Electronic substrate fixing device and electronic substrate edge breaking assembly

Abstract

The utility model relates to the field of semiconductor manufacturing, and discloses an electronic substrate fixing device and an electronic substrate edge severing assembly.The electronic substrate fixing device is characterized in that a supporting assembly is provided with a communicating hole and an adsorption hole, and a first opening of the adsorption hole is formed in the surface, used for fixing an electronic substrate, of the supporting assembly; a second opening of the adsorption hole is formed in the supporting assembly and communicates with the communicating hole; the adsorption pieces are arranged in the adsorption holes in the extending direction of the adsorption holes in a height-adjustable mode. According to the electronic substrate fixing device and the electronic substrate edge breaking assembly, the problem of damage caused by hard pressing and fixing of the electronic substrate is solved, according to the electronic substrate fixing device and the electronic substrate edge breaking assembly, the adsorption part adsorbs the electronic substrate on the surface of the supporting assembly in a vacuum mode, and damage to elements on the surface of the electronic substrate caused by hard fixing in the prior art is avoided; meanwhile, the height of the adsorption part in the adsorption hole can be adjusted, so that the bent electronic substrate can be better adsorbed and fixed, and the situation that the quality of elements on the electronic substrate is affected due to hidden cracks caused by the fact that the electronic substrate is attached to a flat plate is avoided.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor preparation, and in particular relates to an electronic substrate fixing device and an electronic substrate edge bending component. Background Art

[0002] In existing semiconductor electronic substrates, such as DBC boards, before the DBC boards are cut into small pieces and tested, the waste edges around them need to be removed first. During this process, the DBC boards need to be fixed. Existing DBC board edge bending mechanisms all use a robotic arm to press the DBC boards onto a platform for edge bending.

[0003] However, for a DBC board with a curvature, hard pressing by the robot arm may cause hidden cracks in the complete DBC board, and even have the risk of damaging the chip on the surface of the DBC board. Utility Model Content

[0004] The embodiments of the present application provide an electronic substrate fixing device and an electronic substrate edge bending assembly, which can firmly adsorb the electronic substrate based on the curvature of the electronic substrate to avoid damage to the electronic substrate.

[0005] In the first aspect, an embodiment of the present application provides an electronic substrate fixing device, comprising: a supporting component, the supporting component being provided with a connecting hole and an adsorption hole, the first opening of the adsorption hole being formed on the surface of the supporting component for fixing the electronic substrate, the second opening of the adsorption hole being formed inside the supporting component and connected to the connecting hole, and the connecting hole being capable of being connected to a vacuum device; and an adsorption member being arranged in the adsorption hole in an adjustable height along an extension direction of the adsorption hole, and extending out of the surface distribution of the supporting component for fixing the electronic substrate.

[0006] According to the electronic substrate fixing device of the embodiment of the present application, the adsorption holes are arranged at intervals on the edge of the surface of the support component for fixing the electronic substrate, and one of the adsorption members corresponds to one metal block of the electronic substrate.

[0007] According to the electronic substrate fixing device of the embodiment of the present application, the communication hole includes a first vacuum hole and a second vacuum hole that are independent of each other;

[0008] The first vacuum hole is communicated with a part of the adsorption holes, and the second vacuum hole is communicated with the remaining part of the adsorption holes.

[0009] According to the electronic substrate fixing device of the embodiment of the present application, the support component is further provided with an adsorption channel, the adsorption channel is formed inside the support component, one end of the adsorption channel is connected to the adsorption hole, and the other end is connected to the communication hole.

[0010] According to the electronic substrate fixing device of the embodiment of the present application, the connecting hole includes a first vacuum hole, a second vacuum hole and a third vacuum hole which are independent of each other, and the adsorption channel includes a first channel, a second channel and a third channel which are independent of each other; the adsorption holes include a first group of holes, a second group of holes, a third group of holes and a fourth group of holes which are arranged in a rectangular shape, the first group of holes is arranged opposite to the second group of holes, and the third group of holes is arranged opposite to the fourth group of holes;

[0011] The first vacuum hole is connected to the first group of holes and part of the third group of holes through the first channel; the second vacuum hole is connected to the second group of holes and part of the fourth group of holes through the second channel; the third vacuum hole is connected to the remaining third group of holes and the remaining fourth group of holes through the third channel.

[0012] According to the electronic substrate fixing device of the embodiment of the present application, the adsorption member is threadedly connected to the adsorption hole.

