Semiconductor processing equipment
By setting up a driving module in the semiconductor processing equipment to control the movement of the material pickup parts, the problem of large space occupancy of up and down of the material box is solved, space saving and equipment simplification are achieved, stability is improved and development costs are reduced.
Patent Information
- Application Number
- CN202420190497.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-01-26
AI Technical Summary
In existing semiconductor processing equipment, the material box needs to be lifted up and down to cooperate with the operation of the material collection mechanism, which takes up a large space and increases the design complexity and development cost of the equipment.
By setting up a driving module in the semiconductor processing equipment, the material pickup and placement of the wafer ring is realized, reducing the up and down lifting structure of the material box and saving space.
It effectively reduces the space occupied by the material box, saves the installation space and development costs of the equipment, and improves the design simplicity and stability of the equipment, and reduces the possibility of wafer ring falling off.
Smart Images
Figure CN222762929U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing device. Background Art
[0002] At present, semiconductor processing equipment includes structures such as a material box and a material picking mechanism. When the wafer ring is subjected to solid crystal processing, the material picking mechanism takes the wafer ring from the material box and moves it to the material placement position for processing. After the processing is completed, the material picking mechanism picks it up and puts it back into the material box. In the process of picking up and putting back the wafer ring, the material box needs to be lifted up and down to complete the material picking and placing. Since the up and down lifting setting of the material box requires a large space, it is not convenient for other structural settings and installations of the semiconductor processing equipment. Therefore, a larger installation space is required, which increases the floor space and development cost of the semiconductor processing equipment. Utility Model Content
[0003] The main purpose of the utility model is to provide a semiconductor processing equipment, which aims to adjust the up and down lifting of the material picking part by setting a driving module to facilitate the material picking part to pick up the wafer ring, reduce the structure of the material box lifting up and down, and reduce the space occupied by the material box.
[0004] To achieve the above-mentioned purpose, the semiconductor processing equipment proposed by the utility model includes:
[0005] frame;
[0006] A material box, fixed to the frame, the material box is provided with a plurality of receiving cavities spaced apart in the up-down direction along the material box, the receiving cavities being used to receive wafer rings;
[0007] A material taking device, arranged on the frame, comprising a driving module and a material taking member drivingly connected to the driving module; and
[0008] The control system is used to control the driving module so that the material taking component places the wafer ring in the receiving cavity.
[0009] Optionally, the semiconductor processing equipment also includes a first sensor, which is arranged on the material picking part to follow the movement of the material picking part, and the first sensor has a first detection area for detecting the wafer ring. The material picking part has a first stroke. In the first stroke, the material picking part is used to pick up the wafer ring to transport the wafer ring to the receiving cavity. The first detection area is used to detect the wafer ring picked up by the material picking part. The first sensor feeds back a first signal to the control system. In the first stroke, when the control system determines that the material picking part has not picked up the wafer ring according to the first signal, the control system controls the material picking part to stop moving.
[0010] Optionally, the first detection area and a picking area of the material picking component for picking up the wafer ring are set at the same height, so as to detect the wafer ring picked up by the material picking component.
[0011] Optionally, the driving module includes a first driving member, which includes a first slide rail and a first driving motor driving the material picking member, the material picking member is slidably arranged on the first slide rail, and the first driving motor drives the material picking member to slide on the first slide rail in the up and down directions.
[0012] Optionally, the driving module also includes a second driving member, which includes a second slide rail and a second driving motor driving the first slide rail, the first slide rail is slidably arranged on the second slide rail, and the second driving motor drives the first slide rail to slide on the second slide rail along the first direction.
[0013] Optionally, both ends of the second slide rail are provided with a first limiting member, and the first slide rail can slide to abut against the first limiting member.
[0014] Optionally, the driving module also includes a third driving component, which includes a third slide rail provided on the frame and a third driving motor driving the second slide rail, the second slide rail is slidably provided on the third slide rail, and the third driving motor drives the second slide rail to slide on the third slide rail along a second direction, and the first direction is different from the second direction.
[0015] Optionally, both ends of the third slide rail are provided with second limit members, and the second slide rail can slide until it abuts against the second limit member.
