An automatic debugging and inspection system suitable for bare board products of inclination sensors

Abstract

The utility model relates to an automatic debugging and inspection system suitable for a bare board product of an inclination sensor. The system includes a patch debugging tool, a product debugging component installed on the patch debugging tool, an external power supply, a host computer and a turntable. The patch debugging tool includes a tool body with multiple test installation positions and a debugging pressure plate pressed on the tool body. The product debugging component includes a product panel, a debugging base plate, a patch module probe base plate and a signal control board assembled from top to bottom. The tool body is fixedly connected to the turntable, and the patch module probe base plate is respectively connected to the external power supply and the host computer. Compared with the prior art, the utility model has the advantages of strong expansibility, high control accuracy, precise installation and foolproofing.

Description

Technical Field

[0001] The utility model relates to the field of automatic debugging and testing of inclination sensor product production, in particular to an automatic debugging and testing system suitable for inclination sensor bare board products. Background Art

[0002] During the production process of inclination sensor bare board products, debugging and inspection are required. The existing automatic debugging device can only debug a small number of products at the same time. However, for the production requirements of improving the quality and efficiency of inclination sensor bare board products, if the original device is continued to be used for manual debugging and inspection, the wiring installation will take up a lot of time during the debugging and inspection process, which is time-consuming, complicated and inefficient. In addition, manual debugging is prone to errors, resulting in rework.

[0003] In order to solve the above problems, it is necessary to design an automatic debugging and inspection system for inclination sensor bare board products. In conjunction with the host computer, it can greatly improve the debugging efficiency, while achieving rapid wiring installation, saving time for wiring installation and fixation, and can also cooperate with the burner to realize the function of online program burning. Utility Model Content

[0004] In order to solve the technical problems in the background technology, the utility model provides an automatic debugging and inspection system for inclination sensor bare board products, the system including a patch debugging tool, a product debugging component installed on the patch debugging tool, an external power supply, a host computer and a turntable, the patch debugging tool including a tool body provided with multiple test installation positions and a debugging pressure plate pressed on the tool body, the product debugging component including a product panel, a debugging base plate, a patch module probe base plate and a signal control board assembled in sequence from top to bottom, the tool body fixedly connected to the turntable, and the patch module probe base plate are respectively connected to the external power supply and the host computer.

[0005] Preferably, the tooling body is composed of a turntable mounting plate and a mounting main board that are perpendicular to each other and integrally formed. The turntable mounting plate is connected to the turntable by screws. A plurality of test mounting positions are provided on the mounting main board, and a plurality of studs are provided in the middle and a plurality of positioning guide columns are provided on both sides. A first screw hole and a first pin hole are respectively provided in the upper left corner and the lower right corner of each test mounting position, and two second screw holes are respectively provided on the left and right sides of the test mounting position.

[0006] Preferably, a plurality of uncut and unremoved inclination sensor bare board products to be tested are orthogonally arranged on the product panel, and a process edge and a first anti-fool hole are provided on the product panel. In addition, second pin holes are opened at the four corners of the product panel, and the second pin holes cooperate with the first pin holes to fix the product panel to the tooling body through pins.

[0007] Preferably, a pressing contact position is set on the lower surface of the debugging pressure plate according to the shape and position of the test installation position, and each of the pressing contact positions includes two mutually connected grooves and a pressing edge arranged on the outside of the groove. The groove provides an installation space for the inclination sensor bare board product on the product panel, and the pressing edge is in pressing contact with the process edge of the product panel. A plurality of stud holes are provided in the middle of the debugging pressure plate to cooperate with the studs and nuts to achieve central pressing. Positioning guide holes are provided on both sides of the debugging pressure plate to cooperate with the positioning guide columns to achieve positioning and guiding. In addition, box buckle seats are provided on the left and right sides of the debugging pressure plate to cooperate with the buckles to achieve pressing on the left and right sides.

[0008] Preferably, the debugging base plate is a transparent acrylic flat plate, and a plurality of probe holes corresponding to the functional pad positions of the inclination sensor bare board product are opened on the debugging base plate, third screw holes are respectively opened at the four corners and the center of the debugging base plate, a second fool-proof hole is provided next to the third screw hole at the center, third pin holes are provided at the four corners of the debugging base plate, and fourth screw holes are respectively provided on both sides of the left and right grooves of the debugging base plate. The debugging base plate is fixed to the test mounting position by screws through the fourth screw holes and the second screw holes. In addition, two first copper stud holes and a hollow portion are also provided on the debugging base plate.

[0009] Preferably, a fourth pin hole and a fifth screw hole are respectively opened at the four corners of the patch module probe base plate, a sixth screw hole corresponding to the third screw hole is opened at the four corners and the center, and a third anti-fool hole is opened next to the sixth screw hole in the center. In addition, a second copper stud hole is also provided in the middle of the patch module probe base plate. The fourth pin hole cooperates with the third pin hole through a pin, the sixth screw hole cooperates with the third screw hole through a screw, and the second copper stud hole cooperates with the first copper stud hole through a copper stud to fix the patch module probe base plate and the debugging base plate into a whole. The fifth screw hole cooperates with the first screw hole to fix the patch module probe base plate on the test mounting position through a screw.

[0010] Preferably, the signal control board is connected to the patch module probe base plate by means of a pin socket, and a main control module and a digital channel switching control loop and an interface module respectively connected to the main control module are provided on the signal control circuit of the signal control board. The digital channel switching control loop includes a digital channel switching control module, a digital wiring port module and a digital port module. Under the control of the main control module, the relay in the digital channel switching control module is connected to the corresponding port of the patch module probe base plate through the digital wiring port module and the digital port module respectively to realize the selection of the corresponding product digital channel. The interface module includes an RS485 interface module and a 5V power supply port module respectively connected to the corresponding port of the patch module probe base plate, which are used to respectively realize the conversion of the host computer control signal and the 5V power supply to the main control module.

