Thermal Imager
By using a movable attenuator in the thermal imager to control infrared light, the risk of burning of the detector during ultra-high temperature target detection is solved, and effective detection of ultra-high temperature and low temperature targets is achieved.
Patent Information
- Application Number
- CN202421573624.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-07-04
AI Technical Summary
When existing thermal cameras detect ultra-high temperature targets, the detector is at risk of burning.
A thermal imager is designed, which uses the attenuation sheet to correspond to or stagger the through holes to control the infrared light injected into the detector, avoiding the large amount of light burning the detector, and at the same time increasing the temperature detection range.
It effectively avoids the risk of burning the detector during ultra-high temperature target detection and expands the temperature detection range of the thermal imager.
Smart Images
Figure CN222748123U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of infrared thermal imaging technology, and specifically relates to a thermal imager. Background Art
[0002] Thermal imagers are widely used because they can measure temperature in a non-contact manner. In industrial temperature measurement applications, such as blast furnace inspection, steel ladle and iron ladle status monitoring, the target temperature to be detected is as high as 1500°C. If the detector of the thermal imager is directly facing an ultra-high temperature target, it will easily cause detector burns. In order to avoid problems with the detector, in the prior art, the amount of light transmitted is generally controlled by reducing the aperture, thereby reducing the energy transferred to the detector. However, the control of the amount of light transmitted is not easy to grasp, and there is still a risk of detector burns. Utility Model Content
[0003] The technical problem to be solved by the present application is that when an existing thermal imager detects an ultra-high temperature target, there is a risk that the detector will be burned. In order to solve the above technical problem, a thermal imager is provided that can prevent the detector from being burned.
[0004] The technical solution proposed in this application is:
[0005] A thermal imager, comprising:
[0006] A housing having a mounting cavity and a through hole communicating with the mounting cavity;
[0007] A detector is disposed in the mounting cavity and corresponds to the through hole;
[0008] An attenuation sheet is arranged outside the housing and is movably arranged so that the attenuation sheet can correspond to or stagger with the through hole during the movement;
[0009] When the attenuation sheet corresponds to the through hole, the attenuation sheet can attenuate the light incident into the through hole.
[0010] Furthermore, the thermal imager also includes a calibration piece, which is arranged on the outside of the shell and is movably arranged. During the movement of the calibration piece, the calibration piece can correspond to or stagger with the through hole.
[0011] Furthermore, the thermal imager also includes a temperature detector, which is arranged on the housing and is used to detect the temperature of the calibration plate corresponding to the through hole.
[0012] Furthermore, the calibration sheet is rotatably disposed on the outer side of the shell.
[0013] Furthermore, the attenuation sheet is rotatably disposed on the outer side of the shell.
[0014] Furthermore, the thermal imager also includes a heat sink, which is connected to the shell and located in the installation cavity, and the detector is arranged on the heat sink.
[0015] Furthermore, the thermal imager also includes a control component, which is disposed in the installation cavity and electrically connected to the detector.
[0016] Furthermore, the thermal imager also includes a first circuit board, which is disposed in the installation cavity and electrically connected to the detector, and the first circuit board is electrically connected to the control component.
[0017] Furthermore, the control component includes a control module and a heat insulation board, the control module and the heat insulation board are both arranged in the installation cavity, and the control module is electrically connected to the first circuit board, and the heat insulation board is located between the first circuit board and the control module.
[0018] Furthermore, the shell includes a mounting plate, a mounting frame and a heat dissipation cover, the mounting frame is connected to the mounting plate, the heat dissipation cover is connected to the mounting frame, the mounting plate, the mounting frame and the heat dissipation cover enclose the mounting cavity, the mounting plate is provided with the through hole, and the attenuation plate is arranged on the mounting plate.
[0019] When using the above thermal imager to detect the temperature of an ultra-high temperature target, the attenuation sheet can be aligned with the through hole first, and the attenuation sheet attenuates the light entering the through hole, that is, attenuates the light received by the detector, thereby preventing the detector from being burned by a large amount of light. At the same time, since the attenuation sheet can be staggered with the through hole, the target with a lower temperature can be detected at this time. In this way, the temperature detection range of the thermal imager can be effectively increased. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation of the present application.