[0016] Optionally, the semiconductor processing equipment also includes a second sensor, which is arranged on the material picking part to follow the movement of the material picking part. The second sensor has a second detection area arranged above the material picking part. During the lifting and lowering process of the second sensor, the second detection area can pass through the plurality of receiving chambers in sequence. The second sensor feeds back a second signal to the control system. In the first stroke, if the control system determines that the receiving chamber where the second detection area is located is the first receiving chamber that does not contain the wafer ring according to the second signal, the control system controls the material picking part to send the picked-up wafer ring into the first receiving chamber. In the first stroke, if the control system determines that the receiving chamber where the second detection area is located is the second receiving chamber that contains the wafer ring according to the second signal, the control system controls the material picking part not to send the picked-up wafer ring into the second receiving chamber.
[0017] Optionally, the semiconductor processing equipment also includes an alarm device connected to the control system, and the alarm device is used to issue a warning when the control system determines according to the first signal in the first stroke that the material picking piece has not picked up the wafer ring; and / or, is used to issue a warning when the control system determines according to the second signal in the first stroke that the receiving cavity where the second detection area is located is a second receiving cavity that receives the wafer ring.
[0018] In the technical solution of the utility model, the semiconductor processing equipment includes a frame, a material picking device, a material box, and a control system. The material box is fixed to the frame, and the material box has a plurality of receiving cavities spaced apart along the up and down directions, and the receiving cavities are used to receive wafer rings; the material picking device is arranged on the frame, and the material picking device includes a material picking component for picking up the wafer ring and a driving module for driving the material picking component; the control system is used to control the driving module so that the material picking component moves along the up and down directions to pick up or unload the wafer ring. In this way, the material box is fixedly set on the frame to store wafer rings, and the control system controls the driving module to drive the material picking part to move in the up and down direction on the semiconductor processing equipment to adjust the material picking part in the up and down direction, so as to facilitate the material picking part to pick up the wafer ring or put the wafer ring into the material box for storage. With this arrangement, there is no need to lift the material box up and down to cooperate with the material picking part to pick up and put back the wafer ring, which reduces the space occupied by the material box and saves the installation space of the frame under the material box, which is beneficial to the other structural settings and installations of the semiconductor processing equipment, thereby effectively reducing the design size of the semiconductor processing equipment and saving the development cost of the semiconductor processing equipment. It is worth mentioning that the material box does not participate in the movement, which effectively ensures the stability of the wafer ring in the material box and reduces the possibility of the wafer ring falling off due to the movement of the material box. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0020] Figure 1 It is a structural schematic diagram of an embodiment of the semiconductor processing equipment of the utility model;
[0021] Figure 2 for Figure 1 A partial enlarged view of point A in the middle.
[0022] Description of Figure Numbers:
[0023]
[0024] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0027] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or abutment, and it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0029] At present, semiconductor processing equipment includes structures such as a material box and a material picking mechanism. When the wafer ring is subjected to solid crystal processing, the material picking mechanism takes out the wafer ring from the material box and moves it to the material placement position for processing. After the processing is completed, the material picking mechanism picks it up and puts it back into the material box. In the process of picking up and putting back the wafer ring, the material box needs to be lifted up and down to complete the material picking and placing. Because the lifting and lowering of the material box requires a large space, it is not convenient for other structural settings and installations of the semiconductor processing equipment. Therefore, a larger installation space needs to be set, which increases the floor space and development cost of the semiconductor processing equipment. To this end, the utility model proposes a semiconductor processing equipment that aims to adjust the lifting and lowering of the material picking part by setting a drive module, so that the material picking part can pick up the wafer ring, reduce the structure of the lifting and lowering of the material box, and reduce the space occupied by the material box.
