Clamping type cleaning disc for wafer cleaning
By designing a wafer cleaning disk of multiple rotatable jaws and linkage components, the problems of jaw movement out-synchronization and wafer position offset caused by complex structure in the prior art are solved, and the synchronous work of jaws and cleaning are achieved.
Patent Information
- Application Number
- CN202421366763.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-06-14
AI Technical Summary
The existing wafer cleaning disk has complex structure and is prone to errors, resulting in the movement of the jaws being out of synchronization and the wafer position being offset, and it is impossible to ensure that the cleaning is in place.
A clamping cleaning dish for wafer cleaning is designed, using multiple rotatable jaws and linkage components. Through the linkage of the lifting plate, push-pull ring, rotating bracket and tooth ring, the synchronous rotation and movement of the jaws are achieved to ensure stable clamping and cleaning of the wafer.
By simplifying the structure, the synchronous work of the jaws is achieved, preventing the wafer position from being offset, and ensuring the cleaning in place and effect.
Smart Images
Figure CN222762956U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of cleaning discs, in particular to a clamping type cleaning disc used for wafer cleaning. Background Art
[0002] Wafer cleaning is an important process step in the wafer manufacturing process. Its main purpose is to remove pollutants generated by the contact with various organic substances, particles and metals during the continuous processing and polishing of the wafer. It removes pollutants such as metal ions, atoms, organic substances and particles attached to the surface of the wafer to ensure the quality of the wafer and avoid these pollutants from affecting the performance and reliability of the integrated circuit. Wafer cleaning usually uses a dedicated wafer cleaning device.
[0003] The cleaning tray is an indispensable and important component in the wafer cleaning device. In the cleaning chamber, the cleaning tray can firmly fix the wafer to ensure that the wafer will not shift or slide during the cleaning process. The cleaning tray can rotate the wafer around its central axis, which helps to evenly distribute the cleaning liquid on the wafer surface and improve the cleaning effect.
[0004] A cleaning tray usually includes a cleaning table, a clamp, and a drive assembly. There are multiple drive assemblies and clamps, and each drive assembly controls a clamp to move independently. During operation, multiple drive assemblies are required to drive the clamps at the same time. The structure is complex and prone to errors. When the drive assemblies are not started at the same time, the movement of the clamps is not synchronized, which will cause the position of the wafer to shift. When the axis of the wafer is not aligned with the axis of cleaning, it is impossible to ensure that the wafer is cleaned properly during the cleaning process. Utility Model Content
[0005] In order to overcome the deficiencies of the existing technical solutions, the utility model provides a clamping type cleaning disc for wafer cleaning, which can effectively solve the technical problems of complex structure and easy errors.
[0006] The technical solution adopted by the utility model to solve its technical problems is:
[0007] The clamping cleaning plate for wafer cleaning comprises a table and a fixed bracket, the table is arranged at the upper end of the fixed bracket, a mounting hole for connecting with a rotating spindle is arranged in the middle of the table, a clamping claw for clamping the wafer is arranged at the upper end of the table, and a linkage assembly for driving the clamping claw is arranged at the lower end of the table, the clamping claw is arranged at more than three, and the more than three clamping claws are evenly distributed around the center of the table, one end of the clamping claw is rotatably connected to the table through a rotating shaft, and the end of the rotating shaft away from the clamping claw passes through the table and is provided with a transmission gear, the linkage assembly comprises a lifting plate, a push-pull ring, a rotating bracket and a gear ring, the lifting plate is arranged at the lower end of the push-pull ring, the side wall of the lifting plate is slidably connected to the inner wall of the fixed bracket, the rotating bracket is arranged on the inner side of the push-pull ring, the surface of the push-pull ring is provided with an inclined guide groove, the surface of the rotating bracket is provided with a guide block, the guide block is slidably connected to the guide groove, the rotating bracket is connected to the gear ring through a connecting plate, the gear ring is meshed with the transmission gear for transmission, and the axes of the table, the push-pull ring, the rotating bracket and the gear ring all coincide.
[0008] Furthermore, the clamp is composed of a rotating arm and a clamping block, the clamping block is arranged at one end of the rotating arm away from the rotating shaft, a side of the clamping block close to the mounting hole is provided with a limiting groove for clamping the wafer, and the surface of the rotating arm is provided with a boss for supporting the wafer.
[0009] Furthermore, a limiting ring is provided on the inner wall of the fixed bracket, a first guide groove is provided on the inner wall of the limiting ring, the first guide groove is parallel to the axis of the fixed bracket, and a first limiting slider is provided on the side wall of the lifting plate, and the first limiting slider is slidably connected to the first guide groove.
[0010] Furthermore, a second limiting slider is provided on the inner wall of the fixed bracket, a second guide groove is provided on the side wall of the push-pull ring, the second guide groove is parallel to the axis of the push-pull ring, and the second limiting slider is slidably connected to the second guide groove.
