A device for baking solder mask for PCB board

Abstract

The utility model discloses a device for baking solder mask film for PCB board, and relates to the technical field of film baking device. In view of the problem that the overlapping and stacking of PCB boards in the prior art easily causes scratches on the PCB boards, thereby affecting the product quality, and the overlapping of PCB boards causes the PCB boards overlapping in the middle to fail to achieve the baking effect during baking, the following scheme is proposed, including a bottom shell, the outer walls at both ends of the bottom shell are both plugged and fixed with three-way pipes, and one end of the three-way pipe is connected to a hot air blower through a pipeline, the top two ends of the bottom shell are both connected with a first blowing mechanism, and a second blowing mechanism distributed equidistantly is arranged between the two first blowing mechanisms. The utility model inserts the PCB board vertically into the gap between the first blowing mechanism and the second blowing mechanism, and limits and fixes the top of the vertically placed PCB board through a limiting mechanism, so that the PCB board remains parallel to the first blowing mechanism and the second blowing mechanism, which is convenient for hot air blowing.

Description

Technical Field

[0001] The utility model relates to the technical field of film baking devices, in particular to a solder mask baking device for a PCB board. Background Art

[0002] Circuit boards can be called printed circuit boards or printed circuit boards. The English names are PCB, FPC circuit boards and rigid-flex boards. The birth and development of FPC and PCB gave birth to a new product, the rigid-flex board. Therefore, the rigid-flex board is a flexible circuit board and a rigid circuit board, which are combined together after lamination and other processes according to relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the production process of PCB boards, after the solder mask is plated, the PCB boards need to be collected and sent to the baking oven for baking, and the baking time and baking temperature need to be set so that the solder mask is solidified.

[0003] Although the existing PCB board solder mask baking device can transport more PCB boards to be baked at one time;

[0004] However, the overlapping and stacking of PCB boards may easily lead to scratches on the PCB boards, thus affecting product quality. At the same time, due to the overlapping of PCB boards, the PCB boards overlapped in the middle during baking do not achieve the baking effect. Utility Model Content

[0005] In view of the deficiencies of the prior art, the utility model provides a device for baking solder mask of PCB boards, which overcomes the deficiencies of the prior art and effectively solves the problem in the prior art that the overlapping and stacking of PCB boards easily leads to scratches on the PCB boards, thereby affecting the product quality, and the overlapping of PCB boards causes the PCB boards overlapping in the middle to fail to achieve the baking effect during baking.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A device for baking solder mask for PCB board comprises a bottom shell, three-way pipes are inserted and fixed to the outer walls at both ends of the bottom shell, and one end of the three-way pipe is connected to a hot air blower through a pipeline, first air blowing mechanisms are connected to the two ends of the top of the bottom shell, and a second air blowing mechanism is arranged equidistantly between the two first air blowing mechanisms, the first air blowing mechanism and the second air blowing mechanism both comprise a connecting shell, a connecting pipe inserted and fixed to the bottom of the connecting shell, and a connecting cylinder inserted and fixed to the top of the connecting shell equidistantly, a baffle is fixed to the back of the bottom shell, and limiting mechanisms are equidistantly distributed on the top of the baffle.

[0008] By vertically inserting the PCB board into the gap between the first blowing mechanism and the second blowing mechanism, and limiting and fixing the top of the vertically placed PCB board by a limiting mechanism, the PCB board is kept parallel to the first blowing mechanism and the second blowing mechanism, which is convenient for hot air blowing. The hot air blower sends the hot air into the connected first blowing mechanism and the second blowing mechanism through the three-way pipe and the bottom shell, so that the hot air is blown out from the blowing holes of the first blowing mechanism and the second blowing mechanism respectively, thereby completing the drying of the moisture on the PCB board.

[0009] Preferably, the top of the bottom shell is provided with through holes distributed in a matrix, and the inner diameter of the through holes is matched with the outer diameter of the connecting pipe.

[0010] By plugging the connecting pipe into the through hole, the interior of the bottom shell is communicated with the interiors of the first air blowing mechanism and the second air blowing mechanism.