[0021] Figure 1 A schematic diagram of the structure of a thermal imager provided in one embodiment of the present application;
[0022] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the thermal imager shown.
[0023] Description of labels:
[0024] 100, thermal imager; 110, housing; 121, detector; 131, attenuation plate; 111, through hole; 112, mounting plate; 113, mounting frame; 114, heat dissipation cover; 141, calibration plate; 142, temperature detector; 132, first driving member; 143, second driving member; 122, heat dissipation plate; 151, first circuit board; 152, heat insulation board; 153, second circuit board; 154, third circuit board; 155, connecting frame. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0027] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a thermal imager 100 including a housing 110 , a detector 121 and an attenuation sheet 131 .
[0028] The housing 110 has a mounting cavity and a through hole 111 communicating with the mounting cavity. The detector 121 is disposed in the mounting cavity and corresponds to the through hole 111 .
[0029] The attenuation sheet 131 is disposed on the outer side of the housing 110 , and the attenuation sheet 131 is movably disposed. During the movement of the attenuation sheet 131 , the attenuation sheet 131 can correspond to or stagger with the through hole 111 .
[0030] When the attenuation sheet 131 corresponds to the through hole 111 , the attenuation sheet 131 can attenuate the light incident into the through hole 111 ; similarly, when the attenuation sheet 131 is offset from the through hole 111 , the light incident into the through hole 111 will not be attenuated.
[0031] When using the thermal imager 100 to detect the temperature of an ultra-high temperature target, the attenuation sheet 131 can be aligned with the through hole 111. The attenuation sheet 131 attenuates the light entering the through hole 111, that is, attenuates the light received by the detector 121, thereby preventing the detector 121 from being burned by a large amount of light. At the same time, since the attenuation sheet 131 can be staggered from the through hole 111, a target with a lower temperature can be detected at this time. In this way, the temperature detection range of the thermal imager 100 can be effectively increased.
[0032] It should be explained that, assuming that the ultra-high temperature target is a target above 1500°C, the lower temperature target is a target with a temperature not higher than 1500°C, such as a target of 0°C to 1500°C.
[0033] In addition, the above-mentioned attenuation of light is actually attenuation of infrared light. Optionally, the attenuation sheet 131 can be made of a thin film with a certain attenuation effect on infrared, or made of special materials such as silicon and germanium and controlled by coating to control transmittance, as long as it can achieve attenuation of infrared light.
[0034] In one embodiment, the housing 110 includes a mounting plate 112, a mounting frame 113, and a heat dissipation cover 114. The mounting frame 113 is connected to the mounting plate 112, and the heat dissipation cover 114 is connected to the mounting frame 113. The mounting plate 112 and the heat dissipation cover 114 are located on opposite sides of the mounting frame 113. The mounting plate 112, the mounting frame 113, and the heat dissipation cover 114 enclose a mounting cavity, and the mounting cavity is provided with the above-mentioned through hole 111. The attenuation sheet 131 is arranged on the side of the mounting plate 112 away from the heat dissipation cover 114. By providing the heat dissipation cover 114, the electrical components in the mounting cavity can be dissipated.
[0035] In one embodiment, the thermal imager 100 further includes a calibration sheet 141, which is disposed outside the housing 110 and is movable. During the movement of the calibration sheet 141, the calibration sheet 141 can correspond to the through hole 111 or be staggered with the through hole 111. Similarly, when the calibration sheet 141 corresponds to the through hole 111, it can block the light entering the through hole 111, that is, at this time, the detector 121 detects the temperature of the calibration sheet 141, thereby calibrating the detector 121 according to the temperature of the calibration sheet 141, and after the calibration is completed, the calibration sheet 141 can be staggered with the through hole 111.
[0036] Furthermore, the thermal imager 100 further includes a temperature detector 142, which is disposed on the housing 110 and is used to detect the temperature of the calibration sheet 141 corresponding to the through hole 111. Thus, the detector 121 can be calibrated based on the temperature detected by the temperature detector 142 as a reference.
