Wafer double-sided photoetching equipment

Abstract

The utility model belongs to the technical field of wafer processing, and particularly relates to wafer double-sided photoetching equipment. According to the wafer double-sided photoetching equipment, a wafer carrier loaded with a wafer is conveyed through a wafer carrier feeding device, a wafer grabbing device grabs the wafer to an edge searching and centering device for edge searching and centering, and then the wafer is grabbed to an ejector rod, penetrating out of the surface of a wafer processing carrier, of a material receiving adjusting device; after the ejector rod is recycled, the wafer falls onto a wafer processing carrier of the processing moving mechanism, the front face of the wafer is processed through the laser processing device, then the wafer is turned over, then the back face of the wafer is processed, finally, the double-face processing coincidence degree of the wafer is detected through the wafer detection device, qualified products and unqualified products are discharged respectively, and the processing efficiency of double-face photoetching of the wafer is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, and in particular relates to a wafer double-sided photolithography device. Background Art

[0002] At present, the wafer lithography equipment on the market is generally a semi-automatic lithography machine. The general process is: manually place the wafer on the wafer holding fixture in a specific position and direction, visually calibrate, and fix it with negative pressure; then place the mask, calibrate the mask with the grains on the wafer under a microscope, and fix the mask with negative pressure. The two sets of fixtures are manually rotated, and after shifting, they are lithographed at the lithography position. The efficiency is relatively low and the labor intensity of the operators is high. In addition, under the process requirements of laser etching on both sides of the wafer, it is also necessary to detect the overlap of the etching on the front and back sides to verify the processing accuracy. Therefore, it is currently necessary to develop a wafer double-sided lithography equipment with high processing efficiency. Utility Model Content

[0003] The utility model aims to overcome the deficiencies of the prior art and provide a wafer double-sided photolithography device.

[0004] The present application provides a double-sided wafer lithography device. The double-sided wafer lithography device comprises:

[0005] A wafer carrier loading device, used for conveying a wafer carrier loaded with wafers;

[0006] A wafer grabbing device, used for grabbing the wafer;

[0007] An edge-finding and centering device is used to find the edge and center the wafer;

[0008] A material receiving and adjusting device, which includes a plurality of ejector pins for penetrating the surface of the wafer processing carrier to absorb the wafer grasped by the wafer grasping device;

[0009] A processing moving mechanism, on which the wafer processing carrier is arranged, and used for driving the wafer processing carrier to move;

[0010] A laser processing device, disposed above the processing position, for processing the wafer of the wafer processing carrier;

[0011] Wafer detection device, used to detect the overlap of double-sided processing of wafers;

[0012] The qualified product receiving device and the unqualified product receiving device are used to accommodate qualified wafers and unqualified wafers respectively.

[0013] In one embodiment of the present application, the edge finding and centering device comprises:

[0014] A first image acquisition module and an adjustment mechanism electrically connected to the control system;

[0015] The first image acquisition module is used to acquire the wafer image on the adjustment mechanism;

[0016] The control module adjusts the direction of the straight edge of the wafer and the center of the wafer to a preset position according to the wafer image control adjustment mechanism.

[0017] In one embodiment of the present application, the adjustment mechanism includes:

[0018] An x-moving mechanism, a y-moving mechanism, a rotary fixture and a rotary drive;

[0019] The x-direction moving mechanism is installed on the y-direction moving mechanism;

[0020] The rotary fixture and the rotary driver are installed on the x-direction moving mechanism;

[0021] The rotary driver is used to drive the rotary fixture to rotate.

[0022] In one embodiment of the present application, the wafer double-sided lithography equipment further includes a leveling device;

[0023] The leveling device comprises a moving seat and a telescopic arm mounted on the moving seat;

[0024] A leveling baffle is provided at the end of the telescopic arm.

