Semiconductor chip welding vacuumizing mechanism

Abstract

The utility model discloses a semiconductor chip welding vacuumizing mechanism. Comprising an upper cavity, a lower cavity, a cavity seat, a lifting mechanism, a vacuumizing mechanism, a vacuum breaking mechanism and an electric heating block, a lifting mechanism is arranged on the cavity seat, an upper cavity is arranged at the bottom of the cavity seat and connected with the lifting mechanism, a lower cavity is arranged below the upper cavity, the upper cavity is structurally matched with the lower cavity, and an electric heating block is arranged in the lower cavity. The lower cavity is respectively connected with the vacuumizing mechanism and the vacuum breaking mechanism, the upper cavity and the lower cavity are closed to form a sealed cavity, a sealing ring is arranged on a sealing surface of the lower cavity, and the sealed cavity is respectively communicated with the vacuumizing mechanism and the vacuum breaking mechanism. According to the utility model, the upper cavity and the lower cavity are matched with the sealing ring, so that the sealing performance of the sealing cavity is greatly enhanced, the vacuumizing effect is improved, and the voidage of a chip welding surface is reduced. And the lower cavity and the sealing ring are cooled, so that the service life of the sealing ring is prolonged.

Description

Technical field:

[0001] The utility model belongs to the technical field of semiconductor chip production, and particularly relates to a semiconductor chip welding vacuum pumping mechanism. Background technology:

[0002] During the production process of semiconductor chips, the circuit needs to be soldered to the chip surface. The chip enters the heating device, and after preheating and insulation, it is vacuumed in the mold to discharge the gas in the molten solder paste on the chip surface, completing the soldering of the chip circuit and reducing the void rate of the chip soldering surface.

[0003] In the existing heating device, the mold is generally sealed by covering the carrier with the upper cavity and then evacuating. The sealing performance of this method is not good, which affects the effect of vacuuming, and the void ratio of the chip welding surface cannot achieve the ideal effect.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility model content:

[0005] The purpose of the utility model is to provide a semiconductor chip welding vacuum pumping mechanism, so as to overcome the defects in the above-mentioned prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides a semiconductor chip welding vacuum mechanism, including an upper cavity, a lower cavity, a cavity seat, a lifting mechanism, a vacuum mechanism, a vacuum breaking mechanism, and an electric heating block; a lifting mechanism is provided on the cavity seat, an upper cavity is provided at the bottom of the cavity seat, the upper cavity is connected to the lifting mechanism, a lower cavity is provided below the upper cavity, the upper cavity and the lower cavity structure cooperate, and an electric heating block is provided in the lower cavity; the lower cavity is respectively connected to the vacuum mechanism and the vacuum breaking mechanism, and a sealed cavity is formed when the upper cavity and the lower cavity are closed, a sealing ring is provided on the sealing surface of the lower cavity, and the sealed cavity is respectively connected to the vacuum mechanism and the vacuum breaking mechanism.

[0007] Preferably, in the technical solution, a water cooling plate is provided at the bottom of the lower cavity, and the water cooling plate is connected to an external cooling water pipe to prevent the lower cavity and the sealing ring from being overheated, thereby extending the service life of the sealing ring.

[0008] Preferably, in the technical solution, a wiring tube is provided at the bottom of the lower cavity, and the heating power supply is connected to the electric heating block through the wiring tube, so as to further improve the sealing performance of the sealed cavity.

[0009] Preferably, in the technical solution, the lifting mechanism includes a servo motor, a bracket, a lifting block, a guide column, a guide sleeve, and a gear rack transmission mechanism. The bracket and the guide sleeve are arranged on the cavity seat, the servo motor is arranged on the bracket, the servo motor and the lifting block are connected through the gear rack transmission mechanism, the lifting block is connected to the guide column, the guide column is connected to the upper cavity, and the guide sleeve is mounted on the guide column.

[0010] Preferably, in the technical solution, the lifting mechanism further comprises a photoelectric detector, which is arranged on the side of the bracket, and the lifting block is provided with a detection plate at a corresponding position for detecting the position of the upper cavity.

[0011] Preferably, in the technical solution, the lifting mechanism further comprises a cooling fan, the cooling fan is arranged on the bracket, and the air outlet of the cooling fan is arranged toward the servo motor.

[0012] Preferably, in the technical solution, the vacuum extraction mechanism includes a vacuum pump, a positive pressure gas source, a solenoid valve, an angle valve, a gas filter, a positive pressure pipeline, and an exhaust pipeline. The vacuum pump is connected to the lower cavity through an exhaust pipeline, and an angle valve and a gas filter are provided on the exhaust pipeline. The positive pressure gas source is connected to the angle valve through the positive pressure pipeline, and a solenoid valve is provided on the positive pressure pipeline.