[0030] Reference Figures 1 to 2 In one embodiment of the utility model, the semiconductor processing equipment includes a frame 100, a material picking device 300, a material box 200, and a control system 500. The material box 200 is fixed to the frame 100, and the material box 200 has a plurality of accommodating cavities 210 arranged at intervals along the up-down direction, and the accommodating cavities 210 are used to accommodate wafer rings; the material picking device 300 is arranged on the frame 100, and the material picking device 300 includes a material picking member 310 for picking up the wafer ring and a driving module for driving the material picking member 310; the control system 500 is used to control the driving module so that the material picking member 310 moves along the up-down direction to pick up or unload the wafer ring, and the driving module drives the material picking member 310 to move along the up-down direction. In this way, the material box 200 is fixedly set on the frame 100 for storing wafer rings, and the control system 500 controls the driving module to drive the material picking part 310 to move in the up and down direction on the semiconductor processing equipment to adjust the material picking part 310 in the up and down direction, so as to facilitate the material picking part 310 to pick up the wafer ring or put the wafer ring into the material box 200 for storage. With this arrangement, there is no need for the material box 200 to rise and fall to cooperate with the material picking part 310 to pick up and put back the wafer ring, which reduces the space occupied by the material box 200 and saves the installation space of the frame 100 below the material box 200, which is beneficial to the other structural settings and installations of the semiconductor processing equipment, thereby effectively reducing the design size of the semiconductor processing equipment and saving the development cost of the semiconductor processing equipment. It is worth mentioning that the material box 200 does not participate in the movement, which effectively ensures the stability of the wafer ring in the material box 200 and reduces the possibility of the wafer ring falling off due to the movement of the material box 200.
[0031] In another embodiment, there are many ways to set up the material box 200. The material box 200 can also be detachably connected to the frame 100, but it does not participate in the lifting and lowering movement of the material taking device 300. The material box 200 also does not occupy the space under the frame 100, and is conducive to the installation and removal of the material box 200.
[0032] Optionally, in one embodiment, the semiconductor processing equipment also includes a first sensor 400, which is arranged on the material picking member 310 to follow the movement of the material picking member 310. The first sensor 400 has a first detection area for detecting a wafer ring. The material picking member 310 has a first stroke. In the first stroke, the material picking member 310 is used to pick up a wafer ring to transport the wafer ring to the accommodating chamber 210. The first detection area is used to detect the wafer ring picked up by the material picking member 310. The first sensor 400 feeds back a first signal to the control system 500. In the first stroke, when the control system 500 determines that the material picking member 310 has not picked up the wafer ring based on the first signal, the control system 500 controls the material picking member 310 to stop moving. In this way, the first sensor 400 is set to detect the wafer ring picked up by the material picking part 310. When the material picking part 310 picks up the wafer ring and places it in the picking area of the material picking part 310, the wafer ring will be in the first detection area for detection, and the first sensor 400 moves with the material picking part 310. Before the wafer ring picked up by the material picking part 310 is placed in the corresponding receiving cavity 210, the first sensor 400 will continue to detect the wafer ring. When the material picking part 310 is performing the first stroke operation, if the first sensor 400 detects the wafer ring, it means that the wafer ring picked up by the material picking part 310 has not left the picking area of the material picking part 310, and the first sensor 400 moves to the control The control system 500 sends a first signal, and the control system 500 controls the material picking component 310 to continue running according to the signal fed back by the first sensor 400. If the first sensor 400 does not detect the wafer ring when the material picking component 310 is performing the first stroke operation, it means that the wafer ring picked up by the material picking component 310 has left the picking area of the material picking component 310, and the first sensor 400 transmits a first signal to the control system 500. The control system 500 controls the material picking component 310 to stop running according to the first signal fed back by the first sensor 400, thereby reducing the possibility of accumulation of fallen wafer rings affecting the normal operation of semiconductor processing equipment, and also effectively reducing the cost caused by damage to the wafer rings due to falling.
[0033] In another embodiment, there are many ways to configure the first sensor 400 , which may be an infrared sensor or a photoelectric sensor, as long as it can complete the detection of the wafer ring picked up by the material picking component 310 .
[0034] Optionally, in one embodiment, the first detection area and the pickup area of the pick-up member 310 for picking up the wafer ring are set at the same height, so as to detect the wafer ring picked up by the pick-up member 310. In this way, the first detection area is set corresponding to the pickup area of the pick-up member 310, so that the wafer ring picked up by the pick-up member 310 is always in the first detection area and detected by the first sensor 400, thereby improving the accuracy of the detection result of the first sensor 400.
