Heat dissipation module with good heat conduction effect
By introducing a thermally conductive mounting plate, a detachable heat dissipation fan and multiple sets of card blocks into the heat dissipation module, the problem of uneven heat dissipation of heat sources in the vertical direction in the prior art is solved, and more efficient heat dissipation effect and overall uniform temperature are achieved.
Patent Information
- Application Number
- CN202421469163.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-06-25
AI Technical Summary
When handling vertical heat sources, the use of a single heat sink leads to poor overall temperature uniformity.
A heat dissipation module including a thermally conductive mounting plate, a removable heat dissipation fan and multiple sets of card blocks are designed. Through the combination of the heat dissipation fan and multiple sets of card blocks, the heat dissipation area and efficiency are increased, and uniform heat dissipation of the vertical heat source is achieved.
This design significantly improves the heat dissipation effect of the heat dissipation module, ensures the overall uniform temperature of the electronic device at the vertical heat source, and extends the service life of the device.
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Figure CN222762466U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of heat dissipation mechanisms, and in particular relates to a heat dissipation module with good heat conduction effect. Background Art
[0002] As electronic products are updated and replaced, their performance gradually improves, and the power requirements for electronic devices such as graphics cards also gradually increase; when electronic devices are working, the heat they generate needs to be dissipated as quickly as possible.
[0003] For example, the patent with application number 202121238109.0, the utility model discloses a heat dissipation module, which relates to the technical field of heat dissipation mechanisms; it includes first fins and second fins arranged in an staggered manner; the area of the first fins is smaller than the area of the second fins; the technical solution provided by the utility model is used to achieve the technical effect of improving the heat dissipation performance of the heat dissipation module without increasing the heat dissipation area of the fins.
[0004] However, there are some problems with the existing technology: However, in electronic devices, for the uniformity of the heat source in the vertical direction, the existing heat dissipation for the heat source in the vertical direction only uses a single heat sink for heat dissipation, which cannot achieve the overall uniform temperature effect. Therefore, we propose a heat dissipation module with good thermal conductivity. Utility Model Content
[0005] In view of the problems existing in the above-mentioned technologies, the utility model provides a heat dissipation module with good thermal conductivity, which solves the problem of temperature uniformity for vertical heat sources in electronic equipment. The existing heat dissipation for vertical heat sources only uses a single heat sink for heat dissipation, which cannot achieve the overall temperature uniformity effect.
[0006] The utility model is implemented as follows: a heat dissipation module with good thermal conductivity includes a heat-conducting mounting plate, a detachable heat dissipation fan is connected to the middle of the upper end surface of the heat-conducting mounting plate, a plurality of groups of card blocks are connected to the upper end of the heat-conducting mounting plate, the card blocks are located on the left and right sides of the heat dissipation fan, and heat sinks are clamped between the card blocks.
[0007] As a preferred embodiment of the present invention, a plurality of threaded barrels are connected to the upper end surface of the heat-conducting mounting plate, and the threaded barrels are arranged in a group of four in a rectangular shape.
[0008] As a preferred embodiment of the utility model, the outer wall of the heat dissipation fan is integrally formed with a plurality of connecting ears, the connecting ears correspond to the threaded tube, the lower ends of the connecting ears are connected to a positioning tube, and the positioning tube is sleeved on the outside of the threaded tube.
[0009] As a preferred embodiment of the present invention, a threaded shaft is provided inside the connecting ear, and the threaded shaft extends into the interior of the positioning cylinder and is threadedly connected to the threaded cylinder.
[0010] As a preferred embodiment of the present invention, a groove is provided on an outer wall on one side corresponding to the block, and interconnected limiting holes are provided on inner walls on both the left and right sides of the groove.
[0011] As a preferred embodiment of the present invention, both the front and rear outer walls of the heat sink are connected with connection blocks that fit into the groove.
[0012] As a preferred embodiment of the utility model, the left and right outer walls of the connecting block are provided with step holes, the step holes correspond to the limiting holes, a telescopic block is connected to the inside of the step hole, one end of the telescopic block located inside the step hole is connected to a spring, the other end of the spring is connected to the inner wall of the step hole, the other end of the telescopic block extends to the outside of the step hole, and the end of the telescopic block located outside the step hole extends into the limiting hole.