[0013] According to the electronic substrate fixing device of the embodiment of the present application, the supporting assembly includes:

[0014] A support plate, wherein a through hole is formed on the support plate, and the support plate includes a surface for fixing the electronic substrate;

[0015] A rotating base, wherein the rotating base is detachably connected to the support plate, and a first mounting hole is provided on the rotating base, wherein the first mounting hole coincides with the axis of the through hole to form the adsorption hole, and the adsorption component passes through the through hole and is connected to the first mounting hole, wherein the inner diameter of the through hole is larger than the inner diameter of the first mounting hole, and the connecting hole is provided on the rotating base.

[0016] According to the electronic substrate fixing device of the embodiment of the present application, the rotating base is provided with a positioning groove and a second mounting hole, the positioning groove is provided on a side of the rotating base away from the support plate, the rotating base is limited by the positioning groove and the rotating mechanism, and the rotating base is connected to the rotating mechanism through the second mounting hole.

[0017] In the second aspect, an embodiment of the present application also provides an electronic substrate edge bending assembly, comprising a rotating mechanism, an edge bending robot and the above-mentioned electronic substrate fixing device, wherein the rotating mechanism is connected to the supporting assembly, and the edge bending robot can perform an edge bending action on the electronic substrate on the electronic substrate fixing device.

[0018] According to the electronic substrate edge bending assembly provided in the embodiment of the present application, the edge bending robot includes at least two groups of pneumatic clamps arranged in parallel.

[0019] The electronic substrate fixing device and the electronic substrate bending assembly of the embodiments of the present application, by opening an adsorption hole on the support assembly, installing the adsorption component in the adsorption hole, and performing vacuum extraction, the adsorption component can vacuum adsorb the electronic substrate on the surface of the support assembly, thereby avoiding the rigid fixation of the prior art, which causes damage to the components on the surface of the electronic substrate. At the same time, the height of the adsorption component in the adsorption hole is adjustable, so that the curved electronic substrate can be better adsorbed and fixed, avoiding the electronic substrate from being attached to the flat plate and causing hidden cracks, thereby affecting the quality of the components on the electronic substrate. The height-adjustable adsorption component can reduce the replacement time of the entire device and improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] Figure 1 One of the perspective views of a top view of an electronic substrate fixing device provided by some embodiments of the present application is shown;

[0022] Figure 2 Show Figure 1 Sectional view along the AA axis;

[0023] Figure 3 Shown with Figure 1 A schematic diagram of the electronic substrate structure corresponding to the electronic substrate fixing device;

[0024] Figure 4 A second perspective view of a top view of an electronic substrate fixing device provided by other embodiments of the present application is shown;

[0025] Figure 5 A third perspective view of the electronic substrate fixing device provided by some embodiments of the present application is shown;

[0026] Figure 6 An exploded schematic diagram of an electronic substrate fixing device provided by some embodiments of the present application is shown;

[0027] Figure 7 Show Figure 6 A perspective view of an electronic substrate fixing device;

[0028] Figure 8 A schematic diagram of a rotating base of an electronic substrate fixing device provided by some embodiments of the present application is shown;

[0029] Fig. 9 Shows Figure 8 A perspective view of a rotating base of an electronic substrate fixture.

[0030] Reference numerals:

[0031] 100: support plate; 101: through hole; 200: rotating base; 201: first mounting hole; 202: second mounting hole; 203: mounting groove; 210: first vacuum hole; 220: second vacuum hole; 230: third vacuum hole; 211: first channel; 212: second channel; 213: third channel;

[0032] 300: support assembly; 301: adsorption hole; 302: adsorption channel; 303: connecting hole; 304: adsorption piece; 305: fastener; 310: first group of holes; 320: second group of holes; 330: third group of holes; 340: fourth group of holes; 400: DBC board; 401: waste edge; 402: metal block; 403: pre-cut groove. DETAILED DESCRIPTION

[0033] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0035] Electronic substrates include ceramic substrates, metal substrates, rigid substrates, flexible substrates, etc. Take the DBC board among ceramic substrates as an example. The DBC board is a new composite material that directly bonds a highly insulating ceramic substrate (such as aluminum oxide Al2O3 or aluminum nitride AlN) with copper metal. It is mainly used as a carrier for various chips (such as IGBT chips, diode chips, resistors, SiC chips, etc.), and completes the connection of the chip's connecting poles or connecting surfaces through the surface copper coating. Its function is similar to that of a PCB board. The DBC board plays a key role in power electronic module technology. After the DBC board is manufactured, it becomes a large board, which needs to be trimmed and separated.

