Temperature uniformity enhanced slide glass device and probe station equipment

Abstract

The utility model relates to a temperature-uniformity-enhanced slide glass device and probe station equipment. The temperature-uniformity-enhanced slide glass device comprises a slide glass disc and a cooling disc, the slide glass disc is provided with a bearing surface, and the slide glass disc is used for bearing a wafer through the bearing surface; the cooling disc is provided with a cooling flow channel, and the cooling disc is used for cooling the slide glass disc through the cooling flow channel; and turbulent flow blocks are arranged in the cooling flow channels. According to the technical scheme, the cooling medium impacts the turbulent flow block when flowing in the cooling flow channel, so that the flowing of the cooling medium in the cooling flow channel can be disturbed, the phenomenon that some cooling medium is still in the cooling flow channel is avoided, the temperature uniformity of the cooling medium can be improved, and the service life of the cooling medium is prolonged. The temperature uniformity of the wafer loading disc in a low-temperature test is improved, the cooling effect is improved, the test effect is ensured, and the thin wafer is protected. Besides, the cooling flow channel can have a square cross section, so that the cooling flow channel has a larger sectional area, more cooling liquid can pass through the cooling flow channel, the contact area between the slide glass disc and the cooling medium can be effectively increased, and the cooling effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer carrier device and a probe station equipment with enhanced temperature uniformity. Background Art

[0002] During semiconductor processing, the electrical properties of semiconductor chips are usually tested to ensure wafer reliability, and wafer probe stations are often used for testing. To complete the test, the wafer usually needs to be placed flat on a carrier plate, and then the electrical parameters of the integrated circuit on the wafer can be tested by inserting the probe into the measurement point.

[0003] Existing probe stations are generally only suitable for testing at room temperature and high temperature environments. The carrier can be heated and cooled to place the device under test in different temperature environments. As the demand for testing environments increases, the market demand for low-temperature environment testing is also increasing, which requires the probe station to be able to adjust under three temperature conditions: low temperature, room temperature, and high temperature.

[0004] When conducting high and low temperature tests, if the carrier cannot provide a relatively uniform temperature, it is easy to change the flatness of the object being tested, affecting the final test results, and even causing thinner wafers to break due to uneven heating. Therefore, under the premise of ensuring that the target temperature is reached, the temperature uniformity of the carrier should be ensured as much as possible. At present, the wafer carrier is generally cooled by setting cooling channels to meet the low-temperature testing requirements of the wafer. Among them, the flow of the coolant in the cooling channel is uneven, and the coolant flow rate in some places is low or even static, resulting in a low degree of participation of this part of the coolant in heat exchange, resulting in uneven temperature of the coolant, resulting in poor temperature uniformity of the wafer carrier, so this situation needs to be solved. Utility Model Content

[0005] In view of this, the utility model provides a wafer carrier device and a probe station device with enhanced temperature uniformity, and the main technical problem to be solved is: how to improve the uniformity of the temperature of the wafer disk for low-temperature testing.

[0006] In order to achieve the above purpose, the utility model mainly provides the following technical solutions:

[0007] The embodiment of the utility model provides a wafer carrier device with enhanced temperature uniformity, which comprises a wafer carrier plate and a cooling plate;

[0008] The wafer carrier has a carrying surface, and the wafer carrier carries the wafer through the carrying surface;

[0009] The cooling plate is provided with a cooling channel, and the cooling plate cools the wafer carrier plate through the cooling channel;

[0010] Wherein, a spoiler is arranged in the cooling channel.

[0011] In some embodiments, the cooling channel is spiral-shaped, and a center line of the spiral coincides with a center line of the wafer carrier.

[0012] In some embodiments, there are multiple spoilers, which are sequentially spaced apart in the length direction of the cooling channel.

[0013] In some embodiments, the spoiler is in a strip shape, and the spoiler extends from one end to the other end of the cooling channel.

[0014] In some embodiments, the spoiler is detachable.

