Ultra-thin circuit board and LED device

Abstract

The utility model discloses an ultra-thin circuit board and LED device, wherein the circuit board comprises: a circuit board body, a circuit layer arranged on the circuit board body, and an ink layer covering the circuit layer; the ink layer is provided with a plurality of first channels, and the ink layer forms a plurality of ink partitions based on the plurality of first channels; a notch is provided in any of the ink partitions, and a plurality of pads are provided in the notch. By dividing the ink layer of the circuit board into a plurality of ink partitions, the ink partitions of each device are made independent of each other, and when the whole board is passed through a furnace for solidification, the overall expansion and contraction of the ink layer is divided into a plurality of local expansion and contraction, thereby reducing the risk of warping of the circuit board caused by the expansion and contraction of the ink, and improving the processing quality of the ultra-thin circuit board.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of LED devices, and in particular to an ultra-thin circuit board and an LED device. Background Art

[0002] With the miniaturization of LED devices, the thickness of LED lamp bead circuit boards has been reduced. During the production and processing of existing thin circuit boards, the circuit boards need to be furnace-bonded. Since the board material of the circuit board has high thermal stability, while the solder mask ink on the circuit board has low thermal stability, the thin circuit board is prone to warping due to the expansion and contraction of the ink when passing through the furnace for bonding, which affects the processing quality of the circuit board. Utility Model Content

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art. The utility model provides an ultra-thin circuit board and LED device. By dividing the ink layer of the circuit board into a plurality of independent ink partitions, when the whole board is subjected to furnace solidification, the overall expansion and contraction of the ink layer is divided into the local expansion and contraction of the plurality of ink partitions, thereby avoiding the risk of warping of the circuit board due to the expansion and contraction of the ink layer and improving the processing quality of the circuit board.

[0004] On the one hand, the utility model provides an ultra-thin circuit board, which includes: a circuit board body, a circuit layer arranged on the circuit board body, and an ink layer covering the circuit layer.

[0005] The ink layer is provided with a plurality of first channels, and the ink layer is formed with a plurality of ink partitions based on the plurality of first channels;

[0006] A notch is arranged in any of the ink partitions, and a plurality of pads are arranged in the notch.

[0007] Furthermore, the circuit layer is divided into a plurality of arrangement circuits, and the plurality of arrangement circuits are distributed in a one-to-one correspondence with the plurality of ink partitions.

[0008] Furthermore, a plurality of cutting lines are arranged on the circuit board body, and the plurality of cutting lines overlap with the plurality of first channels in a one-to-one correspondence.

[0009] Furthermore, the width of the first river channel is less than or equal to the width of the cutting line.

[0010] Furthermore, the width of the cutting line is w1, and the value range of w1 is: 80 μm≤w1≤100 μm.

[0011] Furthermore, the thickness of the ink layer is d, and the value range of d is: 15 μm≤d≤30 μm.

[0012] Furthermore, the width of the first river channel is w2, and the value range of w2 is: 30μm≤w2≤50μm.

[0013] Furthermore, the circuit board body is provided with a plurality of connecting through holes, and copper pillars are inserted into the connecting through holes.

[0014] Furthermore, a plurality of second river channels are arranged on the ink layer, and the plurality of second river channels are correspondingly arranged in the plurality of ink partitions.

[0015] Furthermore, more than one second river channel is provided in any of the ink partitions.

[0016] Furthermore, the second river channel is a circular river channel.

[0017] Furthermore, the ink partition forms more than two dams based on the second river channel;

[0018] The distance between any two adjacent dams is w3, and the value range of w3 is: 30 μm≤w3≤50 μm.

[0019] Furthermore, the width of any of the dams is w4, and the value range of w4 is: w4≥50 μm.

[0020] On the other hand, the utility model also provides an LED device formed by cutting any of the above-mentioned ultra-thin circuit boards.

