A temperature control device

Abstract

The present application discloses a temperature control device, including: a cabinet, a temperature control mechanism and a water circulation mechanism. The temperature control mechanism is located above the cabinet. The temperature control mechanism includes: a temperature control component, a shell, a water distribution pipe and a lifting and pressing component. The temperature control component includes: an upper temperature variable module and a lower temperature variable module, and the optical module to be tested is located between the upper temperature variable module and the lower temperature variable module; the lifting and pressing component is used to lift and press the upper temperature variable module. The lifting and pressing component can lift and press the upper temperature variable module, and use the guide structure to realize the upper and lower opening and closing of the temperature variable module, so as to plug and unplug the optical module to be tested. The outer shell cover is arranged above the temperature control component and the lifting and pressing component, which can prevent external humid air from entering the temperature variable module, causing condensation water to form, and play a protective role. The water circulation mechanism 200 is a heat dissipation system, which is responsible for dissipating heat to the temperature control mechanism.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a temperature control device. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals. They are one of the key components in optical communication equipment, and optical devices are the core components of optical modules. Therefore, in the production process of optical modules, testing optical devices is one of the important processes in the production of optical modules.

[0003] Since optical devices, including laser chips and other devices whose operation is affected by temperature, when testing optical devices, being able to accurately control the test temperature of the optical devices is a prerequisite for completing the optical device testing.

[0004] At present, the industry mainly uses temperature shock testers and high and low temperature chambers to achieve temperature control, which is achieved by increasing and decreasing the temperature of compressed air, thereby achieving temperature control of optical devices. However, temperature shock test equipment is costly, energy-intensive, and occupies a large area, which is not conducive to large-scale production. Utility Model Content

[0005] The present application provides a temperature control device to improve the efficiency of temperature testing of optical modules.

[0006] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0007] The embodiment of the present application discloses a temperature control device, comprising: a cabinet,

[0008] Cabinet,

[0009] A temperature control mechanism is located above the cabinet, and the temperature control mechanism includes:

[0010] The temperature control component comprises: an upper temperature change module and a lower temperature change module, and the optical module to be tested is located between the upper temperature change module and the lower temperature change module;

[0011] A water distribution pipe connected to the temperature control component;

[0012] A lifting and pressing assembly connected to the upper temperature-changing module, the lifting and pressing assembly being used to lift and press the upper temperature-changing module;

[0013] A housing, which is disposed above the temperature control component and the lifting and pressing component;

[0014] A water circulation mechanism is located below the cabinet, and the water circulation mechanism is connected to the water distribution pipe;

[0015] The upper temperature change module comprises:

[0016] A first water-cooled radiator is fixedly connected to the lifting and pressing assembly, and the first water-cooled radiator is in communication with the water distribution pipe;

[0017] A first semiconductor refrigerator, the top of which is in contact with and connected to the first water-cooling radiator;

[0018] The first heat-conducting component has a top connected to the first semiconductor refrigerator.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] The present application discloses a temperature control device, including: a cabinet, a temperature control mechanism and a water circulation mechanism. The temperature control mechanism is located above the cabinet. The temperature control mechanism includes: a temperature control component, a shell, a water distribution pipe and a lifting and pressing component. The temperature control component includes: an upper temperature variable module and a lower temperature variable module, and the optical module to be tested is located between the upper temperature variable module and the lower temperature variable module; the lifting and pressing component is used to lift and press the upper temperature variable module. The lifting and pressing component can lift and press the upper temperature variable module, and use the guide structure to realize the upper and lower opening and closing of the temperature variable module, so as to plug and unplug the optical module to be tested. The outer shell cover is arranged above the temperature control component and the lifting and pressing component, which can prevent external humid air from entering the temperature variable module, causing condensation water to form, and play a protective role. The water circulation mechanism 200 is a heat dissipation system, which is responsible for dissipating heat to the temperature control mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0022] Figure 1 A three-dimensional diagram of an environmental temperature control device provided according to some embodiments Figure 1 ;

[0023] Figure 2 A three-dimensional diagram of an environmental temperature control device provided according to some embodiments Figure 2 ;

[0024] Figure 3 A schematic diagram of a cabinet structure according to some embodiments Figure 1 ;

[0025] Figure 4 A schematic diagram of a cabinet structure according to some embodiments Figure 2 ;

[0026] Figure 5 is a schematic structural diagram of a temperature control mechanism provided according to some embodiments;

[0027] Figure 6 A schematic diagram of a partial structure of a temperature control mechanism provided according to some embodiments;

[0028] Figure 7 A schematic diagram of the structure of an upper temperature change module provided according to some embodiments;

[0029] Figure 8 A schematic diagram of a lower temperature change module structure provided according to some embodiments;

[0030] Fig. 9 is a schematic diagram of a second heat conducting component provided according to some embodiments;

[0031] Fig.10 The present invention is a schematic diagram of an upper temperature variation module and a lower temperature variation module filled with an optical module to be tested according to some embodiments. DETAILED DESCRIPTION

[0032] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0033] Unless the context requires otherwise, throughout the specification and claims, the term "including" is interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" cannot be understood to indicate or imply relative importance or indicate an upper limit of quantity; the term "plurality" means two or more; the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "level" and other descriptions are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the circuit structure, article or device including the elements.