[0025] In one embodiment of the present application, the material receiving and adjusting device comprises:

[0026] Mounting plate;

[0027] At least three of the push rods are vertically arranged on the mounting plate, and the top ends of the push rods are provided with suction nozzles;

[0028] The lifting drive is used to drive the mounting plate to rise, so as to drive the ejector pin to pass through the corresponding through hole on the wafer processing carrier, so as to lift the wafer off the surface of the wafer processing carrier so that the wafer grasping device can turn the wafer over.

[0029] In one embodiment of the present application, the wafer double-sided lithography equipment further includes a second image acquisition module electrically connected to the control system, for acquiring an image of the wafer after flipping.

[0030] In one embodiment of the present application, the wafer detection device includes:

[0031] Box;

[0032] The lateral movement mechanism is arranged in the box body, and a rotating carrier is arranged on the lateral movement mechanism; the rotating carrier extends out of the upper cover of the box body and is used for adsorbing the wafer;

[0033] The first detection mechanism is arranged above the box body and is used to detect the MARK point on the front side of the wafer;

[0034] The second detection mechanism is arranged in the box body and is used for detecting the MARK point on the back side of the wafer.

[0035] In one embodiment of the present application, a wafer recognition module is provided on the wafer grabbing device for detecting the wafer on the wafer carrier.

[0036] The beneficial effects of the utility model are:

[0037] Different from the prior art, the present application provides a double-sided wafer lithography device. The double-sided wafer lithography device includes a wafer carrier that is loaded with wafers and transported by a wafer carrier loading device, a wafer grabbing device that grabs the wafer to an edge-finding and centering device for edge-finding and centering, and then grabs the wafer to a push rod of a receiving and adjusting device that passes through the surface of the wafer processing carrier, after the push rod is recovered, the wafer falls onto the wafer processing carrier of the processing moving mechanism, and after the front side is processed by a laser processing device, it is turned over and then the back side is processed, and finally the wafer double-sided processing overlap is detected by a wafer detection device, and qualified products and unqualified products are discharged separately, thereby improving the processing efficiency of double-sided wafer lithography.

[0038] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0039] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 It is a front perspective view of a wafer double-sided photolithography device according to a preferred embodiment of the utility model;

[0042] Figure 2 It is a reverse perspective view of a wafer double-sided photolithography device according to a preferred embodiment of the utility model;

[0043] Figure 3 It is a top view of a wafer double-sided photolithography device according to a preferred embodiment of the utility model;

[0044] Figure 4 It is a schematic diagram of an adjustment mechanism of a preferred embodiment of the utility model;

[0045] Figure 5 It is a schematic diagram of a leveling device of a preferred embodiment of the utility model;

[0046] Figure 6 It is a schematic diagram of a material receiving and adjusting device of a preferred embodiment of the utility model;

[0047] Figure 7 is a schematic diagram of a wafer processing carrier according to a preferred embodiment of the utility model;

[0048] Figure 8 It is a schematic diagram of a wafer detection device according to a preferred embodiment of the utility model.

[0049] In the figure:

[0050] Wafer carrier loading device 1, wafer carrier 11, wafer grasping device 2, wafer identification module 21, edge finding and centering device 3, first image acquisition module 31, adjustment mechanism 32, x-axis moving mechanism 321, y-axis moving mechanism 322, rotating fixture 323, rotating driver 324, processing moving mechanism 4, wafer processing carrier 41, through hole 411, laser processing device 5, material receiving adjustment device 6, mounting plate 61, ejector rod 62, suction nozzle 621, lifting driver 63, second image acquisition module 64, wafer detection device 7, box 71, transverse movement mechanism 72, rotating carrier 73, first detection mechanism 74, second detection mechanism 75, qualified product receiving device 81, unqualified product receiving device 82, leveling device 9, movable seat 91, telescopic arm 92, leveling baffle 93. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0052] The present application provides a double-sided wafer lithography device, which is described in detail below. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments of the present application. In the following embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0053] See also Figure 1 , Figure 2 and Figure 3 As shown, in one embodiment, the double-sided wafer lithography equipment includes: a wafer carrier loading device 1, used to transport a wafer carrier 11 loaded with wafers; a wafer grasping device 2, used to grasp wafers; an edge-finding and centering device 3, used to edge-find and center the wafer; a material receiving and adjusting device 6, which includes a plurality of ejector pins 62 for penetrating the surface of a wafer processing carrier 41 to adsorb the wafer grasped by the wafer grasping device 2; a processing moving mechanism 4, on which the wafer processing carrier 41 is arranged, used to drive the wafer processing carrier 41 to move; a laser processing device 5, arranged above the processing position, used to process the wafer of the wafer processing carrier 41; a wafer detection device 7, used to detect the overlap of double-sided wafer processing; a qualified product receiving device 81 and an unqualified product receiving device 82, respectively used to accommodate qualified wafers and unqualified wafers.

