Inductor structure with heat dissipation function

By setting multiple inductors inside the mounting housing and sealing and dissipating heat using a thermally conductive silicone layer, the existing inductors have been solved, and an efficient, low-cost and excellent heat dissipation inductor structure is achieved.

CN222762741UActive Publication Date: 2025-04-15GUANGDONG ZHONGXILI IND CO LTD
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Patent Information

Application Number
CN202421469747.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-25
Publication Date
2025-04-15
Estimated Expiration
2034-06-25

AI Technical Summary

Technical Problem

Existing inductors are less efficient when used, have high production costs and poor heat dissipation effect.

Method used

By setting several inductors inside the mounting housing and setting gaps between the inductors and between the inductors and the mounting housing for insulation, a thermally conductive silicone layer is used for sealing and heat dissipation.

Benefits of technology

It realizes a high-efficiency and low-cost inductor structure, and also has excellent heat dissipation effect, stable electrical properties, high insulation grade, waterproof, moisture-proof, dust-proof, shock-proof and other properties.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of inductors, in particular to an inductor structure with a heat dissipation function. Comprising a mounting shell, an inductor and a potting layer, a plurality of inductors are arranged in the mounting shell, the plurality of inductors are insulated from one another, the plurality of inductors and the mounting shell are insulated from one another, and a potting layer is arranged in the mounting shell and outside the plurality of inductors; the wire ends of the plurality of inductors extend out of the mounting shell; the plurality of inductors are arranged in the mounting shell, the placement shell is used for insulation, and the encapsulation layer is used for sealing and heat dissipation, so that the inductor structure is high in efficiency, low in production cost, good in heat dissipation effect, stable in electrical property, high in insulation grade, waterproof, moistureproof, dustproof, shockproof and the like, and meanwhile, the structure is simple and convenient to operate. And the inductor is hermetically mounted through the encapsulation layer, so that the noise of the inductor can be greatly reduced, and the use effect of the inductor is further improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of inductors, in particular to an inductor structure with a heat dissipation function. Background Art

[0002] Inductance is a property of a closed loop and a physical quantity. When current passes through a coil, a magnetic field is induced in the coil, and the induced magnetic field generates an induced current to resist the current passing through the coil. It is a circuit parameter that describes the induced electromotive force effect caused in the coil or in another coil due to the change of coil current. Inductance is a general term for self-inductance and mutual inductance. The device that provides inductance is called an inductor.

[0003] At present, the existing inductors are generally single structures when in use (this inductor can be applied to solar energy, wind power inverter power supply, etc.), provided with a mounting shell, and the inductor is installed inside the mounting shell. However, this type of inductor is not only inefficient when in use and has a high production cost (one inductor is equipped with one mounting shell), but also has poor heat dissipation effect (in order to enhance the waterproof, moisture-proof, dust-proof and other effects of the inductor, the mounting shell needs to be sealed, but the more sealed the mounting shell is, the worse the heat dissipation effect is); based on this, we propose an inductor structure with heat dissipation function. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides an inductor structure with a heat dissipation function. After being improved, the inductor can effectively solve the problems raised in the above background technology.

[0005] The technical solution of the utility model is:

[0006] An inductor structure with heat dissipation function comprises a mounting shell, an inductor and a potting layer;

[0007] A plurality of inductors are arranged inside the installation shell, gaps are arranged between adjacent inductors and between the inductors and the installation shell, insulation is arranged between the plurality of inductors and between the plurality of inductors and the installation shell, a potting layer is arranged inside the installation shell and outside the plurality of inductors, and wire ends of the plurality of inductors extend outside the installation shell.

[0008] Furthermore, the encapsulation layer is a thermally conductive silicone layer.

[0009] Furthermore, a placement shell is provided inside the installation shell and corresponding to each inductor, and the inductor is installed inside the placement shell.

[0010] Furthermore, the material of the placement shell is PBT, the material of the installation shell is aluminum, and the thickness of the installation shell is 2 mm.