[0034] In order to facilitate accurate control of the temperature of an optical device during testing of the optical device, an embodiment of the present application provides a temperature control device. Figure 1 A three-dimensional diagram of an environmental temperature control device provided according to some embodiments Figure 1 , Figure 2 A three-dimensional diagram of an environmental temperature control device provided according to some embodiments Figure 2 .like Figure 1 and 2 As shown, the temperature control device provided in the embodiment of the present application includes a cabinet 100 , a water circulation mechanism 200 and a temperature control mechanism 300 .

[0035] The cabinet 100 is used to carry the temperature control mechanism 300, realize the assembly of the temperature control device and facilitate the use and setting of the temperature control device. The water circulation mechanism 200 can be set below the cabinet 100, and the water circulation mechanism 200 can be used to carry the temperature control mechanism 300. The water circulation mechanism 200 can be used to carry the temperature control mechanism 300 and the cabinet 100.

[0036] For example, the water circulation mechanism 200 is arranged in the cabinet 100, and the temperature control mechanism 300 is arranged on the top of the cabinet 100, and the cabinet 100 is convenient for protecting the water circulation mechanism 200. The water circulation mechanism 200 is connected to the temperature control mechanism 300, so that heat conduction is performed through the flow of water in the water circulation mechanism 200 in the temperature control mechanism 300.

[0037] In some embodiments of the present application, multiple groups of temperature control mechanisms 300 may be disposed on the top of the cabinet 100; Figure 1 and 2 As shown, a set of temperature control mechanisms 300 is arranged on the top of the cabinet 100. In some embodiments of the present application, the six sets of temperature control mechanisms 300 operate independently without interfering with each other. Of course, the embodiments of the present application are not limited to setting six sets of temperature control mechanisms 300 on the top of the cabinet 100. It is also possible to select two, three, or other sets of temperature control mechanisms 300 in combination with the use scenario of the temperature control device and the size of the cabinet.

[0038] In some embodiments of the present application, the temperature control device may be placed on the optical device testing equipment. To facilitate the placement of the temperature control device and the assembly of the temperature control mechanism 300 and the like, the cabinet 100 may be of a regular shape. Figure 3 A schematic diagram of a cabinet structure according to some embodiments Figure 1 .like Figure 3 As shown, in some embodiments of the present application, the cabinet 100 is a rectangular parallelepiped structure, but is certainly not limited to a rectangular parallelepiped shape. In order to fully utilize the cabinet 100, the cabinet 100 is a hollow cavity structure.

[0039] Figure 3 A schematic diagram of a cabinet structure according to some embodiments Figure 1.like Figure 3 As shown, the cabinet 100 includes an upper cover plate 110 , a bottom plate 120 located at an opposite side of the upper cover plate, and side plates located between the upper cover plate 110 and the bottom plate 120 .

[0040] Figure 4 A schematic diagram of a cabinet structure according to some embodiments Figure 2 . Figure 4 The following is a schematic diagram of the cabinet structure after the upper cover and front side panels are removed. Figure 4 As shown, a temperature controller 111 may be provided in the cabinet 100. The temperature controller may be connected to the temperature control mechanism 300 to control the ambient temperature of the temperature control mechanism 300.

[0041] A single-chip microcomputer controller 112 may be disposed in the cabinet 100 , and a serial port of the single-chip microcomputer controller 112 is located on one of the side walls to facilitate communication with the outside during the test process.

[0042] A test communicator 113 may be disposed in the cabinet 100 ; a port of the test communicator 113 may be disposed on one of the side walls, and the port of the test communicator 113 may be exposed outside the side wall for communicating with the outside during the test process.

[0043] The cabinet 100 may be provided with a wiring slot 115 and a wiring box 116 , and the wiring slot 115 and the wiring box 116 may be used to integrate and fix the connecting wires inside the cabinet 100 .

[0044] A partition 118 may be provided in the cabinet 100 , and the partition 118 may divide the inner space of the cabinet 100 into two parts. The wiring slot 115 and the wiring box 116 may be provided on the partition 118 .