[0054] In the present embodiment, specifically, the wafer carrier loading device 1 can be used to transport a wafer carrier 11 loaded with wafers, and the wafer carrier 11 can be but not limited to a basket carrier, which can accommodate multiple layers of wafers; the wafer carrier loading device 1 can transport the wafer carrier 11 loaded with wafers to the loading position; the wafer grasping device 2 can be a robot, which can grasp the wafer in the wafer carrier 11 at the loading position to the edge-finding and centering device 3, and the edge-finding and centering device 3 adjusts the position and angle of the wafer to the preset position and angle; the wafer grasping device 2 then grasps the wafer to a plurality of ejector pins 62 of the material receiving and adjusting device 6, and after the ejector pins 62 retract, the wafer falls on the wafer processing carrier 41, and the processing moving mechanism 4 can drive the wafer processing carrier 41 to move to the processing position, and the laser processing device 5 processes the front side of the wafer; after the front side processing is completed , the processing moving mechanism 4 can drive the wafer processing carrier 41 to move to the material receiving and adjusting device 6, the push rod 62 extends out to push the wafer off the surface of the wafer processing carrier 41, so that the wafer grasping device 2 can turn the wafer over, and after the push rod 62 retracts, the wafer falls on the wafer processing carrier 41, and the processing moving mechanism 4 drives the wafer processing carrier 41 to move to the processing position again, and the laser processing device 5 processes the back side of the wafer; after the processing is completed, the processing moving mechanism 4 can drive the wafer processing carrier 41 to move to the material receiving and adjusting device 6, the push rod 62 extends out to push the wafer off the surface of the wafer processing carrier 41, so that the wafer grasping device 2 can grab the wafer to the wafer detection device 7, detect the double-sided processing overlap of the wafer, and send qualified products to the qualified product receiving device 81 for unloading, and send unqualified products to the unqualified product receiving device 82 for unloading.

[0055] See also Figure 1 Optionally, the edge-finding and centering device 3 includes: a first image acquisition module 31 and an adjustment mechanism 32 electrically connected to a control system; the first image acquisition module 31 is used to acquire the wafer image on the adjustment mechanism 32; the control module controls the adjustment mechanism 32 to adjust the direction of the straight edge of the wafer and the center of the wafer to a preset position according to the wafer image.

[0056] Specifically, the adjustment mechanism 32 includes: an x-axis moving mechanism 321, a y-axis moving mechanism 322, a rotating fixture 323 and a rotating driver 324; the x-axis moving mechanism 321 is installed on the y-axis moving mechanism 322; the rotating fixture 323 and the rotating driver 324 are installed on the x-axis moving mechanism 321; the rotating driver 324 is used to drive the rotating fixture 323 to rotate.

[0057] For example, when the straight edge of the wafer is offset, the rotary fixture 323 can be driven by the rotary driver 324 to rotate to adjust the straight edge orientation of the wafer; when the center of the wafer is off, the rotary fixture 323 can be driven by the x-axis moving mechanism 321 and the y-axis moving mechanism 322 to move to adjust the center position of the wafer.