[0013] Preferably, in the technical solution, the vacuum breaking mechanism includes a vacuum breaking pipeline, a nitrogen gas source, and a digital pressure gauge. The nitrogen gas source is connected to the vacuum breaking pipeline, and the vacuum breaking pipeline is connected to the lower cavity. A digital pressure gauge is provided on the vacuum breaking pipeline for detecting the vacuum degree of the sealed cavity and the nitrogen flow rate.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] By using the upper and lower cavities with sealing rings, the sealing of the sealed cavity is greatly enhanced, the vacuuming effect is improved, and the void rate of the chip welding surface is reduced. By cooling the lower cavity and the sealing ring, the service life of the sealing ring is extended. Description of the drawings:

[0016] Figure 1 This is a schematic diagram of the front structure of the semiconductor chip welding vacuum pumping mechanism of the utility model;

[0017] Figure 2 for Figure 1 A magnified view of part A;

[0018] Figure 3 This is a schematic diagram of the back structure of the semiconductor chip welding vacuum pumping mechanism of the utility model;

[0019] Figure 4 for Figure 3 Enlarged view of part B. Specific implementation method:

[0020] The specific implementation modes of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific implementation modes.

[0021] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0022] like Figure 1-4 As shown, a semiconductor chip welding vacuum pumping mechanism comprises an upper cavity 1, a lower cavity 2, a cavity seat 3, a lifting mechanism 4, a vacuum pumping mechanism 5, a vacuum breaking mechanism 6, an electric heating block 7, a water cooling plate 8, and a wiring tube 9; the cavity seat 3 is provided with a lifting mechanism 4, the cavity seat 3 is provided with an upper cavity 1 at the bottom, the upper cavity 1 is connected to the lifting mechanism 4, the lower cavity 2 is provided below the upper cavity 1, the upper cavity 1 and the lower cavity 2 are matched in structure, the lower cavity 2 is provided with an electric heating block 7, the bottom of the lower cavity 2 is provided with a wiring tube 9, and the heating The power supply is connected to the electric heating block 7 through the wiring tube 9 to further improve the sealing performance of the sealed cavity; a water cooling plate 8 is provided at the bottom of the lower cavity 2, and the water cooling plate 8 is connected to an external cooling water pipe to prevent the lower cavity 2 and the sealing ring 20 from being overheated, thereby extending the service life of the sealing ring 20; the lower cavity 2 is respectively connected to the vacuum pumping mechanism 5 and the vacuum breaking mechanism 6, and a sealed cavity is formed when the upper cavity 1 and the lower cavity 2 are closed. A sealing ring 20 is provided on the sealing surface of the lower cavity 2, and the sealed cavity is respectively connected to the vacuum pumping mechanism 5 and the vacuum breaking mechanism 6.

[0023] The lifting mechanism 4 includes a servo motor 40, a bracket 41, a lifting block 42, a guide column 43, a guide sleeve 44, a gear rack transmission mechanism 45, a photoelectric detector 46, and a cooling fan 47. The bracket 41 and the guide sleeve 44 are arranged on the cavity seat 3. The servo motor 40 is arranged on the bracket 41. The servo motor 40 is connected to the lifting block 42 through the gear rack transmission mechanism 45. The lifting block 42 is connected to the guide column 43. The guide column 43 is connected to the upper cavity 1. The guide sleeve 44 is sleeved on the guide column 43. The photoelectric detector 46 is arranged on the side of the bracket 41. The lifting block 42 is provided with a detection plate 48 at a corresponding position for detecting the position of the upper cavity 1. The cooling fan 47 is arranged on the bracket 41, and the air outlet of the cooling fan 47 is arranged toward the servo motor 40.

[0024] The vacuum pumping mechanism 5 includes a vacuum pump 50, a positive pressure gas source 51, a solenoid valve 52, an angle valve 53, a gas filter 54, a positive pressure pipeline 55, and an exhaust pipeline 56. The vacuum pump 50 is connected to the lower cavity 2 via the exhaust pipeline 56, and the exhaust pipeline 56 is provided with an angle valve 53 and a gas filter 54. The positive pressure gas source 51 is connected to the angle valve 53 via the positive pressure pipeline 55, and the positive pressure pipeline 55 is provided with a solenoid valve 52.

[0025] The vacuum breaking mechanism 6 includes a vacuum breaking pipeline 60, a nitrogen gas source, and a digital pressure gauge 61. The nitrogen gas source is connected to the vacuum breaking pipeline 60, and the vacuum breaking pipeline 60 is connected to the lower cavity 2. A digital pressure gauge 61 is provided on the vacuum breaking pipeline 60 for detecting the vacuum degree of the sealed cavity and the nitrogen flow rate.