[0045] A power switch 114 may be provided in the cabinet 100 , and the power switch 114 is disposed on a side wall for easy operation.

[0046] The cabinet 100 may be provided with a power supply 117, which may be connected to the power switch 114, and the power switch may be used to control the power supply 117 to be turned on and off. The power supply 117 and other electronic components are respectively located on both sides of the partition 118, which can effectively prevent the heat generated by the power supply from affecting the electronic components on the opposite side of the partition 118.

[0047] A tray 130 is disposed on the side wall of the cabinet 100. The tray 130 can be used to carry the optical module to be tested.

[0048] The upper cover plate 110 of the cabinet 100 can be used to carry the temperature control mechanism 300. In some embodiments, the temperature control mechanism 300 can be provided in one group, two groups or more groups.

[0049] Figure 5 It is a schematic structural diagram of a temperature control mechanism provided according to some embodiments. Figure 6 FIG. 1 is a schematic diagram of a partial structure of a temperature control mechanism provided according to some embodiments. Figure 5 and Figure 6 As shown, the temperature control mechanism 300 may include a housing 310 .

[0050] The housing 310 is disposed above the temperature control component. The housing 310 is connected to the upper cover plate to enclose and form a first cavity. The temperature control component 320 is disposed in the first cavity.

[0051] The temperature control mechanism 300 may include a lifting and pressing assembly 400. The lifting and pressing assembly 400 may be located in the cavity of the housing 310. The lifting and pressing assembly 400 may include a first fixing plate 321.

[0052] The housing 310 is disposed above the temperature control assembly and the lifting and pressing assembly 400 .

[0053] The temperature control mechanism 300 may include a water distribution pipe 331. The water distribution pipe 331 may be connected to the temperature control assembly 320, and the water distribution pipe 331 may be connected to the water circulation mechanism 200.

[0054] The temperature control assembly 320 may include a first upper temperature change module 322 and a first lower temperature change module 323 .

[0055] The first upper temperature change module 322 is fixedly connected to the first fixing plate 321, and the first upper temperature change module 322 can move up and down with the first fixing plate 321. For example, the first fixing plate 321 can be provided with a plurality of screw holes, and the first upper temperature change module 322 is provided with a through hole for connecting and fixing with the first fixing plate 321.

[0056] The first lower temperature change module 323 is fixed on the upper cover plate 110. For example, the upper cover plate 110 may be provided with a plurality of screw holes, and the first lower temperature change module 323 is provided with a through hole for connecting and fixing with the upper cover plate 110.

[0057] In some embodiments, the first upper temperature change module 322 can be covered with the first lower temperature change module 323 to form a first temperature control channel.

[0058] The temperature control assembly may include a second upper temperature change module 332 and a second lower temperature change module 333 .

[0059] The second upper temperature-changing module 332 is fixedly connected to the first fixing plate 321 , and the second upper temperature-changing module 332 can move up and down along with the first fixing plate 321 .

[0060] The second lower temperature change module 333 is fixed on the upper cover plate 110 , and the second upper temperature change module 332 can be covered with the second lower temperature change module 333 to form a second temperature control channel.

[0061] In order to realize automatic control of the first fixing plate 321, the lifting and pressing assembly 400 may include a first shaft seat 4021. The first shaft seat 4021 may be fixedly disposed on the cabinet 100. The lifting and pressing assembly 400 may include a first guide shaft 403. A first fixing ring 4031 is fixedly disposed at one end of the first guide shaft 403, and the other end is connected to the first shaft seat 4021.

[0062] The first guide shaft 403 passes through the first fixed plate 321 through the first linear bearing 411, and the first guide shaft 403 can be movably connected to the first fixed plate 321. The spring is sleeved on the outside of the first guide shaft 403. The spring can be arranged between the first fixed ring 4031 and the first linear bearing 411. The first linear bearing 411 is fixedly connected to the first fixed plate 321 and the first fixed plate 321. The first linear bearing 411 is arranged on the first fixed plate 321 and the first linear bearing 411 passes through the upper and lower surfaces of the first fixed plate 321 and the first linear bearing 411 is slidably connected to the first guide shaft 403.

[0063] When the first fixing plate 321 is subjected to an upward force (facing away from the cabinet surface), the first fixing plate 321 drives the first linear bearing 411 thereon to move upward. Since the first fixing plate 321 is fixedly connected to the first upper temperature-changing module 322, the first upper temperature-changing module 322 is simultaneously driven to move away from the cabinet 100, thereby increasing the distance between the first upper temperature-changing module 322 and the first lower temperature-changing module 323, thereby facilitating the removal and replacement of the optical module to be tested.

