A PCB board capable of avoiding delamination and bubbling

Abstract

The utility model discloses a PCB board that can avoid stratification and bubbling, comprising a substrate, a plurality of hot melt modules are arranged on the substrate, and a plurality of explosion-proof grooves corresponding to the plurality of hot melt modules are arranged on the substrate; the explosion-proof grooves are arranged around the periphery of the corresponding hot melt modules, and the explosion-proof grooves include a first longitudinal total groove section, a second longitudinal total groove section and a transverse total groove section; the first longitudinal total groove section and the second longitudinal total groove section of the explosion-proof groove are arranged on both sides of the corresponding hot melt module; one end of the transverse total groove section of the explosion-proof groove is connected to the first longitudinal total groove section of the explosion-proof groove, and the other end of the transverse total groove section of the explosion-proof groove is connected to the second longitudinal total groove section of the explosion-proof groove; the top of each explosion-proof groove passes through the top surface of the substrate, and the bottom of each explosion-proof groove passes through the bottom surface of the substrate. The utility model can avoid the problems of stratification and bubbling, and can effectively improve the yield of the PCB board.

Description

Technical Field

[0001] The utility model relates to the field of PCB boards, in particular to a PCB board capable of avoiding generation of delamination and bubbling. Background Art

[0002] At present, due to the material characteristics and lamination stacking limitations of PCB boards for high-frequency and high-speed products, the number of layers and thickness of PCB boards for high-speed and high-frequency products are becoming thicker and thicker.

[0003] Hot melt modules are often installed on PCB boards of high-speed and high-frequency products. Since the area where the hot melt module is located undergoes some electroplating and grinding processes after pressing, some mechanical stresses formed in this area cannot be released. When certain conditions are met, bubbling separation will occur and stratification will be formed. If stratification and bubbling occur during the production process, the PCB board will face the situation of being scrapped, which will seriously affect the yield of the PCB board product.

[0004] In order to solve the above problems, some companies make explosion-proof holes at the hot melt module position of the PCB unit. After pressing, they form explosion-proof holes at the hot melt block position by drilling to release some internal stress, so as to prevent the hot melt module from diffusing after hot melting and then electroplating and grinding. However, it cannot effectively release the stress in all areas, and thus still cannot effectively solve the problems of delamination and bubbling, which still has a great impact on the yield of PCB board products. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a PCB board that can avoid delamination and bubbling, which can avoid the problems of delamination and bubbling and can effectively improve the yield of the PCB board.

[0006] The purpose of the utility model is achieved by the following technical solutions:

[0007] A PCB board capable of avoiding delamination and bubbling comprises a substrate, a plurality of hot melt modules are arranged on the substrate, and a plurality of explosion-proof grooves corresponding to the plurality of hot melt modules are arranged on the substrate; the explosion-proof grooves are arranged around the periphery of the corresponding hot melt modules, and the explosion-proof grooves comprise a first longitudinal total groove section, a second longitudinal total groove section and a transverse total groove section; the first longitudinal total groove section and the second longitudinal total groove section of the explosion-proof groove are arranged on both sides of the corresponding hot melt module; one end of the transverse total groove section of the explosion-proof groove is communicated with the first longitudinal total groove section of the explosion-proof groove, and the other end of the transverse total groove section of the explosion-proof groove is communicated with the second longitudinal total groove section of the explosion-proof groove; the top end of each explosion-proof groove passes through the top surface of the substrate, and the bottom end of each explosion-proof groove passes through the bottom surface of the substrate; the spacing between the side of the transverse total groove section of the explosion-proof groove close to the corresponding hot melt module and the corresponding hot melt module is 0.2 mm-1 mm.

[0008] The substrate comprises at least two core plates arranged in sequence from top to bottom; an adhesive layer is arranged between any two adjacent core plates.

[0009] Each core plate is provided with a first through groove unit, each adhesive layer is provided with a second through groove unit, and the first through groove units of any two adjacent core plates are connected through the second through groove units of the adhesive layer located between the two adjacent core plates; the first through groove units of each core plate of the substrate and the second through groove units of each adhesive layer together constitute the explosion-proof groove.

[0010] The first through-groove unit includes a first left-placed branch groove segment, a first right-placed branch groove segment and a first transverse branch groove segment; one end of the first transverse branch groove segment is connected to the first left-placed branch groove segment, and the other end of the first transverse branch groove segment is connected to the first right-placed branch groove segment.

[0011] The second through-groove unit includes a second left-placed branch groove segment, a second right-placed branch groove segment and a second transverse branch groove segment; one end of the second transverse branch groove segment is connected to the second left-placed branch groove segment, and the other end of the second transverse branch groove segment is connected to the second right-placed branch groove segment.