[0015] In some embodiments, the spoiler block is fixed in the cooling channel by screws, so that the spoiler block is detachable.

[0016] In some embodiments, the cooling channel includes a channel groove disposed at one end of the cooling disk, and the wafer carrier covers an opening of the channel groove and is detachably connected to the cooling disk.

[0017] In some embodiments, the wafer carrier plate and the cooling plate are detachably connected via screws.

[0018] In some embodiments, the cooling channel has a square cross-section.

[0019] An embodiment of the present invention further provides a probe station device, which may include any one of the above-mentioned enhanced temperature uniformity wafer carrier devices.

[0020] By means of the above technical solution, the present invention has at least the following beneficial effects:

[0021] 1. When the cooling medium flows in the cooling channel, it hits the spoiler block, which can disturb the flow of the cooling medium in the cooling channel and avoid the phenomenon that some cooling media are stationary in the cooling channel, thereby improving the temperature uniformity of the cooling medium, improving the temperature uniformity of the low-temperature test disk, improving the cooling effect, ensuring the test effect, and protecting the thin wafer.

[0022] 2. The cooling channel can have a square cross-section, so that the cooling channel has a larger cross-sectional area to pass more coolant, thereby effectively increasing the contact area between the wafer carrier and the cooling medium and improving the cooling effect.

[0023] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0025] Figure 1 It is a structural schematic diagram of a wafer carrier device with enhanced temperature uniformity provided by one embodiment of the utility model.

[0026] Figure numerals: 1, wafer carrier; 2, cooling plate; 3, cooling channel; 4, spoiler; 21, one end of the cooling plate; 101, bearing surface. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0030] like Figure 1As shown, an embodiment of the utility model proposes an enhanced temperature uniformity wafer carrier device, which includes a wafer carrier plate 1 and a cooling plate 2. The wafer carrier plate 1 has a carrying surface 101, and the wafer carrier plate 1 carries the wafer through the carrying surface 101. A cooling channel 3 is provided on the cooling plate 2, and the cooling plate 2 cools the wafer carrier plate 1 through the cooling channel 3, and then cools the wafer through the wafer carrier plate 1. Among them, a spoiler block 4 is provided in the cooling channel 3, and the spoiler block 4 is used to turbulent the cooling medium in the cooling channel 3, such as a coolant.

[0031] Specifically, the cooling medium hits the spoiler block 4 when flowing in the cooling channel 3, which can disturb the flow of the cooling medium in the cooling channel 3 and avoid the phenomenon that some cooling media are stationary in the cooling channel 3, thereby improving the temperature uniformity of the cooling medium, improving the temperature uniformity of the low-temperature test download disc 1, and improving the cooling effect.

[0032] In some embodiments, the aforementioned cooling channel 3 may be in a spiral shape, and the center line of the spiral coincides with the center line of the wafer carrier 1 , thereby improving the cooling effect of the cooling channel 3 on the wafer carrier 1 .

[0033] In some embodiments, the aforementioned cooling channel 3 may have a square cross-section, so that the cooling channel 3 has a larger cross-sectional area to pass more coolant, thereby effectively increasing the contact area between the wafer carrier 1 and the cooling medium and improving the cooling effect.

[0034] The aforementioned spoiler blocks 4 can be arranged in sequence and at intervals in the cooling channel 3, or they can be continuously distributed in the cooling channel 3. In one example, the number of the aforementioned spoiler blocks 4 can be multiple, and they are arranged in sequence and at intervals in the length direction of the cooling channel 3, so that the spoiler effect can be improved and the temperature uniformity of the coolant can be improved. In another example, the aforementioned spoiler blocks 4 can be in the shape of a strip, and the spoiler blocks 4 extend from one end of the cooling channel 3 to the other end, so that the spoiler blocks 4 are in a continuously distributed structure, and the height of the spoiler blocks 4 can be lower than the depth of the cooling channel 3 to avoid the spoiler blocks 4 blocking the cooling channel 3.

