Temperature control device and sorting machine

Abstract

The utility model relates to the technical field of chip testing, and discloses a temperature control device and a sorting machine. Wherein the temperature control device comprises a pressure head, a refrigeration module and a heat pipe, and the pressure head is used for contacting with a to-be-tested piece for heat exchange; the refrigeration module is used for providing a cold source for the pressure head; the heat pipe comprises an evaporation end and a condensation end, the evaporation end is connected with the pressure head, and the condensation end is connected with the refrigeration module. Wherein the evaporation end of the heat pipe is connected with the pressure head, the condensation end of the heat pipe is connected with the refrigeration module, the pressure head is connected with the refrigeration module through the heat pipe, the refrigeration module provides a cold source, and the pressure head directly dissipates heat through the heat pipe and the refrigeration module after heat of a chip reaches the surface of the pressure head by utilizing the high heat conduction performance of the heat pipe, so that the purpose of rapid heat dissipation of the chip is achieved. According to the temperature control device, multi-layer contact thermal resistance and material thermal resistance from the surface of the pressure head to the cold end of equipment in a traditional structure are skipped, the temperature reaches the refrigeration module directly through the heat pipe, the heat dissipation capacity of a chip can be greatly improved, the performance of the temperature control device is improved, the modification amount is small, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a temperature control device and a sorting machine. Background Art

[0002] The three-temperature test is an important part of chip testing. During the test, a pressure head with temperature control function needs to be in contact with the chip surface to achieve the function of controlling the chip junction temperature. When the chip heats up during the test, the pressure head needs to be cooled in time to dissipate the heat of the chip so that the junction temperature of the chip remains within a constant range. With the advancement of chip manufacturing technology, the integration of chips is getting higher and higher, the power consumption is getting higher and higher, and the heat generation is getting higher and higher. Chip heat dissipation has become a key point in the three-temperature test.

[0003] The existing technology often uses the following methods to increase the heat dissipation of the chip: Method 1: Find new thermal conductive medium materials to reduce the contact thermal resistance between the chip and the cold end of the device. However, the current development of thermal conductive medium materials has fallen into a bottleneck period, and the ability to reduce contact thermal resistance is similar, without major breakthroughs, and the service life is short and the cost of use is high; Method 2: Reduce thermal resistance by reducing the heat transfer distance between the chip and the cold end. However, a large number of indispensable components need to be placed between the chip and the cold end, making it difficult to further compress the heat transfer distance between the chip and the cold end; Method 3: Strengthen the refrigeration capacity of the refrigeration equipment and increase the heat dissipation by lowering the temperature of the cold end of the equipment. However, the greater the refrigeration capacity of the refrigeration equipment, the greater its volume and power consumption, resulting in a significant increase in equipment costs.

[0004] Based on this, a temperature control device and a sorting machine are urgently needed to solve the above-mentioned problems. Utility Model Content

[0005] Based on the above, the purpose of the present invention is to provide a temperature control device and a sorting machine, which can greatly improve the heat dissipation capacity of the chip and the performance of the temperature control device, with small modifications and low costs.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] In one aspect, a temperature control device is provided, comprising:

[0008] The pressure head is used for heat exchange with the test piece;

[0009] A refrigeration module, used for providing a cold source for the pressure head;

[0010] The heat pipe comprises an evaporation end and a condensation end, wherein the evaporation end is connected to the pressure head, and the condensation end is connected to the refrigeration module.

[0011] As a preferred technical solution of a temperature control device, the refrigeration module includes a refrigeration plate, the refrigeration plate is provided with a refrigeration surface, and the condensation end is attached to the refrigeration surface.

[0012] As a preferred technical solution for a temperature control device, the refrigeration module also includes a substrate, which is arranged between the pressure head and the refrigeration plate. A second receiving groove is arranged on a side of the substrate close to the refrigeration plate, and the condensation end is embedded in the second receiving groove.

[0013] As a preferred technical solution of the temperature control device, the pressure head is provided with a first containing groove, and the evaporation end is embedded in the first containing groove.

[0014] As a preferred technical solution of a temperature control device, the temperature control device further includes a heating module, the heating module is attached to the pressing head, and the heating module can heat the pressing head.

[0015] As a preferred technical solution of the temperature control device, the side of the heating module facing away from the pressure head is connected to the refrigeration module, and a heat insulation board is arranged between the heating module and the refrigeration module.

[0016] As a preferred technical solution for a temperature control device, the heat pipe is U-shaped or spiral.

[0017] As a preferred technical solution of the temperature control device, a heat-conducting medium is provided between the condensing end and the refrigeration surface; and / or a heat-conducting medium is provided between the evaporating end and the pressure head.

[0018] As a preferred technical solution of a temperature control device, the temperature control device further includes a temperature sensor, the temperature sensor is connected to the pressure head, and the temperature sensor is used to detect the temperature of the pressure head.