[0037] It is understandable that calibration is required for both the correspondence or misalignment of the attenuation sheet 131 and the through hole 111. When detecting an ultra-high temperature target, the calibration sheet 141 and the attenuation sheet 131 can be simultaneously aligned with the through hole 111, the temperature detector 142 detects the temperature of the attenuation sheet 131, and the light reflected by the calibration sheet 141 is emitted into the through hole 111 through the attenuation sheet 131. In this way, after the attenuation sheet 131 corresponds to the through hole 111, the detector 121 can be calibrated through the calibration sheet 141 and the temperature detector 142.
[0038] In one embodiment, the calibration sheet 141 and the attenuation sheet 131 are both rotatably disposed on the outside of the housing 110, and are specifically disposed on the side of the mounting plate 112 away from the heat dissipation cover 114. Figure 1 and Figure 2 In the embodiment shown in , the calibration sheet 141 and the attenuation sheet 131 are both one piece, and the figures respectively show the two pieces when they correspond to the through hole 111 and when they are offset from the through hole 111 .
[0039] Preferably, the thermal imager 100 further includes a first driving member 132 and a second driving member 143, both of which are disposed on the mounting plate 112 and are respectively connected to the calibration sheet 141 and the attenuation sheet 131 to drive the calibration sheet 141 and the attenuation sheet 131 to rotate. Optionally, the first driving member 132 and the second driving member 143 are motors.
[0040] In one embodiment, the thermal imager 100 further includes a heat sink 122, which is connected to the housing 110 and is located in the mounting cavity. The detector 121 is disposed on the heat sink 122 and is located on the side of the heat sink 122 facing the through hole 111. Specifically, the heat sink 122 is connected to the mounting plate 112 and can be connected to the mounting plate 112 by screws, so that the detector 121 is connected to the mounting plate 112. At the same time, the heat sink 122 can also dissipate heat from the detector 121, and the heat is dissipated into the mounting cavity and then discharged through the heat dissipation cover 114.
[0041] In one embodiment, the thermal imager 100 further includes a control component, which is disposed in the mounting cavity and electrically connected to the detector 121. Further, the thermal imager 100 further includes a first circuit board 151, which is disposed in the mounting cavity and electrically connected to the detector 121. The first circuit board 151 is electrically connected to the control component, thereby realizing electrical connection between the control component and the detector 121.
[0042] In one embodiment, the control component includes a control module and a heat insulation plate 152, both of which are arranged in the installation cavity. The control module is electrically connected to the first circuit board 151, and the heat insulation plate 152 is located between the first circuit board 151 and the control module to avoid mutual influence between the two.
[0043] Furthermore, the control module includes a second circuit board 153 and a third circuit board 154. The first circuit board 151 and the second circuit board 153 are electrically connected through a connector. The second circuit board 153 and the third circuit board 154 are also electrically connected through a connector, and the third circuit board 154 is connected to the housing 110. Figure 2 In the illustrated embodiment, the third circuit board 154 is connected to the mounting bracket 113. It is understandable that each circuit board is provided with corresponding electrical components.
[0044] In one embodiment, the control assembly further includes a connecting frame 155, the second circuit board 153, the heat insulation board 152 and the first circuit board 151 are all connected to the connecting frame 155, and the second circuit board 153 and the heat insulation board 152 are respectively located on opposite sides of the connecting frame 155, and the first circuit board 151 is located on the side of the heat insulation board 152 away from the second circuit board 153. At this time, the heat insulation board 152 can perform heat insulation treatment on the first circuit board 151 and the second circuit board 153 to avoid mutual influence.
[0045] like Figure 2 As shown, the third circuit board 154 is located on the side of the mounting frame 113 away from the mounting plate 112, and the second circuit board 153, the connecting frame 155, the heat insulating plate 152 and the first circuit board 151 are all located on the side of the mounting frame 113 away from the third circuit board 154. The second circuit board 153, the heat insulating plate 152 and the first circuit board 151 can be connected to the connecting frame 155, and then the connecting frame 155 is connected to the mounting frame 113.