[0058] Optionally, the surface of the rotating fixture 323 can fix the wafer by negative pressure adsorption.

[0059] See also Figure 3 In this embodiment, preferably, the wafer double-sided lithography equipment also includes a leveling device 9; the leveling device 9 includes a moving seat 91 and a telescopic arm 92 installed on the moving seat 91; a leveling baffle 93 is provided at the end of the telescopic arm 92.

[0060] Specifically, when the wafer carrier loading device 1 transports the wafer carrier 11 loaded with wafers to the loading position, the telescopic arm 92 extends, and the moving seat 91 drives the telescopic arm 92 to move, so as to align the side edges of the wafers in the wafer carrier 11 through the leveling baffle 93 .

[0061] See also Figure 6 and Figure 7 Optionally, the material receiving and adjusting device 6 includes: a mounting plate 61; at least three push rods 62, which are vertically arranged on the mounting plate 61 and have a suction nozzle 621 at the top; a lifting driver 63, which is used to drive the mounting plate 61 to rise, so as to drive the push rods 62 to pass through the corresponding through holes 411 on the wafer processing carrier 41, so as to push the wafer away from the surface of the wafer processing carrier 41 for the wafer grasping device 2 to turn the wafer over.

[0062] In this embodiment, the push rod 62 of the material receiving and adjusting device 6 can extend from the corresponding through hole 411 on the wafer processing carrier 41 when the wafer is transferred from the wafer grasping device 2 to the surface of the wafer processing carrier 41 or from the surface of the wafer processing carrier 41 to the wafer grasping device 2, so as to adsorb and fix the wafer grasped by the wafer grasping device 2 and then drop it to the surface of the wafer processing carrier 41 or push the wafer on the surface of the wafer processing carrier 41 off the surface of the wafer processing carrier 41 for grasping by the wafer grasping device 2.

[0063] See also Figure 2The wafer double-sided lithography equipment also includes a second image acquisition module 64 electrically connected to the control system, which is used to acquire the image of the wafer after turning over.

[0064] In this embodiment, the image of the flipped wafer is captured by the second image acquisition module 64, and the control module can identify the straight edge orientation and center position of the flipped wafer, thereby controlling the laser processing device 5 and the processing moving mechanism 4 to process the back side of the wafer according to a predetermined pattern.

[0065] In some other application scenarios, if it is necessary to overlay the etched wafer, the previously etched pattern can be captured by the second image acquisition module 64 to facilitate the overlay.

[0066] See also Figure 8 Specifically, the wafer detection device 7 includes: a box body 71; a transverse movement mechanism 72, which is arranged in the box body 71 and has a rotating carrier 73 arranged thereon; the rotating carrier 73 extends out of the upper cover of the box body 71 to adsorb the wafer; a first detection mechanism 74, which is arranged above the box body 71 and is used to detect the MARK point on the front side of the wafer; a second detection mechanism 75, which is arranged in the box body 71 and is used to detect the MARK point on the back side of the wafer.

[0067] In this embodiment, the first detection mechanism 74 and the second detection mechanism 75 can be camera modules, which can be debugged and calibrated before processing. They can simultaneously detect the MARK points on the front and back sides of the wafer, thereby facilitating the judgment of the overlap of the front and back MARK points, and can detect the overlap of double-sided etching of the wafer.

[0068] See also Figure 3 Preferably, the wafer grabbing device 2 is provided with a wafer identification module 21 for detecting the wafer on the wafer carrier 11 .

[0069] In this example, before the robot arm of the wafer grasping device 2 grasps the wafer, the wafer on the wafer carrier 11 can be scanned by the wafer identification module 21 to detect which layer has a wafer and which layer is an empty layer; optionally, the wafer identification module 21 can be but is not limited to a mapping sensor.