[0035] In another embodiment, there are many ways to set the position of the first sensor 400. The first sensor 400 can also be set above the material picking component 310, and the first detection area is projected into the picking area of the material picking component 310 to detect the wafer ring picked up by the material picking component 310.
[0036] Optionally, in one embodiment, the driving module includes a first driving member 320, the first driving member 320 includes a first slide rail 321 and a first driving motor 322 driving the material picking member 310, the material picking member 310 is slidably arranged on the first slide rail 321, and the first driving motor 322 drives the material picking member 310 to slide along the first slide rail 321 in the up-down direction. In this way, the first driving motor 322 drives the material picking member 310 to slide along the first slide rail 321 in the up-down direction, so as to adjust the wafer ring picked up by the material picking member 310 in the up-down direction and align it with the corresponding receiving cavity 210.
[0037] In another embodiment, the structure of the first driving member 320 can be various, and can also be a scissor-type lift, as long as it can achieve the lifting function of the material picking member 310.
[0038] Optionally, in one embodiment, the driving module further includes a second driving member 330, the second driving member 330 includes a second slide rail 331 and a second driving motor 332 drivingly connected to the first slide rail 321, the first slide rail 321 is slidably arranged on the second slide rail 331, and the second driving motor 332 drives the first slide rail 321 to slide on the second slide rail 331 along the first direction. In this way, the first slide rail 321 is used to slide and adjust the first slide rail 321 in the first direction, the first slide rail 321 drives the material picking member 310 to move in the first direction, and the material picking member 310 is adjusted in the first direction. The second driving member 330 cooperates with the first driving member 320 to adjust the material picking member 310 in the up-down direction and the first direction, so that the material picking member 310 is adjusted to the position of picking up the wafer ring for picking up, and it is also convenient to adjust the material picking member 310 to align with the corresponding receiving cavity.
[0039] In another embodiment, the second driving member 330 may have various structures. The first driving motor 322 may be a screw motor, and the first slide rail 321 may be a cross roller guide rail, as long as the adjustment of the material picking member 310 in the first direction can be completed.
[0040] Optionally, in one embodiment, both ends of the second slide rail 331 are provided with a first stopper 600, and the first slide rail 321 can slide to abut against the first stopper 600. In this way, a first stopper 600 is provided at each end of the second slide rail 331, and when the first slide rail 321 slides to one end of the second slide rail 331, it abuts against a first stopper 600 to limit the first slide rail 321, and prevent the first slide rail 321 from sliding beyond the maximum setting distance and leaving the second rail.
[0041] In another embodiment, a buffer pad may be further provided on the side of the first limit member 600 opposite to the first slide rail 321 to absorb the kinetic energy generated when the first slide rail 321 collides with the first limit member 600, thereby reducing the possibility of damage caused by the collision between the first slide rail 321 and the first limit member 600.
[0042] Optionally, in one embodiment, the third driving member 340 includes a third slide rail 341 for being arranged on the frame 100 and a third driving motor 342 drivingly connected to the second slide rail 331, the second slide rail 331 is slidably arranged on the third slide rail 341, and the third driving motor 342 drives the second slide rail 331 to slide on the third slide rail 341 along the second direction, and the first direction is different from the second direction. It can be understood that the first direction is different from the second direction, so as to adjust the second slide rail 331 to slide in the second direction, the second slide rail 331 drives the first slide rail 321 and the material picking member 310 to move in the second direction, and adjust the material picking member 310 in the second direction, and the third driving member 340 cooperates with the first driving member 320 and the second driving member 330 to adjust the material picking member 310 in the first direction, the second direction, and the up and down directions, so that the material picking member 310 is adjusted to the position of picking up the wafer ring for picking up, and it is also convenient to adjust the material picking member 310 to the corresponding receiving cavity 210 for alignment.
[0043] In another embodiment, the third driving member 340 may have various structures and may be the same as the structure of the second driving member 330 . The second driving motor 332 may be a lead screw motor, and the second slide rail 331 may be a cross roller guide rail.
[0044] Optionally, in one embodiment, both ends of the third slide rail 341 are provided with second stoppers 700, and the second slide rail 331 can slide to abut against the second stoppers 700. In this way, a second stopper 700 is provided at each end of the third slide rail 341, and when the second slide rail 331 slides to one end of the third slide rail 341, it abuts against a second stopper 700 to limit the second slide rail 331, and prevent the second slide rail 331 from sliding beyond the maximum setting distance and leaving the third rail.
