The beneficial effects of the utility model are as follows: the nozzle plays a drainage role, and the liquid medicine sprayed from the nozzle will connect the anode when passing through the platinum wire, and the material strip will connect the cathode. After the liquid medicine passes through the first hole, the local position on the material strip is electroplated. The area where the product does not need to be electroplated with precious metals is covered by a special silicone mold for the product, and the area where the precious metal needs to be electroplated is exposed, so that the electroplating cost can be well controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings further illustrate the present invention, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention.

[0019] Figure 1 A schematic structural diagram of a local electroplating device provided in one embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the structure of the electroplating wheel provided in one embodiment of the utility model Figure 1 ;

[0021] Figure 3 A schematic diagram of the structure of the electroplating wheel provided in one embodiment of the utility model Figure 2 ;

[0022] Figure 4 A schematic diagram of the structure of a nozzle provided in one embodiment of the utility model;

[0023] Figure 5 A half-section view of a nozzle provided in one embodiment of the utility model.

[0024] Figure numerals: 1: electroplating wheel; 2: substrate; 3: pressing belt; 4: first roller; 5: second roller; 6: nozzle; 7: platinum wire; 11: wheel body; 12: panel. DETAILED DESCRIPTION

[0025] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0026] It should be noted that in the present invention, unless otherwise stated, when an element is referred to as being "fixed to" or "set on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The directional words used, such as "upper, lower, left, right" generally refer to the upper, lower, left, right, and right sides of the element. Figure 1 "Inside and outside" refer to the inside and outside of a specific outline. "Far and near" refer to the far and near relative to a certain component.

[0027] like Figure 1 , 2 As shown in , 4, and 5, a local electroplating device provided by an embodiment of the utility model comprises: a substrate 2, an electroplating wheel 1, a nozzle 6, a pressing belt 3, a first roller 4 for the pressing belt 3, and a second roller 5 for conveying the material belt, wherein the electroplating wheel 1, the pressing belt 3, the first roller 4, and the second roller 5 are all arranged on the upper surface of the substrate 2, and the material belt is clamped between the electroplating wheel 1 and the outer circumferential surface of the pressing belt 3, a cavity is concavely provided at one end of the electroplating wheel 1, a groove is provided on the outer surface of the electroplating wheel 1 around the center line of the electroplating wheel 1, the pressing belt 3 is arranged in the groove, and the electroplating wheel 1 is along the radial direction of the electroplating wheel 1 A plurality of first holes are provided, and the two ends of the first holes are connected to the cavity and the groove respectively. The nozzle 6 is arranged at one end of the cavity, and the nozzle 6 is evenly spaced around the center line of the electroplating wheel 1. The nozzle 6 is provided with a second hole along the radial direction of the electroplating wheel 1. The first hole includes a first inner hole and a first outer hole in sequence along the radial direction of the electroplating wheel 1, and the second hole includes a second inner hole and a second outer hole in sequence along the radial direction of the electroplating wheel 1. The first inner hole and the second inner hole are both chamfered, and the projection of the second outer hole along the radial direction of the electroplating wheel 1 is arranged on the motion trajectory of the first inner hole; during electroplating, the first hole and the second hole are coaxially arranged.

[0028] The local electroplating device also includes a platinum wire 7 and a power supply. The platinum wire 7 and the material strip are respectively connected to the anode and cathode of the power supply. The platinum wire 7 is arranged at one end of the nozzle 6. The platinum wire 7 is cross-arranged on the side of the second hole away from the center line of the electroplating wheel 1. The intersection of the platinum wire 7 is colinear with the center line of the second hole.

[0029] The nozzle 6 includes a nozzle 6 body and a fixing element. Four fixing elements are fixed to the nozzle 6 body in sequence around the second hole. The fixing element includes a rod body. One end of the rod body is threadedly connected to the nozzle 6 body. The platinum wire 7 is wound around the rod body.

[0030] The fixing element further comprises a protrusion, which is a cylinder and is integrally formed and arranged at the other end of the rod body. The protrusion is coaxially arranged with the rod body, and the diameter of the rod body is smaller than the diameter of the protrusion.

[0031] The local electroplating device also includes a first positioning pin, which is embedded in the groove. A first threaded hole is opened in the groove. One end of the first positioning pin is threadedly connected to the first threaded hole, and the other end of the first positioning pin passes through the material strip.

[0032] The electroplating wheel 1 comprises a wheel body 11, a main shaft and a panel 12. The wheel body 11 is a cylindrical structure. The panel 12 is detachably arranged at one end of the cylinder by screws. Second threaded holes matching the screws are provided at both ends of the cylinder. The main shaft is arranged through the center of the panel 12. The main shaft is fixedly connected to the panel 12. The panel 12 is a transparent plate.

[0033] The local electroplating device also includes a water pump and a liquid medicine tank. The nozzle 6, the water pump and the liquid medicine tank are connected in sequence through pipelines. The substrate 2 is arranged at the upper end of the liquid medicine tank. The substrate 2 array is provided with a plurality of through holes.

[0034] The local electroplating device also includes a micro switch, and the micro switch and the nozzle 6 are respectively arranged at two ends of the cavity, and one end of the driving rod of the micro switch is arranged on the motion track of one end of the first hole close to the center line of the electroplating wheel 1.