[0011] Preferably, the signal control circuit of the signal control board can also be expanded to include an analog channel switching control loop, and the analog channel switching control loop includes an analog channel switching control module, an analog wiring port module and an analog port module. Under the control of the main control module, the relay in the analog channel switching control module is connected to the corresponding port of the patch module probe base plate through the analog wiring port module and the analog port module respectively, to realize the selection of the analog channel of the corresponding product.

[0012] Preferably, a power supply module, a probe interface module, a probe seat module, a welding line port and a DB-9 interface are provided on the circuit of the patch module probe base plate, and the external power supply is sequentially connected to the DB-9 interface, the welding line port, the power supply module and the probe interface module to realize power supply to the inclination sensor bare board product to be measured, and the external power supply is sequentially connected to the DB-9 interface, the welding line port, the power supply module and the 5V power supply port module to realize power supply to the main control module, and the functional pads of each of the inclination sensor bare board products to be measured on the product panel are respectively physically contacted with the pins of the probe seat module to realize communication, and communicate with the signal control board through the probe interface module;

[0013] The power supply module includes a 6.8V power supply submodule, a 5V power supply submodule, a 3.3V power supply submodule, a power indicator light submodule and a power switching submodule. The 6.8V power supply submodule is connected to the external power supply through the welding wire port and the DB-9 interface. The input ends of the 5V power supply submodule and the 3.3V power supply submodule are connected to the 6.8V power supply submodule, and the output ends are connected to the power switching submodule. The power switching submodule supplies 3.3V or 5V power to the inclination sensor bare board product by means of pin jumpers. The output end of the 5V power supply submodule is also connected to the 5V power supply port module through the power supply port on the probe interface module.

[0014] Preferably, the DB-9 interface is fixed on the installation mainboard, and the DB-9 interface is connected to an extension line, the power line in the extension line is connected to an external power supply, the control communication line communicates with the host computer through an external USB to 485 device, the digital communication line communicates with the host computer through an external USB to 3.3VTTL device, and the burning and debugging line is short-circuited when burning the program and open-circuited when debugging the product.

[0015] Compared with the prior art, the utility model has the following advantages:

[0016] 1. This automatic debugging and inspection device is a special device for SMD inclination sensor products. It includes two power supply voltage modes (3.3V and 5V), and the power supply mode is expandable. By combining with the host computer, it can connect 32 products at the same time to achieve automatic debugging. The product wiring and installation are also very fast, improving production and inspection efficiency. It can cooperate with the burning device and the host computer to realize the online burning program function.

[0017] 2. High channel control accuracy. By adopting the relay channel control method, only one product communicates with the host computer. When communicating with the second product, the host computer sends a command to switch to the next channel and automatically collects product information.

[0018] 3. The communication function is expandable. The utility model reserves the channel selection and control and signal transmission interfaces of analog signal products. Only a slight improvement of the circuit structure is required to achieve the expansion of analog signal product detection. It can be expanded to other signal type bare board products or products with analog output.

[0019] 4. Precise installation and fool-proof. The utility model is provided with fool-proof holes on the debugging base plate. The product panel can only be installed in one direction, and the product panel, debugging base plate and signal control board are aligned and fixed through the positioning pins. The debugging pressure plate is pressed with the nuts and box locks to unify the position and prevent false connection and misalignment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the circuit structure of the main control module;

[0021] Figure 2a This is a schematic diagram of the CH1 channel circuit structure in the digital channel switching control module;

[0022] Figure 2b Schematic diagram of the circuit structure of the digital port module;

[0023] Figure 3 This is a schematic diagram of the circuit structure of the digital wiring port module;

[0024] Figure 4aThis is a schematic diagram of the circuit structure of the RS485 interface module;

[0025] Figure 4b This is a schematic diagram of the circuit structure of the 5V power supply port module;

[0026] Figure 5a This is a circuit diagram of the A_CH1 channel circuit diagram in the analog channel switching control module;

[0027] Figure 5b This is a schematic diagram of the circuit structure of the analog port module;

[0028] Figure 6 This is a schematic diagram of the circuit structure of the analog wiring port module;

[0029] Figure 7 This is a schematic diagram of the circuit structure of the 6.8V power module;

[0030] Figure 8a This is a schematic diagram of the circuit structure of the 5V power supply module;

[0031] Figure 8b This is a schematic diagram of the circuit structure of the 3.3V power module;

[0032] Figure 9 This is a schematic diagram of the circuit structure of the power indicator light module;

[0033] Figure 10 Schematic diagram of the circuit structure of the power switching module;

[0034] Figure 11 Schematic diagram of the circuit structure of the probe base U1;

[0035] Figure 12 Schematic diagram of the circuit structure of the probe interface module;

[0036] Figure 13 This is a schematic diagram of the circuit structure of the welding line port;

[0037] Figure 14 14 is a schematic structural diagram of the tooling body, wherein FIG (14a) is a schematic structural diagram of the main body of the tooling body from a front view, FIG (14b) is a schematic structural diagram of the tooling body from a top view, FIG (14c) is a schematic structural diagram of the tooling body from a left view, and FIG (14d) is a schematic structural diagram of the tooling body from a bottom view;

[0038] Figure 15 is a schematic structural diagram of the pad, wherein FIG (15a) is a schematic structural diagram of the pad from the front, FIG (15b) is a schematic structural diagram of the pad from the top, FIG (15c) is a schematic structural diagram of the pad from the left, and FIG (15d) is an axonometric diagram of the pad;

[0039] Figure 1616 is a schematic diagram of the structure of the debugging base plate, wherein FIG (16a) is a schematic diagram of the main structure of the debugging base plate, FIG (16b) is a schematic diagram of the top structure of the debugging base plate, and FIG (16c) is a schematic diagram of the left structure of the debugging base plate;

