A PCBA circuit board positioning soldering device

Abstract

The utility model belongs to the field of PCBA circuit board production, and specifically is a PCBA circuit board positioning soldering device, comprising a device body; a first fixing groove is provided on the top of the device body; a second fixing groove is fixedly connected to the middle of the first fixing groove; a pick-up plate is fixedly connected to the middle of the second fixing groove; a vertical plate is fixedly connected to the top of the pick-up plate; a first slide groove is provided on the top of the pick-up plate; the vertical plate and the first slide groove are slidably connected; a handle is fixedly connected to the middle of the vertical plate; a plurality of arc-shaped pieces are fixedly connected to the top of the pick-up plate; a rotating rod is hingedly connected to the bottom of the arc-shaped piece; a top plate is fixedly connected to the end of the adjacent rotating rod; when the vertical plate is pushed, the arc-shaped piece is squeezed and the top plate is rotated to adjust the direction of the circuit board, so that the device can adjust the direction of the circuit board when it moves, reduce the time for the staff to align the circuit board with the second fixing groove, and improve the convenience of the device to adjust the direction of the circuit board when soldering.

Description

Technical Field

[0001] The utility model relates to the field of PCBA circuit board production, in particular to a PCBA circuit board positioning soldering device. Background Art

[0002] PCBA circuit board, or printed circuit board assembly, is the support for electronic components and the provider of circuit connections. It uses conductive materials to form a predetermined circuit pattern on an insulating substrate, and then uses SMT (surface mount technology) and other methods to accurately mount and solder various electronic components on the circuit board.

[0003] The production of PCBA circuit boards mainly includes the following steps: preparing PCB boards, etching, SMT patching, soldering, inspection and testing, cleaning and packaging.

[0004] When soldering the existing PCBA circuit board, the circuit board is usually aligned with the molten tin pool and then placed in the molten tin pool for soldering, which increases the working time required for soldering the circuit board.

[0005] Therefore, in order to solve the above problems, a PCBA circuit board positioning soldering device is proposed. Utility Model Content

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the utility model to solve the technical problem is as follows: a PCBA circuit board positioning soldering device described in the utility model comprises a device body; a first fixing groove is provided on the top of the device body; a second fixing groove is fixedly connected to the middle of the first fixing groove; a pick-up plate is fixedly connected to the middle of the second fixing groove; a vertical plate is fixedly connected to the top of the pick-up plate; a first slide groove is provided on the top of the pick-up plate; the vertical plate and the first slide groove are slidably connected; a handle is fixedly connected to the middle of the vertical plate; a plurality of arc-shaped pieces are fixedly connected to the top of the pick-up plate; the arc-shaped pieces are symmetrically arranged; a rotating rod is hinged at the bottom of the arc-shaped piece; The rotating rod and the lifting plate are in a rotating relationship; the ends of the adjacent rotating rods are fixedly connected with the top plate; after placing the circuit board on the top of the lifting plate, the vertical plate can be pushed to send the circuit board into the molten tin pool, which simplifies the operation process of soldering the circuit board, reduces the difficulty of the device in soldering the circuit board, and reduces the risk of burns caused by high temperature when the staff are soldering the circuit board. At the same time, when the vertical plate is pushed, the arc-shaped sheet will be squeezed and the top plate will be rotated to adjust the direction of the circuit board, so that the device can adjust the direction of the circuit board when it moves, reduce the time for the staff to align the circuit board with the second fixed groove, and improve the convenience of the device in adjusting the direction of the circuit board when soldering.

[0008] Preferably, a first horizontal plate is fixedly connected to the middle of the vertical plate; a sliding rod is slidably connected to the middle of the first horizontal plate; a pulling plate is fixedly connected to the top of the sliding rod; a first spring is fixedly connected to the bottom of the pulling plate; the first spring and the first horizontal plate are both fixedly connected; a second horizontal plate is fixedly connected to the bottom of the sliding rod; by pulling the pulling plate, the sliding rod can slide along the first horizontal plate and control the distance between the second horizontal plate and the circuit board, thereby achieving the clamping of the circuit board by the device, reducing the shaking of the circuit board during soldering, and improving the stability of the circuit board during soldering.

[0009] Preferably, a plurality of suction cups are fixedly connected to the bottom of the second horizontal plate; the suction cups are arranged in an array; by arranging the suction cups, when the second horizontal plate approaches the circuit board, the suction cups will adsorb the circuit board, thereby increasing the contact area between the device and the circuit board and improving the stability of the device fixing the circuit board.