[0012] A plurality of first left-placed branch slot sections and second left-placed branch slot sections alternately arranged from top to bottom are connected in sequence and together constitute a first longitudinal total slot section.

[0013] A plurality of first right-placed branch slot sections and second right-placed branch slot sections alternately arranged from top to bottom are connected in sequence and together constitute a second longitudinal total slot section.

[0014] A plurality of first transverse branch slot sections and second transverse branch slot sections alternately arranged from top to bottom are connected in sequence and together constitute a transverse total slot section.

[0015] The spacing between the first longitudinal total groove section of the explosion-proof groove and the corresponding hot-melt module is 0.5mm-1.5mm.

[0016] The spacing between the second longitudinal total groove section of the explosion-proof groove and the corresponding hot-melt module is 0.5mm-1.5mm.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model provides a PCB board which can avoid the generation of delamination and bubbling. The explosion-proof groove is provided on the base plate, and the explosion-proof groove is surrounded by the periphery of the corresponding hot-melt module. The explosion-proof groove adopts a first longitudinal total groove section, a second longitudinal total groove section and a transverse total groove section, and the spacing between the transverse total groove section of the explosion-proof groove and the corresponding hot-melt module is reasonably set. The explosion-proof groove can prevent the corresponding hot-melt module from being located in an all-round way, limit the diffusion of delamination, and effectively release the thermal stress of the area where each hot-melt module is located, so as to avoid the generation of delamination and bubbling, thereby improving the yield of the PCB board; moreover, it is convenient to manufacture. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the utility model;

[0020] Figure 2 It is a cross-sectional view of the utility model;

[0021] Figure 3 It is the structural schematic diagram of the core board;

[0022] Figure 4 is a schematic diagram of the structure of the bonding layer;

[0023] 10. Base plate; 20. Hot melt module; 30. Explosion-proof groove; 40. First longitudinal total groove section; 50. Second longitudinal total groove section; 60. Transverse total groove section; 70. Core plate; 71. First through groove unit; 72. First left branch groove section; 73. First right branch groove section; 74. First transverse branch groove section; 80. Adhesive layer; 81. Second through groove unit; 82. Second left branch groove section; 83. Second right branch groove section; 84. Second transverse branch groove section. DETAILED DESCRIPTION

[0024] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0025] like Figure 1-4As shown, a PCB board that can avoid delamination and bubbling includes a substrate 10, on which a plurality of hot melt modules 20 are arranged, and the substrate 10 is provided with a plurality of explosion-proof grooves 30 corresponding to the plurality of hot melt modules 20; the explosion-proof grooves 30 are arranged around the periphery of the corresponding hot melt modules 20, and the explosion-proof grooves 30 include a first longitudinal total groove section 40, a second longitudinal total groove section 50 and a transverse total groove section 60; the first longitudinal total groove section 40 and the second longitudinal total groove section 50 of the explosion-proof groove 30 are respectively arranged in the corresponding hot melt modules 20. 0 on both sides; one end of the transverse total groove section 60 of the explosion-proof groove 30 is connected to the first longitudinal total groove section 40 of the explosion-proof groove 30, and the other end of the transverse total groove section 60 of the explosion-proof groove 30 is connected to the second longitudinal total groove section 50 of the explosion-proof groove 30; the top of each explosion-proof groove 30 passes through the top surface of the substrate 10, and the bottom end of each explosion-proof groove 30 passes through the bottom surface of the substrate 10; the spacing L1 between the side of the transverse total groove section 60 of the explosion-proof groove 30 close to the corresponding hot melt module 20 and the corresponding hot melt module 20 is 0.2mm-1mm.

[0026] The utility model provides a PCB board which can avoid the generation of stratification and bubbling. The explosion-proof groove 30 is provided on the substrate 10, and the explosion-proof groove 30 is surrounded by the outer periphery of the corresponding hot-melt module 20. At the same time, the explosion-proof groove 30 adopts a first longitudinal total groove section 40, a second longitudinal total groove section 50 and a transverse total groove section 60, and the spacing between the transverse total groove section 60 of the explosion-proof groove 30 and the corresponding hot-melt module 20 is reasonably set. Through the explosion-proof groove 30, the area where the corresponding hot-melt module 20 is located can be prevented in all directions, the diffusion of its stratification can be restricted in all directions, the thermal stress of the area where each hot-melt module 20 is located can be completely released, and the problem of stratification and bubbling invading the unit in each area after hot-melt pressing and then causing the PCB product to be scrapped can be prevented to the greatest extent, stratification and bubbling can be avoided, and the yield rate of the PCB board can be improved; moreover, it is convenient to manufacture.

