Fixed film assembly and buffer film

Abstract

The embodiment of the utility model discloses a fixed film assembly which is applied to fixing a buffer film on the surface of a wafer chuck. The fixed membrane assembly comprises an alignment part and a fixed part; the alignment part is configured to be aligned with the notch of the buffer film, and is also configured to be inserted into the notch in the edge of the wafer chuck and can slide along a first direction to drive the buffer film to be close to the surface of the wafer chuck; and the fixing part is used for fixing the buffer film relative to the alignment part.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of semiconductor technology, and in particular to a fixed film assembly and a buffer film. Background Art

[0002] In some semiconductor manufacturing machines, such as etching machines, cleaning machines, chemical mechanical grinding machines or gas deposition machines, wafer carrying devices are generally integrated or assembled to fix and carry wafers so as to perform different processes on the wafers. The wafer carrying device may include a wafer carrying platform for fixing and carrying wafers, or a wafer chuck. The wafer chuck may use mechanical force to clamp the edge of the wafer to fix the wafer; the wafer chuck may use electrostatic adsorption or vacuum adsorption to fix the wafer, and such a wafer chuck may also be called a wafer suction cup. During the process of wafer process flow or transfer, the wafer chuck may also be used to fix the wafer. A buffer film may be pasted on the carrying surface of the wafer chuck, and the buffer film contacts the wafer to increase the clamping force and adsorption force of the wafer chuck on the wafer, increase the friction between the contact surface of the wafer chuck and the wafer, and reduce the damage of the wafer to the wafer chuck. As the semiconductor manufacturing process becomes more sophisticated and demanding, the process requirements for wafer chucks are getting higher and higher, and the process requirements for buffer films are also getting higher and higher. How to improve the alignment accuracy between the buffer film and the wafer chuck has become an urgent problem to be solved. Utility Model Content

[0003] In view of this, an embodiment of the present disclosure provides a fixed film assembly and a buffer film.

[0004] According to some aspects of the embodiments of the present disclosure, there is provided a fixed film assembly, which is applied to fix a buffer film on the surface of a wafer chuck;

[0005] The fixed membrane assembly includes an alignment portion and a fixing portion;

[0006] The alignment portion is configured to align with the notch of the buffer film, and is also configured to be inserted into the notch at the edge of the wafer chuck and slide along a first direction to drive the buffer film close to the surface of the wafer chuck;

[0007] The fixing portion is used to fix the buffer film relative to the alignment portion.

[0008] In some embodiments, the fixing portion includes a clamp, a bearing clamp, and a first surface of the buffer film; the clamp is configured to clamp the buffer film.

[0009] In some embodiments, the fixing portion includes a second surface disposed opposite to the first surface; the alignment portion is located at an edge of the fixing portion, and the alignment portion includes:

[0010] a first portion protruding from the first surface of the fixing portion along the first direction; and

[0011] A second portion protrudes from the second surface of the fixing portion along the first direction.

[0012] In some embodiments, the first portion is configured to be aligned with the notch of the buffer film, and the second portion is configured to be inserted into the notch of the edge of the wafer chuck and to be slidable along the first direction.

[0013] In some embodiments, one end of the first portion close to the fixing portion is configured to align with the notch of the buffer film, and one end away from the fixing portion is configured to be inserted into the notch of the edge of the wafer chuck and can slide along the first direction.

[0014] In some embodiments, a projection of the second portion along the first direction falls within a projection of the first portion along the first direction.

[0015] In some embodiments, a dimension of the second portion along the first direction is greater than a dimension of the first portion along the first direction.

[0016] In some embodiments, a cross-sectional shape of the second portion of the alignment portion along a first plane is the same as a shape of the notch; wherein the first plane is perpendicular to the first direction.

[0017] In some embodiments, the alignment portion penetrates the fixing portion, and a side surface of the alignment portion extending along the first direction is exposed from an edge of the fixing portion.

[0018] In some embodiments, the fixing portion exposes a partial area of ​​the buffer film in the first direction.

[0019] According to some aspects of the embodiments of the present disclosure, a buffer film is provided, which is used to be fixed on the surface of a wafer chuck; the buffer film comprises:

[0020] A notch at the edge, the notch corresponding to the notch at the edge of the wafer chuck;

[0021] The openings passing through the buffer film are aligned and communicated with the air flow channel on the wafer chuck for vacuum adsorption of the wafer.