[0010] Preferably, a plurality of second springs are fixedly connected to the bottom of the second horizontal plate; pressure rings are fixedly connected to the ends of adjacent second springs; the pressure rings and the suction cups are arranged correspondingly; through the cooperation of the second springs and the pressure rings, after the suction cup and the circuit board come into contact, the circuit board will squeeze the second springs and the second springs will be squeezed against the middle part of the suction cup after being subjected to the elastic force of the pressure ring, thereby reducing the interference of external air on the suction cup, enhancing the air tightness of the suction cup, improving the adsorption effect of the suction cup on the circuit board, and further enhancing the fixing effect of the device on the circuit board.

[0011] Preferably, an air pump is fixedly connected to the top of the device body; an air pipe is connected to the input end of the air pump; a collecting bag is fixedly connected to the top of the device body; the collecting bag and the air pump are connected by a pipeline; starting the air pump can extract the harmful gas generated by the device when soldering the circuit board into the collecting bag, thereby realizing the recovery and collection of the harmful gas by the device, reducing the pollution to the environment after the harmful gas is discharged, and improving the environmental friendliness of the device.

[0012] Preferably, the end of the air pipe is connected to a shower head; a plurality of circular holes are provided at the bottom of the shower head; through the cooperation of the shower head and the circular holes, after starting the air pump, the harmful gas will enter the interior of the shower head from the circular holes and then flow into the interior of the collection bag, thereby accelerating the collection speed of the harmful gas by the device, reducing the residence time of the harmful gas in the air, and improving the environmental protection of the device.

[0013] Preferably, a second slide groove is opened in the middle of the device body; a collection box is slidably connected to the middle of the second slide groove; through the cooperation of the second slide groove and the collection box, the collection box can collect the debris generated during the soldering of the circuit board, reduce the impurities remaining on the surface of the device, and improve the smoothness of the surface of the device.

[0014] The utility model is beneficial in that:

[0015] 1. The utility model discloses a PCBA circuit board positioning soldering device. After placing the circuit board on the top of the pick plate, the vertical plate can be pushed to send the circuit board into the molten tin pool, which simplifies the operation process of circuit board soldering, reduces the difficulty of the device in soldering the circuit board, and reduces the risk of burns caused by high temperature when the staff is soldering the circuit board. At the same time, when the vertical plate is pushed, the arc-shaped sheet will be squeezed and the top plate will be rotated to adjust the direction of the circuit board, so that the device can adjust the direction of the circuit board when it moves, reduce the time for the staff to align the circuit board with the second fixing groove, and improve the convenience of the device in adjusting the direction of the circuit board when soldering.

[0016] 2. The PCBA circuit board positioning soldering device described in the utility model can make the slide bar slide along the first horizontal plate and control the distance between the second horizontal plate and the circuit board by pulling the pull plate, so as to realize the clamping of the circuit board by the device, reduce the shaking of the circuit board during soldering, and improve the stability of the circuit board during soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the main body of the utility model;

[0019] Figure 2 It is a schematic diagram of the structure of the shower head in the utility model;

[0020] Figure 3 It is a structural schematic diagram of the arc-shaped piece in the utility model;

[0021] Figure 4 It is a schematic structural diagram of the second horizontal plate in the utility model.

[0022] In the figure: 1. device body; 102. first fixed groove; 103. second fixed groove; 104. lifting plate; 105. vertical plate; 106. handle; 107. first slide groove; 108. arc-shaped piece; 109. rotating rod; 110. top plate; 2. first horizontal plate; 22. sliding rod; 23. first spring; 24. pulling plate; 25. second horizontal plate; 3. suction cup; 4. second spring; 42. pressure ring; 5. air pump; 52. air pipe; 53. collecting bag; 6. shower head; 62. round hole; 7. second slide groove; 72. collecting box. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Specific examples are given below.