[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0014] 1. The utility model improves the heat dissipation effect of the heat dissipation module by adding a heat dissipation fan, and facilitates the connection of multiple heat sinks through the correspondingly arranged multiple groups of card blocks, further improving the heat dissipation effect of the heat dissipation module, thereby achieving an overall uniform temperature effect;
[0015] 2. The utility model connects the positioning cylinder with the threaded cylinder, and uses the threaded shaft to connect with the threaded cylinder, which is convenient for disassembly and installation of the heat dissipation fan, and convenient for cleaning and replacement of the heat dissipation fan;
[0016] 3. The utility model extends the connecting block connected to the front and rear sides of the heat sink into the groove, so that the telescopic block contacts the inner wall of the groove, and drives the spring to contract toward the step hole under the influence of force. When the step hole corresponds to the limit hole, the telescopic block is not affected by the force, and the spring rebounds, driving the telescopic block to extend into the limit hole, limiting and fixing the connecting block, which is convenient for disassembly and installation of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of a top view structure provided by an embodiment of the utility model;
[0018] Figure 2 It is a top view schematic diagram of a heat-conducting mounting plate provided by an embodiment of the utility model;
[0019] Figure 3 It is a front view schematic diagram of the heat dissipation fan provided by an embodiment of the utility model;
[0020] Figure 4 It is a cross-sectional schematic diagram of a card block provided in an embodiment of the utility model;
[0021] Figure 5 It is a cross-sectional schematic diagram of a connection block provided in an embodiment of the utility model.
[0022] In the figure: 1. thermal conductive mounting plate; 2. heat sink; 3. heat dissipation fan; 11. clamping block; 12. threaded barrel; 21. connecting block; 31. connecting ear; 32. threaded shaft; 33. positioning barrel; 111. groove; 112. limiting hole; 211. telescopic block; 212. step hole; 213. spring. DETAILED DESCRIPTION
[0023] In order to further understand the content, features and effects of the utility model, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.
[0024] The structure of the utility model is described in detail below in conjunction with the accompanying drawings.
[0025] like Figure 1 As shown, a heat dissipation module with good thermal conductivity provided by an embodiment of the utility model comprises a heat-conducting mounting plate 1, a detachable heat dissipation fan 3 is connected to the middle of the upper end surface of the heat-conducting mounting plate 1, a plurality of groups of card blocks 11 are connected to the upper end of the heat-conducting mounting plate 1, the card blocks 11 are located on the left and right sides of the heat dissipation fan 3, and heat sinks 2 are clamped between the card blocks 11; the heat dissipation effect of the heat dissipation module is improved by adding the heat dissipation fan 3, and the correspondingly arranged plurality of card blocks 11 facilitates the connection of a plurality of heat sinks 2, thereby further improving the heat dissipation effect of the heat dissipation module.
[0026] like Figure 2 and Figure 3 As shown, the upper end surface of the heat-conducting mounting plate 1 is connected to a plurality of threaded barrels 12, and the threaded barrels 12 are arranged in a rectangular shape in a group of four; the outer wall of the heat dissipation fan 3 is integrally formed with a plurality of connecting ears 31, and the connecting ears 31 correspond to the threaded barrels 12, and the lower ends of the connecting ears 31 are connected to positioning barrels 33, and the positioning barrel 33 is sleeved on the outside of the threaded barrel 12; a threaded shaft 32 is provided inside the connecting ear 31, and the threaded shaft 32 extends into the interior of the positioning barrel 33 and is threadedly connected to the threaded barrel 12; the positioning barrel 33 is connected to the threaded barrel 12, and the threaded shaft 32 is threadedly connected to the threaded barrel 12, so that the heat dissipation fan 3 is easy to disassemble and install, and the heat dissipation fan 3 is convenient to clean and replace.