[0022] The embodiment of the present disclosure provides a fixed film assembly, which is used to fix a buffer film on the surface of a wafer chuck, and the fixed film assembly includes an alignment part and a fixing part; the alignment part is aligned with the notch of the buffer film and inserted into the notch at the edge of the wafer chuck to position the fixed film assembly at the target position of the wafer chuck; the alignment part is aligned with the notch of the buffer film, and the fixing part supports the buffer film to position and fix it relative to the alignment part; the fixing part slides in the notch of the wafer chuck to drive the buffer film to be close to the surface of the wafer chuck and align it with the wafer chuck, and the aligned buffer film is subsequently adhered or adsorbed and fixed to the wafer chuck to improve the alignment accuracy between the buffer film and the wafer chuck. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 and Figure 2 is a schematic diagram of an exemplary wafer chuck according to an exemplary embodiment;

[0024] Figure 3 is a schematic diagram of an exemplary buffer film according to an embodiment of the present disclosure;

[0025] Figures 4 to 6 is a schematic diagram of an exemplary fixed membrane assembly according to an embodiment of the present disclosure;

[0026] Figures 7 to 9 It is a schematic diagram of a method for using a fixed membrane assembly according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the specific embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0028] In the following description, a large number of specific details are given to provide a more thorough understanding of the present disclosure. However, it is obvious to those skilled in the art that the present disclosure can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present disclosure, some technical features known in the art are not described; that is, all features of actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0029] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present disclosure, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present disclosure necessarily has the first element, component, region, layer or part.

[0030] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0031] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be a limitation of the present disclosure. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0032] It should be understood that the "some embodiments" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiments are included in at least one embodiment of the present disclosure. Therefore, "in some embodiments" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present disclosure, the size of the sequence number of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present disclosure.

[0033] The wafer chuck can be used to fix the wafer, and the wafer fixing method may include but is not limited to mechanical claw fixing, electrostatic adsorption, vacuum adsorption, etc. The bearing surface of the wafer chuck is used to contact and carry the surface of the wafer, such as a surface for electrostatic adsorption or vacuum adsorption, and the wafer chuck may include a mechanical claw for providing a mechanical clamping force.

[0034] In some embodiments, for a wafer chuck that adopts the principle of electrostatic adsorption, electrodes are integrated inside the wafer chuck to generate electrostatic adsorption force, so that the wafer is tightly attached to the surface of the wafer chuck; when releasing the electrostatic adsorption, the electrodes are powered off to eliminate the electrostatic adsorption force to release the electrostatic adsorption. The wafer chuck can be provided with multiple ejector pins, which can move up and down along the vertical direction or the thickness direction of the wafer on the bearing surface of the wafer chuck. When the wafer is adsorbed, the ejector pins move below the bearing surface of the wafer chuck or flush with the bearing surface to make the wafer fit the bearing surface; when the wafer contacts and adsorbs, the ejector pins protrude upward from the bearing surface to lift the wafer, making it easier for the mechanical claw to pick up the wafer for transfer.

[0035] In some embodiments, for a wafer chuck that adopts the vacuum adsorption principle, an air flow channel is set inside the wafer chuck and on the bearing surface. The air flow channel has air holes on the wafer bearing surface. When the wafer is adsorbed, the air flow channel sucks air to form a negative pressure between the wafer bearing surface and the wafer, so that the wafer is closely attached to the wafer bearing surface and adsorbed; when the adsorption is released, the air flow channel stops sucking air and can even spray air to restore the ambient pressure between the wafer bearing surface and the wafer without being adsorbed. The vacuum adsorption type wafer chuck can also be provided with a push rod to lift the wafer when the vacuum adsorption is released, so as to facilitate the robot arm to pick up the wafer for transfer.

[0036] In some embodiments, for wafer chucks that adopt electrostatic adsorption or vacuum adsorption, a heating device can be integrated to provide a process temperature for the wafer. The heating device can use heated inert gas as a medium to flow on the back of the wafer and contact the wafer to heat the wafer. The cooling device can use a circulating refrigerant in a cooling tube to reduce the temperature of the wafer chuck, thereby reducing the temperature of the wafer. For some wafer chucks that use processes such as cleaning, wet etching, spin coating and glue spreading, the wafer chuck or the bearing surface of the wafer chuck that carries the wafer can be rotated to contact chemical liquids, photoresists or other liquid materials, and the wafer can also be centrifugally dried; the wafer chuck can be integrated with an ultrasonic component to perform ultrasonic vibration on the wafer to achieve wafer cleaning or make the liquid material on the wafer surface more evenly distributed.

[0037] The embodiments of the present disclosure do not limit the wafer size. For example, the wafer size generally refers to the diameter of the wafer, and the wafer size may include but is not limited to the commonly used 6-inch (150mm), 8-inch (200mm), and 12-inch (300mm). 6-inch and 8-inch wafers can be mainly used for low-end chip manufacturing, and 12-inch wafers can be mainly used for 14nm and below chip manufacturing. The size of the wafer chuck of the embodiments of the present disclosure can be adapted according to the wafer size, and the size can be increased to adapt to larger wafers, such as 14-inch, 15-inch, 16-inch, 20-inch and other large-sized wafers, to adapt to more advanced wafer manufacturing processes and reduce manufacturing costs. The wafer chuck can adapt to the wafer size, such as the diameter of the wafer chuck can be larger than the diameter of the wafer to be manufactured.