[0025] See also Figures 1 to 3As shown, a PCBA circuit board positioning soldering device described in an embodiment of the utility model comprises a device body 1; a first fixing groove 102 is provided on the top of the device body 1; a second fixing groove 103 is fixedly connected to the middle of the first fixing groove 102; a pick plate 104 is fixedly connected to the middle of the second fixing groove 103; a vertical plate 105 is fixedly connected to the top of the pick plate 104; a first slide groove 107 is provided on the top of the pick plate 104; the vertical plate 105 is slidably connected to the first slide groove 107; a handle 106 is fixedly connected to the middle of the vertical plate 105; a plurality of arc-shaped pieces 108 are fixedly connected to the top of the pick plate 104; the arc The arc-shaped pieces 108 are symmetrically arranged; a rotating rod 109 is hinged at the bottom of the arc-shaped piece 108; the rotating rod 109 is in a rotational relationship with the lifting plate 104; the ends of the adjacent rotating rods 109 are fixedly connected to the top plate 110; the arc-shaped piece 108 is usually in a bent state. When working, the circuit board is placed on the top of the lifting plate 104 and the device body 1 is started. After the device body 1 is started, the tin material inside the second fixing groove 103 will be heated and melted. Then the staff can hold the handle 106 and push the vertical plate 105. After the vertical plate 105 is subjected to the force, it will slide along the first slide groove 107, and will move with the arc-shaped piece 108 during the movement of the vertical plate 105. When the arc-shaped sheet 108 contacts the lifting plate 104, the angle of the arc-shaped sheet 108 changes due to the squeezing effect and approaches the lifting plate 104. When the arc-shaped sheet 108 moves, it drives the rotating rod 109 to move together and makes the rotating rod 109 rotate along the lifting plate 104. When the rotating rod 109 rotates, it drives the top plate 110 to rotate together. During the rotation process, the top plate 110 contacts the circuit board and adjusts the direction of the circuit board until the top plate 110 contacts the lifting plate 104. At the same time, the vertical plate 105 contacts the circuit board during the sliding process and pushes the circuit board to move together. During the movement, the circuit board is adjusted in direction by the top plate 110 and enters the second fixing groove 104 in a positive direction. 3, at this time, the device completes the soldering work on the circuit board; after placing the circuit board on the top of the pick plate 104, the vertical plate 105 can be pushed to send the circuit board into the molten tin pool, simplifying the operation process of circuit board soldering, reducing the difficulty of the device soldering the circuit board, and reducing the risk of burns caused by high temperature when the staff is soldering the circuit board. At the same time, when the vertical plate 105 is pushed, the arc piece 108 will be squeezed and the top plate 110 will be rotated to adjust the direction of the circuit board, so that the device can adjust the direction of the circuit board when it moves, reducing the time for the staff to align the circuit board with the second fixing groove 103, and improving the convenience of the device to adjust the direction when soldering the circuit board.

[0026] See also Figure 3 and Figure 4As shown, the middle of the vertical plate 105 is fixedly connected to the first horizontal plate 2; the middle of the first horizontal plate 2 is slidably connected to the slide bar 22; the top of the slide bar 22 is fixedly connected to the pull plate 24; the bottom of the pull plate 24 is fixedly connected to the first spring 23; the first spring 23 and the first horizontal plate 2 are both fixedly connected; the bottom of the slide bar 22 is fixedly connected to the second horizontal plate 25; when the vertical plate 105 is pushed, the vertical plate 105 will come into contact with the circuit board, and before the contact, the pull plate 24 can be pulled to drive the slide bar 22 to slide along the first horizontal plate 2, and when the slide bar 22 slides, it will drive the second horizontal plate 25 to move together, and at the same time, the first spring 23 will also In the stretched state, when the vertical plate 105 comes into contact with the circuit board, the pull plate 24 can be released, at which time the first spring 23 releases elastic potential energy and moves the pull plate 24 toward the first horizontal plate 2. When the pull plate 24 moves, the slide bar 22 slides along the slide bar 22 and the second horizontal plate 25 approaches the circuit board until the second horizontal plate 25 comes into contact with the circuit board and completes the clamping of the circuit board; by pulling the pull plate 24, the slide bar 22 can slide along the first horizontal plate 2 and control the distance between the second horizontal plate 25 and the circuit board, so that the device can clamp the circuit board, reduce the shaking of the circuit board during soldering, and improve the stability of the circuit board during soldering.

[0027] See also Figure 4 As shown, a plurality of suction cups 3 are fixedly connected to the bottom of the second horizontal plate 25; the suction cups 3 are arranged in an array; the suction cups 3 will first come into contact with the circuit board before the second horizontal plate 25 comes into contact with the circuit board, and the air in the suction cups 3 will be discharged during the contact, and the suction cups 3 will adsorb the surface of the circuit board under the action of atmospheric pressure; by providing the suction cups 3, the suction cups 3 will adsorb the circuit board when the second horizontal plate 25 approaches the circuit board, thereby increasing the contact area between the device and the circuit board and improving the stability of the device fixing the circuit board.