[0036] With the maturity of automation technology, the cutting of DBC boards has also been automated. When cutting the waste edges of DBC boards, existing automated equipment places a DBC board on a platform, presses the DBC board on the platform with a robotic arm, and then uses a robotic arm to break off the waste edges of the DBC board to achieve the cutting of the waste edges. However, in this process, in order to ensure that the DBC board does not move when the robotic arm breaks the edges of the DBC board, the robotic arm needs to press the DBC board with a greater force so that the DBC board is firmly fixed on the platform when breaking the edges. When the DBC board has a certain curvature, the greater pressing force makes the DBC board tend to be horizontal. Forcibly flattening the DBC board will cause hidden cracks in the DBC board, and even damage the chips on the surface of the DBC board, affecting product quality.

[0037] In order to solve the problems of the prior art, the embodiment of the present application provides an electronic substrate fixing device and an electronic substrate edge bending assembly. The electronic substrate fixing device provided by the embodiment of the present application is first introduced below.

[0038] Figure 1 One of the perspective views of the top view of the electronic substrate fixing device provided by some embodiments of the present application is shown. Figure 2 Show Figure 1 Cross-sectional view along the AA axis.

[0039] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides an electronic substrate fixing device, including: a support component 300 and an adsorption component 304, the support component 300 is provided with a connecting hole 303 and an adsorption hole 301, the first opening of the adsorption hole 301 is formed on the surface of the support component 300 for fixing the electronic substrate, the second opening of the adsorption hole 301 is formed inside the support component 300 and is connected to the connecting hole 303, and the connecting hole 303 can be connected to a vacuum device; the adsorption component 304 is arranged in the adsorption hole 301 in an adjustable height along the extension direction of the adsorption hole 301, and extends out of the support component 300 for fixing the surface distribution of the electronic substrate.

[0040] The embodiment of the present application is explained by taking the DBC board 400 as an example. The support component 300 has a support plane, and the support plane is used to support the DBC board 400. An adsorption hole 301 is opened in the thickness direction of the support component 300, and an adsorption component 304 is installed in the adsorption hole 301, so that the adsorption component 304 in the adsorption hole 301 is connected with the connecting hole 303, and then vacuum is absorbed to adsorb and fix the DBC board 400 on the support plane.

[0041] In order to adapt to the flexible fixation of the DBC board 400 with a curvature, the height of the adsorption member 304 and the support plane of the support assembly 300 are adjustable, that is, the adsorption member 304 and the adsorption hole 301 are connected in a height-adjustable manner, so that the height direction of the adsorption member 304 matches the curvature of the DBC board 400, meets the fixation during the process of breaking off the waste edge 401 of the DBC board 400, and avoids damage to the DBC board 400, thereby affecting the quality of the chip on the DBC board 400. At the same time, the height of the adsorption member 304 is adjustable, which can adapt to different types of electronic substrates, reducing the time for replacing the kit by 80%, improving work efficiency, reducing the number of robot arm movements compared to the prior art, and increasing the overall UPH (unit time output) by 30%.

[0042] Further, in a specific embodiment of the present application, the adsorption member 304 is threadedly connected to the adsorption hole 301. That is, the adsorption member 304 includes a connected stud and a suction cup, the suction cup is placed on the support plane, the stud is connected to the internal thread of the adsorption hole 301, and the height adjustment of the suction cup is achieved through the stud and the adsorption hole 301. Since the connecting hole 303 is connected to the adsorption hole 301, no matter how the adsorption member 304 is adjusted, the connection between the connecting hole and the adsorption member 304 is always maintained. The suction cup can be made of rubber.

[0043] Figure 3 Shown with Figure 1 Schematic diagram of the electronic substrate structure corresponding to the electronic substrate fixing device.

[0044] With respect to the DBC board 400 of the embodiment of the present application, the DBC board 400 includes a board body and waste edges 401 around the board body. The board body includes metal blocks 402 spaced apart from each other by pre-cut grooves 403. The metal blocks 402 are higher than other parts of the board body. When the DBC board 400 is fixed, the adsorption member 304 is adsorbed on the metal block 402.

[0045] Therefore, in order to save costs and better fix the DBC board 400, the adsorption holes 301 are arranged at intervals on the edge of the surface of the support assembly 300 for fixing the electronic substrate, and one adsorption member 304 corresponds to one metal block 402 of the electronic substrate.