[0038] In some embodiments, in order to reduce the damage to the surface of the wafer chuck that contacts the wafer and increase the service life of the wafer chuck, a buffer film can be fixed on the bearing surface of the wafer chuck. The buffer film can have an adhesive backing and be adhered and fixed to the surface of the wafer chuck; the buffer film can also be without an adhesive backing, and the buffer film is fixed to the surface of the wafer chuck by electrostatic adsorption. The buffer film can be made of an elastic material, and the buffer film can include a flexible diaphragm that can produce elastic deformation under the pressure of an external force, and deform when the wafer is electrostatically adsorbed or vacuum adsorbed, so that the wafer fits more closely to the wafer chuck; for some wafers with a certain degree of warpage, the buffer film can provide a wafer deformation margin, which can reduce the risk of wafer bending and fragmentation when the wafer fits tightly to the wafer chuck. For some vacuum adsorption type wafer chucks, during vacuum adsorption, the buffer film that produces elastic deformation can fill the gap between the wafer and the surface of the wafer chuck, reduce air leakage between the wafer chuck and the wafer, improve the air tightness of vacuum adsorption, improve the adsorption force, make the wafer and the wafer chuck fit tightly, reduce wafer movement, and improve process stability and yield. Exemplarily, the buffer film may include but is not limited to a UV adhesive film or a silicone film.

[0039] In some embodiments, when fixing or sticking a buffer film on the surface of a wafer chuck, the buffer film needs to be positioned so that the buffer film is fixed in the correct area of ​​the wafer chuck. The center of the buffer film can be coincident with the center of the wafer chuck or basically coincident within a certain error range. If the buffer film is not fully aligned, the buffer film may extend beyond the edge of the wafer chuck. If the buffer film extends too much beyond the wafer chuck, it may be scratched or deformed by the moving component, resulting in failure of the moving component to transfer the wafer or even a wafer drop alarm. For a vacuum adsorption type wafer chuck, if the buffer film is not fully aligned with the surface of the wafer chuck, the opening of the buffer film and the airflow channel on the surface of the wafer chuck may be misaligned, causing the vacuum pressure sensor of the machine to alarm, resulting in the adsorbed surface of the wafer slipping due to loss of pressure during the process, causing wafer damage and contamination, and process interruption, causing the machine to alarm. For some wafer chucks with complex structures and shapes, the buffer film adapted to this type of wafer chuck may be irregular, and the difficulty of alignment is further increased. In view of this, some aspects of the embodiments of the present disclosure provide a fixed film assembly for aligning and fixing (or pasting) the buffer film to improve the alignment accuracy of the buffer film on the surface of the wafer chuck. The wafer chuck mentioned in the embodiments of the present disclosure can be applied to wafer clamping and fixing scenarios, including but not limited to: cleaning machines, wet etching machines, dry etching machines, rotary glue spreading machines, cleaning parts of chemical mechanical grinding machines with cleaning functions, etc.

[0040] In some embodiments, Figure 1 An example diagram of a wafer chuck 100 is provided. The edge of the wafer chuck 100 has a notch 101. The schematic cross-sectional view of the wafer chuck 100 in the xoy plane may be a circle, and the notch 101 is formed by removing a portion of the circle. The notch 101 on the edge of the wafer chuck 100 can be used for a moving part to move and pick up a wafer. The moving part may include but is not limited to a robot 200. The robot 200 clamps the edge of the wafer and moves to the notch 101. After the notch 101 is matched, the robot 200 reaches the target position and places the wafer in the working area of ​​the wafer chuck 100. The wafer is vacuum adsorbed or electrostatically adsorbed by the wafer chuck 100.

[0041] In some embodiments, Figure 2A schematic diagram of the position of the robot arm 200 relative to the wafer chuck 100 is provided. The robot arm 200 has three clamping points 201 for clamping the edge of the wafer and driving the wafer to move; the robot arm 200 clamps the wafer and moves close to the notch 101, and some moving rods or other components of the robot arm 200 approach the notch 101 along the y direction until they fit into the notch 101, and at least a portion of the moving rod of the robot arm 200 moves to the inside of the notch 101, and may be in contact with or not in contact with the notch 101; at this time, the wafer has not yet contacted the wafer chuck 100, and the robot arm 200 moves in the vertical direction (the z direction perpendicular to the xoy plane) until the wafer contacts the surface of the wafer chuck 100, and the clamping points 201 of the robot arm 200 release the clamping and place the wafer on the surface of the wafer chuck 100, and the wafer chuck 100 performs electrostatic adsorption or vacuum adsorption to fix the wafer. The disclosed embodiment does not impose any restriction on the specific components of the robot arm 200 , nor does it impose any restriction on the transmission method of the robot arm 200 , such as electric transmission or pneumatic transmission; nor does it impose any restriction on the number of clamping points 201 of the robot arm 200 .