[0021] The utility model provides an ultra-thin circuit board and LED device. By dividing the ink layer of the circuit board into a plurality of ink partitions, the ink partitions of each device on the circuit board are made independent of each other. When the whole board is subjected to furnace solidification, the overall expansion and contraction of the ink layer is divided into the local expansion and contraction of a plurality of ink partitions, thereby avoiding the risk of warping of the circuit board due to the expansion and contraction of the ink layer and improving the processing quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a structural schematic diagram of the ultra-thin circuit board in the first embodiment of the utility model;

[0024] Figure 2 It is a schematic diagram of the structure of the LED device in the first embodiment of the utility model;

[0025] Figure 3 It is a structural schematic diagram of an ultra-thin circuit board in Embodiment 2 of the present utility model;

[0026] Figure 4 It is a schematic diagram of the structure of the LED device in the second embodiment of the present utility model. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Embodiment 1:

[0029] Figure 1 The schematic diagram of the structure of the ultra-thin circuit board of the embodiment of the utility model is shown. Figure 2 A schematic diagram of the structure of an LED device of an embodiment of the utility model is shown, wherein the circuit board comprises: a circuit board body 1, a circuit layer 3 arranged on the circuit board body 1, and an ink layer 2 covering the circuit layer 3, wherein the ink layer 2 is used to prevent the components on the circuit layer 3 from short-circuiting the circuits in non-welding areas during soldering, and can also reduce the tin spraying and gold plating losses in non-welding areas.

[0030] Specifically, the ink layer 2 is provided with a plurality of first channels 4, and the ink layer 2 forms a plurality of ink partitions 21 based on the plurality of first channels 4. The plurality of first channels 4 are distributed horizontally and vertically, and divide the ink layer 2 into a plurality of ink partitions 21 arranged in an array. A notch is provided in any of the ink partitions 21, and a plurality of solder pads 31 are provided in the notch. The plurality of solder pads 31 are used to install the LED chip 6.

[0031] Furthermore, the circuit layer 3 is divided into a plurality of arrangement circuits, and the plurality of arrangement circuits are distributed one-to-one with the plurality of ink partitions 21. The plurality of arrangement circuits are distributed independently of each other, and more than two of the pads 31 are provided on the arrangement circuit layer 3, and the arrangement circuit is configured as a circuit structure of a single LED device.

[0032] Specifically, the processing technology of the ink layer 2 is as follows: covering the ink layer 2 on the circuit board body 1, setting marking points on the ink layer 2, covering the ink layer 2 with a silk screen, and accurately covering the ink layer 2 of the circuit board body 1 based on the marking point positioning, covering the corresponding positions of the grooves and the river channels based on the silk screen, so that the ink layer 2 can be light-hardened based on the exposed positions of the silk screen, and after the ink layer 2 is light-hardened, developing the ink layer 2 with a developer, and softening and eliminating the corresponding covered parts of the silk screen with the developer, so that ablation and etching are formed on the ink layer 2 to form a plurality of first river channels 4 and grooves, forming a plurality of ink partitions 21.

[0033] Specifically, a plurality of cutting lines are arranged on the circuit board body 1, and the plurality of cutting lines overlap with the plurality of first river channels 4 one by one, that is, the plurality of cutting lines are crisscrossed and overlap with the plurality of first river channels 4, and the cutting lines are used to mark the cutting path of the circuit board body 1, so that the circuit board body 1 can be divided into a plurality of LED devices along the cutting lines by a cutting mechanism.

[0034] Furthermore, the width of the first river channel 4 is less than or equal to the width of the cutting line, so that when the cutting mechanism cuts the circuit board body 1, it can ensure that the surface of the single LED device after segmentation is covered with a complete ink partition 21, that is, the edge of the single LED device coincides with the edge of the ink partition 21, so as to ensure the appearance of the LED device.

[0035] Specifically, the width of the cutting line is w1, and the value range of w1 is: 80 μm≤w1≤100 μm. The width of the cutting line corresponds to the thickness of the grinding wheel of the cutting mechanism, so that the grinding wheel of the cutting mechanism can perform a segmentation operation on the circuit board body 1.

[0036] Furthermore, when w1 is 80 μm, the grinding wheel thickness of the cutting mechanism may be between 50 μm and 80 μm, so that the grinding wheel of the cutting mechanism can perform routing cutting on the circuit board body 1 along the cutting line, thereby achieving the effect of dividing the circuit board.