[0046] In order to facilitate understanding of the technical solution of this application, Figure 1 and Figure 2 The operation method and working principle of the thermal imager 100 in the above embodiment are described as follows:
[0047] First, it should be noted that the thermal imager 100 in the above embodiment realizes two levels of temperature detection by rotating the attenuation plate 131 , namely, a high temperature level for ultra-high temperature targets and a low temperature level for relatively low temperature targets.
[0048] The thermal imager 100 needs to be calibrated before use. First, the attenuation plate 131 is rotated to a position offset from the through hole 111, and the calibration plate 141 is rotated to a position corresponding to the through hole 111. Then, the temperature of the calibration plate 141 is detected by the temperature detector 142, and the detector 121 is calibrated according to the temperature detected by the temperature detector 142 to achieve the calibration of the low temperature gear; then the attenuation plate 131 is rotated to a position corresponding to the through hole 111, and the detector 121 continues to be calibrated according to the temperature detected by the temperature detector 142 to achieve the calibration of the high temperature gear. After the calibration is completed, the calibration plate 141 is rotated to a position offset from the through hole 111.
[0049] When detecting an ultra-high temperature target, the attenuation plate 131 is rotated to a position corresponding to the through hole 111, and the infrared light incident into the through hole 111 is attenuated by the attenuation plate 131 and then received by the detector 121, thereby effectively preventing the detector 121 from being burned. When detecting a target with a lower temperature, the attenuation plate 131 is rotated to a position offset from the through hole 111. At this time, the infrared light incident into the through hole 111 will not be affected by the attenuation plate 131, thereby preventing the attenuation plate 131 from affecting the optical path, thereby ensuring detection accuracy and image effects.
[0050] It should be explained that when detecting a target with a relatively low temperature, if the infrared light is attenuated by the attenuation sheet 131, the optical path will change, which will affect the detection accuracy and image effect to a certain extent. Therefore, in the low temperature gear, the attenuation sheet 131 is staggered with the through hole 111 to ensure the detection accuracy and image effect.
[0051] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A thermal imager, characterized in that: include: A housing having a mounting cavity and a through hole communicating with the mounting cavity; A detector is disposed in the mounting cavity and corresponds to the through hole; An attenuation sheet is arranged outside the housing and is movably arranged so that the attenuation sheet can correspond to or stagger with the through hole during the movement; When the attenuation sheet corresponds to the through hole, the attenuation sheet can attenuate the light incident into the through hole.
2. The thermal imager according to claim 1, characterized in that: The thermal imager further comprises a calibration sheet, which is arranged outside the shell and is movably arranged. During the movement of the calibration sheet, the calibration sheet can correspond to or stagger with the through hole.
3. The thermal imager according to claim 2, characterized in that: The thermal imager further includes a temperature detector, which is disposed on the housing and is used to detect the temperature of the calibration sheet corresponding to the through hole.
4. The thermal imager according to claim 2, characterized in that: The calibration sheet is rotatably arranged on the outer side of the shell.
5. The thermal imager according to claim 1, characterized in that: The attenuation sheet is rotatably arranged on the outer side of the shell.
6. The thermal imager according to claim 1, characterized in that: The thermal imager further comprises a heat sink, which is connected to the housing and is located in the installation cavity, and the detector is arranged on the heat sink.
7. The thermal imager according to claim 1, characterized in that: The thermal imager also includes a control component, which is arranged in the installation cavity and is electrically connected to the detector.
8. The thermal imager according to claim 7, characterized in that: The thermal imager further includes a first circuit board, which is disposed in the mounting cavity and electrically connected to the detector, and the first circuit board is electrically connected to the control component.
9. The thermal imager according to claim 8, characterized in that: The control assembly includes a control module and a heat insulation board, both of which are arranged in the installation cavity, and the control module is electrically connected to the first circuit board, and the heat insulation board is located between the first circuit board and the control module.
10. The thermal imager according to claim 1, characterized in that: The shell includes a mounting plate, a mounting frame and a heat dissipation cover, the mounting frame is connected to the mounting plate, the heat dissipation cover is connected to the mounting frame, the mounting plate, the mounting frame and the heat dissipation cover enclose the mounting cavity, the mounting plate is provided with the through hole, and the attenuation plate is arranged on the mounting plate.