Vacuumizing device

Abstract

The utility model relates to the technical field of semiconductor temperature control, and provides a vacuumizing device. The vacuumizing device comprises a vacuum pump, a first pipeline and a control system. One end of the first pipeline is communicated with the vacuum pump, and the other end is communicated with first semiconductor temperature control equipment; the first pipeline is provided with a first vacuum gauge and a second vacuum gauge, the measuring ranges of the first vacuum gauge and the second vacuum gauge are different, and the first vacuum gauge and the second vacuum gauge are both used for detecting the vacuum degree in the first pipeline; and the vacuum pump, the first vacuum gauge and the second vacuum gauge are all in signal connection with the control system. According to the utility model, the problem that in the prior art, when the semiconductor temperature control equipment is vacuumized, the vacuum degree cannot be detected, so that accurate control cannot be carried out, and the error of the vacuum degree formed by the equipment is relatively large is solved, and the vacuumizing device capable of accurately controlling the vacuum degree of the semiconductor temperature control equipment is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor temperature control, in particular to a vacuum pumping device. Background Art

[0002] In the integrated circuit process, semiconductor-specific temperature control equipment provides constant temperature fluids of different temperatures for the main equipment. The main station has high requirements for the temperature control accuracy of the constant temperature liquid provided by the semiconductor temperature control device, and at the same time requires the semiconductor-specific temperature control device to be stable and reliable. The semiconductor temperature control equipment consists of two parts: the refrigeration system and the circulation system. The refrigeration system exchanges heat with the circulation system, and the circulation system mainly provides circulating fluid for the main equipment. The refrigeration system needs to be filled with refrigerant so that the refrigerant can exchange heat with the circulation system. The refrigeration system needs to be evacuated before the refrigerant is added, and the vacuum degree affects the temperature accuracy of the semiconductor refrigeration system.

[0003] At present, the vacuum pumping of semiconductor temperature control equipment is only judged by time, but not by the vacuum degree of the system. Although the vacuum pumping time is the same, the vacuum degree of the final refrigeration system will be different due to the different performance of the vacuum pump. Utility Model Content

[0004] The utility model provides a vacuum pumping device, which is used to solve the defect in the prior art that the vacuum pumping of semiconductor temperature control equipment is only determined according to time but the vacuum degree of the system is not determined, and realizes a vacuum pumping device capable of accurately controlling the vacuum degree of the semiconductor temperature control equipment.

[0005] The utility model provides a vacuum pumping device, comprising a vacuum pump, a first pipeline and a control system. One end of the first pipeline is connected to the vacuum pump, and the other end is connected to a first semiconductor temperature control device; the first pipeline is provided with a first vacuum gauge and a second vacuum gauge, the first vacuum gauge and the second vacuum gauge have different ranges, and are both used to detect the vacuum degree inside the first pipeline; the vacuum pump, the first vacuum gauge and the second vacuum gauge are all connected to the control system signal, and the control system is used to control the operation of the vacuum pump, the first vacuum gauge and the second vacuum gauge.

[0006] According to a vacuum pumping device provided by the utility model, a first filter is provided between the first pipeline and the first semiconductor temperature control device.

[0007] According to a vacuum pumping device provided by the utility model, the first pipeline is further provided with a first solenoid valve, and the first solenoid valve is used to control the on-off of the airflow inside the first pipeline.

[0008] According to a vacuum pumping device provided by the utility model, it also includes a second pipeline, one end of the second pipeline is connected to the first pipeline between the vacuum pump and the first solenoid valve, and the other end of the second pipeline is connected to a second semiconductor temperature control device; the second pipeline is provided with a third vacuum gauge, and the third vacuum gauge is used to detect the vacuum degree inside the second pipeline.

[0009] According to a vacuum pumping device provided by the utility model, the second pipeline is further provided with a fourth vacuum gauge, and the measuring range of the fourth vacuum gauge is different from that of the fourth vacuum gauge.