[0046] Since the scrap edge 401 is placed around the board body, the metal block 402 of the DBC board 400 close to the scrap edge 401 can be adsorbed to achieve the purpose of firm fixation. Of course, in other embodiments of the present application, adsorption holes 301 can also be set at other positions of the support plane of the support assembly 300 corresponding to the metal block 402, so as to install the adsorption member 304.

[0047] Figure 4 The second perspective view of the top view of the electronic substrate fixing device provided in some other embodiments of the present application is shown.

[0048] like Figure 4 As shown, in some optional embodiments of the present application, in order to avoid the gap between the adsorption member 304 in the adsorption hole 301 and the DBC board 400, which causes vacuum leakage and affects the adsorption of the remaining adsorption members 304, the connecting hole 303 includes a first vacuum hole 210 and a second vacuum hole 220 that are independent of each other; the first vacuum hole 210 is connected to a part of the adsorption holes 301; and the second vacuum hole 220 is connected to the remaining adsorption holes 301.

[0049] That is to say, the connecting hole 303 is divided into multiple pipelines for independent vacuuming to ensure that at least a part of the adsorption member 304 is in a good adsorption state, reduce the situation of insufficient adsorption force, and improve the stable adsorption state of the support assembly 300. In other embodiments of the present application, the connecting hole 303 can also include three vacuum holes, four vacuum holes, etc., each vacuum hole is independently connected to part of the adsorption holes 301 to improve the adsorption effect. The adsorption hole 301 and the connecting hole 303 can be connected by a pipeline or an internal channel.

[0050] Continue to refer Figure 1 and Figure 2 In some optional embodiments of the present application, the support component 300 is further provided with an adsorption channel 302, which is formed inside the support component 300, and one end of the adsorption channel 302 is connected to the adsorption hole 301, and the other end is connected to the connecting hole 303.

[0051] For example, in order to facilitate the manufacture of the adsorption channel 302, a plurality of through holes 101 are provided inside the support component 300 along the distribution direction of the adsorption holes 301, and the axis of the through hole 101 may be perpendicular to the axis of the adsorption hole 301. The plurality of through holes 101 form an adsorption channel 302, and the adsorption channel 302 connects the adsorption hole 301 with the connecting hole 303. The through holes 101 form openings on the side of the support component 300, and each opening is blocked by a blocking member. During the vacuum adsorption process of the adsorption hole 301, the adsorption channel 302 is in a closed state.

[0052] Figure 5 A third perspective view of the electronic substrate fixing device provided by some embodiments of the present application is shown.

[0053] In order to reasonably set the hole positions, optimize the hole positions, and ensure the stability and reliability of the adsorption state. In a specific embodiment of the present application, the connecting hole 303 includes a first vacuum hole 210, a second vacuum hole 220, and a third vacuum hole 230 that are independent of each other, and the adsorption channel 302 includes a first channel 211, a second channel 212, and a third channel 213 that are independent of each other; the adsorption hole 301 includes a first group of holes 310, a second group of holes 320, a third group of holes 330, and a fourth group of holes 340 arranged in a rectangular shape, the first group of holes 310 is arranged opposite to the second group of holes 320, and the third group of holes 330 is arranged opposite to the fourth group of holes 340; the first vacuum hole 210 is connected to the first group of holes 310 and part of the third group of holes 330 through the first channel 211; the second vacuum hole 220 is connected to the second group of holes 320 and part of the fourth group of holes 340 through the second channel 212; the third vacuum hole 230 is connected to the remaining third group of holes 330 and the remaining fourth group of holes 340 through the third channel 213.

[0054] For example, the spacing of the adsorption holes 301 of each group is determined by the spacing of the metal block 402 of the DBC plate 400, and the center of the adsorption hole 301 can coincide with the center of the metal block 402. In other words, the spacing between adjacent adsorption holes 301 can be equal. The first vacuum hole 210, the second vacuum hole 220 and the third vacuum hole 230 can be opened in the middle of the support assembly 300. Of course, the first vacuum hole 210, the second vacuum hole 220 and the third vacuum hole 230 can also be opened to coincide with the central axis of the adsorption hole 301.