[0019] On the other hand, a sorting machine is provided, comprising a feeding device, a loading station, a material receiving device, a transport device, a testing mechanism and a temperature control device as described in any of the above schemes, wherein the feeding device is used to supply pieces to be tested, the transport device is used to transport the pieces to be tested in the feeding device to the loading station, the testing mechanism is used to test the pieces to be tested at the loading station, the temperature control device is arranged on the testing mechanism and is used to control the temperature of the pieces to be tested at the loading station, and the transport device is also used to transport the products tested at the loading station to the material receiving device.

[0020] The beneficial effects of the utility model are:

[0021] The utility model provides a temperature control device and a sorting machine, wherein the evaporation end of the heat pipe is connected to the pressure head, and the condensation end of the heat pipe is connected to the refrigeration module. The heat pipe is used to connect the pressure head and the refrigeration module, and the refrigeration module provides a cold source. The high thermal conductivity of the heat pipe is used to make the heat of the chip reach the surface of the pressure head, and the pressure head directly dissipates heat through the heat pipe and the refrigeration module, so as to achieve the purpose of rapid heat dissipation of the chip. The temperature control device skips the multi-layer contact thermal resistance and material thermal resistance from the pressure head surface to the cold end of the equipment in the traditional structure, and directly reaches the refrigeration module through the heat pipe, which can greatly improve the heat dissipation capacity of the chip and improve the performance of the temperature control device, and the modification is small and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of the structure of a U-shaped heat pipe in a temperature control device provided by a specific embodiment of the utility model;

[0024] Figure 2 It is a structural explosion diagram of the temperature control device provided in a specific embodiment of the utility model;

[0025] Figure 3 It is a schematic diagram of a partial structure of a U-shaped heat pipe in a temperature control device provided by a specific embodiment of the utility model;

[0026] Figure 4 It is a structural schematic diagram of a pressure head provided in a specific embodiment of the utility model;

[0027] Figure 5 It is a schematic diagram of the structure of a spiral heat pipe in a temperature control device provided by a specific embodiment of the utility model;

[0028] Figure 6 It is an exploded view of a partial structure of a spiral heat pipe in a temperature control device provided by a specific embodiment of the utility model.

[0029] The following are marked in the figure:

[0030] 1. Press head; 11. First receiving groove; 12. Mounting groove; 13. Mounting hole;

[0031] 2. Refrigeration module; 21. Refrigeration plate; 211. Refrigeration surface; 22. Base plate; 221. Second receiving groove; 222. Positioning groove;

[0032] 3. Heat pipe; 31. Evaporation end; 32. Condensation end;

[0033] 4. Heating module; 5. Heat insulation board; 6. Temperature sensor. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0038] like Figure 1 and Figure 2As shown, this embodiment provides a temperature control device, which includes a pressure head 1, a refrigeration module 2 and a heat pipe 3. The pressure head 1 is used for contacting and exchanging heat with the test piece; the refrigeration module 2 is used to provide a cold source for the pressure head 1; the heat pipe 3 includes an evaporation end 31 and a condensation end 32, the evaporation end 31 is connected to the pressure head 1, and the condensation end 32 is connected to the refrigeration module 2. Among them, the evaporation end 31 of the heat pipe 3 is connected to the pressure head 1, and the condensation end 32 is connected to the refrigeration module 2. The heat pipe 3 is used to connect the pressure head 1 and the refrigeration module 2, and the refrigeration module 2 provides a cold source. By utilizing the high thermal conductivity of the heat pipe 3, after the heat of the chip reaches the surface of the pressure head 1, the pressure head 1 directly dissipates heat through the heat pipe 3 and the refrigeration module 2, so as to achieve the purpose of rapid heat dissipation of the chip. The temperature control device skips the multi-layer contact thermal resistance and material thermal resistance from the surface of the pressure head 1 to the cold end of the device in the traditional structure, and directly reaches the refrigeration module 2 through the heat pipe 3, which can greatly improve the heat dissipation capacity of the chip and the performance of the temperature control device, and the modification is small and the cost is low. In this embodiment, the device to be tested is a chip, and the press head 1 adjusts the temperature of the chip.

[0039] Preferably, the refrigeration module 2 includes a refrigeration plate 21, the refrigeration plate 21 is provided with a refrigeration surface 211, the condensation end 32 is attached to the refrigeration surface 211, the heat of the condensation end 32 of the heat pipe 3 is transferred to the refrigeration plate 21 through the refrigeration surface 211, and the heat dissipation medium in the refrigeration plate 21 dissipates the heat, so that the refrigeration module 2 provides a cold source for the heat pipe 3. It should be noted that the refrigeration plate 21 is a prior art and will not be described in detail here.