[0010] According to a vacuum pumping device provided by the utility model, the second pipeline is further provided with a second solenoid valve, and the second solenoid valve is located between the first pipeline and the third vacuum gauge.

[0011] According to a vacuum pumping device provided by the utility model, the control system includes a touch screen and a controller, and the controller is signal-connected to the touch screen, the vacuum pump, the first solenoid valve, the first vacuum gauge, the second vacuum gauge, the second solenoid valve, the third vacuum gauge and the fourth vacuum gauge.

[0012] According to a vacuum pumping device provided by the utility model, a second filter is provided between the second pipeline and the second semiconductor temperature control device.

[0013] According to a vacuum pumping device provided by the utility model, a plurality of mounting seats are provided on the second pipeline and the second semiconductor temperature control device, and the mounting seats are provided with connecting parts, and the connecting parts are provided with threaded holes.

[0014] According to the vacuum pumping device provided by the utility model, the mounting seat is provided with a shock absorbing mechanism.

[0015] The vacuum pumping device provided by the utility model can realize precise control of the vacuum degree through the cooperation of the control system and the vacuum gauge, ensuring that the first semiconductor temperature control device reaches the required vacuum level. According to the real-time feedback of the vacuum degree, the control system can intelligently adjust the working state of the vacuum pump, avoid unnecessary energy consumption, and improve the efficiency of vacuum pumping. By setting the first vacuum gauge and the second vacuum gauge with different ranges, it can adapt to the vacuum degree detection requirements in different ranges, while ensuring the safe and stable operation of the equipment. Secondly, the vacuum gauge can also be used to detect whether there is gas leakage in the device, which plays a role in leak detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a structural schematic diagram of the vacuum pumping device provided by the utility model.

[0018] Figure 2 This is one of the flow charts of the vacuum pumping device provided by the utility model.

[0019] Figure 3 This is the second flow chart of the vacuum pumping device provided by the utility model.

[0020] Figure numerals: 100: vacuum pump; 200: first pipeline; 300: control system; 400: first semiconductor temperature control device; 500: second pipeline; 600: second semiconductor temperature control device; 210: first solenoid valve; 220: first vacuum gauge; 230: second vacuum gauge; 310: touch screen; 320: controller; 510: second solenoid valve; 520: third vacuum gauge; 530: fourth vacuum gauge. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood in specific circumstances.

[0024] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0025] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0026] Figure 1 The schematic diagram of the structure of the vacuum pumping device provided by the embodiment of the utility model is illustrated. Figure 1 The embodiment of the utility model provides a vacuum pumping device including a vacuum pump 100, a first pipeline 200 and a control system 300. The first pipeline 200 is connected to the vacuum pump 100 at one end and to the first semiconductor temperature control device 400 at the other end; the first pipeline 200 is provided with a first vacuum gauge 220 and a second vacuum gauge 230, the first vacuum gauge 220 and the second vacuum gauge 230 have different ranges and are both used to detect the vacuum degree inside the first pipeline 200; the vacuum pump 100, the first vacuum gauge 220 and the second vacuum gauge 230 are all connected to the control system 300 by signal, and the control system 300 is used to control the operation of the vacuum pump 100, the first vacuum gauge 220 and the second vacuum gauge 230.

[0027] In the above structure, when the vacuum pump 100 is started, it starts to extract the gas in the first semiconductor temperature control device 400 through the first pipeline 200, gradually reducing its internal air pressure to form a vacuum environment. In this process, the first solenoid valve 210 plays a role in controlling the flow of gas, and can be opened or closed as needed to adjust the speed and progress of the vacuum pumping. The first vacuum gauge 220 and the second vacuum gauge 230 detect the vacuum degree inside the first pipeline 200 in real time, and feed back the detected data to the control system 300. The control system 300 is connected to the vacuum pump 100 and the first vacuum gauge 220 signals, and intelligently adjusts the working state of the vacuum pump 100 according to the received vacuum degree data. If the vacuum degree does not reach the preset value, the control system will instruct the vacuum pump 100 to continue working; once it reaches or exceeds the preset value, the control system will instruct the vacuum pump 100 to stop working to avoid damage to the equipment caused by excessive vacuum pumping.

