Lossless clamping device for wafer thinning processing

Abstract

The utility model discloses a lossless clamping device for wafer thinning processing, and relates to the technical field of clamping devices.The lossless clamping device for wafer thinning processing comprises a processing box, a groove is formed in the surface of the processing box, a placing block is arranged in the processing box, a sliding groove is formed in the surface of the placing block, and a clamping block is arranged in the sliding groove. And two connecting rods are slidably connected to the inner wall of the sliding groove, clamping plates are fixedly connected to the ends, located on the surface of the placing block, of the two connecting rods, a rotating rod is rotatably connected to the interior of the placing block, and a gear is fixedly connected to the surface of the rotating rod. The two clamping plates move oppositely or oppositely to clamp, fix or loosen products, the situation that the device fixes and processes the products of different specifications conveniently is avoided, meanwhile, the situation that the products are clamped and fixed through multiple sets of second electric telescopic rods is avoided, and the production cost of the device is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of clamping devices, in particular to a non-destructive clamping device for wafer thinning processing. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] Patent No.: CN217468380U, proposes a non-destructive clamping device for thinning ultra-thin wafers. By setting a small screw, a threaded column, a support column, a clamping block, a telescopic rod, a connecting rod, and an extension block, it is convenient to move the wafer column in the clamping device and finely adjust the length of the wafer column extending out of the clamping device, which facilitates the thinning of the wafer column into ultra-thin wafers.

[0004] During the implementation of the device, multiple sets of electric telescopic rods are used to control the clamping, fixing and supporting of the wafer column, which increases the manufacturing cost of the device. In addition, setting up multiple sets of electric telescopic rods is too cumbersome and inconvenient for staff to operate. Therefore, a non-destructive clamping device for wafer thinning processing is proposed to solve the above problem. Utility Model Content

[0005] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a non-destructive clamping device for wafer thinning processing, which can solve the problems of the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a non-destructive clamping device for wafer thinning processing, comprising a processing box, a groove is provided on the surface of the processing box, a placement block is arranged inside the processing box, a slide groove is provided on the surface of the placement block, and two connecting rods are slidably connected to the inner wall of the slide groove, and the two connecting rods are located at one end of the surface of the placement block and are fixedly connected to a clamping plate, the inside of the placement block is rotatably connected to a rotating rod, a gear is fixedly connected to the surface of the rotating rod, and the surfaces of the two connecting rods are fixedly connected to racks, and the two racks are located on both sides of the gear, and the surface of the gear is meshed with the two racks.

[0007] Preferably, a fixing plate is fixedly connected to the surface of the placement block, an electric telescopic rod 2 is fixedly connected to the surface of the fixing plate, an output end of the electric telescopic rod 2 is slidably connected to the interior of the placement block, and one end of the output end of the electric telescopic rod 2 is located inside the placement block and is fixedly connected to the connecting rod.

[0008] Preferably, an electric telescopic rod 1 is fixedly connected to the interior of the processing box, and an output end of the electric telescopic rod 1 is fixedly connected to the placement block.

[0009] Preferably, a limiting groove is provided inside the processing box, and the inner wall of the limiting groove is slidably connected to the surface of the electric telescopic rod 2 and the fixed plate.

[0010] Preferably, a pressing rod is fixedly connected to the surface of one of the connecting rods, and the pressing rod is arranged in an inclined shape at one end away from the connecting rod.

[0011] Preferably, a sliding rod is slidably connected to the interior of the rotating rod, a fixed rod is fixedly connected to the surface of the sliding rod, and the position of the fixed rod corresponds to the pressing rod.

[0012] Preferably, one end of the sliding rod away from the rotating rod is fixedly connected to a pushing block, and the surface of the pushing block is slidably connected to the inside of the placing block.

[0013] Preferably, a spring is fixedly connected inside the rotating rod, and one end of the spring away from the rotating rod is in contact with the sliding rod.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] (1) The non-destructive clamping device for wafer thinning processing starts the electric telescopic rod 2 to make the two clamping plates move relative to or away from each other to clamp or loosen the product, thereby avoiding the need to fix products of different specifications by the device and also avoiding the need to clamp the product by multiple sets of electric telescopic rods 2, thereby reducing the production cost of the device.

[0016] (2) In the non-destructive clamping device for wafer thinning processing, under the elastic force of the spring, the sliding rod drives the pushing block to slide, and then the pushing block lifts up the processed product, so that the product is no longer in close contact with the surface of the placement block, making it easier to remove the processed product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of the processing box of the utility model;

[0020] Figure 3 For this utility model Figure 2 A is a schematic diagram of the enlarged structure of the middle part;

[0021] Figure 4 It is a schematic diagram of the internal structure of the rotating rod of the utility model.