[0011] Furthermore, the connecting plate is arranged at the upper end of the rotating bracket, the gear ring is arranged at the edge of the connecting plate, a support ring is arranged at the lower end of the table top, a ring groove is arranged on the side wall of the support ring, and a ball bearing is arranged between the inner ring of the connecting plate and the ring groove.
[0012] Furthermore, a rotatable truncated table is arranged in the fixed bracket, a roller bearing is arranged between the truncated table and the fixed bracket, and the surface of the truncated table is fixedly connected to the edge of the connecting plate.
[0013] Furthermore, a fixing seat is arranged in the table top, the rotating shaft passes through the fixing seat, and a ball bearing is arranged between the rotating shaft and the fixing seat.
[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: more than three clamping jaws are provided, and the clamping jaws are rotatably arranged on the table top, and a linkage assembly for driving the clamping jaws is provided at the lower end of the table top, and the lifting plate can be driven by the cylinder in the cleaning device, and the lifting plate moves along the axis, and the lifting plate drives the push-pull ring to move synchronously when it moves, and the rotating bracket rotates around the axis under the action of the inclined guide slot and the guide block, and the rotating bracket drives the gear ring to rotate together, and the gear ring drives the transmission gear to make the clamping jaws rotate along the axis of the rotating shaft, so that the clamping jaws can be close to or away from the midpoint of the table top to clamp and release the wafer, the structure is simpler, and more than three clamping jaws can work synchronously to prevent the wafer position from shifting. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the structure of the utility model;
[0016] Figure 2 It is a top view of the utility model;
[0017] Figure 3 for Figure 2 Sectional view at AA in the middle;
[0018] Figure 4 for Figure 3 A partial enlarged view of point B in the middle;
[0019] Numbers in the figure: 1-table, 2-fixed bracket, 3-mounting hole, 4-clamping claw, 401-rotating arm, 402-clamping block, 403-boss, 5-rotating shaft, 6-transmission gear, 7-fixed seat, 8-lifting plate, 9-push-pull ring, 10-rotating bracket, 11-gear ring, 12-round table, 13-limiting ring, 14-support ring, 15-guide block, 16-guide slide groove. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] Combine the following Figure 1-Figure 4 The clamping cleaning plate for wafer cleaning of the utility model is described in detail:
[0022] A clamping cleaning plate for wafer cleaning comprises a table top 1 and a fixed bracket 2, wherein the table top 1 is arranged at the upper end of the fixed bracket 2, a mounting hole 3 for connecting with a rotating spindle is arranged in the middle of the table top 1, a clamping claw 4 for clamping a wafer is arranged at the upper end of the table top 1, the clamping claw 4 is composed of a rotating arm 401 and a clamping block 402, the clamping block 402 is arranged at the end of the rotating arm 401 away from the rotating shaft 5, a limiting groove for clamping the wafer is arranged on a side of the clamping block 402 close to the mounting hole 3, a boss 403 for supporting the wafer is arranged on the surface of the rotating arm 401, when the rotating arm 401 rotates, the end provided with the clamping block 402 approaches or moves away from the center of the table top 1, and a linkage component for driving the clamping claw 4 is arranged at the lower end of the table top 1.
[0023] The clamping jaws 4 are provided with three, and the three clamping jaws 4 are evenly distributed around the center of the table 1. One end of the clamping jaw 4 is rotatably connected to the table 1 through a rotating shaft 5. A fixed seat 7 is provided in the table 1, and the rotating shaft 5 passes through the fixed seat 7. A ball bearing is provided between the rotating shaft 5 and the fixed seat 7. The end of the rotating shaft 5 away from the clamping jaw 4 passes through the table 1, and a transmission gear 6 is provided on the surface. The linkage component includes a lifting plate 8, a push-pull ring 9, a rotating bracket 10 and a gear ring 11. The lifting plate 8 is arranged at the lower end of the push-pull ring 9, and the side wall of the lifting plate 8 is slidably connected to the inner wall of the fixed bracket 2. The rotating bracket 10 is arranged on the inner side of the push-pull ring 9. An inclined guide groove 16 is provided on the surface of the push-pull ring 9. A guide block 15 is provided on the surface of the rotating bracket 10. The guide block 15 is slidably connected to the guide groove 16. The rotating bracket 10 is connected to the gear ring 11 through a connecting plate. A rotatable round table 12 is provided in the fixed bracket 2, and a round table 12 is provided between the round table 12 and the fixed bracket 2. Roller bearing, the surface of the truncated table 12 is fixedly connected to the edge of the connecting plate, the gear ring 11 is meshed with the transmission gear 6 for transmission, the axes of the table top 1, the push-pull ring 9, the rotating bracket 10 and the gear ring 11 all coincide, the inner wall of the fixed bracket 2 is provided with a limit ring 13, the inner wall of the limit ring 13 is provided with a first guide groove, the first guide groove is parallel to the axis of the fixed bracket 2, the side wall of the lifting plate 8 is provided with a first limit slider, the first limit slider is slidably connected with the first guide groove, the first limit slider and the first guide groove can limit the horizontal rotation of the lifting plate 8, so that the lifting plate 8 can only move along the axial direction, the inner wall of the fixed bracket 2 is provided with a second limit slider, the side wall of the push-pull ring 9 is provided with a second guide groove, the second guide groove is parallel to the axis of the push-pull ring 9, the second limit slider is slidably connected with the second guide groove, the second limit slider and the second guide groove can limit the horizontal rotation of the push-pull ring 9, so that the push-pull ring 9 can only move along the axial direction. The connecting plate is arranged at the upper end of the rotating bracket 10, the gear ring 11 is arranged at the edge of the connecting plate, a supporting ring 14 is arranged at the lower end of the table 1, a ring groove is arranged on the side wall of the supporting ring 14, and a ball bearing is arranged between the inner ring of the connecting plate and the ring groove.