[0040] Figure 17 17 is a schematic diagram of the structure of the debugging pressure plate, wherein FIG (17a) is a schematic diagram of the main structure of the debugging pressure plate, FIG (17b) is a schematic diagram of the top structure of the debugging pressure plate, FIG (17c) is a schematic diagram of the left structure of the debugging pressure plate, and FIG (17d) is a schematic diagram of the bottom structure of the debugging pressure plate;

[0041] Figure 18 18 is a schematic structural diagram of a box buckle seat, wherein FIG (18a) is a schematic structural diagram of a main view of the box buckle seat, FIG (18b) is a schematic structural diagram of a top view of the box buckle seat, FIG (18c) is a schematic structural diagram of a left view of the box buckle seat, and FIG (18d) is an axonometric view of the box buckle seat;

[0042] Figure 19 This is a structural diagram of the product layout.

[0043] Figure 20 This is a schematic diagram of the structure of the patch module probe base plate.

[0044] Figure 21 This is a structural diagram of installing the product debugging component on the test installation position of the tooling main body.

[0045] Figure 22 This is a schematic block diagram of the circuit structure principle of the utility model.

[0046] Figure 23 This is a flow chart for the installation and testing of the bare board product of the inclination sensor of the present utility model.

[0047] Description of Reference Numerals

[0048] 1. Tooling body, 2. Product paneling, 3. Debugging base plate, 4. SMD module probe base plate, 11. Install the main board, 12. Turntable mounting plate, 111. Test mounting position, 112. Stud, 113. Positioning guide column, 114. First screw hole, 115. First pin hole, 116. Second screw hole, 21. Inclination sensor bare board product, 22. Process edge, 23. Second pin hole, 24. First fool-proof hole, 31. Probe hole, 32. Third screw hole, 33. Third pin hole, 34. Fourth screw hole, 35. First copper stud hole, 36. Hollow part, 37. Second fool-proof hole, 41. Fourth pin hole, 42. Fifth screw hole, 43. Third fool-proof hole, 44. Second copper stud hole, 45. Sixth screw hole, 51. Groove, 52. Pressing edge, 53. Stud hole, 54. Positioning guide hole. DETAILED DESCRIPTION

[0049] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0050] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0051] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the utility model.

[0052] The terms “first”, “second”, etc. are only used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0053] In the description of this embodiment, it should be noted that, unless otherwise specified or limited, the terms "disposed," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this embodiment based on specific circumstances.

[0054] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0055] The utility model provides an automatic debugging and testing system for inclination sensor bare board products, which is used to realize automatic debugging and testing of patch-type inclination sensor bare board products. The design scheme and implementation principle of the automatic debugging and testing system are as follows:

[0056] In addition to external devices such as an external power supply, a host computer, and a turntable, the automatic debugging and inspection system also includes three main parts: a signal control board, a patch module probe baseboard, and a patch debugging tooling. Among them, the signal control board and the patch module probe baseboard are the main circuit boards for realizing automatic debugging and inspection of the inclination sensor bare board products, while the patch debugging tooling serves as the hardware installation structure of the device, playing the role of support, protection and connection. These three parts are described in detail below.

[0057] Part 1: Signal Control Panel

[0058] The signal control board is mainly used to realize channel switching control, program burning and communication. It includes the main control module, digital channel switching control module, digital wiring port module, interface module, analog channel switching control module and analog wiring port module. The circuit structure of each module is described as follows:

[0059] like Figure 1 As shown, the main control module is mainly composed of the main control chip U7, the program burning port P6 connected to the main control chip U7 respectively, and the chip normal operation indicator circuit. The main control chip U7 adopts the single-chip microcomputer STM8S005K6, the program burning port P6 pin 1 is connected to 5V, the pin 2 is connected to the SWIM function of the main control chip U7 pin 26, the pin 3 is connected to GND, the pin 4 RST is connected to the pin 1 of the main control chip U7, C16 is the ground filter capacitor of the pin 4 RST, one end of the resistor R42 is connected to 5V, and the other end is connected to the pin 4 RST of the main control chip U7.

[0060] The light-emitting diode D18, resistor R43 and 5V power supply form the chip normal operation indicator light circuit. Pin 15 of the main control chip U7 is connected to the negative pole of the light-emitting diode D18. When pin 15 of the main control chip U7 is at a low level, the light-emitting diode D18 lights up to indicate that the chip is operating normally.

[0061] Pins 6, 7, and 9 of the main control chip U7 are connected to 5V respectively, C18, C19, and C20 are power filter capacitors respectively, pins 4 and 10 of the main control chip U7 are connected to GND respectively, and pin 5 is grounded through C17.

[0062] like Figure 2a As shown, the digital channel switching control module sets 8 identical digital channel control sub-circuits to control the switching of 8 digital channels. Pins 17-25 of the main control chip U7 can control any pin of channels CH1 to CH8 to output a high level, thereby controlling any operation of relays K1 to K8.

[0063] Taking channel CH1 as an example, when it is necessary to control relay K1 to work, pin 22 (CH1) of the main control chip U7 outputs a high level to the base of transistor Q10. After Q10 turns on the relay coil and is energized, TX1 and RX1 are turned on with TX and RX respectively. The light-emitting diode D1 lights up, indicating that the CH1 channel is connected, thereby indicating that the connected relay is working. R72 is the current-limiting resistor of the light-emitting diode D1.

[0064] The structures and working principles of other digital channel control sub-circuits are the same.

[0065] like Figure 2b As shown, the digital port module P7 is connected to the relay of the digital channel switching control module and the probe interface module U11 respectively, so as to realize the transmission of the output digital signal of the inclination sensor bare board product of the selected channel.

[0066] like Figure 3 As shown, in the digital wiring port module, P2 is the wiring port for the TX1 to TX8 and RX1 to RX8 digital channels. The wiring port P2 is connected to the probe interface module U11 of the probe base plate of the patch module, and is connected in a pin and socket manner.