[0027] like Figure 4 and Figure 5As shown, a groove 111 is provided on the outer wall corresponding to one side of the block 11, and the inner walls on the left and right sides of the groove 111 are provided with communicating limiting holes 112; the outer walls on the front and rear sides of the heat sink 2 are connected with connecting blocks 21 that fit with the groove 111; the outer walls on the left and right sides of the connecting block 21 are provided with step holes 212, and the step holes 212 correspond to the limiting holes 112, and the inside of the step holes 212 is connected with a telescopic block 211, and one end of the telescopic block 211 located inside the step hole 212 is connected with a spring 213, and the other end of the spring 213 is connected to the inner wall of the step hole 212, and the telescopic block 2 The other end of 11 extends to the outside of the step hole 212, and one end of the telescopic block 211 located outside the step hole 212 extends into the limiting hole 112; the connecting block 21 connected to the front and rear sides of the heat sink 2 extends into the groove 111, so that the telescopic block 211 contacts the inner wall of the groove 111, and drives the spring 213 to shrink into the step hole 212 under the influence of force. When the step hole 212 corresponds to the limiting hole 112, the telescopic block 211 is not affected by the force, and the spring 213 rebounds, driving the telescopic block 211 to extend into the limiting hole 112, limiting and fixing the connecting block 21, so as to facilitate the disassembly and installation of the heat sink 2.
[0028] Working principle:
[0029] When in use, first install the heat dissipation fan 3 on the heat-conducting mounting plate 1, and then install multiple heat sinks 2 on the heat-conducting mounting plate 1. The heat sink 2 extends into the groove 111 through the connecting blocks 21 connected on the front and rear sides, so that the telescopic block 211 contacts the inner wall of the groove 111, and drives the spring 213 to shrink into the step hole 212 under the influence of force. When the step hole 212 corresponds to the limiting hole 112, the telescopic block 211 is not affected by the force, and the spring 213 rebounds, driving the telescopic block 211 to extend into the limiting hole 112, and fixes the connecting block 21. After the installation is completed, the heat dissipation module is installed on the host of the electronic product and powered on. When the electronic product is working, the heat dissipation fan 3 operates according to the opening of the electronic product, starts heat dissipation processing, improves the heat dissipation effect, and cooperates with the use of multiple heat sinks 2 to achieve an overall uniform temperature effect inside the host.
[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation module with good thermal conductivity, comprising a thermally conductive mounting plate (1), characterized in that: A detachable heat dissipation fan (3) is connected to the middle of the upper end surface of the heat-conducting mounting plate (1), and a plurality of groups of card blocks (11) are connected to the upper end of the heat-conducting mounting plate (1), wherein the card blocks (11) are located on the left and right sides of the heat dissipation fan (3), and heat sinks (2) are clamped between the card blocks (11).
2. A heat dissipation module with good thermal conductivity as claimed in claim 1, characterized in that: The upper end surface of the heat-conducting mounting plate (1) is connected to a plurality of threaded barrels (12), and the threaded barrels (12) are arranged in a group of four in a rectangular shape.
3. A heat dissipation module with good thermal conductivity as claimed in claim 1, characterized in that: The outer wall of the heat dissipation fan (3) is integrally formed with a plurality of connecting ears (31), the connecting ears (31) correspond to the threaded cylinder (12), the lower end of the connecting ears (31) is connected to a positioning cylinder (33), and the positioning cylinder (33) is sleeved on the outside of the threaded cylinder (12).
4. A heat dissipation module with good thermal conductivity as claimed in claim 3, characterized in that: A threaded shaft (32) is provided inside the connecting ear (31), and the threaded shaft (32) extends into the interior of the positioning cylinder (33) and is threadedly connected to the threaded cylinder (12).
5. A heat dissipation module with good thermal conductivity as claimed in claim 1, characterized in that: A groove (111) is provided on an outer wall corresponding to one side of the clamping block (11), and interconnected limiting holes (112) are provided on inner walls on both the left and right sides of the groove (111).
6. A heat dissipation module with good thermal conductivity as claimed in claim 1, characterized in that: The outer walls on both the front and rear sides of the heat sink (2) are connected with connection blocks (21) that fit into the grooves (111).
7. A heat dissipation module with good thermal conductivity as claimed in claim 6, characterized in that: The outer walls on both sides of the connecting block (21) are provided with step holes (212), the step holes (212) correspond to the limiting holes (112), the inside of the step holes (212) is connected with a telescopic block (211), one end of the telescopic block (211) located inside the step hole (212) is connected with a spring (213), the other end of the spring (213) is connected to the inner wall of the step hole (212), the other end of the telescopic block (211) extends to the outside of the step hole (212), and the end of the telescopic block (211) located outside the step hole (212) extends into the limiting hole (112).
Citation Information
Patent Citations
Heat dissipation module
CN214852486U