[0042] In some embodiments, Figure 3 An example diagram of a buffer film 300 is provided, the shape of the buffer film 300 is adapted to the shape of the wafer chuck 100, the size of the buffer film 300 can be equal to the size of the wafer chuck 100, or slightly smaller than the size of the wafer chuck 100, or slightly larger than the size of the wafer chuck 100, and the center of the buffer film 300 is aligned with the center of the wafer chuck 100. The buffer film 300 can have a backing adhesive to be attached and fixed to the surface of the wafer chuck 100; or the buffer film 300 can be without a backing adhesive, and the adhesive is brushed on the surface of the wafer chuck 100, and then the buffer film 300 is attached and fixed to the surface of the wafer chuck 100, or the buffer film 300 is attached and fixed to the surface of the wafer chuck 100 by electrostatic adsorption. The buffer film 300 has a notch 301 on its edge adapted to the notch 101 on the edge of the wafer chuck 100, and the notch 301 of the buffer film 300 is aligned with the notch 101 of the wafer chuck 100; after the buffer film 300 is aligned with the wafer chuck 100, the notch 301 of the buffer film 300 exposes the notch 101 of the wafer chuck 100, and the edge of the notch 301 of the buffer film 300 may not protrude from the edge of the notch 101 of the wafer chuck 100, so that the buffer film 300 will not be scratched by moving parts such as the robotic arm 200.

[0043] In some embodiments, for a vacuum adsorption type wafer chuck 100, the surface of the wafer chuck 100 has an air flow channel for vacuum adsorption of the wafer, and the buffer film 300 adapted to this type of wafer chuck 100 may have an opening 302, and the opening 302 penetrates the buffer film 300, and the opening 302 is aligned and connected with the air flow channel of the wafer chuck 100, so as to avoid the buffer film 300 blocking the air flow channel of the wafer chuck 100 and causing the risk of wafer dicing due to loss of vacuum. In order to improve the alignment accuracy between the buffer film 300 and the wafer chuck 100, the embodiment of the present disclosure provides a buffer film 300 adapted to the wafer chuck 100. Figure 1 The tool for fixing the buffer film 300 on the wafer chuck 100 is a fixed film assembly 400. The cross-sectional schematic diagrams of the fixed film assembly 400 in different directions are shown in FIG. Figures 4 to 6 The example given.

[0044] According to some aspects of the embodiments of the present disclosure, a fixed film assembly 400 is provided, which is applied to fix the buffer film 300 on the surface of the wafer chuck 100, and the fixing method may include pasting, electrostatic adsorption, etc. Figures 1 to 6 As shown, the fixed membrane assembly 400 includes an alignment portion 402 and a fixing portion 401;

[0045] The alignment portion 401 is configured to align with the notch 301 of the buffer film 300, and is also configured to be inserted into the notch 101 at the edge of the wafer chuck 100 and can slide along the first direction (z direction) to drive the buffer film 300 close to the surface of the wafer chuck 100; the fixing portion 401 is used to fix the buffer film 300 relative to the alignment portion 402.

[0046] Reference Figure 4 and Figure 5As shown, the first direction is the vertical direction, which is the direction perpendicular to the wafer chuck 100, the wafer thickness direction, the thickness direction of the buffer film 300, and the z direction in the figure. In order to adapt to the circular contour of the wafer chuck 100 and the circular contour of the buffer film 300, the outer contour of the fixing portion 401 of the fixing film assembly 400 is an arc as a whole, and specifically can be a figure surrounded by multiple arc segments and straight line segments. The alignment portion 402 is located at the edge of the fixing portion 401 and can extend along the z direction. A part of the alignment portion 402 protrudes from the surface of the fixing portion 401 along the positive z direction, and is used to adapt to the notch 301 of the buffer film 300 to align the buffer film 300, so as to position the buffer film 300 on the fixing portion 401; the side surface of the fixing portion 401 in the positive z direction is used to carry and fix the buffer film 300, so as to facilitate the alignment and fixation of the buffer film 300 relative to the alignment portion 402; the fixing method may include but is not limited to pasting, clamping or electrostatic adsorption. A portion of the alignment portion 402 protrudes from the fixing portion 401 along the negative z direction, and the fixing film assembly 400 can slide along the z direction, so that the alignment portion 402 is inserted into the notch 101 at the edge of the wafer chuck 100 to complete the alignment and fixation, and drive the buffer film 300 close to the surface of the wafer chuck 100 to align the buffer film 300 with the wafer chuck 100; after the buffer film 300 is fixed to the surface of the wafer chuck 100, the alignment portion 402 moves out of the notch 101 to separate the fixing film assembly 400 from the wafer chuck 100.