[0011] Furthermore, the number of the inductors is five, and they are arranged from left to right.

[0012] Furthermore, the wires of the five inductors are bundled together inside the mounting housing and extend out from one of the inductors.

[0013] Furthermore, the installation shell and the placement shell are both opened on the top surface and are arranged in a rectangular structure.

[0014] The beneficial effects of the utility model are:

[0015] Compared with the prior art, the utility model has a plurality of inductors arranged inside the mounting shell, and the shell is placed for insulation, and the potting layer is used for sealing and heat dissipation, so that the inductor structure is not only more efficient and has lower production costs, but also has better heat dissipation effect, electrical stability, high insulation level, waterproof, moisture-proof, dust-proof, shock-proof and other properties, and also has excellent temperature stability, and can work for a long time at a temperature of -45°C to 130°C; in addition, the inductor is sealed and installed by the potting layer, which can greatly reduce its noise, thereby improving the use effect of the inductor, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model.

[0017] In the figure, 1. Install the shell; 2. Inductor; 3. Potting layer; 4. Place the shell; 5. Wire. DETAILED DESCRIPTION

[0018] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings:

[0019] like Figure 1 As shown,

[0020] An inductor structure with heat dissipation function, comprising a mounting shell 1, an inductor 2 and a potting layer 3; a plurality of inductors 2 are arranged inside the mounting shell 1, gaps are arranged between adjacent inductors 2 and between the inductor 2 and the mounting shell 1, a plurality of inductors 2 and a plurality of inductors 2 and the mounting shell 1 are insulated, a potting layer 3 is arranged inside the mounting shell 1 and outside the plurality of inductors 2, and the potting layer 3 is a heat-conducting silicone layer; the ends of the wires 5 of the plurality of inductors 2 extend to the outside of the mounting shell 1; In this embodiment, by arranging a plurality of inductors 2 inside the mounting housing 1, one mounting housing 1 can correspond to the arrangement of a plurality of inductors 2, and the cost can be greatly reduced. Moreover, the installation of a plurality of inductors 2 can also save subsequent use space, and greatly improve the efficiency of the structure of the inductor 2. In addition, by adopting the potting layer 3 for sealing and fixing, the potting layer 3 is a thermally conductive silicone layer, and the thermally conductive silicone has better insulation and thermal conductivity, thereby greatly improving the heat dissipation effect of the inductor 2, and even the combination of a plurality of inductors 2 can effectively and timely discharge the generated heat.

[0021] Since the potting layer 3 has a good sealing effect, it can achieve better waterproof, moisture-proof and dust-proof effects. In addition, multiple inductors 2 are installed inside a mounting shell 1 and are sealed and fixed by the potting layer 3, so that they have better shockproof performance. Based on the sealing structure of the mounting shell 1 and the potting layer 3, the inductor 2 also has excellent temperature stability and can work for a long time at a temperature of -45°C to 130°C. Moreover, due to the good sealing effect of the potting layer 3, the noise generated by it is greatly reduced, and the noise reduction effect is good.

[0022] As a preferred embodiment, a placement shell 4 is provided inside the installation shell 1 and corresponding to each inductor 2. The material of the placement shell 4 is PBT, and the inductor 2 is installed inside the placement shell 4. By providing the placement shell 4, and the material of the placement shell 4 is PBT, which has insulation and high temperature resistance properties, adjacent inductors 2 and between the inductor 2 and the installation shell 1 have a higher insulation level, thereby ensuring the use effect and quality of each inductor 2.

[0023] As a preferred embodiment, the material of the installation shell 1 is aluminum, and the thickness of the installation shell 1 is 2 mm.

[0024] As a preferred implementation, the number of the inductors 2 is five, arranged from left to right; in order to meet different power requirements, the number of the inductors 2 can also be set to be less than five or greater than five.