[0028] Through the cooperation of the control system 300 and the vacuum gauge, precise control of the vacuum degree can be achieved to ensure that the first semiconductor temperature control device 400 reaches the required vacuum level. According to the real-time feedback of the vacuum degree, the control system 300 can intelligently adjust the working state of the vacuum pump 100 to avoid unnecessary energy consumption and improve the efficiency of vacuum extraction. By setting the first vacuum gauge 220 and the second vacuum gauge 230 with different ranges, it can adapt to the vacuum degree detection requirements in different ranges while ensuring the safe and stable operation of the equipment. Secondly, the vacuum gauge can also be used to detect whether there is gas leakage in the device, which plays a role in leak detection.

[0029] In some possible embodiments, the control system 300 includes an AI algorithm to further optimize the performance of the control system 300. For example, machine learning technology can be used to learn and analyze a large amount of vacuum degree data to improve the accuracy of vacuum degree prediction and control. Secondly, remote monitoring and fault diagnosis functions can also be introduced to facilitate users to remotely manage and maintain the vacuum device.

[0030] Reference Figure 1 In some embodiments of the present invention, a first filter is provided between the first pipeline 200 and the first semiconductor temperature control device 400 .

[0031] Specifically, the cross-sections of the first pipeline 200 and the first semiconductor temperature control device 400 are circular. The first filter can be detachably arranged at the air inlet of the first pipeline 200 and the first semiconductor temperature control device 400 by means of bolts or the like. The first filter type can select different types of filters according to the specific needs and application scenarios of the vacuum device, such as a gold exhibition network filter or a polymer material filter. Specifically, a card slot is provided on the inner wall of the air inlet of the first pipeline 200 and the first semiconductor temperature control device 400. The first filter includes a frame and a filter screen, wherein the filter screen is fixedly installed on the frame. The shape of the frame is adapted to the cross-street surface of the first pipeline 200, and a protrusion is provided on the outside of the frame, which is arranged one-to-one with the card slot on the inner wall of the air inlet of the first pipeline 200. When the first filter is installed specifically, the protrusion can be aligned with the card slot, so that the frame is installed inside the first pipeline 200 or the first semiconductor temperature control device 400. It should be noted that, in order to prevent the first filter from moving into the first pipeline 200 under the action of the airflow, a block may be provided on the slot, and the function of the block is to prevent the first filter from further moving into the first pipeline 200 .

[0032] During the vacuuming process, tiny particles, dust or other impurities may exist in the pipeline. If these impurities are sucked into the setting equipment (such as vacuum pumps or other sensitive components), it may cause equipment failure or performance degradation. By setting the first filter, these impurities can be effectively intercepted to maintain the cleanliness of the gas in the pipeline, thereby protecting the normal operation of the setting equipment. In addition, the presence of impurities may block the pipeline or reduce the rate of gas flow, thereby affecting the speed and efficiency of vacuuming. By setting a filter, the resistance in the pipeline can be reduced, the gas flow can be kept smooth, and the efficiency of the entire vacuuming process can be improved.

[0033] Reference Figure 1 In some embodiments of the present invention, the first pipeline 200 is further provided with a first solenoid valve 210 , and the first solenoid valve 210 is used to control the on-off and flow direction of the airflow inside the first pipeline 200 .