[0067] like Figure 4a-4b As shown, the signal control board is connected to the probe interface module U11 on the patch module probe base plate through the interface module, including the RS485 interface module, 5V power supply port module, digital port module P7 and analog port module P4 connected to the patch module probe base plate respectively.

[0068] like Figure 4a As shown, the RS485 interface module includes a 485 communication chip U4, peripheral circuits and a TVS diode U5. The 485 communication chip U4 adopts the MAX487 model. Pins 6 and 7 of U4 are respectively connected to the probe interface module U11 on the probe base plate of the patch module through the P1 port. The signal output pins 1-4 of the 485 communication chip U4 are respectively connected to pins 29-31 of the main control chip U7 to enable the host computer to send control commands to the main control chip U7.

[0069] like Figure 4b As shown, the 5V power supply port module is used to power the signal control board. Its output end is connected to the main control chip U7, the chip normal operation indicator circuit, the program burning port P6 and the digital channel switching control module to provide 5V power supply. The input end interface P5 is connected to the 5V power supply module on the patch module probe base plate.

[0070] like Figure 5a As shown, the analog channel switching control module sets 8 identical analog channel control sub-circuits to control the switching of 8 analog channels. Pins 2, 3, 11-14, 16 and 32 of the main control chip U7 can control any pin of channels A_CH1 to A_CH8 to output a high level, thereby controlling any operation of relays K9 to K16.

[0071] Taking channel A_CH1 as an example, when relay K9 needs to be activated, pin 16 (A_CH1) of the main control chip U7 outputs a high level to the base of transistor Q1. After Q1 turns on, energizing the relay coil, A0_CH1 and A1_CH1 connect to A0 and A1, respectively. LED D9 illuminates, indicating that channel A_CH1 is activated, thereby indicating that the connected relay is operating. R35 is the current-limiting resistor for LED D9.

[0072] The structures and working principles of other analog channel control sub-circuits are the same.

[0073] like Figure 5b As shown, the analog port module P4 is used as an additional extension setting for analog product detection in the present invention. When it is necessary to detect the inclination sensor bare board product with analog output, it can be connected to the analog wiring port module P3 and the probe interface module U11 respectively to upload the analog signal of the inclination sensor bare board product of the selected channel under the control of the analog channel switching control module.

[0074] like Figure 6 As shown, in the analog wiring port module, P3 is the wiring port of channels A0_CH1~A0_CH8 and A1_CH1~A1_CH8. The wiring port P3 can be connected to the probe interface module U11 of the probe base plate of the patch module as an alternative channel for analog output products. The connection is achieved by using a pin and a socket. The current bare board products of the inclination sensor of the utility model are all digital outputs, so they are not used temporarily. As an expandable port, if it is necessary to test analog output products in the future, it can also be easily modified and expanded.

[0075] Part 2: SMD module probe base plate

[0076] like Figure 20 As shown in the figure, the probe base plate of the patch module is mainly used to realize the connection, power supply and communication between the signal control board and the host computer, including a 6.8V power module, a 5V power module, a 3.3V power module, a power indicator module, a power switching module, a probe interface module U11, a probe seat module and a welding line port. The introduction of each module is as follows.

[0077] like Figure 7 As shown, the 6.8V power module outputs 6.8V and includes a power input VCC, a resettable fuse F1, a power management chip U9, and peripheral circuitry. Resettable fuse F1 is preferably 500mA / 30V and provides overcurrent protection. Diode D1 is unidirectional, with its positive electrode connected to resettable fuse F1 and its negative electrode connected to the Vin pin of power management chip U9 to prevent reverse polarity. The positive plate of filter capacitor C2 at the power input is connected to the negative electrode of diode D1, and the negative plate is grounded.

[0078] The model of the power management chip U9 is TD1509PR, which is used to convert the voltage of 8~30V into 6.8V voltage output. R9 and R10 are voltage regulating resistors respectively. The voltage output Vout of the power management chip U9 is Vout = 1.23*(1+R9 / R10), D3 is the output rectifier diode, L1 is the output inductor, C8 is the output capacitor, and C1 is the feedforward capacitor (which does not need to be soldered in this utility model).

[0079] like Figure 8a and 8b As shown, the 5V power module and the 3.3V power module are connected to the output end of the 6.8V power module respectively. Figure 8a In the figure, C9 and C10 of the 5V power module are input filter capacitors respectively. The 6.8V voltage is converted to 5V voltage by the low voltage dropout regulator chip U10 and then output. C4 and C7 are output capacitors respectively, and Z1 is a voltage regulator diode.

[0080] exist Figure 8b In the figure, C5 and C3 of the 3.3V power module are input capacitors respectively. The 6.8V voltage is converted into 3.3V voltage by the low voltage difference regulator chip U12 and then output. C6 and C13 are 3.3V output filter capacitors respectively. D2 is an overvoltage protection diode.

[0081] like Figure 9 As shown, the resistor R16 and the light-emitting diode D4 of the power indicator module are connected in series to form a 5V power indicator light, and the resistor R17 and the light-emitting diode D5 are connected in series to form a 3.3V power indicator light, which are used to indicate whether the 5V and 3.3V power supplies are output normally.

[0082] like Figure 10 As shown in the figure, the power switching module uses pin jumpers to achieve 3.3V power supply or 5V power supply. If the bare board product of the inclination sensor to be tested is a 5V product, VDD is connected to the V5.0 pin. If the bare board product of the inclination sensor to be tested is a 3.3V product, VDD is connected to the 3.3V pin.