[0037] Furthermore, when the w1 is 100 μm, the thickness of the grinding wheel of the cutting mechanism can be between 80 μm and 100 μm, so that the thickness of the grinding wheel of the cutting mechanism is smaller than the cutting line, so that the cutting mechanism can drive the grinding wheel to perform routing cutting along the cutting line, and use a thick grinding wheel to cut the circuit board body 1, thereby improving the cutting effect of the circuit board body 1, and is suitable for the production and processing of miniaturized devices.

[0038] Specifically, the thickness of the ink layer 2 is d, and the value range of d is: 15 μm≤d≤30 μm. The ink layer 2 with a certain thickness is provided to cover and protect the non-welding area of ​​the circuit layer 3 on the circuit board body 1.

[0039] Furthermore, when d is 15 μm, the requirements for solder mask coverage of the circuit layer 3 can be met, while reducing the amount of ink used and reducing the impact of ink expansion and contraction on the circuit board body 1. When d is 30 μm, it can ensure that the ink layer 2 has a good solder mask effect and improve the reliability of the circuit layer 3 plastic packaging.

[0040] Specifically, the width of the first channel 4 is w2, and the value range of w2 is: 30μm≤w2≤50μm. The width of the first channel 4 is set between 30μm and 50μm, so that the several ink partitions 21 can be divided from each other, and when each ink partition 21 is undergoing furnace bonding, it can be ensured that the expansion and contraction of the ink partition 21 is less than the width of the first channel 4, thereby avoiding mutual interference between adjacent ink partitions 21 and improving the processing quality of the circuit board body 1 undergoing furnace bonding.

[0041] Specifically, the circuit board body 1 is provided with a plurality of connecting through holes 11, in which copper pillars can be inserted, and a bottom circuit layer is provided at the bottom of the circuit board body 1, which is connected to the bottom circuit layer based on copper pillar plug holes.

[0042] Furthermore, the inner wall of the connecting through hole 11 may be covered with a metal layer, and an electrical connecting through hole 11 is formed based on the metal layer on the inner wall of the connecting through hole 11, so as to realize electrical connection between the circuit layer 3 and the bottom circuit layer based on the electrical connecting through hole 11.

[0043] An embodiment of the utility model provides an ultra-thin circuit board, which divides the ink layer 2 of the circuit board into multiple ink partitions 21 so that the ink partitions 21 of each device on the circuit board are independent of each other. When the entire board is subjected to furnace bonding, the overall expansion and contraction of the ink layer 2 is divided into the local expansion and contraction of several ink partitions 21, thereby avoiding the risk of warping of the circuit board due to the expansion and contraction of the ink layer 2 and improving the processing quality of the circuit board.

[0044] Embodiment 2:

[0045] Figure 3 The schematic diagram of the structure of the ultra-thin circuit board of the embodiment of the utility model is shown. Figure 4A schematic diagram of the structure of an LED device of an embodiment of the utility model is shown, wherein the circuit board comprises: a circuit board body 1, a circuit layer 3 arranged on the circuit board body 1, and an ink layer 2 covering the circuit layer 3, wherein the ink layer 2 is used to prevent the components on the circuit layer 3 from short-circuiting the circuits in non-welding areas during soldering, and can also reduce the tin spraying and gold plating losses in non-welding areas.

[0046] Specifically, the ink layer 2 is provided with a plurality of first channels 4, and the ink layer 2 forms a plurality of ink partitions 21 based on the plurality of first channels 4. The plurality of first channels 4 are distributed horizontally and vertically, and divide the ink layer 2 into a plurality of ink partitions 21 arranged in an array. A notch is provided in any of the ink partitions 21, and a plurality of solder pads 31 are provided in the notch. The plurality of solder pads 31 are used to install the LED chip 6.

[0047] Furthermore, the circuit layer 3 is divided into a plurality of arrangement circuits, and the plurality of arrangement circuits are distributed one-to-one with the plurality of ink partitions 21. The plurality of arrangement circuits are distributed independently of each other, and more than two of the pads 31 are provided on the arrangement circuit layer 3, and the arrangement circuit is configured as a circuit structure of a single LED device.