[0034] In the above structure, the first solenoid valve 210 can accurately control the on-off and flow direction of the airflow in the first pipeline 200. This ensures that the airflow can circulate quickly and accurately when needed, or be cut off in time when not needed, thereby achieving precise control of the vacuum degree. Secondly, the first solenoid valve 210 has the characteristics of rapid response, and can respond quickly to control signals to achieve rapid switching of airflow states. This is particularly important in applications that require rapid adjustment of the vacuum degree, such as semiconductor manufacturing, high-energy physics research and other fields. In some possible embodiments, in order to ensure that the first solenoid valve 210 can maintain stable performance under long-term and high-frequency use, and meet the requirements of the vacuum device for airflow control, the first solenoid valve 210 can be made of precision processing and high-quality materials.

[0035] Reference Figure 1 In some embodiments of the utility model, a second pipeline 500 is further included, one end of the second pipeline 500 is connected to the first pipeline 200 between the vacuum pump 100 and the first solenoid valve 210, and the other end of the second pipeline 500 is connected to the second semiconductor temperature control device 600; the second pipeline 500 is provided with a third vacuum gauge 520, and the third vacuum gauge 520 is used to detect the vacuum degree inside the second pipeline 500. The second pipeline 500 is also provided with a fourth vacuum gauge 530, and the fourth vacuum gauge 530 has a different range from the fourth vacuum gauge 530. The second pipeline 500 is also provided with a second solenoid valve 510, and the second solenoid valve 510 is located between the first pipeline 200 and the third vacuum gauge 520.

[0036] Through the setting of the above scheme, the utility model can control multiple devices and realize vacuuming of multiple devices. It should be noted that the utility model is not limited to operating two semiconductor temperature control devices, and three, four, etc. can be set according to actual conditions. Multiple devices can be set in parallel in the manner of this embodiment.

[0037] Reference Figure 1 In some embodiments of the present invention, the control system 300 includes a touch screen 310 and a controller 320, and the controller 320 is signal-connected to the touch screen 310, the vacuum pump 100, the first solenoid valve 210, the first vacuum gauge 220, the second vacuum gauge 230, the second solenoid valve 510, the third vacuum gauge 520 and the fourth vacuum gauge 530.

[0038] In the above structure, the touch screen 310 serves as an interactive interface between the user and the control system 300, providing an intuitive and friendly operating experience. The user can easily set the vacuuming parameters, monitor the real-time status, and perform fault diagnosis and early warning operations through the touch screen 310, which greatly simplifies the operation process. Secondly, the controller 320 works in coordination with the vacuum pump 100, the first solenoid valve 210, the second solenoid valve 510, and the vacuum gauge through signal connection to achieve accurate control and monitoring of the vacuuming process. It can automatically adjust the operating state of the vacuum pump 100 according to the preset parameters, control the switch of the first solenoid valve 210 and the second solenoid valve 510, and read the measurement data of the vacuum gauge, thereby ensuring the stability and efficiency of the vacuuming process. Furthermore, the control system 300 has a fault diagnosis and early warning function, which can monitor the operating state of the vacuuming device in real time. Once an abnormal situation or potential fault is found, the system will immediately issue an alarm and display relevant information on the touch screen 310 to remind the user to deal with it in time.

[0039] Reference Figure 1 In some embodiments of the present invention, a second filter is provided between the second pipeline 500 and the second semiconductor temperature control device 600. The configuration of the second filter can refer to the first filter, and will not be described in detail here.

[0040] In some embodiments of the present invention, the second pipeline 500 and the second semiconductor temperature control device 600 are both provided with a plurality of mounting seats, the mounting seats are provided with connecting parts, the connecting parts are provided with threaded holes, and the mounting seats are provided with a shock absorbing mechanism.

[0041] In the above structure, multiple mounting seats provide a stable support for the second pipeline 500 and the second semiconductor temperature control device 600 to ensure their stability during operation. Each mounting seat is provided with a connection portion and a threaded hole. Such a design makes the installation and removal process simple and quick, and also facilitates subsequent maintenance and replacement. In addition, by adjusting the position and number of the mounting seats, the position of the second pipeline 500 and the second semiconductor temperature control device 600 can also be fine-tuned to meet different usage requirements.