[0047] In some embodiments, reference Figure 4 As shown, the fixing portion 401 includes a clamp 403 , a carrier clamp 403 , and a first surface of the buffer film 300 ; the clamp 403 is configured to clamp the buffer film 300 .

[0048] In some embodiments, reference Figure 5 As shown, the fixing portion 401 includes a second surface arranged opposite to the first surface; the alignment portion 402 is located at the edge of the fixing portion 401, and the alignment portion 402 includes:

[0049] A first portion 4021 protrudes from the first surface of the fixing portion 401 along the z direction, and a second portion 4022 protrudes from the second surface of the fixing portion 401 along the z direction.

[0050] In some embodiments, the first portion 4021 may be configured to align with the notch 301 of the buffer film 300 ; and the second portion 4022 may be configured to be inserted into the notch 101 at the edge of the wafer chuck 100 and slidable along the z direction.

[0051] The first surface is Figure 5The fixing portion 401 shown in the figure is the right side surface in the positive z direction, and the second surface is the left side surface in the negative z direction of the fixing portion 401. In some embodiments, the fixing portion 401 includes a first surface and a second surface arranged opposite to each other in the first direction (z direction); the first surface is used to fix the buffer film 300, and a clamp 403 may be arranged on the first surface to clamp and fix the buffer film 300; the alignment portion 402 is located at the edge of the fixing portion 401 and extends along the z direction; the alignment portion 402 has a second portion 4022 protruding from the second surface of the fixing portion 401 along the negative z direction; when the buffer film 300 is fixed on the wafer chuck 100, the second portion 4022 of the alignment portion 402 is inserted into the notch 101 at the edge of the wafer chuck 100 for fixing, and the side wall of the alignment portion 402 contacts the inner wall of the notch 101.

[0052] The alignment portion 402 may be disposed only on a surface of the fixing portion 401 that does not bear the buffer film 300, such as the second surface. In this case, the alignment portion 402 includes the following parts: Figure 5 The second portion 4022 of the alignment portion 402 is inserted into the notch 101 at the edge of the wafer chuck 100 and fixed therein, and the alignment portion 402 fits in the notch 101. Figure 4 The side walls a, b and c of the middle alignment portion 402 are aligned with Figure 1 The three inner walls of the notch 101 of the wafer chuck 100 are in contact for alignment and fixation to prevent the alignment part 402 from loosening in the notch 101; the length of the side wall b of the alignment part 402 can be equal to the width D1 of the notch 101, or the length of the side wall b can be slightly less than the width D1 of the notch 101; the length of the side walls a, c of the alignment part 402 can be equal to the depth D2 of the notch 101, or can be greater than or less than. When the length of the side walls a, c of the alignment part 402 is less than the depth D2 of the notch 101, the alignment part 402 does not protrude from the notch 101; when the length of the side walls a, c of the alignment part 402 is greater than the depth D2 of the notch 101, the alignment part 402 protrudes from the notch 101, and both can complete the alignment and the installation and fixation of the buffer film 300. After the installation of the buffer film 300 is completed, the fixed film assembly 400 will be removed, which will not affect the movement of moving parts such as the robot arm 200 in the notch 101. For example, Figure 4 The length of the other aligning portion side wall b is R1=D1, the length of the aligning portion side walls a and c is R2, R1 can be 20-40 mm, such as 26 mm and 39 mm; R2 can be 3-10 mm, such as 5 mm. The thickness of the fixing portion 401 in the z direction is 1-3 mm.

[0053] In some embodiments, reference Figure 5As shown, one end of the first part 4021 close to the fixing part 401 is configured to align with the notch 301 of the buffer film 300, and the other end away from the fixing part 401 is configured to be inserted into the notch 101 at the edge of the wafer chuck 100 and can slide along the z direction. The right surface of the fixing part 401 along the z direction carries the buffer film 300, and the part of the first part 4021 that contacts the fixing part 401 is inserted into the notch 301 of the buffer film 300 to position the buffer film 300. One end of the first part 4021 protruding from the buffer film 300 is inserted into the notch 101 at the edge of the wafer chuck 100 to complete the positioning. The fixing part 401 moves along the z direction to approach the wafer chuck 100 to drive the buffer film 300 close to the surface of the wafer chuck 100. The surface of the buffer film 300 close to the wafer chuck 100 is provided with adhesive so that the buffer film 300 is adhered and fixed on the wafer chuck 100.