[0027] Specifically, the substrate 10 includes at least two core plates 70 arranged in sequence from top to bottom; an adhesive layer 80 is disposed between any two adjacent core plates 70 .

[0028] The adhesive layer 80 may be a prepreg or the like. Of course, the adhesive layer 80 is not limited to the prepreg, and may be other materials as long as they can play a bonding role. However, using the prepreg as the adhesive layer 80 is the most preferred embodiment of the utility model, which can reduce costs and facilitate the connection between the core plates 70 by pressing.

[0029] Each core plate 70 is provided with a first through-groove unit 71, each adhesive layer 80 is provided with a second through-groove unit 81, and the first through-groove units 71 of any two adjacent core plates 70 are connected through the second through-groove units 81 of the adhesive layer 80 located between the two adjacent core plates 70; the first through-groove units 71 of each core plate 70 and the second through-groove units 81 of each adhesive layer 80 of the substrate 10 together constitute the explosion-proof groove 30. By adopting the above method, the production of the explosion-proof groove 30 can be facilitated.

[0030] Preferably, the core board 70 includes a base layer and two copper layers respectively arranged on both sides of the base layer; the first through slot unit 71 extends from the copper layer on one side of the base layer to the copper layer on the other side of the base layer.

[0031] The first through slot unit 71 includes a first left branch slot section 72, a first right branch slot section 73 and a first transverse branch slot section 74; one end of the first transverse branch slot section 74 is connected to the first left branch slot section 72, and the other end of the first transverse branch slot section 74 is connected to the first right branch slot section 73. By adopting the above arrangement of the first through slot unit 71, processing can be facilitated.

[0032] The second through-groove unit 81 includes a second left branch groove section 82, a second right branch groove section 83 and a second transverse branch groove section 84; one end of the second transverse branch groove section 84 is connected to the second left branch groove section 82, and the other end of the second transverse branch groove section 84 is connected to the second right branch groove section 83. By adopting the above arrangement of the second through-groove unit 81, processing can be facilitated.

[0033] A plurality of first left-placed branch slot sections 72 and second left-placed branch slot sections 82 alternately arranged from top to bottom are connected in sequence and together constitute a first longitudinal total slot section 40 to facilitate the formation of the first longitudinal total slot section 40 .

[0034] A plurality of first right-placed branch slot sections 73 and second right-placed branch slot sections 83 alternately arranged from top to bottom are connected in sequence and together constitute a second longitudinal total slot section 50 to facilitate the formation of the second longitudinal total slot section 50 .

[0035] A plurality of first transverse branch slot sections 74 and second transverse branch slot sections 84 alternately arranged from top to bottom are connected in sequence and together constitute a transverse total slot section 60 to facilitate the formation of the transverse total slot section 60 .

[0036] Preferably, the spacing L2 between the first longitudinal total groove section 40 of the explosion-proof groove 30 and the corresponding hot melt module 20 is 0.5mm-1.5mm. The spacing L3 between the second longitudinal total groove section 50 of the explosion-proof groove 30 and the corresponding hot melt module 20 is 0.5mm-1.5mm. By reasonably setting the spacing between the first longitudinal total groove section 40 of the explosion-proof groove 30 and the corresponding hot melt module 20, and the spacing between the second longitudinal total groove section 50 and the corresponding hot melt module 20, the thermal stress release effect can be further improved, and the yield rate of the PCB board can be further improved.

[0037] In this embodiment, the substrate 10 includes two core plates 70, the upper core plate 70 is formed as an upper plate, and the lower core plate 70 is formed as a lower plate, and the copper layers of the upper plate and the lower plate close to the adhesive layer 80 are formed as built-in layers. Specifically, the built-in layers are each provided with a hot melt module 20.

[0038] The explosion-proof groove 30 can be directly formed by milling or the like. As a preferred embodiment of the present invention, the first through groove unit 71 located at the inner layer can be formed by etching, which can reduce the wear and tear of the CNC cutter and the copper rolling problem, and improve the material utilization rate.

[0039] Preferably, the width P of the first longitudinal total groove section 40, the second longitudinal total groove section 50, and the transverse total groove section 60 of the explosion-proof groove 30 are all 1.5mm-2.5mm, and by reasonably setting the width of the first longitudinal total groove section 40, the second longitudinal total groove section 50, and the transverse total groove section 60 of the explosion-proof groove 30, the thermal stress release effect can be further improved, and the yield of the PCB board can be further improved.