[0055] For the adsorption holes 301 of the first group of holes 310, the second group of holes 320, the third group of holes 330 and the fourth group of holes 340, the adsorption holes 301 on the four edges of the support plane of the support assembly 300 are grouped, the centers of the first group of holes 310, the second group of holes 320, the third group of holes 330 and the fourth group of holes 340 are on a straight line. The first channel 211, the second channel 212 and the third channel 213 divide the first group of holes 310, the second group of holes 320, the third group of holes 330 and the fourth group of holes 340 into three independently connected parts, so that when the adsorption holes 301 in any part are in a state of insufficient adsorption, the adsorption holes 301 in other parts can still firmly adsorb the DBC board 400 on the support assembly 300.

[0056] For example, the first channel 211 connects the first group of holes 310 and part of the third group of holes 330 to form an L-shaped first channel 211, the second channel 212 connects the second group of holes 320 and part of the fourth group of holes 340 to form an L-shaped second channel 212, the first channel 211 and the second channel 212 are arranged diagonally, and the third channel 213 connects the remaining third group of holes 330 and the fourth group of holes 340 to form a Z-shaped third channel 213. When the adsorbent 304 connected to the first channel 211 and / or the second channel 212 has insufficient vacuum, the Z-shaped third channel 213 can still ensure that the DBC board 400 can be firmly adsorbed on the support assembly 300. Similarly, when the adsorbent 304 connected to the third channel 213 has insufficient vacuum, the first channel 211 and the second channel 212 can still ensure that the DBC board 400 can be firmly adsorbed on the support assembly 300. The adsorption stability of the support assembly 300 is improved.

[0057] Figure 6 An exploded schematic diagram of an electronic substrate fixing device provided by some embodiments of the present application is shown; Figure 7 Show Figure 6 A perspective view of an electronic substrate fixture.

[0058] like Figure 6 and Figure 7 As shown, in one embodiment of the present application, the support assembly 300 includes a support plate 100 and a rotating base 200, the support plate 100 is provided with a through hole 101, and the support plate 100 includes a surface for fixing the electronic substrate; the rotating base 200 is detachably connected to the support plate 100, the rotating base 200 is provided with a first mounting hole 201, the first mounting hole 201 coincides with the axis of the through hole 101 to form an adsorption hole 301, the adsorption member 304 passes through the through hole 101 and is connected to the first mounting hole 201, the inner diameter of the through hole 101 is larger than the inner diameter of the first mounting hole 201, and the connecting hole 303 is provided on the rotating base 200.

[0059] Specifically, the rotating base 200 is detachably connected to the support plate 100, which is convenient for the manufacture of the rotating base 200 and the support plate 100, and is also convenient for replacing adsorption members 304 of different heights. The adsorption hole 301 can be interference fit with the first mounting hole 201, or the adsorption hole 301 is threadedly connected to the first mounting hole 201. The rotating base 200 is connected to the rotating mechanism to realize the overall rotation of the support assembly 300, which is convenient for bending the four waste edges 401 of the DBC board 400. The inner diameter of the through hole 101 is larger than the first mounting hole 201, so as to facilitate the installation of the suction cup of the adsorption member 304. An adsorption channel 302 is opened in the rotating base 200, so that the adsorption channel 302 is connected to the first mounting hole 201 and the connecting hole 303.

[0060] In other embodiments of the present application, a plurality of first mounting holes 201 are arranged at equal intervals on the rotating base 200, and based on the positions of the through holes 101 of different support plates 100, the rotating base 200 is matched with different first mounting holes 201 to achieve the adaptation of the rotating base 200 to the plurality of support plates 100. The rotating base 200 and the support plate 100 can be connected by fasteners 305 such as bolts, or the rotating base 200 and the support plate 100 can be connected by a positioning pin hole structure for limiting connection.

[0061] Figure 8 A schematic diagram of a rotating base 200 of an electronic substrate fixing device provided in some embodiments of the present application is shown; Fig. 9 Shows Figure 8 A perspective view of a rotating base 200 of an electronic substrate fixing device.

[0062] like Figure 8 and Fig. 9 As shown, in another embodiment of the present application, the rotating base 200 is provided with a positioning groove and a second mounting hole 202, the positioning groove is provided on a side of the rotating base 200 facing away from the support plate 100, the rotating base 200 is limited by the positioning groove and the rotating base 200 is connected to the rotating mechanism through the second mounting hole 202.

[0063] For example, the positioning groove can be a circular groove that matches the rotating mechanism of the cylinder. The positioning groove improves the installation accuracy of the rotating base 200 and the rotating mechanism and improves the installation efficiency. The second mounting hole 202 can be opened in the positioning groove. The second mounting hole 202 can be a countersunk hole so that the mounting bolt is sunk in the second mounting hole 202.