[0054] In some embodiments, reference Figure 4 and Figure 5 As shown, the fixed film assembly 400 also includes a clamp 403, which is disposed on the first surface of the fixed portion 401 carrying the buffer film 300 to be fixed, and the clamp 403 is used to clamp and fix the buffer film 300 on the first surface of the fixed portion 401. After the alignment portion 402 is inserted into the notch 101 of the wafer chuck 100 to complete the alignment and fixing, the second surface of the fixed portion 401 is relatively close to the wafer chuck 100 or in contact with the wafer chuck 100, and the first surface of the fixed portion 401 is relatively far away from the wafer chuck 100 and does not contact the wafer chuck 100. Figure 5 In the fixed film assembly 400 shown, the second surface of the fixed part 401 is the left side surface in the figure, which is the negative z-direction surface, and the first surface of the fixed part 401 is the right side surface in the figure, which is the positive z-direction surface. The second part 4022 of the alignment part 402 protrudes from the second surface of the fixed part 401 along the negative z-direction. The clamp 403 is located on the first surface of the fixed part 401. There is no restriction on the shape of the clamp 403. The clamp 403 is used to clamp and fix the buffer film 300 to be installed. The alignment part 402 may only include the second part 4022. The alignment part 402 is only arranged on the second surface of the fixed part 401 for alignment with the notch 101 of the wafer chuck 100. The first surface of the fixed part 401 may be provided with an alignment mark for positioning the buffer film 300 to be installed. The alignment mark may be a mark of a flat screen printing or protruding from the first surface.

[0055] In some embodiments, the alignment portion 402 may further include a first portion 4021, which is located on the first surface of the fixing portion 401 and protrudes from the first surface along the positive z direction. The first portion 4021 may be used to align and position the buffer film 300 to be installed on the fixing portion 401. In some specific examples, the buffer film 300 has an alignment mark or a clamping mark, and the clamp 403 aligns the clamping mark to complete the fixing and alignment of the buffer film 300. In addition to the fixing method using the clamp 403, the buffer film 300 may also be fixed to the first surface of the fixing portion 401 by gluing or electrostatic adsorption.

[0056] In some embodiments, the alignment portion 402 also includes: a first portion 4021 arranged opposite to the second portion 4022 in the z direction, and the first portion 4021 protrudes from the first surface of the fixing portion 401 along the positive z direction; when the buffer film 300 is fixed on the first surface of the fixing portion 401, the first portion 4021 is aligned with the notch 301 at the edge of the buffer film 300 and embedded in the notch 301.

[0057] Combination Figure 3 The buffer film 300 shown in the example is adapted to Figure 1 The shape of the wafer chuck 100 has a notch 301 corresponding to the notch 101, and the buffer film 300 is fixed to the wafer chuck 100. Figure 5 When the buffer film 300 is on the first surface of the fixing portion 401 , the notch 301 is aligned with the first portion 4021 of the aligning portion 402 , so that the first portion 4021 is embedded in the notch 301 , so that the buffer film 300 is accurately positioned on the fixing portion 401 without deviation.

[0058] In some embodiments, the first part 4021 and the second part 4022 are continuous parts, that is, the alignment part 402 extends as a whole along the z direction and penetrates the fixing part 401, or the first part 4021 and the second part 4022 are located on the first surface and the second surface respectively. In some embodiments, the first part 4021, the second part 4022 and the fixing part 401 can be an integrally formed structure, in which case there may be no obvious physical boundaries between the parts, and the materials of the parts may include but are not limited to materials such as engineering plastics, resins, polytetrafluoroethylene, etc. In some embodiments, the first part 4021 and the second part 4022 can be completely aligned or not completely aligned in the horizontal direction x or y.

[0059] In some embodiments, the projection of the second portion 4022 along the z direction falls within the projection of the first portion 4021 along the z direction. The first portion 4021 and the second portion 4022 of the alignment portion 402 are aligned in the z direction, the size of the second portion 4022 in the horizontal x direction or y direction is less than or equal to the size of the first portion 4021, and the projection of the second portion 4022 in the z direction may have the same shape as the projection of the first portion 4021 in the z direction and completely overlap, or fall within the projection of the first portion 4021, that is, not fall outside the projection of the first portion 4021. The second portion 4022 is used to be inserted into the notch 101 of the wafer chuck 100 and is adapted to or equal to the size of the notch 101. The first portion 4021 is embedded in the notch 301 of the buffer film 300 to align and position the buffer film 300. The size of the first portion 4021 is adapted to or equal to the size of the buffer film 300. Because after the buffer film 300 is subsequently fixed to the surface of the wafer chuck 100, the notch 301 of the buffer film 300 corresponds to the notch 101 of the wafer chuck 100. Figure 3 The size D3 of the notch 301 of the buffer film 300 may be greater than or equal to Figure 1 The size D1 of the notch 101 of the wafer chuck 100 is to reduce scratches on the buffer film 300 , so the horizontal dimension of the second portion 4022 may be smaller than that of the first portion 4021 .