[0040] As the most preferred embodiment of the present invention, the width of the first longitudinal total groove section 40, the second longitudinal total groove section 50, and the transverse total groove section 60 of the explosion-proof groove 30 are all 2 mm, the spacing between the first longitudinal total groove section 40 of the explosion-proof groove 30 close to the corresponding hot melt module 20 and the corresponding hot melt module 20 is 1 mm, the spacing between the second longitudinal total groove section 50 of the explosion-proof groove 30 close to the corresponding hot melt module 20 and the corresponding hot melt module 20 is 1 mm, and the transverse total groove section 60 of the explosion-proof groove 30 is 1 mm. The distance between the side close to the corresponding hot melt module 20 and the corresponding hot melt module 20 is 0.5mm, the distance L4 between the side of the first longitudinal total groove section 40 of the explosion-proof groove 30 away from the transverse total groove section 60 and the side of the corresponding hot melt module 20 away from the transverse total groove section 60 is 2mm, and the distance L4 between the side of the second longitudinal total groove section 50 of the explosion-proof groove 30 away from the transverse total groove section 60 and the side of the corresponding hot melt module 20 away from the transverse total groove section 60 is 2mm, so as to maximize the high thermal stress release effect.

[0041] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A PCB board that can avoid delamination and blistering, characterized in that: It includes a substrate, a plurality of hot melt modules are arranged on the substrate, and a plurality of explosion-proof grooves corresponding to the plurality of hot melt modules are arranged on the substrate; the explosion-proof grooves are arranged around the periphery of the corresponding hot melt modules, and the explosion-proof grooves include a first longitudinal total groove section, a second longitudinal total groove section and a transverse total groove section; the first longitudinal total groove section and the second longitudinal total groove section of the explosion-proof groove are respectively arranged on both sides of the corresponding hot melt module; one end of the transverse total groove section of the explosion-proof groove is connected with the first longitudinal total groove section of the explosion-proof groove, and the other end of the transverse total groove section of the explosion-proof groove is connected with the second longitudinal total groove section of the explosion-proof groove; the top end of each explosion-proof groove passes through the top surface of the substrate, and the bottom end of each explosion-proof groove passes through the bottom surface of the substrate; the spacing between the side of the transverse total groove section of the explosion-proof groove close to the corresponding hot melt module and the corresponding hot melt module is 0.2mm-1mm.

2. The PCB board capable of avoiding delamination and blistering as claimed in claim 1, characterized in that: The substrate comprises at least two core plates arranged in sequence from top to bottom; an adhesive layer is arranged between any two adjacent core plates.

3. The PCB board capable of avoiding delamination and blistering as claimed in claim 2, characterized in that: Each core plate is provided with a first through groove unit, each adhesive layer is provided with a second through groove unit, and the first through groove units of any two adjacent core plates are connected through the second through groove units of the adhesive layer located between the two adjacent core plates; the first through groove units of each core plate of the substrate and the second through groove units of each adhesive layer together constitute the explosion-proof groove.

4. The PCB board capable of avoiding delamination and blistering as claimed in claim 3, characterized in that: The first through-groove unit includes a first left-placed branch groove segment, a first right-placed branch groove segment and a first transverse branch groove segment; one end of the first transverse branch groove segment is connected to the first left-placed branch groove segment, and the other end of the first transverse branch groove segment is connected to the first right-placed branch groove segment.

5. The PCB board capable of avoiding delamination and blistering as claimed in claim 4, characterized in that: The second through slot unit comprises a second left-placed branch slot segment, a second right-placed branch slot segment and a second transverse branch slot segment; One end of the second transverse branch slot segment is communicated with the second left-placed branch slot segment, and the other end of the second transverse branch slot segment is communicated with the second right-placed branch slot segment.

6. The PCB board capable of avoiding delamination and blistering as claimed in claim 5, characterized in that: A plurality of first left-placed branch slot sections and second left-placed branch slot sections alternately arranged from top to bottom are connected in sequence and together constitute a first longitudinal total slot section.

7. The PCB board capable of avoiding delamination and blistering as claimed in claim 5, characterized in that: A plurality of first right-placed branch slot sections and second right-placed branch slot sections alternately arranged from top to bottom are connected in sequence and together constitute a second longitudinal total slot section.

8. The PCB board capable of avoiding delamination and blistering as claimed in claim 5, characterized in that: A plurality of first transverse branch slot sections and second transverse branch slot sections alternately arranged from top to bottom are connected in sequence and together constitute a transverse total slot section.

9. The PCB board capable of avoiding delamination and blistering as claimed in claim 1, characterized in that: The spacing between the first longitudinal total groove section of the explosion-proof groove and the corresponding hot-melt module is 0.5mm-1.5mm.

10. The PCB board capable of avoiding delamination and blistering as claimed in claim 1, characterized in that: The spacing between the second longitudinal total groove section of the explosion-proof groove and the corresponding hot-melt module is 0.5mm-1.5mm.

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