[0035] The local electroplating device further comprises a supporting element, which is arranged on the substrate 2, and is arranged inside the cavity. The supporting element is a cylindrical structure, and the spindle passes through the supporting element. The surface of the supporting element away from the substrate 2 is provided with a plurality of through grooves in an array around the center line of the electroplating wheel 1, and the middle of the nozzle 6 is arranged inside the through groove. The wheel body 11 and the supporting element are both made of insulating materials, such as PEEK material.

[0036] The local electroplating device also includes a second positioning pin, which is embedded in the groove. A second threaded hole is opened in the groove. One end of the second positioning pin is threadedly connected to the second threaded hole. The pressing belt 3 is provided with a positioning groove, and the other end of the second positioning pin is arranged in the positioning groove.

[0037] In one embodiment, if Figure 3 As shown, one end of the nozzle 6 is connected to an elbow, and the elbow is threadedly connected to the substrate 2.

[0038] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, which should be considered as the scope of this specification.

Claims

1. A local electroplating device, characterized in that: include: A substrate, an electroplating wheel, a nozzle, a pressing belt, a first roller for the pressing belt and a second roller for conveying the material belt, wherein the electroplating wheel, the pressing belt, the first roller and the second roller are all arranged on the upper surface of the substrate, the material belt is clamped between the electroplating wheel and the outer circumferential surface of the pressing belt, a cavity is recessed at one end of the electroplating wheel, a groove is arranged on the outer surface of the electroplating wheel around the center line of the electroplating wheel, the pressing belt is arranged in the groove, the electroplating wheel is provided with a plurality of first holes along the radial direction of the electroplating wheel, the two ends of the first hole are connected to the cavity and the groove respectively, the nozzle is arranged at one end of the cavity, the nozzle is evenly spaced around the center line of the electroplating wheel, the nozzle is provided with a second hole along the radial direction of the electroplating wheel, the first hole includes a first inner hole and a first outer hole in sequence along the radial direction of the electroplating wheel, the second hole includes a second inner hole and a second outer hole in sequence along the radial direction of the electroplating wheel, the first inner hole and the second inner hole are both chamfered, and the projection of the second outer hole along the radial direction of the electroplating wheel is arranged on the motion trajectory of the first inner hole.

2. The local electroplating device according to claim 1, characterized in that: It also includes a platinum wire and a power supply, wherein the platinum wire and the material strip are respectively connected to the anode and cathode of the power supply, the platinum wire is arranged at one end of the nozzle, and the platinum wire is cross-arranged on the side of the second hole away from the center line of the electroplating wheel, and the intersection point of the platinum wire is colinear with the center line of the second hole.

3. The local electroplating device according to claim 2, characterized in that: The nozzle comprises a nozzle body and a fixing element. Four fixing elements are fixed to the nozzle body in sequence around the second hole. The fixing element comprises a rod body. One end of the rod body is threadedly connected to the nozzle body. The platinum wire is wound around the rod body.

4. The local electroplating device according to claim 3, characterized in that: The fixing element further comprises a protrusion, which is a cylinder and is integrally formed and arranged at the other end of the rod body. The protrusion is coaxially arranged with the rod body, and the diameter of the rod body is smaller than the diameter of the protrusion.

5. The local electroplating device according to claim 1, characterized in that: It also includes a first positioning pin, which is embedded in the groove. A first threaded hole is opened in the groove. One end of the first positioning pin is threadedly connected to the first threaded hole, and the other end of the first positioning pin passes through the material strip.

6. The local electroplating device according to claim 1, characterized in that: The electroplating wheel includes a wheel body, a main shaft and a panel. The wheel body is a cylindrical structure. The panel is detachably arranged at one end of the cylinder by screws. Second threaded holes matching the screws are provided at both ends of the cylinder. The main shaft is arranged through the center of the panel, and the main shaft is fixedly connected to the panel.

7. The local electroplating device according to claim 1, characterized in that: It also includes a water pump and a medicine tank. The nozzle, the water pump and the medicine tank are connected in sequence by pipelines. The substrate is arranged at the upper end of the medicine tank, and the substrate array is provided with a plurality of through holes.

8. The local electroplating device according to claim 1, characterized in that: It also includes a micro switch, which is respectively arranged at two ends of the cavity with the nozzle, and one end of the driving rod of the micro switch is arranged on the motion track of one end of the first hole close to the center line of the electroplating wheel.

9. The local electroplating device according to claim 6, characterized in that: It also includes a supporting element, which is arranged on the substrate, the supporting element is arranged inside the cavity, the supporting element is a cylindrical structure, the main shaft passes through the supporting element, the surface of the supporting element away from the substrate is provided with a plurality of through grooves around the center line array of the electroplating wheel, and the middle part of the nozzle is arranged inside the through groove.

10. The local electroplating device according to claim 1, characterized in that: It also includes a second positioning pin, which is embedded in the groove. A second threaded hole is opened in the groove. One end of the second positioning pin is threadedly connected to the second threaded hole. The pressing belt is provided with a positioning groove, and the other end of the second positioning pin is arranged in the positioning groove.

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