[0064] When the first fixing plate 321 is subjected to a downward force (toward the cabinet surface), the first fixing plate 321 drives the first linear bearing 411 thereon to move downward. Since the first fixing plate 321 is fixedly connected to the first upper temperature-variable module 322, the first upper temperature-variable module 322 is driven to move toward the cabinet 100 at the same time, so that the distance between the first upper temperature-variable module 322 and the first lower temperature-variable module 323 is reduced, so that the first upper temperature-variable module 322 and the first lower temperature-variable module 323 are pressed onto the optical module to be tested.

[0065] The lifting and pressing assembly 400 may include a second shaft seat 4022. The second shaft seat 4022 may be fixedly disposed on the cabinet 100. The lifting and pressing assembly 400 may include a second guide shaft 404. A second fixing ring 4041 is fixedly disposed at one end of the second guide shaft 404, and the other end is connected to the second shaft seat 4022.

[0066] The second guide shaft 404 passes through the first fixed plate 321 through the second linear bearing 412, and the second guide shaft 404 can be movably connected to the first fixed plate 321. The spring is sleeved on the outside of the second guide shaft 404. The spring can be arranged between the second fixed ring 4041 and the second linear bearing 412. The second linear bearing 412 is fixedly connected to the first fixed plate 321, and the second linear bearing 412 is arranged on the first fixed plate 321, and the second linear bearing 412 passes through the upper and lower surfaces of the first fixed plate 321. The second linear bearing 412 is slidably connected to the second guide shaft 404.

[0067] When the first fixing plate 321 is subjected to an upward force (facing away from the cabinet surface), the first fixing plate 321 drives the second linear bearing 412 thereon to move upward. Since the first fixing plate 321 is fixedly connected to the second upper temperature-changing module 332, the second upper temperature-changing module 332 is driven to move away from the cabinet 100 at the same time, so that the distance between the second upper temperature-changing module 332 and the second lower temperature-changing module 333 is increased, thereby facilitating the removal and replacement of the optical module to be tested.

[0068] The lifting and pressing assembly 400 may include an electromagnetic push rod 413. The fixed end of the electromagnetic push rod 413 is fixedly connected to the upper surface of the cabinet 100, and the other end is connected to the first fixed plate 321, which is used to push the first fixed plate 321 to move up and down. When it is necessary to lift the first upper temperature variable module 322 to place the optical module to be tested between the first upper temperature variable module 322 and the first lower temperature variable module 323, the electromagnetic push rod 413 is started to push the first fixed plate 321 to move away from the cabinet 100. At this time, the first fixed plate 321 drives the first upper temperature variable module 322 to move away from the cabinet 100, and the spring is compressed, so that the gap between the first upper temperature variable module 322 and the first lower temperature variable module 323 increases, and this space can be used to accommodate the optical module to be tested. When the optical module is set between the first upper temperature-variable module 322 and the first lower temperature-variable module 323, the electromagnetic push rod 413 is closed, and the first fixed plate 321 falls back under the action of the spring force and the gravity of the first fixed plate 321 itself, and is pressed onto the top of the optical module to be tested, thereby realizing the lifting and pressing of the first upper temperature-variable module 322 controlled by the lifting and pressing assembly 400.

[0069] In order to ensure that the first fixed plate 321 is subjected to balanced force and the optical module temperature test device can measure multiple optical modules at the same time, the electromagnetic push rod 413 can be set in the middle of the first fixed plate 321, and a temperature control component 320 is set on both sides. One or more optical modules to be tested can be set between the first upper temperature change module 322 and the first lower temperature change module 323 of each temperature control component 320, and the specific size can be related to the size of the optical module temperature test device. This setting is generally suitable for the measurement of multi-channel optical modules, because the measurement plate used for multi-channel optical modules is a single separated test plate.

[0070] Figure 7 FIG. 1 is a schematic diagram of a structure of an upper temperature change module according to some embodiments. Figure 7 As shown, the upper temperature change module may include: a first water-cooled radiator 3221. The first water-cooled radiator 3221 may be connected to the water distribution pipe 331, and the first water-cooled radiator 3221 is arranged on the first fixed plate 321, and the top of the first water-cooled radiator 3221 is connected to the first fixed plate 321. The water inlet and the water outlet of the first water-cooled radiator 3221 are respectively connected to the water circulation mechanism 200, and then the circulating water can circulate in the first water-cooled radiator 3221.

[0071] The upper temperature change module may include: a first semiconductor refrigerator 3222. The bottom of the first water-cooled radiator 3221 is in contact with the first semiconductor refrigerator 3222, and the heat generated by the first semiconductor refrigerator 3222 can be conducted out through the first water-cooled radiator 3221 to adjust the temperature of the bottom of the first semiconductor refrigerator 3222, so that the first semiconductor refrigerator 3222 can work well.