[0011] Preferably, one side of the outer wall of the connecting tube in the first air blowing mechanism is provided with first air blowing holes distributed at equal distances, and the first air blowing holes are all oriented toward the direction of the second air blowing mechanism.

[0012] The hot air enters the first blowing mechanism and is blown out through the first blowing hole.

[0013] Preferably, second blowing holes distributed at equal distances are provided on both sides of the outer wall of the connecting tube in the second blowing mechanism.

[0014] The hot air enters the second blowing mechanism and is blown out through the second blowing hole

[0015] Preferably, the limiting mechanism comprises a fixed block, an inserting block fixed to the bottom of the fixed block, and limiting strips fixed to both ends of an outer wall on one side of the fixed block.

[0016] The top of the vertically placed PCB board is limited and fixed by the setting limit mechanism, so that the PCB board is kept parallel to the first blowing mechanism and the second blowing mechanism, which is convenient for hot air drying.

[0017] Preferably, slots distributed at equal distances are provided on the top of the baffle, and the slots and the insert blocks form an interference fit, and the limit strips are made of elastic material.

[0018] The limit mechanism is connected and fixed to the baffle by plugging the plug into the slot. The limit strip made of elastic material can clamp PCB boards of different thicknesses and avoid scratching the PCB boards.

[0019] The beneficial effects of the utility model are:

[0020] The PCB board is vertically inserted into the gap between the first blowing mechanism and the second blowing mechanism, and the top of the vertically placed PCB board is limited and fixed by a limiting mechanism, so that the PCB board is kept parallel to the first blowing mechanism and the second blowing mechanism, which is convenient for hot air blowing. The hot air blower sends the hot air into the connected first blowing mechanism and the second blowing mechanism through the three-way pipe and the bottom shell, so that the hot air is blown out from the blowing holes of the first blowing mechanism and the second blowing mechanism respectively, thereby completing the drying of the moisture on the PCB board. This effectively solves the problem in the prior art that the PCB boards are easily scratched due to overlapping and stacking, thereby affecting the product quality, and the problem that the PCB boards overlapped in the middle during baking do not achieve the baking effect due to overlapping PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of a device for baking solder mask for PCB board proposed by the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of a blower mechanism for a PCB solder mask drying device proposed by the utility model;

[0023] Figure 3 The utility model is a schematic diagram of the structure of a limiting mechanism for a PCB solder mask baking device.

[0024] In the figure: 1, bottom shell; 2, three-way pipe; 3, hot air blower; 4, first blower mechanism; 5, second blower mechanism; 6, connecting shell; 7, connecting pipe; 8, connecting cylinder; 9, baffle; 10, limit mechanism; 11, fixing block; 12, plug block; 13, limit strip. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0026] Example:

[0027] Reference Figure 1-3 , a device for baking solder mask film of PCB board, comprising a bottom shell 1, two ends of the outer wall of the bottom shell 1 are plugged and fixed with three-way pipes 2, one end of the three-way pipe 2 is connected with a hot air blower 3 through a pipeline, two ends of the top of the bottom shell 1 are connected with first air blowing mechanisms 4, and two second air blowing mechanisms 5 are arranged between the two first air blowing mechanisms 4. The first air blowing mechanisms 4 and the second air blowing mechanisms 5 both include a connecting shell 6, a connecting pipe 7 plugged and fixed to the bottom of the connecting shell 6, and a connecting tube 8 plugged and fixed to the top of the connecting shell 6 at an equal distance. A baffle 9 is fixed to the back of the bottom shell 1, and a limiting mechanism 10 is evenly distributed on the top of the baffle 9;

[0028] The top of the bottom shell 1 is provided with through holes distributed in a matrix, and the inner diameter of the through holes is adapted to the outer diameter of the connecting tube 7. By plugging the connecting tube 7 into the through holes, the interior of the bottom shell 1 is connected with the interior of the first blowing mechanism 4 and the second blowing mechanism 5. The outer wall of the connecting tube 8 in the first blowing mechanism 4 is provided with first blowing holes distributed at equal distances on one side, and the first blowing holes are all oriented toward the second blowing mechanism 5. After the hot air enters the first blowing mechanism 4, it is blown out through the first blowing holes. After the hot air enters the second blowing mechanism 5, the outer wall of the connecting tube 8 is provided with second blowing holes distributed at equal distances on both sides. After the hot air enters the second blowing mechanism 5, it is blown out through the second blowing holes.