[0048] Specifically, a plurality of cutting lines are arranged on the circuit board body 1, and the plurality of cutting lines overlap with the plurality of first river channels 4 one by one, that is, the plurality of cutting lines are crisscrossed and overlap with the plurality of first river channels 4, and the cutting lines are used to mark the cutting path of the circuit board body 1, so that the circuit board body 1 can be divided into a plurality of LED devices along the cutting lines by a cutting mechanism.

[0049] Furthermore, the width of the first river channel 4 is less than or equal to the width of the cutting line, so that when the cutting mechanism cuts the circuit board body 1, it can ensure that the surface of the single LED device after segmentation is covered with a complete ink partition 21, that is, the edge of the single LED device coincides with the edge of the ink partition 21, so as to ensure the appearance of the LED device.

[0050] Specifically, the width of the cutting line is w1, and the value range of w1 is: 80 μm≤w1≤100 μm. The width of the cutting line corresponds to the thickness of the grinding wheel of the cutting mechanism, so that the grinding wheel of the cutting mechanism can perform a segmentation operation on the circuit board body 1.

[0051] Furthermore, when w1 is 80 μm, the grinding wheel thickness of the cutting mechanism may be between 50 μm and 80 μm, so that the grinding wheel of the cutting mechanism can perform routing cutting on the circuit board body 1 along the cutting line, thereby achieving the effect of dividing the circuit board.

[0052] Furthermore, when the w1 is 100 μm, the thickness of the grinding wheel of the cutting mechanism can be between 80 μm and 100 μm, so that the thickness of the grinding wheel of the cutting mechanism is smaller than the cutting line, so that the cutting mechanism can drive the grinding wheel to perform routing cutting along the cutting line, and use a thick grinding wheel to cut the circuit board body 1, thereby improving the cutting effect of the circuit board body 1, and is suitable for the production and processing of miniaturized devices.

[0053] Specifically, the thickness of the ink layer 2 is d, and the value range of d is: 15 μm≤d≤30 μm. The ink layer 2 with a certain thickness is provided to cover and protect the non-welding area of ​​the circuit layer 3 on the circuit board body 1.

[0054] Furthermore, when d is 15 μm, the requirements for solder mask coverage of the circuit layer 3 can be met, while reducing the amount of ink used and reducing the impact of ink expansion and contraction on the circuit board body 1. When d is 30 μm, it can ensure that the ink layer 2 has a good solder mask effect and improve the reliability of the circuit layer 3 plastic packaging.

[0055] Specifically, the width of the first channel 4 is w2, and the value range of w2 is: 30μm≤w2≤50μm. The width of the first channel 4 is set between 30μm and 50μm, so that the several ink partitions 21 can be divided from each other, and when each ink partition 21 is undergoing furnace bonding, it can be ensured that the expansion and contraction of the ink partition 21 is less than the width of the first channel 4, thereby avoiding mutual interference between adjacent ink partitions 21 and improving the processing quality of the circuit board body 1 undergoing furnace bonding.

[0056] Specifically, the circuit board body 1 is provided with a plurality of connecting through holes 11, in which copper pillars can be inserted, and a bottom circuit layer is provided at the bottom of the circuit board body 1, which is connected to the bottom circuit layer based on copper pillar plug holes.

[0057] Furthermore, the inner wall of the connecting through hole 11 may be covered with a metal layer, and an electrical connecting through hole 11 is formed based on the metal layer on the inner wall of the connecting through hole 11, so as to realize electrical connection between the circuit layer 3 and the bottom circuit layer based on the electrical connecting through hole 11.

[0058] Specifically, a plurality of second river channels 5 are disposed on the ink layer 2 , and the plurality of second river channels 5 are correspondingly disposed in the plurality of ink partitions 21 , and more than one second river channel 5 is disposed in any of the ink partitions 21 .