[0026] When in use, the servo motor 40 is started, driving the upper cavity 1 to press downward, and the upper cavity 1 forms a sealed cavity with the lower cavity 2 and the sealing ring 20. The vacuum pump 50 and the positive pressure gas source 51 are started, and the angle valve 53 and the solenoid valve 52 are started to evacuate the sealed cavity and extract the air. At the same time, the electric heating block 7 heats the chip in the sealed cavity to discharge the gas in the melted solder paste on the chip surface, thereby reducing the void rate of the chip welding surface. After the welding is completed, the nitrogen gas source is turned on, and the nitrogen enters the sealed cavity from the vacuum breaking pipeline 60 to break the vacuum. The servo motor 40 drives the upper cavity 1 to reset, and the cooling water cools the lower cavity 2 and the sealing ring 20 through the water cooling plate 8. The chip is removed, and the next chip is moved in to repeat the above steps. By using the upper cavity 1 and the lower cavity 2 in combination with the sealing ring 20, the sealing of the sealed cavity is greatly enhanced, the vacuuming effect is improved, and the void rate of the chip welding surface is reduced. By cooling the lower cavity 2 and the sealing ring 20, the service life of the sealing ring 20 is extended. .

[0027] The foregoing description of specific exemplary embodiments of the utility model is for the purpose of illustration and illustration. These descriptions are not intended to limit the utility model to the precise form disclosed, and it is clear that many changes and variations can be made based on the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the utility model and its practical application, so that those skilled in the art can realize and utilize various different exemplary embodiments of the utility model and various different options and changes. The scope of the utility model is intended to be defined by the claims and their equivalents.

Claims

1. A semiconductor chip welding vacuum pumping mechanism, characterized in that: It includes an upper cavity, a lower cavity, a cavity seat, a lifting mechanism, a vacuum pumping mechanism, a vacuum breaking mechanism, and an electric heating block; a lifting mechanism is provided on the cavity seat, an upper cavity is provided at the bottom of the cavity seat, the upper cavity is connected to the lifting mechanism, a lower cavity is provided below the upper cavity, the upper cavity and the lower cavity structure cooperate, and an electric heating block is provided in the lower cavity; the lower cavity is respectively connected to the vacuum pumping mechanism and the vacuum breaking mechanism, and a sealed cavity is formed when the upper cavity and the lower cavity are closed, a sealing ring is provided on the sealing surface of the lower cavity, and the sealed cavity is respectively connected to the vacuum pumping mechanism and the vacuum breaking mechanism.

2. The semiconductor chip welding vacuum pumping mechanism according to claim 1, characterized in that: A water cooling plate is arranged at the bottom of the lower cavity, and the water cooling plate is connected to an external cooling water pipe.

3. The semiconductor chip welding vacuum pumping mechanism according to claim 1, characterized in that: A wiring tube is arranged at the bottom of the lower cavity, and the heating power supply is connected to the electric heating block through the wiring tube.

4. The semiconductor chip welding vacuum pumping mechanism according to claim 1, characterized in that: The lifting mechanism includes a servo motor, a bracket, a lifting block, a guide column, a guide sleeve, and a gear rack transmission mechanism. The bracket and the guide sleeve are arranged on the cavity seat, and the servo motor is arranged on the bracket. The servo motor is connected to the lifting block through the gear rack transmission mechanism, the lifting block is connected to the guide column, the guide column is connected to the upper cavity, and the guide sleeve is mounted on the guide column.

5. The semiconductor chip welding vacuum pumping mechanism according to claim 4, characterized in that: The lifting mechanism also includes a photoelectric detector, which is arranged on the side of the bracket, and a detection plate is arranged at the corresponding position of the lifting block.

6. The semiconductor chip welding vacuum pumping mechanism according to claim 4, characterized in that: The lifting mechanism also includes a cooling fan, which is arranged on the bracket, and an air outlet of the cooling fan is arranged toward the servo motor.

7. The semiconductor chip welding vacuum pumping mechanism according to claim 1, characterized in that: The vacuum extraction mechanism includes a vacuum pump, a positive pressure gas source, a solenoid valve, an angle valve, a gas filter, a positive pressure pipeline, and an exhaust pipeline. The vacuum pump is connected to the lower cavity through an exhaust pipeline, and an angle valve and a gas filter are provided on the exhaust pipeline. The positive pressure gas source is connected to the angle valve through the positive pressure pipeline, and a solenoid valve is provided on the positive pressure pipeline.

8. The semiconductor chip welding vacuum pumping mechanism according to claim 1, characterized in that: The vacuum breaking mechanism comprises a vacuum breaking pipeline, a nitrogen gas source and a digital pressure gauge. The nitrogen gas source is connected to the vacuum breaking pipeline, the vacuum breaking pipeline is connected to the lower cavity, and a digital pressure gauge is arranged on the vacuum breaking pipeline.

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