[0045] In another embodiment, a buffer pad may be further provided on the side of the second limit member 700 opposite to the second slide rail 331 to absorb the kinetic energy generated when the second slide rail 331 collides with the second limit member 700, thereby reducing the possibility of damage caused by the collision between the second slide rail 331 and the second limit member 700.
[0046] Optionally, in one embodiment, the semiconductor processing equipment also includes a second sensor 800, which is arranged on the material picking member 310 to follow the movement of the material picking member 310. The second sensor 800 has a second detection area arranged above the material picking member 310. During the lifting and lowering process of the second sensor 800, the second detection area can pass through multiple receiving chambers 210 in sequence. The second sensor 800 feeds back a second signal to the control system 500. In the first stroke, if the control system 500 determines that the receiving chamber 210 where the second detection area is located is the first receiving chamber 210 that does not contain a wafer ring based on the second signal, the control system 500 controls the material picking member 310 to send the picked-up wafer ring into the first receiving chamber 210. In the first stroke, if the control system 500 determines that the receiving chamber 210 where the second detection area is located is the second receiving chamber 210 that contains a wafer ring based on the second signal, the control system 500 controls the material picking member 310 to not send the picked-up wafer ring into the second receiving chamber 210. In this way, a second sensor 800 is set on the material picking piece 310 to detect the receiving cavity 210 before the wafer ring is placed in the receiving cavity 210 to be placed. The material picking piece 310 picks up the wafer ring and rises to the front of the receiving cavity 210 where the wafer ring is to be placed under the drive module, so that the wafer ring picked up by the material picking piece 310 is aligned in the upper and lower directions of the cavity opening of the receiving cavity 210. At this time, the second sensor 800 will also rise to the front of the receiving cavity 210 with the material picking piece 310, and project the second detection area into the receiving cavity 210 to detect the receiving cavity 210. If the second sensor 800 detects the wafer ring in the detected receiving cavity 210, the second sensor 800 will detect the wafer ring. The second sensor 800 will transmit a second signal to the control system 500, and the control system 500 will control the material picking device 300 not to send the picked-up wafer ring into the receiving cavity 210 according to the second signal fed back by the second sensor 800, so as to avoid the wafer ring picked up by the material picking device 310 from colliding with the wafer ring in the receiving cavity 210 to be placed and being damaged; if the second sensor 800 does not detect the wafer ring in the detected receiving cavity 210, the second sensor 800 will transmit a second signal to the control system 500, and the control system 500 will control the material picking device 300 to continue to operate according to the second signal fed back by the second sensor 800, so as to send the wafer ring into the corresponding receiving cavity 210. Such a setting effectively improves the safety and stability of the operation of the semiconductor processing equipment and effectively reduces the cost caused by the damage of the wafer ring.
[0047] In another embodiment, there are many types of the second sensor 800, which may be an infrared sensor or other sensors, as long as it can complete the detection of the wafer ring in the corresponding receiving cavity 210; it can be understood that the control system 500 can be a computer control system 500 integrated in the computer operating system of the semiconductor processing equipment, or it can be an independently arranged electrical control system 500 connected to the second sensor 800 and the material picking device 300, as long as it can realize the function of receiving the signal sent by the second sensor 800 and controlling the material picking device 300.
[0048] Optionally, in one embodiment, the semiconductor processing equipment further includes an alarm device connected to the control system 500, and the alarm device is used to issue an alarm when the control system 500 determines that the material picker 310 has not picked up the wafer ring according to the first signal in the first stroke; and is also used to issue an alarm when the control system 500 determines that the receiving cavity 210 where the second detection area is located is the second receiving cavity 210 that receives the wafer ring according to the second signal in the first stroke. In this way, an alarm system is set up, and when the material picker 310 is in the first stroke, when the first sensor 400 does not detect the wafer ring after the material picker 310 picks up the wafer ring, the control system 500 will activate the alarm device to issue an alarm to remind the staff to handle it in time; when the second sensor 800 detects that there is a wafer ring in the corresponding receiving cavity 210 to be placed, the control system 500 will also activate the alarm device to issue an alarm to remind the staff to handle it in time, thereby reducing the possibility that the semiconductor processing equipment has been in an abnormal working state.