[0059] Furthermore, the second river channel 5 is a ring-shaped river channel, and the ink partition 21 forms more than two dams based on the second river channel 5, that is, the ink partition 21 forms a plurality of dams from the middle to the outside, so that when the subsequent sealing is performed, the contact area between the ink partition 21 and the packaging glue can be increased, thereby extending the path of water vapor intrusion and improving the packaging reliability of the LED device.

[0060] Specifically, the spacing between any two adjacent dams is w3, and the value range of w3 is: 30μm≤w3≤50μm, ensuring that the expansion and contraction amount of each dam during furnace bonding is smaller than the spacing between the dams, thereby improving the working reliability of the dams.

[0061] Furthermore, the width of any of the dams is w4, and the value range of w4 is: w4≥50μm. The width of the dam is set to be above 50μm so that the dam can maintain a stable state when passing through a high-temperature furnace, thereby reducing the risk of deformation or collapse of the dam.

[0062] Furthermore, the width of the dam is adjusted according to actual device processing requirements, and the widths of the plurality of dams are designed to meet device size design requirements, which are not specifically limited here.

[0063] An embodiment of the utility model provides an ultra-thin circuit board, which divides the ink layer 2 of the circuit board into multiple ink partitions 21 so that the ink partitions 21 of each device on the circuit board are independent of each other. When the entire board is subjected to furnace bonding, the overall expansion and contraction of the ink layer 2 is divided into the local expansion and contraction of several ink partitions 21, thereby avoiding the risk of warping of the circuit board due to the expansion and contraction of the ink layer 2 and improving the processing quality of the circuit board.

[0064] In addition, the above is a detailed introduction to an ultra-thin circuit board provided by an embodiment of the utility model. Specific examples are used in this article to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. An ultra-thin circuit board, characterized in that: The circuit board comprises: a circuit board body, a circuit layer arranged on the circuit board body, and an ink layer covering the circuit layer; The ink layer is provided with a plurality of first channels, and the ink layer is formed with a plurality of ink partitions based on the plurality of first channels; A notch is arranged in any of the ink partitions, and a plurality of pads are arranged in the notch.

2. The ultra-thin circuit board according to claim 1, characterized in that: The circuit layer is divided into a plurality of arrangement circuits, and the plurality of arrangement circuits are distributed in a one-to-one correspondence with the plurality of ink partitions.

3. The ultra-thin circuit board according to claim 1, characterized in that: A plurality of cutting lines are arranged on the circuit board body, and the plurality of cutting lines overlap with the plurality of first river channels in a one-to-one correspondence.

4. The ultra-thin circuit board according to claim 3, characterized in that: The width of the first river channel is less than or equal to the width of the cutting line.

5. The ultra-thin circuit board according to claim 3, characterized in that: The width of the cutting line is w1, and the value range of w1 is: 80 μm≤w1≤100 μm.

6. The ultra-thin circuit board according to claim 1, characterized in that: The thickness of the ink layer is d, and the value range of d is: 15 μm≤d≤30 μm.

7. The ultra-thin circuit board according to claim 1, characterized in that: The width of the first river channel is w2, and the value range of w2 is: 30μm≤w2≤50μm.

8. The ultra-thin circuit board according to claim 1, characterized in that: The circuit board body is provided with a plurality of connecting through holes, and copper pillars are inserted into the connecting through holes.

9. The ultra-thin circuit board according to claim 1, characterized in that: A plurality of second river channels are arranged on the ink layer, and the plurality of second river channels are correspondingly arranged in the plurality of ink partitions.

10. The ultra-thin circuit board according to claim 9, characterized in that: More than one second channel is provided in any of the ink partitions.

11. The ultra-thin circuit board according to claim 9, characterized in that: The second river channel is a circular river channel.

12. The ultra-thin circuit board according to claim 9, characterized in that: The ink partition forms more than two dams based on the second river channel; The distance between any two adjacent dams is w3, and the value range of w3 is: 30 μm≤w3≤50 μm.

13. The ultra-thin circuit board according to claim 12, characterized in that: The width of any of the dams is w4, and the value range of w4 is: w4≥50μm.

14. An LED device, characterized in that: It is formed by cutting the ultra-thin circuit board described in any one of claims 1 to 13.

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