[0072] In some embodiments, the first semiconductor cooler 3222 may be a three-stage semiconductor cooler.

[0073] In some embodiments, the upper temperature change module may include: a first thermally conductive gasket 3241. The first thermally conductive gasket 3241 may be disposed between the first semiconductor refrigerator 3222 and the first water-cooled radiator 3221, so that the heat transfer surface between the first semiconductor refrigerator 3222 and the first water-cooled radiator 3221 is in close contact, avoiding the generation of a gap and maintaining a very high heat transfer efficiency.

[0074] In some embodiments, the first thermally conductive gasket 3241 may be a thermally conductive silicone gasket. When the first thermally conductive gasket 3241 is subjected to extrusion force, it may be deformed to fill the gap between the first semiconductor refrigerator 3222 and the first water-cooled radiator 3221 .

[0075] The bottom of the first semiconductor refrigerator 3222 is connected to the first heat conducting component 3224. The top surface of the first heat conducting component 3224 covers the working surface of the first semiconductor refrigerator 3222, increasing the contact area between the first heat conducting component 3224 and the first semiconductor refrigerator 3222 and improving the heat transfer efficiency.

[0076] In some embodiments, the upper temperature change module may include: a second heat conductive pad 3242. The second heat conductive pad 3242 may be disposed between the first semiconductor refrigerator 3222 and the first heat conductive component 3224, so that the heat transfer surface between the first semiconductor refrigerator 3222 and the first heat conductive component 3224 is in close contact, avoiding the generation of a gap and maintaining a very high heat transfer efficiency.

[0077] In some embodiments, the second thermally conductive gasket 3242 may be a thermally conductive silicone gasket. When the second thermally conductive gasket 3242 is subjected to a squeezing force, it may be deformed to fill the gap between the first semiconductor cooler 3222 and the first thermally conductive component 3224 .

[0078] In some embodiments, the upper temperature variable module may include: an upper insulation shell 3223. The upper insulation shell 3223 covers the side walls of the first water-cooled radiator, the first semiconductor refrigerator 3222 and the first heat-conducting component 3224, and isolates the first water-cooled radiator, the first semiconductor refrigerator 3222 and the first heat-conducting component 3224 from the outside.

[0079] In some embodiments, the upper temperature-insulating shell 3223 may be made of a non-metallic material, which may isolate the first semiconductor refrigerator 3222 and the first heat-conducting component 3224 from the outside world, thereby playing a role of heat insulation.

[0080] In some embodiments, the inner wall of the upper temperature-insulating shell 3223 may be provided with a limiting portion, and the limiting portion may be used to limit the first semiconductor refrigerator 3222 .

[0081] In some embodiments, the upper temperature change module may include: a third thermally conductive gasket 3243. The third thermally conductive gasket 3243 is located below the first thermally conductive component 3224. During testing, the third thermally conductive gasket 3243 is located between the optical module to be tested and the first thermally conductive component 3224, thereby enhancing the contact between the first thermally conductive component 3224 and the surface of the optical module to be tested, so that the first thermally conductive component 3224 and the optical module to be tested fit more closely, thereby improving the efficiency of temperature transfer.

[0082] In order to monitor the temperature of the upper temperature change module, the upper temperature change module may include a temperature monitor 3225. The temperature monitor 3225 may be located in the first heat conducting component 3224, and the temperature monitor 3225 may be electrically connected to a corresponding temperature controller inside the cabinet 100.

[0083] When working, the temperature monitor 3225 feeds back the actual temperature value on the first heat-conducting component 3224 to the computer control program (remote controller) through the temperature sensing line. The computer outputs the corresponding heating or cooling command according to the temperature test requirements of the product and returns it to the temperature controller. After receiving the command, the temperature controller powers on the semiconductor refrigerator and senses the temperature of the temperature monitor 3225 at all times. The test program also feeds back the "DDMI temperature" of the optical film block at all times. When the temperature reaches the target value, the temperature test starts, thereby forming a temperature control loop.

[0084] When working, the two poles of the first semiconductor refrigerator are energized. When energized in the forward direction, the first working surface of the first semiconductor refrigerator absorbs heat, causing the heat-spreading copper sheet in contact with it to cool down rapidly. The heat absorbed by the first working surface is released through the second working surface, and the first water-cooled radiator in close contact with the second working surface quickly absorbs the heat and takes it away, thereby continuously cooling the first heat-conducting component 3224 to achieve a cooling effect. When energized in the reverse direction, the first working surface and the second working surface have opposite effects, the first working surface releases heat, and the second working surface absorbs heat, thereby causing the first heat-conducting component to heat up to achieve a heating effect.