[0035] It should be noted here that the aforementioned spoiler block 4 can be a spoiler block with the same structure, which can improve the temperature uniformity of the coolant. The coolant with uniform temperature is conducive to uniformly absorbing the heat of the wafer carrier plate 1, thereby improving the temperature uniformity of the carrying surface 101 of the wafer carrier plate 1.

[0036] In some embodiments, the aforementioned spoiler block 4 is detachable. For example, the spoiler block 4 can be fixed in the cooling channel 3 by screws, so that the spoiler block 4 is detachable.

[0037] In the above example, since the spoiler block 4 is detachable, it is convenient to assemble the spoiler block 4 after it is processed separately, thus facilitating the processing of the spoiler block 4 .

[0038] like Figure 1 As shown, the aforementioned cooling channel 3 may include a channel groove arranged at one end 21 of the cooling disk, and the wafer carrier 1 covers the opening of the channel groove and is detachably connected to the cooling disk 2. In a specific application example, the aforementioned wafer carrier 1 is detachably connected to the cooling disk 2 by screws.

[0039] In the above example, since the wafer carrier 1 directly covers the opening of the flow channel groove, the coolant in the flow channel groove can directly contact the wafer carrier 1, which can improve the cooling effect of the coolant on the wafer carrier 1.

[0040] One embodiment of the utility model also proposes a probe station device, which may include any of the above-mentioned enhanced temperature uniformity wafer carrier devices. In this example, because the probe station device adopts the above-mentioned enhanced temperature uniformity wafer carrier device, the cooling medium hits the spoiler block 4 when flowing in the cooling channel 3, so that the flow of the cooling medium in the cooling channel 3 can be disturbed, avoiding the phenomenon that some cooling media are stationary in the cooling channel 3, thereby improving the temperature uniformity of the cooling medium, improving the temperature uniformity of the wafer disk 1 under the low-temperature test, and improving the cooling effect.

[0041] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A wafer carrier device with enhanced temperature uniformity, characterized in that: It comprises a wafer carrier plate (1) and a cooling plate (2); The wafer carrier (1) has a carrying surface (101), and the wafer carrier (1) carries the wafer via the carrying surface (101); The cooling plate (2) is provided with a cooling channel (3), and the cooling plate (2) cools the wafer carrier plate (1) through the cooling channel (3); Wherein, a spoiler (4) is provided in the cooling channel (3); the cooling channel (3) includes a channel groove arranged at one end (21) of the cooling disk, and the carrier disk (1) covers the opening of the channel groove and is detachably connected to the cooling disk (2).

2. The wafer carrier device with enhanced temperature uniformity as claimed in claim 1, characterized in that: The cooling channel (3) is in a spiral shape, and the center line of the spiral coincides with the center line of the wafer carrier (1).

3. The enhanced temperature uniformity wafer carrier device according to claim 1 or 2, characterized in that: The spoiler blocks (4) are multiple in number and are arranged in sequence and at intervals in the length direction of the cooling channel (3).

4. The enhanced temperature uniformity wafer carrier device according to claim 1 or 2, characterized in that: The spoiler block (4) is in a strip shape, and the spoiler block (4) extends from one end of the cooling channel (3) to the other end.

5. The enhanced temperature uniformity wafer carrier device according to claim 1 or 2, characterized in that: The spoiler block (4) is detachable.

6. The wafer carrier device with enhanced temperature uniformity as claimed in claim 5, characterized in that: The spoiler block (4) is fixed in the cooling channel (3) by means of screws, so that the spoiler block (4) is detachable.

7. The wafer carrier device with enhanced temperature uniformity as claimed in claim 1, characterized in that: The wafer carrier plate (1) and the cooling plate (2) are detachably connected via screws.

8. The enhanced temperature uniformity wafer mounting device according to claim 1, 2, 6 or 7, characterized in that: The cooling channel (3) has a square cross section.

9. A probe station device, characterized in that: A wafer carrier device with enhanced temperature uniformity comprising the device described in any one of claims 1 to 8.

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