[0022] Figure numerals: 1. processing box; 2. groove; 3. placement block; 4. splint; 5. slide groove; 6. connecting rod; 7. rack; 8. electric telescopic rod one; 9. limit groove; 10. electric telescopic rod two; 11. fixed plate; 12. rotating rod; 13. gear; 14. sliding rod; 15. fixed rod; 16. pressing rod; 17. pushing block; 18. spring. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0024] See also Figure 1-4 The utility model provides a technical solution: a non-destructive clamping device for wafer thinning processing, comprising a processing box 1, a groove 2 is provided on the surface of the processing box 1, a placement block 3 is arranged inside the processing box 1, a slide groove 5 is provided on the surface of the placement block 3, and two connecting rods 6 are slidably connected to the inner wall of the slide groove 5, and one end of the two connecting rods 6 located on the surface of the placement block 3 is fixedly connected to a clamping plate 4, the inside of the placement block 3 is rotatably connected to a rotating rod 12, and a gear 13 is fixedly connected to the surface of the rotating rod 12, and racks 7 are fixedly connected to the surfaces of the two connecting rods 6, and the two racks 7 are located on both sides of the gear 13, and the surface of the gear 13 is meshed with the two racks 7.

[0025] A fixed plate 11 is fixedly connected to the surface of the placement block 3, and an electric telescopic rod 10 is fixedly connected to the surface of the fixed plate 11. The output end of the electric telescopic rod 10 is slidably connected to the inside of the placement block 3, and the output end of the electric telescopic rod 10 is located at one end inside the placement block 3 and is fixedly connected to the connecting rod 6.

[0026] When the electric telescopic rod 10 is started, the output end of the electric telescopic rod 10 pushes the connecting rod 6, and the connecting rod 6 drives the rack 7 on its surface to move, and the rack 7 pushes the gear 13, causing the gear 13 to drive the rotating rod 12 to rotate, and the rotating rod 12 rotates to pull the other rack 7, causing the other rack 7 to pull the connecting rod 6 fixed to it, thereby causing the two connecting rods 6 to move relative to each other, so that the two clamps 4 move relative to each other. When the product processing is completed, the electric telescopic rod 10 is started again, and the output end of the electric telescopic rod 10 pushes the connecting rod 6 to move relative to each other. The rod 6 is pulled, and the connecting rod 6 pulls the rack 7, causing the gear 13 to drive the rotating rod 12 to reverse, and then the other rack 7 drives the fixed connecting rod 6 to move, so that the two connecting rods 6 move away from each other, causing the two clamps 4 to move away from each other, and then by starting the electric telescopic rod 2 10, the two clamps 4 move relative to or away from each other, clamping or loosening the product, avoiding the need for the device to fix products of different specifications, and at the same time avoiding the need to clamp the product through multiple sets of electric telescopic rods 2 10, reducing the production cost of the device.

[0027] An electric telescopic rod 8 is fixedly connected to the interior of the processing box 1 , and an output end of the electric telescopic rod 8 is fixedly connected to the placement block 3 .

[0028] When the processing box 1 is started, the output end of the processing box 1 pushes the placement block 3, pushing the product fixed on the surface of the placement block 3, thereby controlling how much of the product is exposed from the surface of the processing box 1, thereby controlling how much the product is thinned.

[0029] A limiting groove 9 is provided inside the processing box 1 , and the inner wall of the limiting groove 9 is slidably connected to the surfaces of the electric telescopic rod 10 and the fixing plate 11 .

[0030] When the placement block 3 slides, the placement block 3 drives the electric telescopic rod 2 10 and the fixed plate 11 to move, thereby causing the electric telescopic rod 2 10 and the fixed plate 11 to slide inside the limiting groove 9, thereby limiting the sliding of the electric telescopic rod 2 10 and the fixed plate 11, avoiding shaking during the sliding process.

[0031] A pressing rod 16 is fixedly connected to the surface of one of the connecting rods 6, and the end of the pressing rod 16 away from the connecting rod 6 is arranged in an inclined shape. The interior of the rotating rod 12 is slidably connected to the sliding rod 14, and the surface of the sliding rod 14 is fixedly connected to the fixing rod 15, and the position of the fixing rod 15 corresponds to the pressing rod 16. The end of the sliding rod 14 away from the rotating rod 12 is fixedly connected to a pushing block 17, and the surface of the pushing block 17 is slidably connected to the interior of the placing block 3. When the pushing block 17 is retracted into the interior of the placing block 3, the surface of the pushing block 17 is parallel to the surface of the placing block 3. A spring 18 is fixedly connected to the interior of the rotating rod 12, and the end of the spring 18 away from the rotating rod 12 contacts with the sliding rod 14.