[0060] In some embodiments, reference Figure 5 As shown, the dimension R3 of the second part 4022 along the z direction is greater than the dimension R4 of the first part 4021 along the z direction. For example, R3 is 80 mm, and R4 is 20 mm. The second part 4022 has a larger dimension to facilitate insertion into the notch 101 of the wafer chuck 100 for alignment. The first part 4021 is embedded in the notch 301 of the buffer film 300 to position the buffer film 300. The buffer film 300 has a small thickness, and the dimension R4 of the first part 4021 can be reduced to reduce the size of the fixed film assembly 400 for easy operation.

[0061] In some embodiments, the cross-sectional shape of the second portion 4022 of the alignment portion 402 along the first plane is the same as the shape of the notch 101 at the edge of the wafer chuck 100; wherein the first plane is perpendicular to the z direction. The first plane is a horizontal plane, such as an xoy plane.

[0062] In some embodiments, while ensuring Figure 4 The middle alignment portion 402 can be inserted into Figure 1 Under the premise that the notch 101 of the wafer chuck 100 is inside, the shapes of the alignment portion 402 and the notch 101 may not be completely consistent. Figure 1The middle notch 101 may be composed of a straight inner wall, and the shape may be a rectangle, a trapezoid, etc., or the cross-sectional shape of the notch 101 in the xoy plane, or the shape of the orthographic projection in the xoy plane may be a rectangle or a trapezoid; the cross-sectional shape of the second part 4022 and the first part 4021 of the alignment part 402 inserted into the notch 101 in the xoy plane may be the same as the shape of the notch 101, such as a rectangle, and the cross-sectional shape of the second part 4022 and the first part 4021 of the alignment part 402 inserted into the notch 101 in the xoy plane may be different from the shape of the notch 101, such as a circle, an ellipse or even a triangle, and the side wall of the alignment part 402 only needs to contact the side wall of the notch 101 and be inserted into the notch 101 after the alignment part 402 is inserted into the notch 101. Exemplarily, with Figure 4 Taking the alignment portion 402 with dimensions R1 and R2 as an example, it is only necessary that the maximum dimension R1 of the second portion 4022 of the alignment portion 402 in the x direction is equal to the dimension of the corresponding notch 101, and there is no restriction on whether the shape of each side wall is a straight line or an arc.

[0063] In some embodiments, reference Figure 6 As shown, the alignment portion 402 penetrates the fixing portion 401, and the side surface of the alignment portion 402 extending along the z direction is exposed from the edge of the fixing portion 401. The alignment portion 402 as a whole penetrates the edge of the fixing portion 401 along the z direction, and the first portion 4021 and the second portion 4022 of the alignment portion 402 may not have a clear boundary.

[0064] In some embodiments, reference Figure 6 As shown, the fixed membrane assembly 400 also includes:

[0065] The clamp 403 is located at the edge of the first surface of the fixing portion 401 and is used to clamp the buffer film 300 . The clamp 403 includes a plurality of alignment portions 402 and a plurality of clamps 403 . The clamp 403 can be located between two adjacent alignment portions 402 .

[0066] In some embodiments, the outer contour shape of the fixed membrane assembly 400 includes:

[0067] A closed figure formed by arcs and straight line segments.

[0068] Reference Figure 4 As shown, the outer contour of the fixed membrane assembly 400 can be a part of a circle, such as a sector or a semicircle. In this case, the side walls or sides of the alignment portion 402 and the clamp 403 exposed at the edge of the fixed portion 401 are arcs, forming an entire arc-shaped outer contour with the arc-shaped edge of the fixed portion 401; the side walls or sides of the alignment portion 402 and the clamp 403 exposed at the edge of the fixed portion 401 can be straight line segments. In this case, the outer contour of the entire fixed membrane assembly 400 is not strictly sector-shaped or semicircular.

[0069] In some embodiments, the fixing portion 401 of the fixed film assembly 400 exposes a partial area of ​​the buffer film 300 in the z-direction.

[0070] Suitable for Figure 3 The circular buffer film 300 shown, Figure 4 The fixing portion 401 of the fixed film assembly 400 shown is not a complete circle. When the buffer film 300 is fixed on the first surface of the fixing portion 401, a portion of the buffer film 300 is fixed on the fixing portion 401, and the other portion does not contact the fixing portion 401. This is to facilitate the fixation of the buffer film 300 on the wafer chuck 100 and the detachment of the fixed film assembly 400.