[0083] like Figure 11 As shown, taking the probe seat U1 in the figure as an example (in the utility model, 8 probe seats with the same structure are provided on a patch module probe base plate), the 5 probes TX1, RX1, VDD, GND, and Boot0 are respectively connected to the 5 functional pads TX, RX, VCC, GND, and Boot0 corresponding to the bare board product of the inclination sensor to be detected, and the probe seat U1 and the other 7 identical probe seats U2~U8 are respectively connected to the corresponding pins RX1~RX8 and TX1~TX8 of the probe interface module U11.

[0084] like Figure 12As shown, the probe interface module U11 is connected to the signal control board by plugging in a pin socket. The connection relationship between the patch module probe base plate and the signal control board is as follows:

[0085] The RX1~RX8 and TX1~TX8 pins of the probe interface module U11 in the patch module probe base plate are respectively connected to the RX1~RX8 and TX1~TX8 of P2 in the signal control board; the A and B pins in the probe interface module U11 are respectively connected to the P1 port of the RS485 interface module in the signal control board; the RX and TX pins of the probe interface module U11 are respectively connected to the digital port module P7 in the signal control board; 3, 4, 5, 6 (GND, 5V, 5V, GND) of the probe interface module U11 are respectively connected to the input interface P5 in the 5V power supply port module in the signal control board to power the signal control board.

[0086] In addition, if analog signal expansion is required, a probe connected to the product's analog output function pad can be added to the probe seat module, and analog pins A0_1~8 and A1_1~8 connected to it can be added to the probe interface module U11. After adding analog signal welding wires to the welding wire port, communication with the host computer can be carried out through the DB-9 interface.

[0087] like Figure 13 As shown, the welding line port adopts a redundant design, with P1 port and P2 port respectively. In the present invention, a total of 4 signal control boards and 4 patch module probe base boards are provided, and the two are connected one-to-one. Therefore, the present invention can debug and test 32 inclination sensor bare board products at the same time.

[0088] The VCC, GND, A, B, RX, TX, Boot0 and 3.3V pins of the P1 (P2) ports in the four patch module probe base plates are connected one by one to the DB-9 interface by welding wires (the wiring of the four signal control boards is in parallel), and the DB-9 interface is fixed to the patch debugging tooling with screws (not shown in the figure).

[0089] In addition, the utility model is also provided with an extension line corresponding to the DB-9 interface. The VCC and GND wires in the extension line are connected to the positive and negative poles of the external power supply to power the entire device. The A and B wires in the extension line are connected to the USB to 485 device and then communicate with the host computer, so that the host computer sends a selection control signal to the main control chip U7. The RX and TX wires in the extension line are connected to the USB to 3.3VTTL device and then communicate with the host computer to transmit the digital output signal of the inclination sensor bare board product to be detected in the selected channel to the host computer; and Boot0 and 3.3V are short-circuited when burning the program and disconnected when debugging the product to realize the burning program control or debugging function switching. This function can also be achieved by setting a switch between Boot0 and 3.3V.

[0090] In addition, when expanding the bare board product of the analog inclination sensor, analog signal transmission can be added to the DB-9 interface and extension cable respectively, and communication with the host computer can be achieved through the USB to analog device.

[0091] During the automatic debugging test, the four signal control boards are respectively set to addresses 01, 02, 03, and 04. The host computer software queries the address to select which signal function board and which channel of the inclination sensor bare board product to communicate with. The utility model can install 4*8=32 products. During the detection, only one product can communicate with the host computer software.

[0092] Similarly, the burning procedure is the same. Now short-circuit Boot0 and 3.3V, and all products are in the burning program enable state. Then, use the host computer software to control the channel switching and connect the products one by one to the burner to burn the program.

[0093] In summary, if Figure 22 As shown in the figure, the connection relationship between the circuit modules of the signal control board and the patch module probe base plate, the communication connection relationship with the host computer and the connection relationship of the analog channel control extension have been demonstrated. The signal control board and the patch module probe base plate are connected by means of pin socket plugging. The patch module probe base plate communicates with the host computer through the DB-9 interface and its extension line and the external adapter device. The host computer collects the digital and / or analog signal outputs of the inclination sensor bare board product of the selected channel through the control signal path, the power control path and the digital (extended analog) quantity acquisition signal path, and finally completes the automatic debugging and inspection process.

[0094] In the control signal path, after the host computer sends out the strobe control signal, it passes through the external USB to 485 device, the DB-9 interface and its extension cable, the welding line port, the probe interface module, and the RS485 interface module before reaching the main control chip U7. The main control chip U7 controls the relay of the corresponding channel through the digital channel switching control module to turn on, thereby selecting the inclination sensor bare board product of the channel;

[0095] In the power control path, the external power supply is connected to the 6.8V power module through the DB-9 interface and its extension cable and welding wire port. According to the power supply voltage requirements of different products, 3.3V and 5V voltage conversion is performed respectively. Then, the appropriate voltage is selected according to the power switching module to power the inclination sensor bare board product of the selected channel through the probe interface module. In addition, after the 5V voltage conversion, the main control chip U7 is powered through the probe interface module and the power supply terminal P5.

[0096] In the digital (extended analog) quantity acquisition signal path, the digital (extended analog) quantity output of the inclination sensor bare board product of the selected channel passes through the probe seat module, the probe interface module, the digital wiring port P2 (analog wiring port P3), the relay group, the digital port module P7 (analog port module P4), the corresponding digital quantity (analog quantity) interface of the probe interface module, the welding wire port, the DB-9 interface and its extension cable, the external USB to 3.3VTTL device, and then is sent to the host computer, and then the host computer software automatically performs data comparison, recording, alarm and other operations.