[0025] As a preferred embodiment, the wires 5 of the five inductors 2 are bundled together inside the mounting shell 1 and extend out from one of the inductors 2; the purpose of this structural design is: before potting, the wires 5 are bundled and placed inside the mounting shell 1, and after potting, the wires 5 can be fixed, and the connection between the wires 5 and the inductor 2 is sealed and fixed, which can ensure the stability of the connection and is not prone to connection failures. Moreover, this part of the wires 5 can also be well protected, extending the service life of the wires 5; in addition, under this design, each wire 5 is extended in one position, avoiding the disorder of the wires 5 and enabling better connection and installation with external components; in the present application, several wires 5 extend from the first inductor 2.

[0026] As a preferred embodiment, the installation shell 1 and the placement shell 4 are both opened on the top and are arranged in a rectangular structure; under this structure, the volume of the inductor 2 can be further reduced, so that it can be installed better and its adaptability can be enhanced.

[0027] In the present application, a number of arranged placement shells 4 are first placed inside the installation shell 1, and then the inductor 2 is placed inside the placement shell 4. One end of the wire 5 of each inductor 2 is tied together and placed inside the installation shell 1, and the other end extends out of the installation shell 1. Then, glue is poured, and after the thermal conductive silicone is solidified, a potting layer 3 is formed.

[0028] Note: There are five inductors 2 in total, and all inductors 2 extend from the designated area on the left.

[0029] Starting from the outlet position of inductor 2, from left to right, there are inductors 2 No. 1, 2, 3, 4, and 5. The models of inductors 2 are as follows:

[0030] Serial number 1 2 3 4 5 Inductor Model PV-01 PV-01 DCDC-01 INV-01 INV-01 Inductor cable length (mm) 600 600 700 700 700 Line Marking PV1 PV1 DCDC INV1 INV2

[0031] It should be pointed out that the main problems in the prior art are: the existing inductor is generally a single structure when in use, which results in low efficiency and high production cost when in use, and poor heat dissipation effect;

[0032] Therefore, after the improvement of the present application, by arranging a plurality of inductors 2 inside the mounting shell 1, and insulating by placing a shell 4, and sealing and heat dissipating by a potting layer 3, the structure of the inductor 2 is not only more efficient and has lower production costs, but also has better heat dissipation effect while having electrical stability, high insulation level, waterproof, moisture-proof, dust-proof, shock-proof and other properties. At the same time, the inductor 2 is sealed and installed by the potting layer 3, which can greatly reduce its noise, thereby improving the use effect of the inductor 2.

[0033] The above implementation modes are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary engineering and technical personnel in the field shall fall within the protection scope determined by the claims of the present invention.

Claims

1. An inductor structure with heat dissipation function, characterized in that: Including installing the housing, inductor and potting layer; A plurality of inductors are arranged inside the installation shell, gaps are arranged between adjacent inductors and between the inductors and the installation shell, insulation is arranged between the plurality of inductors and between the plurality of inductors and the installation shell, a potting layer is arranged inside the installation shell and outside the plurality of inductors, and wire ends of the plurality of inductors extend outside the installation shell.

2. The inductor structure with heat dissipation function according to claim 1, characterized in that: The potting layer is a thermally conductive silica gel layer.

3. The inductor structure with heat dissipation function according to claim 2, characterized in that: A placement shell is arranged inside the installation shell and corresponding to each inductor, and the inductor is installed inside the placement shell.

4. The inductor structure with heat dissipation function according to claim 3, characterized in that: The material of the placement shell is PBT, the material of the installation shell is aluminum, and the thickness of the installation shell is 2 mm.

5. The inductor structure with heat dissipation function according to claim 4, characterized in that: There are five inductors, which are arranged from left to right.

6. The inductor structure with heat dissipation function according to claim 5, characterized in that: Lead wires of the five inductors are bundled together inside the mounting housing and extend out from one of the inductors.

7. The inductor structure with heat dissipation function according to claim 6, characterized in that: The installation shell and the placement shell are both opened on the top surface and are arranged in a rectangular structure.