[0049] In another embodiment, the alarm device may be a magnetic alarm lamp provided on the semiconductor processing equipment, or an alarm integrated on the control system 500, as long as the corresponding warning function can be achieved.
[0050] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A semiconductor processing equipment, characterized in that: include: frame; A material box, fixed to the frame, the material box is provided with a plurality of receiving cavities spaced apart in the up-down direction along the material box, the receiving cavities being used to receive wafer rings; A material picking device is arranged on the frame, and the material picking device includes a driving module and a material picking member drivingly connected to the driving module; the driving module includes a first driving member, and the first driving member includes a first slide rail and a first driving motor drivingly connected to the material picking member, the material picking member is slidingly arranged on the first slide rail, and the first driving motor drives the material picking member to slide on the first slide rail in the up and down direction; as well as The control system is used to control the driving module so that the material taking component places the wafer ring in the receiving cavity.
2. The semiconductor processing equipment according to claim 1, characterized in that The semiconductor processing equipment also includes a first sensor, which is arranged on the material picking part to follow the movement of the material picking part, and the first sensor has a first detection area for detecting the wafer ring. The material picking part has a first stroke. In the first stroke, the material picking part is used to pick up the wafer ring to transport the wafer ring to the receiving chamber. The first detection area is used to detect the wafer ring picked up by the material picking part. The first sensor feeds back a first signal to the control system. In the first stroke, when the control system determines that the material picking part has not picked up the wafer ring according to the first signal, the control system controls the material picking part to stop moving.
3. The semiconductor processing equipment according to claim 2, characterized in that The first detection area and a picking area of the pick-up member for picking up the wafer ring are set at the same height, so as to detect the wafer ring picked up by the pick-up member.
4. The semiconductor processing equipment according to claim 1, wherein: The driving module also includes a second driving member, which includes a second slide rail and a second driving motor driving the first slide rail. The first slide rail is slidably arranged on the second slide rail, and the second driving motor drives the first slide rail to slide on the second slide rail along a first direction.
5. The semiconductor processing equipment according to claim 4, characterized in that Both ends of the second slide rail are provided with first limiting members, and the first slide rail can slide until it abuts against the first limiting members.
6. The semiconductor processing equipment according to claim 4, characterized in that The driving module also includes a third driving component, which includes a third slide rail for being arranged on the frame and a third driving motor driving the second slide rail, the second slide rail is slidably arranged on the third slide rail, and the third driving motor drives the second slide rail to slide on the third slide rail along a second direction, and the first direction is different from the second direction.
7. The semiconductor processing equipment according to claim 6, characterized in that Both ends of the third slide rail are provided with second limiting members, and the second slide rail can slide until it abuts against the second limiting member.
8. The semiconductor processing equipment according to claim 2, characterized in that The semiconductor processing equipment also includes a second sensor, which is arranged on the material picking part to follow the movement of the material picking part. The second sensor has a second detection area arranged above the material picking part. During the lifting and lowering process of the second sensor, the second detection area can pass through multiple receiving chambers in sequence. The second sensor feeds back a second signal to the control system. In the first stroke, if the control system determines that the receiving chamber where the second detection area is located is the first receiving chamber that does not accommodate the wafer ring according to the second signal, the control system controls the material picking part to send the picked up wafer ring into the first receiving chamber. In the first stroke, if the control system determines that the receiving chamber where the second detection area is located is the second receiving chamber that accommodates the wafer ring according to the second signal, the control system controls the material picking part not to send the picked up wafer ring into the second receiving chamber.
9. The semiconductor processing equipment according to claim 8, characterized in that The semiconductor processing equipment also includes an alarm device connected to the control system, and the alarm device is used to issue a warning when the control system determines according to the first signal in the first stroke that the material picking piece has not picked up the wafer ring; and / or, to issue a warning when the control system determines according to the second signal in the first stroke that the receiving cavity where the second detection area is located is a second receiving cavity that receives the wafer ring.