[0097] 3. Patch debugging tooling:

[0098] The patch debugging tooling is a structural component of the automatic debugging and inspection system for the inclination sensor bare board product of the utility model. It is used to realize the installation and fixation of the inclination sensor bare board product 21 to be tested, the signal control board and the patch module probe base plate 4. The patch debugging tooling includes a product panel 2, a debugging base plate 3, a debugging pressure plate, a pad, a tooling body 1 and a box buckle seat. The following is an introduction to each component:

[0099] like Figure 14 As shown, the tooling body consists of a turntable mounting plate 12 and a mounting main board 11 that are perpendicular to each other and integrally formed. The turntable mounting plate 12 is provided with two threaded holes, which are fixed to the high-precision turntable by screws. The mounting main board 11 is provided with four test mounting positions 111, which are arranged in 2*2 in this example and can be expanded in number if necessary. Each test mounting position 111 is respectively installed with a set of product debugging components. Each set of product debugging components is provided with a product panel 2, a debugging base plate 3, a patch module probe base plate 4 and a signal control board from top to bottom. The signal control board is plugged into the back of the patch module probe base plate 4 by a pin socket.

[0100] like Figure 14 As shown in FIG. 2 , a plurality of test mounting positions 111 are provided on the mounting main board 11, and a plurality of studs 112 are provided in the middle and a plurality of positioning guide columns 113 are provided on both sides. A first screw hole 114 and a first pin hole 115 are respectively provided in the upper left corner and the lower right corner of each test mounting position 111, and two second screw holes 116 are respectively provided on the left and right sides of the test mounting position 111.

[0101] like Figure 15 As shown, two pads are fixed on the lower surface of the mounting main board 11, the purpose of which is to raise the tool body 1 in the vertical direction, to make space for the installation of the signal control board and to protect the signal control board from collision.

[0102] like Figure 19 As shown, the product panel 2 is integrated with the uncut and unremoved inclination sensor bare board product 21 to be tested, which is then cut and removed after the debugging and testing is completed. In this example, each product panel is provided with 2*4 inclination sensor bare board products 21, a total of 8 inclination sensor bare board products 21. It can be seen that the present invention can install and debug a total of 8*4 inclination sensor bare board products, a total of 32. In addition, in order to ensure that the functional pads of all the inclination sensor bare board products 21 on the product panel can be in close contact with the probes of the patch module probe base plate 4, a debugging pressure plate is required to press them tightly together. Therefore, in addition to the inclination sensor bare board product 21, the product panel 2 is also provided with a process edge 22 on its periphery for cooperating with the debugging pressure plate to press the edge tightly.

[0103] In addition, the product panel 2 is provided with a first fool-proof hole 24 , and second pin holes 23 are opened at the four corners of the product panel 2 . The second pin holes 23 cooperate with the first pin holes 115 to fix the product panel 2 to the tooling body 1 through pins.

[0104] like Figure 16As shown, the debugging base plate 3 in the present invention is a flat plate made of transparent acrylic material, and the front side of the patch module probe base plate 4 is fixed to the debugging base plate 3 as a whole by screws (a total of 5 third screw holes 32 are respectively provided at the four corners and the center of the debugging base plate 3) and copper studs (two first copper stud holes 35 are provided on the debugging base plate), and probe hole groups that match the probe positions of the probe interface module on the patch module probe base plate 4 are orthogonally provided on the debugging base plate 3. In this example, there are 2*4 groups of 8 probe hole groups, each group of probe hole groups includes 5 probe holes 31, so that the probes of the probe interface module on the patch module probe base plate 4 pass through the probe holes 31 corresponding to the debugging base plate 3 and then contact the functional pads of each inclination sensor bare board product 21 to be measured; in the debugging A groove that cooperates with the test mounting position 111 is opened in the middle of the left and right sides of the test base plate 3, and a fourth screw hole 34 is provided on both sides of the groove for cooperating with the second screw hole 116 to be fixed to the mounting position 111 by screws, and a number of long strip hollow portions 36 are opened on the debugging base plate 3 to avoid the protruding parts of the solder joints on the patch module probe base plate 4; in addition, a 2.2mm third pin hole 33 is opened at the four corners of the debugging base plate 3 to fix the patch module probe base plate 4 and the debugging base plate 3 into a whole on the test mounting position 111 through pins, and a second anti-fool hole 37 is opened on the side of the center of the debugging base plate 3 to realize anti-fool installation of the product and fix the installation direction of the product panel 2. If it is reversed, it cannot be installed and fixed.

[0105] like Figure 17 As shown, the debugging pressure plate matches the shape of the mounting main board 11 and is pressed onto the mounting main board 11. There are three studs 112 vertically in the middle of the mounting main board 11, which are used to cooperate with the nut to vertically press the debugging pressure plate in the middle to prevent the debugging base plate 3 from tilting and causing the probe of the patch module probe base plate 4 to separate from the product panel 2; in addition, there are positioning guide columns 113 in the middle of the left and right sides of the mounting main board 11 to limit and guide the debugging pressure plate. Similarly, stud holes 53 and positioning guide holes 54 for passing through the studs 112 and positioning guide columns 113 are also provided on the debugging pressure plate, and box buckle seats are also provided on the left and right sides of the debugging pressure plate (such as Figure 18 As shown), it is used to fasten the hook on the main board 11 by snap-fitting, thereby ensuring the pressing performance of the debugging pressure plate in the horizontal and vertical directions respectively.

[0106] In addition, on the inner surface where the debugging pressure plate is in pressing contact with the product panel 2, a pressing contact position is opened corresponding to the shape of the test installation position 111. Each pressing contact position includes two mutually connected grooves 51 and a pressing edge 52 arranged on the outside of the groove. The groove 51 is used to be misaligned with the product on the product panel 2 (to avoid direct pressure on the product), and the pressing edge 52 is in pressing contact with the process edge 22 of the product panel 2, thereby pressing the product panel 2 and the debugging base plate 3 and the patch module probe base plate 4 as a whole.