[0032] When the connecting rod 6 moves, the connecting rod 6 drives the pressing rod 16 to move, and due to the setting of the inclined surface of the pressing rod 16, the pressing rod 16 moves its inclined surface to squeeze the fixed rod 15, causing the fixed rod 15 to drive the sliding rod 14 to move, and the sliding rod 14 slides toward the inside of the rotating rod 12, so that the sliding rod 14 drives the pushing block 17 to move, so that the pushing block 17 is retracted into the inside of the placement block 3. When the processing is completed, the clamping plate 4 no longer clamps the product, the clamping plate 4 drives the connecting rod 6 and the pressing rod 16 to move, and then the pressing rod 16 no longer presses the fixed rod 15, so that under the elastic force of the spring 18, the sliding rod 14 drives the pushing block 17 to slide, and then the pushing block 17 lifts the processed product, so that the product is no longer in close contact with the surface of the placement block 3, which is convenient for removing the processed product.

[0033] Working principle: the electric telescopic rod 10 is started, and the output end of the electric telescopic rod 10 pushes the connecting rod 6, and the connecting rod 6 drives the rack 7 on its surface to move, and the rack 7 pushes the gear 13, causing the gear 13 to drive the rotating rod 12 to rotate, and the rotating rod 12 rotates to pull another rack 7, causing the other rack 7 to pull the connecting rod 6 fixed to it, thereby causing the two connecting rods 6 to move relative to each other, and the two splints 4 to move relative to each other. When the product is processed, the electric telescopic rod 10 is started again, and the output end of the electric telescopic rod 10 pulls the connecting rod 6, and the connecting rod 6 pulls the rack 7, causing the gear 13 to drive the rotating rod 12 to reverse, and then the other rack 7 drives the fixed connecting rod 6 to move, so that the two connecting rods 6 move away from each other, causing the two splints 4 to move away from each other.

[0034] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A non-destructive clamping device for wafer thinning processing, comprising a processing box (1), characterized in that: The processing box (1) has a groove (2) on its surface, a placement block (3) is provided inside the processing box (1), a slide groove (5) is provided on the surface of the placement block (3), the inner wall of the slide groove (5) is slidably connected to two connecting rods (6), one end of the two connecting rods (6) located on the surface of the placement block (3) is fixedly connected to a clamping plate (4), the inside of the placement block (3) is rotatably connected to a rotating rod (12), the surface of the rotating rod (12) is fixedly connected to a gear (13), the surfaces of the two connecting rods (6) are fixedly connected to racks (7), and the two racks (7) are located on both sides of the gear (13), and the surface of the gear (13) is meshed with the two racks (7).

2. A non-destructive clamping device for wafer thinning processing according to claim 1, characterized in that: The surface of the placement block (3) is fixedly connected to a fixing plate (11), the surface of the fixing plate (11) is fixedly connected to an electric telescopic rod 2 (10), the output end of the electric telescopic rod 2 (10) is slidably connected to the interior of the placement block (3), and one end of the output end of the electric telescopic rod 2 (10) located inside the placement block (3) is fixedly connected to a connecting rod (6).

3. The non-destructive clamping device for wafer thinning processing according to claim 1, characterized in that: An electric telescopic rod (8) is fixedly connected inside the processing box (1), and the output end of the electric telescopic rod (8) is fixedly connected to the placement block (3).

4. A non-destructive clamping device for wafer thinning processing according to claim 3, characterized in that: A limiting groove (9) is provided inside the processing box (1), and the inner wall of the limiting groove (9) is slidably connected to the surface of the second electric telescopic rod (10) and the fixed plate (11).

5. The non-destructive clamping device for wafer thinning processing according to claim 1, characterized in that: A pressing rod (16) is fixedly connected to the surface of one of the connecting rods (6), and one end of the pressing rod (16) away from the connecting rod (6) is arranged in an inclined shape.

6. A non-destructive clamping device for wafer thinning processing according to claim 5, characterized in that: The interior of the rotating rod (12) is slidably connected to a sliding rod (14), and the surface of the sliding rod (14) is fixedly connected to a fixing rod (15), and the position of the fixing rod (15) corresponds to the pressing rod (16).

7. A non-destructive clamping device for wafer thinning processing according to claim 6, characterized in that: One end of the sliding rod (14) away from the rotating rod (12) is fixedly connected to a pushing block (17), and the surface of the pushing block (17) is slidably connected to the inside of the placing block (3).

8. A non-destructive clamping device for wafer thinning processing according to claim 7, characterized in that: A spring (18) is fixedly connected inside the rotating rod (12), and one end of the spring (18) away from the rotating rod (12) is in contact with the sliding rod (14).

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