[0028] See also Figure 4 As shown, a plurality of second springs 4 are fixedly connected to the bottom of the second cross plate 25; a pressure ring 42 is fixedly connected to the end of the adjacent second spring 4; the pressure ring 42 is correspondingly arranged with the suction cup 3; after the suction cup 3 comes into contact with the circuit board, the second cross plate 25 will continue to approach the circuit board, during which the circuit board will come into contact with the pressure ring 42 and generate pressure on the pressure ring 42, and the pressure ring 42 will transfer the pressure to the second spring 4 after being squeezed, and the second spring 4 will be in a compressed state after being pressed, and then the second spring 4 will release elastic potential energy and subject the pressure ring 42 to elastic force, and the pressure ring 42 will squeeze the middle part of the suction cup 3 after being acted upon by the elastic force; through the cooperation of the second spring 4 and the pressure ring 42, after the suction cup 3 comes into contact with the circuit board, the circuit board will squeeze the second spring 4, and the second spring 4 will squeeze the middle part of the suction cup 3 after being subjected to the elastic force of the pressure ring 42, thereby reducing the interference of external air on the suction cup 3, enhancing the air tightness of the suction cup 3, improving the adsorption effect of the suction cup 3 on the circuit board, and further enhancing the fixing effect of the device on the circuit board.

[0029] See also Figure 1 As shown, an air pump 5 is fixedly connected to the top of the device body 1; an air pipe 52 is connected to the input end of the air pump 5; a collecting bag 53 is fixedly connected to the top of the device body 1; the collecting bag 53 and the air pump 5 are connected by a pipeline; harmful gases will be generated when the device is soldering the circuit board, and the air pump 5 can be started at this time. After the air pump 5 is started, the harmful gases on the top of the second fixed groove 103 will be extracted through the air pipe 52, and these harmful gases will enter the air pipe 52 and flow through the air pump 5 to enter the interior of the collecting bag 53; starting the air pump 5 can extract the harmful gases generated by the device when soldering the circuit board into the collecting bag 53, so that the device can recover and collect the harmful gases, reduce the pollution to the environment after the harmful gases are discharged, and improve the environmental protection of the device.

[0030] See also Figure 1 and Figure 2 As shown, the end of the air pipe 52 is connected to the shower head 6; a plurality of circular holes 62 are provided at the bottom of the shower head 6; after the air pump 5 is started, the air at the top of the first fixed groove 102 will flow toward the air pipe 52, and the air will first enter the interior of the shower head 6 through the circular holes 62, and then the harmful gas will flow into the interior of the collecting bag 53; through the cooperation of the shower head 6 and the circular holes 62, after the air pump 5 is started, the harmful gas will enter the interior of the shower head 6 from the circular holes 62 and then flow into the interior of the collecting bag 53, thereby accelerating the collection speed of the harmful gas by the device, reducing the residence time of the harmful gas in the air, and improving the environmental protection of the device.

[0031] See also Figure 1 As shown, a second slide groove 7 is provided in the middle of the device body 1; a collection box 72 is slidably connected to the middle of the second slide groove 7; impurities such as debris or solder slag will be generated when the circuit board is soldered, and the staff can pour these impurities into the collection box 72 after cleaning, thereby reducing impurities on the surface of the device; through the cooperation of the second slide groove 7 and the collection box 72, the collection box 72 can collect the debris generated when the circuit board is soldered, thereby reducing impurities remaining on the surface of the device and improving the surface finish of the device.