[0085] Figure 8 FIG. 1 is a schematic diagram of a lower temperature change module structure provided according to some embodiments. Figure 8 As shown, the lower temperature variable module may include: a second water-cooled radiator 3231. The second water-cooled radiator 3231 may be connected to the water distribution pipe 331, and the second water-cooled radiator 3231 is arranged on the upper cover plate 110, and the bottom of the second water-cooled radiator 3231 is connected to the upper cover plate 110. The water inlet and the water outlet of the second water-cooled radiator 3231 are respectively connected to the water circulation mechanism 200, and then the circulating water can circulate in the second water-cooled radiator 3231.

[0086] The lower temperature change module may include: a second semiconductor refrigerator 3232. The top of the second water-cooled radiator 3231 is in contact with the second semiconductor refrigerator 3232, and the heat generated by the second semiconductor refrigerator 3232 can be conducted out through the second water-cooled radiator 3231 to adjust the temperature of the bottom of the second semiconductor refrigerator 3232, so that the second semiconductor refrigerator 3232 can work well.

[0087] In some embodiments, the second semiconductor cooler 3232 may be a three-stage semiconductor cooler.

[0088] In some embodiments, the lower temperature variable module may include: a fourth thermally conductive gasket 3251. The fourth thermally conductive gasket 3251 may be disposed between the second semiconductor refrigerator 3232 and the second water-cooled radiator 3231, so that the heat transfer surface between the second semiconductor refrigerator 3232 and the second water-cooled radiator 3231 is in close contact, avoiding the generation of a gap and maintaining a very high heat transfer efficiency.

[0089] In some embodiments, the fourth thermally conductive gasket 3251 may be a thermally conductive silicone gasket. When the fourth thermally conductive gasket 3251 is subjected to extrusion force, it may be deformed to fill the gap between the second semiconductor refrigerator 3232 and the second water-cooled radiator 3231 .

[0090] The second heat conducting component 3234 is connected to the top of the second semiconductor refrigerator 3232. The top surface of the second heat conducting component 3234 covers the working surface of the second semiconductor refrigerator 3232, increasing the contact area between the second heat conducting component 3234 and the second semiconductor refrigerator 3232 and improving the heat transfer efficiency.

[0091] In some embodiments, the lower temperature variable module may include: a fifth heat conductive pad 3252. The fifth heat conductive pad 3252 may be disposed between the second semiconductor refrigerator 3232 and the second heat conductive component 3234, so that the heat transfer surface between the second semiconductor refrigerator 3232 and the second heat conductive component 3234 is in close contact, avoiding the generation of a gap and maintaining a very high heat transfer efficiency.

[0092] In some embodiments, the fifth thermally conductive gasket 3252 may be a thermally conductive silicone gasket. When the fifth thermally conductive gasket 3252 is subjected to a squeezing force, it may be deformed to fill the gap between the second semiconductor cooler 3232 and the second thermally conductive component 3234 .

[0093] In some embodiments, the lower temperature variable module may include: a lower insulation shell 3233. The lower insulation shell 3233 covers the side walls of the first water-cooled radiator, the second semiconductor refrigerator 3232 and the second heat-conducting component 3234, and isolates the first water-cooled radiator, the second semiconductor refrigerator 3232 and the second heat-conducting component 3234 from the outside.

[0094] In some embodiments, the lower temperature-insulating shell 3233 may be made of a non-metallic material, which can isolate the second semiconductor refrigerator 3232 and the second heat-conducting component 3234 from the outside world and play a role in heat insulation.

[0095] In some embodiments, the inner wall of the lower temperature-insulating shell 3233 may be provided with a limiting portion, and the limiting portion can be used to limit the second semiconductor refrigerator 3232 .

[0096] When working, the two poles of the first semiconductor refrigerator are energized. When energized in the forward direction, the first working surface of the second semiconductor refrigerator absorbs heat, causing the heat-spreading copper sheet in contact with it to cool down rapidly. The heat absorbed by the first working surface is released through the second working surface, and the first water-cooled radiator in close contact with the second working surface quickly absorbs the heat and takes it away, thereby continuously cooling the second heat-conducting component 3234 to achieve a cooling effect. When energized in the reverse direction, the first working surface and the second working surface have opposite effects, the first working surface releases heat, and the second working surface absorbs heat, thereby causing the first heat-conducting component to heat up, achieving a heating effect.

[0097] In some embodiments, the lower insulation shell 3233 is provided with a condensation water guide groove 3253. The condensation water generated in the temperature control assembly 320 can be discharged through the condensation water guide groove 3253.