[0029] The limiting mechanism 10 includes a fixed block 11, an insert block 12 fixed to the bottom of the fixed block 11, and a limiting strip 13 fixed to both ends of the outer wall of one side of the fixed block 11. The limiting mechanism 10 is set to limit and fix the top of the vertically placed PCB board, so that the PCB board is kept parallel to the first blower mechanism 4 and the second blower mechanism 5, which is convenient for hot air blowing. The top of the baffle 9 is provided with slots distributed at equal distances, and the slots and the insert block 12 form an interference fit. The limiting strip 13 is made of elastic material. The insert block 12 is plugged into the slot to connect and fix the limiting mechanism 10 to the baffle 9. The limiting strip 13 with elastic material can clamp PCB boards of different thicknesses and can also avoid scratching the PCB board.

[0030] Working principle:

[0031] During operation, the PCB board is vertically inserted into the gap between the first blowing mechanism 4 and the second blowing mechanism 5, and the top of the vertically placed PCB board is limited and fixed by the provided limiting mechanism 10, so that the PCB board is kept parallel to the first blowing mechanism 4 and the second blowing mechanism 5, which is convenient for hot air blowing. The hot air blower 3 sends the hot air into the connected first blowing mechanism 4 and the second blowing mechanism 5 through the three-way pipe 2 and the bottom shell 1, so that the hot air is blown out from the blowing holes of the first blowing mechanism 4 and the second blowing mechanism 5 respectively, thereby completing the drying of the moisture on the PCB board.

[0032] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A device for baking solder mask on a PCB, comprising a bottom shell (1), characterized in that: The outer walls of both ends of the bottom shell (1) are plugged and fixed with three-way pipes (2), and one end of the three-way pipe (2) is connected to a hot air blower (3) through a pipeline. The top ends of the bottom shell (1) are connected with first air blowing mechanisms (4), and second air blowing mechanisms (5) are arranged between the two first air blowing mechanisms (4) at equal distances. The first air blowing mechanisms (4) and the second air blowing mechanisms (5) both comprise a connecting shell (6), a connecting pipe (7) plugged and fixed to the bottom of the connecting shell (6), and a connecting tube (8) plugged and fixed to the top of the connecting shell (6) at equal distances. A baffle (9) is fixed to the back of the bottom shell (1), and limiting mechanisms (10) are arranged at equal distances on the top of the baffle (9).

2. The device for baking solder mask for PCB board according to claim 1, characterized in that: The top of the bottom shell (1) is provided with through holes distributed in a matrix, and the inner diameter of the through holes is matched to the outer diameter of the connecting pipe (7).

3. The device for baking solder mask for PCB board according to claim 1, characterized in that: One side of the outer wall of the connecting tube (8) in the first air blowing mechanism (4) is provided with first air blowing holes which are distributed at equal distances, and the first air blowing holes are all oriented towards the direction of the second air blowing mechanism (5).

4. The device for baking solder mask for PCB board according to claim 1, characterized in that: Second blowing holes are equidistantly distributed on both sides of the outer wall of the connecting tube (8) in the second blowing mechanism (5).

5. The device for baking solder mask for PCB board according to claim 1, characterized in that: The limiting mechanism (10) comprises a fixed block (11), an insert block (12) fixed to the bottom of the fixed block (11), and limiting strips (13) fixed to both ends of an outer wall on one side of the fixed block (11).

6. The device for baking solder mask for PCB board according to claim 5, characterized in that: The top of the baffle (9) is provided with slots which are distributed at equal distances, and the slots and the insert block (12) form an interference fit, and the limiting strip (13) is made of elastic material.

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