[0070] It should be noted that the present application does not improve the control program, image recognition program and other software programs, and those skilled in the art can fully implement them using existing technologies; the various devices selected in the present application (components whose specific structures are not described) are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or through conventional experimental methods.

[0071] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0072] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0073] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer double-sided lithography device, characterized in that: include: A wafer carrier loading device (1) for conveying a wafer carrier (11) loaded with wafers; A wafer grabbing device (2), used for grabbing a wafer; An edge-finding and centering device (3) is used to perform edge-finding and centering on a wafer; A material receiving and adjusting device (6), comprising a plurality of ejector pins (62) for penetrating the surface of the wafer processing carrier (41) to absorb the wafer grasped by the wafer grasping device (2); A processing moving mechanism (4), on which the wafer processing carrier (41) is arranged, and is used to drive the wafer processing carrier (41) to move; A laser processing device (5), arranged above the processing position, and used for processing the wafer on the wafer processing carrier (41); A wafer detection device (7) for detecting the overlap of double-sided processing of the wafer; The qualified product receiving device (81) and the unqualified product receiving device (82) are used to accommodate qualified wafers and unqualified wafers respectively.

2. The wafer double-sided lithography equipment according to claim 1, characterized in that: The edge-finding and centering device (3) comprises: a first image acquisition module (31) electrically connected to the control system and an adjustment mechanism (32); The first image acquisition module (31) is used to acquire an image of a wafer on the adjustment mechanism (32); The control system adjusts the orientation of the straight edge of the wafer and the center of the wafer to a preset position according to the wafer image control adjustment mechanism (32).

3. The wafer double-sided lithography equipment according to claim 2, characterized in that: The adjustment mechanism (32) comprises: an x-direction moving mechanism (321), a y-direction moving mechanism (322), a rotating fixture (323) and a rotating driver (324); The x-direction moving mechanism (321) is installed on the y-direction moving mechanism (322); The rotating fixture (323) and the rotating driver (324) are installed on the x-direction moving mechanism (321); The rotary driver (324) is used to drive the rotary fixture (323) to rotate.

4. The wafer double-sided lithography equipment according to claim 1, characterized in that: The wafer double-sided photolithography equipment further comprises a leveling device (9); The leveling device (9) comprises a movable seat (91) and a telescopic arm (92) mounted on the movable seat (91); A leveling baffle (93) is provided at the end of the telescopic arm (92).

5. The wafer double-sided lithography equipment according to claim 1, characterized in that: The material receiving and adjusting device (6) comprises: Mounting plate (61); At least three of the top rods (62) are vertically arranged on the mounting plate (61), and have suction nozzles (621) arranged at their top ends; The lifting drive (63) is used to drive the mounting plate (61) to rise, so as to drive the push rod (62) to pass through the corresponding through hole (411) on the wafer processing carrier (41), so as to lift the wafer off the surface of the wafer processing carrier (41) so that the wafer can be turned over by the wafer grabbing device (2).

6. The wafer double-sided lithography equipment according to claim 5, characterized in that: The wafer double-sided photolithography equipment further comprises a second image acquisition module (64) electrically connected to the control system and used for acquiring an image of the wafer after turning over.

7. The wafer double-sided lithography equipment according to claim 1, characterized in that: The wafer detection device (7) comprises: Box (71); The lateral movement mechanism (72) is arranged in the box body (71) and has a rotating carrier (73) arranged thereon; the rotating carrier (73) extends out of the upper cover of the box body (71) and is used for adsorbing wafers; A first detection mechanism (74) is arranged above the box (71) and is used to detect a MARK point on the front side of the wafer; The second detection mechanism (75) is arranged in the box (71) and is used to detect the MARK point on the back surface of the wafer.

8. The wafer double-sided lithography equipment according to claim 1, characterized in that: The wafer grabbing device (2) is provided with a wafer identification module (21) for detecting the wafer on the wafer carrier (11).

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