[0040] Preferably, if Figure 1-Figure 3 As shown, the refrigeration module 2 also includes a substrate 22, which is arranged between the pressure head 1 and the refrigeration plate 21. A second accommodating groove 221 is arranged on the side of the substrate 22 close to the refrigeration plate 21, and the condensation end 32 is embedded in the second accommodating groove 221. The evaporation end 31 is squeezed by the substrate 22 and the refrigeration surface 211, which improves the fitting strength between the condensation end 32 and the refrigeration surface 211, improves the heat conduction effect, and realizes the fixation of the condensation end 32, thereby improving the connection stability between the heat pipe 3 and the refrigeration module 2.

[0041] Furthermore, the pressure head 1 is provided with a first receiving groove 11, and the evaporation end 31 is embedded in the first receiving groove 11. On the one hand, the evaporation end 31 and the pressure head 1 are fixed, and on the other hand, after the evaporation end 31 is embedded in the first receiving groove 11, the evaporation end 31 fits with the side wall of the first receiving groove 11, thereby increasing the contact area between the evaporation end 31 and the pressure head 1, thereby achieving a better heat conduction effect.

[0042] While controlling the junction temperature of the chip, it is also necessary to heat the chip. In this embodiment, the temperature control device also includes a heating module 4, which is attached to the pressure head 1. The heating module 4 can heat the pressure head 1. During the test, on the one hand, the heating module 4 can increase the temperature of the pressure head 1, and the cooling module 2 can reduce the temperature of the pressure head 1. The heating module 4 and the cooling module 2 cooperate to jointly adjust the temperature of the pressure head 1 so that the pressure head 1 reaches a preset temperature to meet the test requirements. In this embodiment, the heating module 4 is a heating plate.

[0043] The heat exchange capacity of the heat pipe 3 depends on the temperature difference between the evaporation end 31 and the condensation end 32. The greater the temperature difference, the stronger the heat exchange capacity of the heat pipe 3. Preferably, the side of the heating module 4 away from the pressure head 1 is connected to the refrigeration module 2, and a heat insulation board 5 is provided between the heating module 4 and the refrigeration module 2. Among them, the heat insulation board 5 is made of low thermal conductivity material. After the heat insulation board 5 is placed between the heating module 4 and the refrigeration module 2, the heat insulation board 5 can isolate the heat transfer between the refrigeration module 2 and the heating module 4, and the heat of the heating module 4 cannot be transferred to the condensation end 32 of the heat pipe 3, reducing the influence of the heating module 4 on the condensation end 32 of the heat pipe 3, increasing the temperature difference between the two ends of the heat pipe 3, and improving the cooling effect of the pressure head 1; furthermore, the heat insulation board 5 can reduce the heat loss of the heating module 4 and improve the utilization rate of the heat of the heating module 4. In this embodiment, by providing the heat insulation board 5, the power of the heating plate is reduced, and the load of the refrigeration module 2 is reduced, while reducing the cost of the heating plate, the service life of the refrigeration module 2 is extended.

[0044] In this embodiment, the heat insulation board 5 is connected to the side of the base plate 22 away from the refrigeration plate 21. A positioning groove 222 is provided on the side of the base plate 22 away from the refrigeration plate 21, and the heat insulation board 5 is embedded in the positioning groove 222, and the heat insulation board 5 can be connected to the bottom of the positioning groove 222 by screws.

[0045] Preferably, if Figure 2 and Figure 4 As shown, a mounting groove 12 is provided on one side of the pressure head 1 close to the heating plate, the heating plate is embedded in the mounting groove 12, the pressure head 1 and the heat insulation board 5 are connected to the base plate 22 by screws, and the heating plate is fixed between the pressure head 1 and the heat insulation board 5. On the one hand, the pressure head 1, the heating plate, the heat insulation board 5 and the base plate 22 are fixedly connected; on the other hand, the heating plate is located in the mounting groove 12 and is not exposed, thereby reducing the heat loss of the heating plate and further improving the utilization rate of the heat of the heating plate.

[0046] Preferably, a heat conducting medium is provided between the condensation end 32 and the refrigeration surface 211 to reduce the thermal resistance between the condensation end 32 and the refrigeration surface 211; and / or a heat conducting medium is provided between the evaporation end 31 and the pressure head 1 to reduce the thermal resistance between the evaporation end 31 and the pressure head 1. In this embodiment, a heat conducting medium is provided between the condensation end 32 and the refrigeration surface 211; and a heat conducting medium is provided between the evaporation end 31 and the pressure head 1. The heat conducting medium may be a heat conducting medium such as a carbon fiber thermal pad or thermal grease.