[0024] The clamping cleaning plate for wafer cleaning of the present embodiment is provided with more than three clamping jaws 4, and the clamping jaws 4 are rotatably arranged on the table 1. The lower end of the table 1 is provided with a linkage component for driving the clamping jaws 4. The lifting plate 8 can be driven by the cylinder in the cleaning device, and the lifting plate 8 can move along the axis. When the lifting plate 8 moves, it drives the push-pull ring 9 to move synchronously. Under the action of the inclined guide slot 16 and the guide block 15, the rotating bracket 10 rotates around the axis, and the rotating bracket 10 drives the gear ring 11 to rotate together. The gear ring 11 drives the transmission gear 6 to make the clamping jaws 4 rotate along the axis of the rotating shaft 5, so that the clamping jaws 4 can be close to or away from the midpoint of the table 1 to clamp and release the wafer. The structure is simpler, and more than three clamping jaws 4 can work synchronously to prevent the wafer position from shifting.
[0025] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
Claims
1. A clamping cleaning plate for wafer cleaning, comprising a table and a fixed bracket, wherein the table is arranged at the upper end of the fixed bracket, a mounting hole for connecting with a rotating spindle is arranged in the middle of the table, a clamping claw for clamping the wafer is arranged at the upper end of the table, and a linkage assembly for driving the clamping claw is arranged at the lower end of the table, characterized in that: The clamping jaws are provided with more than three, and the more than three clamping jaws are evenly distributed around the center of the table. One end of the clamping jaw is rotatably connected to the table through a rotating shaft, and the end of the rotating shaft away from the clamping jaw passes through the table and is provided with a transmission gear. The linkage assembly includes a lifting plate, a push-pull ring, a rotating bracket and a gear ring. The lifting plate is arranged at the lower end of the push-pull ring, and the side wall of the lifting plate is slidably connected to the inner wall of the fixed bracket. The rotating bracket is arranged on the inner side of the push-pull ring, and the surface of the push-pull ring is provided with an inclined guide groove, and the surface of the rotating bracket is provided with a guide block, which is slidably connected to the guide groove, and the rotating bracket is connected to the gear ring through a connecting plate, and the gear ring is meshed with the transmission gear for transmission, and the axes of the table, the push-pull ring, the rotating bracket and the gear ring all coincide.
2. The clamping cleaning plate for wafer cleaning according to claim 1, characterized in that: The clamping claw is composed of a rotating arm and a clamping block. The clamping block is arranged at one end of the rotating arm away from the rotating shaft. A limiting groove for clamping the wafer is arranged on one side of the clamping block close to the mounting hole, and a boss for supporting the wafer is arranged on the surface of the rotating arm.
3. The clamping cleaning plate for wafer cleaning according to claim 1, characterized in that: The inner wall of the fixed bracket is provided with a limit ring, the inner wall of the limit ring is provided with a first guide groove, the first guide groove is parallel to the axis of the fixed bracket, the side wall of the lifting plate is provided with a first limit slider, and the first limit slider is slidably connected to the first guide groove.
4. The clamping cleaning plate for wafer cleaning according to claim 1, characterized in that: The inner wall of the fixed bracket is provided with a second limiting slider, the side wall of the push-pull ring is provided with a second guide groove, the second guide groove is parallel to the axis of the push-pull ring, and the second limiting slider is slidably connected to the second guide groove.
5. The clamping cleaning plate for wafer cleaning according to any one of claims 1 to 4, characterized in that: The connecting plate is arranged at the upper end of the rotating bracket, the gear ring is arranged at the edge of the connecting plate, a supporting ring is arranged at the lower end of the table top, a ring groove is arranged on the side wall of the supporting ring, and a ball bearing is arranged between the inner ring of the connecting plate and the ring groove.
6. The clamping cleaning plate for wafer cleaning according to any one of claims 1 to 4, characterized in that: A rotatable round table is arranged inside the fixed bracket, a roller bearing is arranged between the round table and the fixed bracket, and the surface of the round table is fixedly connected to the edge of the connecting plate.
7. The clamping cleaning plate for wafer cleaning according to any one of claims 1 to 4, characterized in that: A fixing seat is arranged inside the table top, the rotating shaft passes through the fixing seat, and a ball bearing is arranged between the rotating shaft and the fixing seat.