[0107] like Figure 21 As shown, the figure shows a structural top view in which the product panel 2, the debugging base plate 3, and the patch module probe base plate 4 are installed on the tooling body in sequence. The upper left part of the figure shows a structural schematic diagram in which the test installation position 111 of the tooling body 11 has not yet been installed, and the upper right part shows a structural schematic diagram in which the patch module probe base plate 4 is fixed to the test installation position 111 of the tooling body 11 by the upper left and lower right pins and screws. The lower left part shows a structural schematic diagram in which the debugging base plate 3 is installed on the basis of the installation of the patch module probe base plate 4 and is fixed to the patch module probe base plate 4 by 5 screws and two copper studs, and is fixed to the tooling body 11 by 2 screws on the left and 2 screws on the left. The lower right part shows a structural schematic diagram in which after the patch module probe base plate 4 is installed, the product panel 2 is installed on it and fixed by the studs at the four corners (if necessary, with two copper studs).

[0108] In summary, if Figure 23 As shown, the installation and testing process of the inclination sensor product of this utility model is as follows:

[0109] 1) Assemble the two pads at the bottom of the tooling body as the feet of the tooling body, which makes it convenient to place it on the table and protect the signal control board from being damaged by external bumps after installing the signal control board;

[0110] 2) Align and fix the SMD module probe base plate and the debugging base plate to form a whole, and use screws and / or copper studs to fix them through the screw holes at the four corners. In this example, there are four SMD module probe base plates and four debugging base plates respectively;

[0111] 3) Install the four patch module probe base plates and the debugging base plate into the pin holes and screw holes of the fixed ear plates at the corresponding test installation positions of the tool body through the pins and screws at the four corners (in this example, only the two pin holes and two screw holes on the upper left and lower right are used to ensure stability);

[0112] 4) Plug the signal control board into the back of the probe base plate of the patch module in a way that the pins and sockets are aligned, and use copper studs to ensure that the plug is stable. If the plug is stable, copper studs are not required for auxiliary fixation;

[0113] 5) Place the four product panels on the debugging baseboard, and align the probes of the probe interface module on the SMD module probe baseboard with the functional pads of each inclination sensor bare board product to be tested after passing through the corresponding holes in the debugging baseboard. Use wires to solder the welding wire ports of each SMD module probe baseboard to the corresponding DB-9 interfaces.

[0114] 6) Press the debugging plate onto the tooling body through the studs and guide rods, and align the inner surface of the debugging plate with the process edge of the corresponding product panel. After pressing tightly, tighten the three nuts on the studs and fasten the buckles on the box buckle seat to ensure firm contact between the product and the probe.

[0115] 7) Fix the installed and tightened tooling body to the high-precision turntable for testing with screws, and connect the communication power supply cable and the host computer;

[0116] 8) Start the automatic detection software in the host computer, initialize and load the automatic test file of the inclination sensor bare board product to be tested, start the detection software and then automatically debug and test the 32 inclination sensor bare board products in sequence;

[0117] 9) The host computer sends a channel selection control signal to the signal control board through the address corresponding to the signal control board so that the function pad signal of the inclination sensor bare board product to be measured in the corresponding channel can be transmitted to the host computer to complete the signal acquisition of the current channel;

[0118] 10) The host computer compares the collected output signal of the inclination sensor bare board product to be tested with the pre-built-in standard signal. If the difference does not exceed the set threshold, the product is judged to be qualified, otherwise it is judged to be unqualified.

[0119] In summary, the utility model provides an automatic debugging and inspection system for inclination sensor bare board products. The device has a simple structure, is fool-proof and easy to install. It can install up to 32 inclination sensor bare board products at the same time, and power the selected channels and select the signals, and can expand the two power supply voltages of the products. In addition, the system also reserves channel selection and control and signal transmission interfaces for analog signal products. Only slight improvements to the circuit structure are required to realize the expansion of analog signal product detection, and it can be expanded to other signal type bare board products or products with analog output.

[0120] The above describes in detail the preferred embodiments of the present invention. It should be understood that those skilled in the art can make numerous modifications and variations based on the concepts of the present invention without inventive effort. Therefore, any technical solutions that can be derived by those skilled in the art based on the concepts of the present invention through logical analysis, reasoning, or limited experimentation based on the existing technology should be within the scope of protection defined by the claims.

Claims

1. An automatic debugging and inspection system suitable for bare board products of inclination sensors, characterized in that: The system comprises a patch debugging tool, a product debugging component mounted on the patch debugging tool, an external power supply, a host computer and a turntable. The patch debugging tool comprises a tool body (1) provided with a plurality of test installation positions (111) and a debugging pressing plate pressed against the tool body (1). The product debugging component comprises a product panel (2), a debugging base plate (3), a patch module probe base plate (4) and a signal control board which are sequentially assembled from top to bottom. The tool body (1) is fixedly connected to the turntable, and the patch module probe base plate (4) is respectively connected to the external power supply and the host computer.

2. The automatic debugging and inspection system for the inclination sensor bare board product according to claim 1 is characterized in that: The tooling body (1) is composed of a turntable mounting plate (12) and a mounting main plate (11) which are perpendicular to each other and integrally formed. The turntable mounting plate (12) is connected to the turntable by screws. The mounting main plate (11) is provided with a plurality of test mounting positions (111), and a plurality of studs (112) are provided in the middle and a plurality of positioning guide columns (113) are provided on both sides. A first screw hole (114) and a first pin hole (115) are respectively provided at the upper left corner and the lower right corner of each test mounting position (111), and two second screw holes (116) are respectively provided on the left and right sides of the test mounting position (111).

3. The automatic debugging and inspection system for the inclination sensor bare board product according to claim 2 is characterized in that: The product panel (2) is orthogonally arranged with a plurality of uncut and unremoved inclination sensor bare plate products (21) to be tested, and a process edge (22) and a first fool-proof hole (24) are provided on the product panel (2). In addition, second pin holes (23) are opened at the four corners of the product panel (2), and the second pin holes (23) cooperate with the first pin holes (115) to fix the product panel (2) to the tooling body (1) through pins.