[0047] Furthermore, if Figure 2 As shown, the temperature control device further includes a temperature sensor 6, which is connected to the pressure head 1 and is used to detect the temperature of the pressure head 1. The pressure head 1 is provided with a mounting hole 13, and the temperature sensor 6 is installed in the mounting hole 13. The temperature sensor 6 is placed near the crimping surface of the pressure head 1 and at a higher temperature position, and is used to measure the temperature of the pressure head 1 and feed it back to the controller of the heating module 4, so that the heating module 4 outputs a suitable heating power.

[0048] Preferably, there are at least two heat pipes 3 symmetrically arranged on both sides of the pressure head 1 and the refrigeration module 2 . The at least two heat pipes 3 jointly dissipate heat for the pressure head 1 , thereby improving the thermal conductivity between the pressure head 1 and the refrigeration module 2 .

[0049] Furthermore, the heat pipe 3 is a new type of heat-conducting element, which makes full use of the heat absorption and heat release properties of the phase change medium during evaporation and condensation to transfer heat, and has a thermal conductivity far exceeding that of known metals. The thermal conductivity of the heat pipe 3 is related to its length. The longer the length, the stronger the thermal conductivity. In this embodiment, the heat pipe 3 is U-shaped, and the heat pipe 3 is flattened and bent into a U-shape. One end of the heat pipe 3 is embedded in the first receiving groove 11, and the other end is embedded in the second receiving groove 221. The heat pipe 3 is in a limited space, and the length of the heat pipe 3 is increased as much as possible, thereby improving the thermal conductivity. In other embodiments, such as Figure 5 and Figure 6 As shown, the heat pipe 3 is in a spiral shape, and the heat pipe 3 is flattened and coiled into a spiral shape, which further increases the length.

[0050] This embodiment also provides a sorting machine, including a feeding device, a loading station, a receiving device, a transport device, a testing mechanism and the above-mentioned temperature control device, wherein the feeding device is used to supply the test pieces, the transport device is used to transport the test pieces in the feeding device to the loading station, the testing mechanism is used to test the test pieces in the loading station, the temperature control device is arranged on the testing mechanism and is used to control the temperature of the test pieces in the loading station, and the transport device is also used to transport the tested products in the loading station to the receiving device to complete the test of the chip. Among them, the feeding device, the receiving device, the transport device and the testing mechanism are prior art and will not be described in detail here.

[0051] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A temperature control device, characterized in that: include: A pressure head (1), used for contacting and exchanging heat with the test piece; A refrigeration module (2), used for providing a cold source for the pressure head (1); The heat pipe (3) comprises an evaporation end (31) and a condensation end (32), wherein the evaporation end (31) is connected to the pressure head (1), and the condensation end (32) is connected to the refrigeration module (2).

2. The temperature control device according to claim 1, characterized in that: The refrigeration module (2) comprises a refrigeration plate (21), the refrigeration plate (21) is provided with a refrigeration surface (211), and the condensation end (32) is attached to the refrigeration surface (211).

3. The temperature control device according to claim 2, characterized in that: The refrigeration module (2) further comprises a substrate (22), wherein the substrate (22) is arranged between the pressure head (1) and the refrigeration plate (21), and a second receiving groove (221) is arranged on a side of the substrate (22) close to the refrigeration plate (21), and the condensation end (32) is embedded in the second receiving groove (221).

4. The temperature control device according to claim 1, characterized in that: The pressure head (1) is provided with a first containing groove (11), and the evaporation end (31) is embedded in the first containing groove (11).

5. The temperature control device according to claim 1, characterized in that: The temperature control device further comprises a heating module (4), wherein the heating module (4) is attached to the pressing head (1), and the heating module (4) is capable of heating the pressing head (1).

6. The temperature control device according to claim 5, characterized in that: The side of the heating module (4) facing away from the pressure head (1) is connected to the refrigeration module (2), and a heat insulation board (5) is provided between the heating module (4) and the refrigeration module (2).

7. The temperature control device according to claim 1, characterized in that: The heat pipe (3) is U-shaped or spiral-shaped.

8. The temperature control device according to claim 2, characterized in that: A heat-conducting medium is provided between the condensing end (32) and the refrigeration surface (211); and / or a heat-conducting medium is provided between the evaporating end (31) and the pressure head (1).

9. The temperature control device according to claim 1, characterized in that: The temperature control device further comprises a temperature sensor (6), wherein the temperature sensor (6) is connected to the pressure head (1), and the temperature sensor (6) is used to detect the temperature of the pressure head (1).

10. A sorting machine, characterized in that: It includes a feeding device, a loading station, a receiving device, a transport device, a testing mechanism and a temperature control device as described in any one of claims 1 to 9, the feeding device is used to supply the test pieces, the transport device is used to transport the test pieces in the feeding device to the loading station, the testing mechanism is used to test the test pieces at the loading station, the temperature control device is arranged on the testing mechanism and is used to control the temperature of the test pieces at the loading station, and the transport device is also used to transport the tested products at the loading station to the receiving device.

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