[0098] Fig. 9 FIG. 1 is a schematic diagram of a second heat conducting component provided according to some embodiments. Fig. 9 As shown, in some embodiments, in order to facilitate simultaneous measurement of multiple optical modules, the second heat-conducting component 3234 may include: a heat-conducting bottom plate 32341. The heat-conducting bottom plate 32341 is used to support the optical module to be tested. The bottom of the heat-conducting bottom plate 32341 may be in contact with the first working surface of the second semiconductor cooler.

[0099] In some embodiments, to facilitate the connection and limiting of the heat-conducting bottom plate 32341 and the second semiconductor cooler, a limiting groove 32346 may be provided at the bottom of the heat-conducting bottom plate 32341. The limiting groove 32346 is recessed upward relative to the bottom of the heat-conducting bottom plate 32341, and the first working surface of the second semiconductor cooler is embedded in the limiting groove 32346.

[0100] The second heat-conducting component 3234 may include: a first baffle 32342, a second baffle 32343, and a third baffle 32344, wherein the first baffle 32342, the second baffle 32343, and the third baffle 32344 protrude from the upper surface of the heat-conducting bottom plate 32341, a first gap 32347 is provided between the first baffle 32342 and the second baffle 32343, and a second gap 32348 is provided between the second baffle 32343 and the third baffle 32344. The optical module to be tested may be embedded in the first gap 32347, so that the side walls of the optical module to be tested are respectively in contact and connected with the first baffle 32342, the second baffle 32343, and the heat-conducting bottom plate 32341, thereby improving the heat conduction efficiency.

[0101] The optical module to be tested can be embedded in the second gap 32348 so that the side walls of the optical module to be tested are respectively in contact with the first baffle 32342 , the second baffle 32343 , and the heat-conducting bottom plate 32341 to improve heat conduction efficiency.

[0102] In some embodiments, a limiting protrusion 32325 may be provided on the heat-conducting bottom plate 32341. The limiting protrusion 32325 may protrude to the left relative to the first baffle 32342 to limit the lower insulation shell 3233. The limiting protrusion 32325 may protrude to the right relative to the third baffle 32344 to limit the lower insulation shell 3233.

[0103] Fig.10 FIG. 1 is a schematic diagram of an upper temperature-variable module and a lower temperature-variable module filled with an optical module to be tested according to some embodiments. Fig.10As shown, the upper temperature variable module 322 is connected to the first fixed plate 321, and the lower temperature variable module 323 is connected to the upper cover plate 110. When it is necessary to lift the first upper temperature variable module 322 to place the optical module to be tested between the first upper temperature variable module 322 and the first lower temperature variable module 323, start the electromagnetic push rod 413 to push the first fixed plate 321 to move away from the cabinet 100. At this time, the first fixed plate 321 drives the first upper temperature variable module 322 to move away from the cabinet 100, and the spring is compressed, so that the gap between the first upper temperature variable module 322 and the first lower temperature variable module 323 increases, and this space can be used to accommodate the optical module to be tested. At this time, the first optical module 501 and the second optical module 502 can be placed in the first gap 32347 and the second gap 32348 respectively. When the optical module is set between the first upper temperature-variable module 322 and the first lower temperature-variable module 323, the electromagnetic push rod 413 is closed, and the first fixed plate 321 falls back under the action of the spring force and the gravity of the first fixed plate 321 itself, and is pressed onto the top of the optical module to be tested, thereby realizing the lifting and pressing of the first upper temperature-variable module 322 controlled by the lifting and pressing assembly 400.

[0104] In the embodiment of the present application, the upper temperature change module and the lower temperature change module can cover the optical module to be tested in four directions: up, down, left, and right, thereby increasing the contact area between the optical module to be tested and the temperature control device and improving the heat transfer efficiency.

[0105] The temperature control mechanism of the embodiment of the present application is mainly composed of a temperature control mechanism 300, a cabinet 100 and an external water circulation mechanism 200. The temperature control mechanism 300 is an executive component, and its main function is to power the optical module, communicate and simulate the ultra-low temperature test environment required for the test. The heat transfer method adopts contact heat transfer, that is, the temperature control mechanism 300 directly changes the outer shell temperature, optical engine temperature, chip temperature, etc. of the optical module through close contact with the optical module to meet the temperature test requirements of the optical module; the temperature control mechanism 300 is composed of an upper temperature change module and a lower temperature change module. The temperature control mechanism 300 can test 4 optical modules at the same time. Through the telescopic effect of the push rod motor, the guide structure is used to realize the upper and lower opening and closing of the temperature change module, so as to plug and unplug the optical module, that is, the loading and unloading action.

[0106] The cabinet 100 is a control component, and its main functions are to supply power to the temperature control mechanism 300, control the forward and reverse rotation of the voltage, control the temperature reduction amplitude and rate, and communicate with the optical module test board. It is composed of control components such as a temperature controller, a single-chip microcomputer serial port controller, a switching power supply, and a test communicator.