[0071] In some embodiments, Figures 7 to 9 The schematic diagram of the use of the fixed membrane assembly 400 is shown as an example. Figure 7 As shown, the buffer film 300 is fixed on the first surface of the fixing part 401 of the fixing film assembly 400, and can be fixed by a clamp 403, or by electrostatic adsorption, gluing, etc.; the upper part of the buffer film 300 with the notch 301 is fixed to the first surface of the fixing film assembly 400, and the first part 4021 of the alignment part 402 is embedded in the notch 301 of the buffer film 300 to position the buffer film 300, and the lower part of the buffer film 300 without the notch 301 does not contact the fixing part 401. Figure 8 As shown, the fixed film assembly 400 (or the alignment part 402) can be slid along the z direction, and the second part 4022 of the alignment part 402 can be inserted into the notch 101 of the wafer chuck 100, so as to drive the buffer film 300 close to the surface of the wafer chuck 100, so that the second surface of the fixed part 401 can be in contact with the surface of the wafer chuck 100, and the lower part of the buffer film 300 can be fixed to the surface of the wafer chuck 100 according to the direction of the arrow in the figure; the buffer film 300 can have its own adhesive backing, and the adhesive cover film of the lower part of the buffer film 300 can be peeled off to leak the adhesive backing, and the lower part of the buffer film 300 can be pressed tightly against the wafer chuck 100 to complete the fixation of this part, or the buffer film 300 can be fixed to the surface of the wafer chuck 100 by electrostatic adsorption. Refer to Fig. 9 As shown, the clamping of the clamp 403 is released, and the alignment portion 402 is slid out of the notch 101 of the wafer chuck 100 to remove the fixed film assembly 400 , and the buffer film 300 is completely fixed on the surface of the wafer chuck 100 .

[0072] According to some aspects of the embodiments of the present disclosure, referring to Figure 1 and Figure 3As shown, a buffer film 300 is provided, which is used to be fixed on the surface of a wafer chuck 100; the buffer film 300 includes: a notch 301 located at the edge, the notch 301 corresponds to (or is aligned with) the notch 101 at the edge of the wafer chuck 100; an opening 302 that penetrates the buffer film 300, the opening 302 is aligned and connected with the air flow channel on the wafer chuck 100, and is used for vacuum adsorption of the wafer; wherein the buffer film 300 includes a flexible diaphragm that can produce elastic deformation under the pressure of an external force. The buffer film 300 may have a backing adhesive on one side surface in the z direction, which is used to be pasted and fixed on the surface of the wafer chuck 100, the notch 301 of the buffer film 300 is aligned one-to-one with the notch 101 of the wafer chuck 100, and the notch 301 exposes the entire area of ​​the notch 101 in the z direction; the opening 302 of the buffer film 300 is aligned one-to-one with the air flow channel on the wafer chuck 100, and exposes the entire area of ​​the air flow channel in the z direction. The opening 302 may include, but is not limited to, a circle, a strip, an arc, or a combination thereof. The embodiment of the present disclosure does not limit the specific shape and number of the notch 101, the notch 301, the opening 302, and the airflow channel.

[0073] The above description is only a specific implementation mode of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure.

Claims

1. A fixed membrane module, characterized in that: Used to fix buffer film on the surface of wafer chuck; The fixed membrane assembly includes an alignment portion and a fixing portion; The alignment portion is configured to align with the notch of the buffer film, and is also configured to be inserted into the notch at the edge of the wafer chuck and slide along a first direction to drive the buffer film close to the surface of the wafer chuck; The fixing portion is used to fix the buffer film relative to the alignment portion.

2. The fixed membrane assembly according to claim 1, characterized in that: The fixing portion includes a clamp and a first surface that supports the clamp and the buffer film; the clamp is configured to clamp the buffer film.

3. The fixed membrane assembly according to claim 2, characterized in that: The fixing portion includes a second surface arranged opposite to the first surface; the alignment portion is located at an edge of the fixing portion, and the alignment portion includes: a first portion protruding from the first surface of the fixing portion along the first direction, and A second portion protrudes from the second surface of the fixing portion along the first direction.

4. The fixed membrane assembly according to claim 3, characterized in that: The first part is configured to be aligned with the notch of the buffer film, and the second part is configured to be inserted into the notch of the edge of the wafer chuck and can slide along the first direction.

5. The fixed membrane assembly according to claim 3, characterized in that: One end of the first part close to the fixing part is configured to align with the notch of the buffer film, and one end away from the fixing part is configured to be inserted into the notch of the edge of the wafer chuck and can slide along the first direction.

6. The fixed membrane assembly according to claim 3, characterized in that: A projection of the second portion along the first direction falls within a projection of the first portion along the first direction.

7. The fixed membrane assembly according to claim 3, characterized in that: A size of the second portion along the first direction is greater than a size of the first portion along the first direction.

8. The fixed membrane assembly according to claim 1, characterized in that: The aligning portion penetrates the fixing portion, and the aligning portion is exposed from an edge of the fixing portion along the first direction.

9. The fixed membrane assembly according to claim 1, characterized in that: The fixing portion exposes a partial area of ​​the buffer film in the first direction.

10. A buffer film, characterized in that: Applied to be fixed on the surface of a wafer chuck; the buffer film comprises: A notch at the edge, the notch corresponding to the notch at the edge of the wafer chuck; The openings passing through the buffer film are aligned and communicated with the air flow channel on the wafer chuck for vacuum adsorption of the wafer.

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