[0032] Working principle: The arc piece 108 is usually in a bent state. When working, the circuit board is placed on the top of the pick plate 104 and the device body 1 is started. After the device body 1 is started, the tin material inside the second fixing groove 103 will be heated and melted. Then the staff can hold the handle 106 and push the vertical plate 105. The vertical plate 105 will slide along the first slide groove 107 after being subjected to the force. During the movement of the vertical plate 105, it will contact the arc piece 108. The angle of the arc piece 108 will change due to the squeezing effect and it will approach the pick plate 104. When the arc piece 108 moves, it will drive the rotating rod 109 to move together and make the rotating rod 109 rotate along the pick plate 104. When the rotating rod 109 rotates, it will drive the top plate 110 The top plate 110 will come into contact with the circuit board during the rotation process and adjust the direction of the circuit board until the top plate 110 comes into contact with the lifting plate 104. At the same time, the vertical plate 105 will come into contact with the circuit board during the sliding process and push the circuit board to move together. The circuit board will be adjusted in direction by the top plate 110 during the movement and enter the second fixing groove 103 in a positive direction. At this time, the device completes the soldering work on the circuit board; when pushing the vertical plate 105, the vertical plate 105 will come into contact with the circuit board. Before the contact, the pull plate 24 can be pulled to drive the slide bar 22 to slide along the first horizontal plate 2. When the slide bar 22 slides, it will drive the second horizontal plate 25 to move together. At the same time, the first spring 23 will also be in a stretched state. When the vertical plate 105 and the circuit board are After the boards come into contact, the pull plate 24 can be released, at which time the first spring 23 will release its elastic potential energy and move the pull plate 24 toward the first transverse plate 2. When the pull plate 24 moves, the slide bar 22 will slide along the slide bar 22 and the second transverse plate 25 will approach the circuit board until the second transverse plate 25 comes into contact with the circuit board and completes the clamping of the circuit board; before the second transverse plate 25 comes into contact with the circuit board, the suction cup 3 will first come into contact with the circuit board, and the air in the suction cup 3 will be discharged during the contact, and the suction cup 3 will adsorb the surface of the circuit board under the action of atmospheric pressure; after the suction cup 3 comes into contact with the circuit board, the second transverse plate 25 will continue to approach the circuit board, and during the process, the circuit board will come into contact with the pressure ring 42 and generate pressure on the pressure ring 42, and the pressure ring 42 will be squeezed After that, the pressure will be transmitted to the second spring 4. After the second spring 4 is under pressure, it will be in a compressed state. Then, the second spring 4 will release its elastic potential energy and make the pressure ring 42 subject to elastic force. After the pressure ring 42 is subject to the elastic force, it will squeeze the middle part of the suction cup 3. When the device is soldering the circuit board, harmful gas will be generated. At this time, the air pump 5 can be started. After the air pump 5 is started, the harmful gas at the top of the second fixed groove 103 will be extracted through the air pipe 52. After these harmful gases enter the air pipe 52, they will flow through the air pump 5 and enter the interior of the collecting bag 53. After starting the air pump 5, the air at the top of the first fixed groove 102 will flow to the air pipe 52. These air will first enter the interior of the shower head 6 through the circular hole 62, and then the harmful gas will flow to the interior of the collecting bag 53.When soldering the circuit board, impurities such as debris or solder slag will be generated. After cleaning, the staff can pour these impurities into the collection box 72 to reduce impurities on the surface of the device. ;

[0033] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A PCBA circuit board positioning soldering device, comprising a device body (1), characterized in that: The top of the device body (1) is provided with a first fixing groove (102); the middle of the first fixing groove (102) is fixedly connected to a second fixing groove (103); the middle of the second fixing groove (103) is fixedly connected to a lifting plate (104); the top of the lifting plate (104) is fixedly connected to a vertical plate (105); the top of the lifting plate (104) is provided with a first sliding groove (107); the vertical plate (105) and the first sliding groove (107) are slidably connected; the middle of the vertical plate (105) is fixedly connected to a handle (106); the top of the lifting plate (104) is fixedly connected to a plurality of arc-shaped pieces (108); the arc-shaped pieces (108) are symmetrically arranged; the bottom of the arc-shaped piece (108) is hinged with a rotating rod (109); the rotating rod (109) and the lifting plate (104) are in a rotational relationship; the ends of the adjacent rotating rods (109) are fixedly connected to a top plate (110).

2. A PCBA circuit board positioning soldering device according to claim 1, characterized in that: The middle part of the vertical plate (105) is fixedly connected to a first horizontal plate (2); the middle part of the first horizontal plate (2) is slidably connected to a sliding rod (22); the top of the sliding rod (22) is fixedly connected to a pulling plate (24); the bottom of the pulling plate (24) is fixedly connected to a first spring (23); the first spring (23) and the first horizontal plate (2) are both in a fixed connection relationship; the bottom of the sliding rod (22) is fixedly connected to a second horizontal plate (25).

3. A PCBA circuit board positioning soldering device according to claim 2, characterized in that: A plurality of suction cups (3) are fixedly connected to the bottom of the second transverse plate (25); the suction cups (3) are arranged in an array.

4. A PCBA circuit board positioning soldering device according to claim 3, characterized in that: A plurality of second springs (4) are fixedly connected to the bottom of the second transverse plate (25); a pressure ring (42) is fixedly connected to the end of an adjacent second spring (4); and the pressure ring (42) and the suction cup (3) are arranged correspondingly.

5. A PCBA circuit board positioning soldering device according to claim 4, characterized in that: An air pump (5) is fixedly connected to the top of the device body (1); an input end of the air pump (5) is connected to an air pipe (52); a collecting bag (53) is fixedly connected to the top of the device body (1); and the collecting bag (53) and the air pump (5) are connected by a pipeline.

6. A PCBA circuit board positioning soldering device according to claim 5, characterized in that: The end of the air pipe (52) is connected to a shower head (6); a plurality of circular holes (62) are provided at the bottom of the shower head (6).

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