[0107] The water circulation mechanism 200 is a heat dissipation system responsible for dissipating heat for the temperature control mechanism 300. It continuously generates low-temperature coolant that flows through the water-cooled radiator of the temperature variable module and exchanges heat with the semiconductor refrigeration chip, thereby simulating an ultra-low temperature test environment.

[0108] The outer shell 310 covers the temperature control mechanism 300 and allows dry gas to enter and discharge the high-humidity gas in the cavity. Its function is to prevent the external moist air from entering the temperature change module, causing the formation of condensed water, thereby causing the undesirable phenomenon of large-scale frost and damaging electrical components, thus playing a protective role.

[0109] In some embodiments of the present application, a temperature-changing module is provided with a temperature-insulating housing outside thereof to insulate the temperature-changing module. The housing 310 covers the temperature control mechanism 300 to insulate the temperature-changing module, which is conducive to the formation of an ultra-low temperature test environment.

[0110] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

Claims

1. A temperature control device, characterized in that: include: Cabinet, A temperature control mechanism is located above the cabinet, and the temperature control mechanism includes: The temperature control component comprises: an upper temperature change module and a lower temperature change module, and the optical module to be tested is located between the upper temperature change module and the lower temperature change module; A water distribution pipe connected to the temperature control component; A lifting and pressing assembly connected to the upper temperature-changing module, the lifting and pressing assembly being used to lift and press the upper temperature-changing module; A housing, which is disposed above the temperature control component and the lifting and pressing component; A water circulation mechanism is located below the cabinet, and the water circulation mechanism is connected to the water distribution pipe; The upper temperature change module comprises: A first water-cooled radiator is fixedly connected to the lifting and pressing assembly, and the first water-cooled radiator is in communication with the water distribution pipe; A first semiconductor refrigerator, the top of which is in contact with and connected to the first water-cooling radiator; The first heat-conducting component has a top connected to the first semiconductor refrigerator.

2. The temperature control device according to claim 1, characterized in that: The upper temperature change module includes: a first heat conductive pad, located between the first semiconductor refrigerator and the first water cooling radiator; The second heat-conducting gasket is located between the first semiconductor refrigerator and the first heat-conducting component.

3. The temperature control device according to claim 1, characterized in that: The upper temperature-changing module includes: an upper insulation shell, which covers the side walls of the first water-cooled radiator, the first semiconductor refrigerator and the first heat-conducting component, and isolates the first water-cooled radiator, the first semiconductor refrigerator and the first heat-conducting component from the outside.

4. The temperature control device according to claim 1, characterized in that: The upper temperature change module includes: a temperature monitor embedded in the first heat conducting component, the temperature monitor is connected to a temperature controller, and the temperature controller is located inside the cabinet.

5. The temperature control device according to claim 1, characterized in that: The lower temperature change module comprises: A second water-cooling radiator is fixedly connected to the lifting and pressing assembly, and the second water-cooling radiator is communicated with the water distribution pipe; A second semiconductor refrigerator, the bottom of which is in contact with and connected to the second water-cooling radiator; The second heat-conducting component has a bottom connected to the first semiconductor refrigerator.

6. The temperature control device according to claim 5, characterized in that: The second heat conducting component comprises: A heat-conducting bottom plate, the bottom of which is in contact with and connected to the second semiconductor refrigerator; A first baffle protrudes from the upper surface of the heat-conducting bottom plate; a second baffle plate protruding from the upper surface of the heat-conducting bottom plate, wherein a first gap is provided between the first baffle plate and the second baffle plate; The third baffle plate protrudes from the upper surface of the heat-conducting bottom plate, and a second gap is provided between the second baffle plate and the third baffle plate.

7. The temperature control device according to claim 6, characterized in that: The lower temperature variable module includes: a lower insulation shell, which covers the side walls of the second water-cooled radiator, the second semiconductor refrigerator and the second heat-conducting component to isolate the second water-cooled radiator, the second semiconductor refrigerator and the second heat-conducting component from the outside.

8. The temperature control device according to claim 6, characterized in that: A limiting groove is provided at the bottom of the heat-conducting bottom plate, and the first working surface of the second semiconductor refrigerator is embedded in the limiting groove.

9. The temperature control device according to claim 7, characterized in that: The heat-conducting bottom plate is provided with a limiting protrusion, and the limiting protrusion is used for limiting the position of the lower thermal insulation shell.

10. The temperature control device according to claim 7, characterized in that: The lower temperature-insulating shell is provided with a condensed water guide groove for guiding out the condensed water generated in the temperature control component.

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