[0042] When the vacuum pump is working, the second pipeline 500 and the second semiconductor temperature control device 600 may vibrate due to factors such as internal gas flow and external vibration. Long-term vibration may not only cause the second pipeline 500 and the second semiconductor temperature control device 600 to loosen or be damaged, but may also affect their performance and service life. Therefore, the design of the shock absorbing mechanism is crucial. The shock absorbing mechanism usually adopts elastic materials or structures to achieve vibration absorption and buffering. For example, rubber pads, springs or other elastic elements can be embedded in the mounting seat. When the second pipeline 500 and the second semiconductor temperature control device 600 are vibrated, these elastic elements can absorb part of the vibration energy and reduce the impact of the vibration on the second pipeline 500 and the second semiconductor temperature control device 600. In addition, the shock absorbing mechanism can also adopt a damping design to further reduce the vibration amplitude by consuming vibration energy.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A vacuum pumping device, characterized in that: include: Vacuum pump (100); A first pipeline (200), one end of which is connected to the vacuum pump (100), and the other end of which is connected to the first semiconductor temperature control device (400); the first pipeline (200) is provided with a first vacuum gauge (220) and a second vacuum gauge (230); the first vacuum gauge (220) and the second vacuum gauge (230) have different measuring ranges and are both used to detect the vacuum degree inside the first pipeline (200); A control system (300), wherein the vacuum pump (100), the first vacuum gauge (220) and the second vacuum gauge (230) are all connected to the control system (300) by signal, and the control system (300) is used to control the operation of the vacuum pump (100), the first vacuum gauge (220) and the second vacuum gauge (230).

2. The vacuum pumping device according to claim 1, characterized in that: A first filter is provided between the first pipeline (200) and the first semiconductor temperature control device (400).

3. The vacuum pumping device according to claim 2, characterized in that: The first pipeline (200) is also provided with a first solenoid valve (210), and the first solenoid valve (210) is used to control the on / off of the airflow inside the first pipeline (200).

4. The vacuum pumping device according to claim 3, characterized in that: The invention also comprises a second pipeline (500), one end of which is connected to the first pipeline (200) between the vacuum pump (100) and the first solenoid valve (210), and the other end of which is connected to a second semiconductor temperature control device (600); the second pipeline (500) is provided with a third vacuum gauge (520), and the third vacuum gauge (520) is used to detect the vacuum degree inside the second pipeline (500).

5. The vacuum pumping device according to claim 4, characterized in that: The second pipeline (500) is also provided with a fourth vacuum gauge (530), and the measuring range of the fourth vacuum gauge (530) is different from that of the fourth vacuum gauge (530).

6. The vacuum pumping device according to claim 5, characterized in that: The second pipeline (500) is further provided with a second solenoid valve (510), and the second solenoid valve (510) is located between the first pipeline (200) and the third vacuum gauge (520).

7. The vacuum pumping device according to claim 6, characterized in that: The control system (300) includes a touch screen (310) and a controller (320), wherein the controller (320) is signal-connected to the touch screen (310), the vacuum pump (100), the first solenoid valve (210), the first vacuum gauge (220), the second vacuum gauge (230), the second solenoid valve (510), the third vacuum gauge (520) and the fourth vacuum gauge (530).

8. The vacuum pumping device according to any one of claims 4 to 7, characterized in that: A second filter is provided between the second pipeline (500) and the second semiconductor temperature control device (600).

9. The vacuum pumping device according to claim 8, characterized in that: The second pipeline (500) and the second semiconductor temperature control device (600) are both provided with a plurality of mounting seats, the mounting seats are provided with connecting parts, and the connecting parts are provided with threaded holes.

10. The vacuum pumping device according to claim 9, characterized in that: The mounting seat is provided with a shock absorbing mechanism.

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