4. The automatic debugging and inspection system for the inclination sensor bare board product according to claim 3 is characterized in that: The lower surface of the debugging pressure plate is provided with a clamping contact position corresponding to the shape and position of the test installation position (111), each of the clamping contact positions includes two mutually connected grooves (51) and a clamping edge (52) arranged on the outer side of the groove (51), the groove (51) provides an installation space for the inclination sensor bare board product (21) on the product panel (2), the clamping edge (52) is in clamping contact with the process edge (22) of the product panel (2), a plurality of stud holes (53) are provided in the middle of the debugging pressure plate to cooperate with the studs (112) and nuts to achieve central clamping, positioning guide holes (54) are provided on both sides of the debugging pressure plate to cooperate with the positioning guide columns (113) to achieve positioning and guiding, and box buckle seats are provided on the left and right sides of the debugging pressure plate to cooperate with the buckles to achieve left and right side clamping.

5. The automatic debugging and inspection system for the inclination sensor bare board product according to claim 4 is characterized in that: The debugging base plate (3) is a transparent acrylic flat plate. A plurality of probe holes (31) corresponding to the positions of the functional pads of the inclination sensor bare board product (21) are provided on the debugging base plate (3). Third screw holes (32) are provided at the four corners and the center of the debugging base plate (3). A second fool-proof hole (37) is provided next to the third screw hole at the center. Third pin holes (33) are provided at the four corners of the debugging base plate (3). Fourth screw holes (34) are provided on both sides of the left and right grooves of the debugging base plate (3). The debugging base plate (3) is fixed to the test installation position (111) by screws through the fourth screw holes (34) and the second screw holes (116). In addition, two first copper stud holes (35) and a hollow portion (36) are provided on the debugging base plate (3).

6. The automatic debugging and inspection system for the bare board product of the inclination sensor according to claim 5, characterized in that: A fourth pin hole (41) and a fifth screw hole (42) are respectively provided at the four corners of the patch module probe base plate (4), a sixth screw hole (45) corresponding to the third screw hole (32) is provided at the four corners and the center, and a third fool-proof hole (43) is provided next to the sixth screw hole (45) at the center. In addition, a second copper stud hole (44) is also provided in the middle of the patch module probe base plate (4). The fourth pin hole (41) cooperates with the third pin hole (33) through a pin, the sixth screw hole (45) cooperates with the third screw hole (32) through a screw, and the second copper stud hole (44) cooperates with the first copper stud hole (35) through a copper stud to fix the patch module probe base plate (4) and the debugging base plate (3) into a whole. The fifth screw hole (42) cooperates with the first screw hole (114) through a screw to fix the patch module probe base plate (4) on the test installation position (111).

7. The automatic debugging and inspection system for the bare board product of the inclination sensor according to claim 6, characterized in that: The signal control board is connected to the patch module probe base plate (4) by means of a pin socket. A main control module and a digital channel switching control circuit and an interface module respectively connected to the main control module are provided on the signal control circuit of the signal control board. The digital channel switching control circuit comprises a digital channel switching control module, a digital wiring port module and a digital port module. Under the control of the main control module, the relay in the digital channel switching control module is respectively connected to the corresponding port of the patch module probe base plate (4) through the digital wiring port module and the digital port module to realize the gating of the corresponding product digital channel. The interface module comprises an RS485 interface module and a 5V power supply port module respectively connected to the corresponding port of the patch module probe base plate (4) to respectively realize the conversion of the host computer control signal and the 5V power supply to the main control module.

8. The automatic debugging and inspection system for the inclination sensor bare board product according to claim 7, characterized in that: The signal control circuit of the signal control board can also be extensibly provided with an analog channel switching control loop, the analog channel switching control loop comprising an analog channel switching control module, an analog wiring port module and an analog port module. Under the control of the main control module, the relay in the analog channel switching control module is connected to the corresponding port of the patch module probe base plate (4) through the analog wiring port module and the analog port module respectively, so as to realize the gating of the analog channel of the corresponding product.

9. The automatic debugging and inspection system for the bare board product of the inclination sensor according to claim 8, characterized in that: The circuit of the patch module probe base plate (4) is provided with a power module, a probe interface module, a probe seat module, a welding line port and a DB-9 interface. The external power supply sequentially supplies power to the inclination sensor bare board product to be measured through the DB-9 interface, the welding line port, the power module and the probe interface module, and the external power supply sequentially supplies power to the main control module through the DB-9 interface, the welding line port, the power module and the 5V power supply port module. The functional pads of each of the inclination sensor bare board products to be measured on the product panel (2) are respectively physically contacted with the pins of the probe seat module to achieve communication, and communicate with the signal control board through the probe interface module; The power module includes a 6.8V power submodule, a 5V power submodule, a 3.3V power submodule, a power indicator light submodule and a power switching submodule. The 6.8V power submodule is connected to an external power supply through the welding line port and the DB-9 interface. The input ends of the 5V power submodule and the 3.3V power submodule are connected to the 6.8V power submodule, and the output ends are connected to the power switching submodule. The power switching submodule supplies 3.3V or 5V power to the inclination sensor bare board product by means of a pin jumper cap. The output end of the 5V power submodule is also connected to a 5V power supply port module through a power supply port on a probe interface module.

10. The automatic debugging and inspection system for the inclination sensor bare board product according to claim 9, characterized in that: The DB-9 interface is fixed on the installation mainboard (11), and the DB-9 interface is connected to an extension line corresponding to the DB-9 interface. The power line in the extension line is connected to an external power supply. The control communication line communicates with the host computer through an external USB to 485 device, and the digital communication line communicates with the host computer through an external USB to 3.3VTTL device. The burning and debugging line is short-circuited when burning the program and is open-circuited when debugging the product.

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