[0064] Further, in some embodiments of the present application, an electronic substrate edge breaking assembly includes a rotating mechanism, an edge breaking manipulator, and the electronic substrate fixing device of the above embodiment, wherein the rotating mechanism is connected to the support assembly 300, and the edge breaking manipulator can break the edge of the electronic substrate on the electronic substrate fixing device. The edge breaking manipulator is arranged on one side of the support assembly 300, and the support assembly is driven to rotate 0°, 90°, 180°, and 270° by the rotating mechanism, and the edge breaking manipulator breaks the waste edge 401 of the DBC board 400.

[0065] In other embodiments of the present application, the edge breaking robot comprises at least two sets of pneumatic grippers arranged in parallel. The pneumatic grippers are arranged at intervals along the length direction of the scrap edge 401, so that the force on the scrap edge 401 is more balanced.

[0066] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. An electronic substrate fixing device, characterized in that: include: A support component, wherein the support component is provided with a communication hole and an adsorption hole, wherein a first opening of the adsorption hole is formed on a surface of the support component for fixing the electronic substrate, and a second opening of the adsorption hole is formed inside the support component and communicates with the communication hole, and the communication hole can be connected to a vacuum device; The adsorption member is arranged in the adsorption hole in an adjustable height along the extension direction of the adsorption hole, and extends out of the support component to fix the surface distribution of the electronic substrate.

2. The electronic substrate fixing device according to claim 1, characterized in that: The adsorption holes are arranged at intervals on the edge of the surface of the support component for fixing the electronic substrate, and one of the adsorption members corresponds to one metal block of the electronic substrate.

3. The electronic substrate fixing device according to claim 1, characterized in that: The communicating hole comprises a first vacuum hole and a second vacuum hole which are independent of each other; The first vacuum hole is communicated with a part of the adsorption holes, and the second vacuum hole is communicated with the remaining part of the adsorption holes.

4. The electronic substrate fixing device according to claim 1, characterized in that: The support component is further provided with an adsorption channel, which is formed inside the support component. One end of the adsorption channel is communicated with the adsorption hole, and the other end of the adsorption channel is communicated with the communication hole.

5. The electronic substrate fixing device according to claim 4, characterized in that: The connecting holes include first vacuum holes, second vacuum holes and third vacuum holes that are independent of each other, and the adsorption channels include first channels, second channels and third channels that are independent of each other; the adsorption holes include first, second, third and fourth groups of holes that are arranged in a rectangular shape, the first group of holes is arranged opposite to the second group of holes, and the third group of holes is arranged opposite to the fourth group of holes; The first vacuum hole is connected to the first group of holes and part of the third group of holes through the first channel; the second vacuum hole is connected to the second group of holes and part of the fourth group of holes through the second channel; the third vacuum hole is connected to the remaining third group of holes and the remaining fourth group of holes through the third channel.

6. The electronic substrate fixing device according to any one of claims 1 to 5, characterized in that: The adsorption piece is threadedly connected to the adsorption hole.

7. The electronic substrate fixing device according to claim 6, characterized in that: The support assembly comprises: A support plate, wherein a through hole is formed on the support plate, and the support plate includes a surface for fixing the electronic substrate; A rotating base, wherein the rotating base is detachably connected to the support plate, and a first mounting hole is provided on the rotating base, wherein the first mounting hole coincides with the axis of the through hole to form the adsorption hole, and the adsorption component passes through the through hole and is connected to the first mounting hole, wherein the inner diameter of the through hole is larger than the inner diameter of the first mounting hole, and the connecting hole is provided on the rotating base.

8. The electronic substrate fixing device according to claim 7, characterized in that: The rotating base is provided with a positioning groove and a second mounting hole. The positioning groove is provided on a side of the rotating base away from the support plate. The rotating base is limited by the rotating mechanism through the positioning groove. The rotating base is connected to the rotating mechanism through the second mounting hole.

9. An electronic substrate edge bending assembly, characterized in that: It comprises a rotating mechanism, an edge-bending robot and the electronic substrate fixing device according to any one of claims 1 to 8, wherein the rotating mechanism is connected to the supporting assembly, and the edge-bending robot can perform edge-bending action on the electronic substrate on the electronic substrate fixing device.

10. The electronic substrate edge bending assembly according to claim 9, characterized in that: The edge breaking robot comprises at least two groups of pneumatic clamps arranged in parallel.

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