Chip with coated alloy pin insert

Abstract

The utility model discloses a chip with a coated alloy pin insertion sheet. The chip comprises a chip body and pin insertion pieces packaged on the periphery of the chip body, and each pin insertion piece comprises a metal matrix and an Ag / Cu-graphene silvering composite coating film obtained by plating the surface of the metal matrix. The Ag / Cu-graphene silvering composite coating film obtained by plating the surface of the pin insert can effectively improve the conductivity and high-temperature wear resistance of the pin insert on the premise of not influencing the welding or plugging of the pin insert, so that the service life of the chip is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of chips, and in particular relates to a chip with a film-plated alloy pin insert. Background Art

[0002] Chip, also known as microcircuit, microchip, integrated circuit (English: integrated circuit, IC), refers to a silicon wafer containing an integrated circuit. It is very small and is often part of a computer or other electronic device. It uses "packaging technology" to package the integrated circuit with insulating plastic or ceramic materials to prevent impurities in the air from corroding the chip circuit and causing a decrease in electrical performance. On the other hand, the packaged chip is also easier to install and transport. In the process of chip packaging, it is necessary to install pin plugs to achieve electrical connection. Therefore, in the prior art, a number of pin plugs are provided on the surface of the chip. These pin plugs can be connected to the IC socket and the PCB board, which requires the pin plugs to have good conductivity. In addition, with the increase in the number of integrated circuit pins, the increase in test temperature, and the continuous reduction in size, the high temperature resistance requirements for the pin plug materials are also increased.

[0003] In order to solve the above problems, after searching, Chinese patent CN109860130A discloses a package for reducing the stacked package structure of communication chips, wherein the upper surface of the upper insulating shell is provided with a model label, one side of the upper insulating shell is provided with an input pin, and the other side of the upper insulating shell is provided with an output pin, and the outer walls of the input pin and the output pin are provided with a metal coating, which can improve the moisture-proof, heat-insulating and conductive properties of the pin, making it easier to weld the pin with the circuit board and improve its conductive properties, and the current on the circuit board enters the communication chip through the input pin and then returns to the circuit board through the output pin. For another example, Chinese patent CN208654836U discloses an improved IC card chip structure of a dual-interface card, which includes a flexible circuit board at the bottom, an integrated circuit arranged on the flexible circuit board, and a plurality of stainless steel sheets fixed on the flexible circuit board by an insulating glue layer, a stainless steel sheet is electrically connected with a pin of the integrated circuit, the stainless steel sheets are located on the same plane, and a gap is formed, and a layer of brass-colored conductive film is vacuum-coated on the upper end surface of the stainless steel sheet.

[0004] However, although the pins disclosed in the above patents are provided with metal coatings, the specific coating type and the components of the coatings are not disclosed. At the same time, after the chip is manufactured, it needs to be tested, and there is friction between the pin insert and the test socket, which also puts forward new requirements for the wear resistance of the pins. Summary of the invention

[0005] 1. Problems to be solved

[0006] In view of the above technical problems, the purpose of the utility model is to provide a chip with a coated alloy pin insert, which effectively improves the high-temperature wear resistance of the pin insert on the basis of satisfying the conductive performance.

[0007] 2. Technical solution

[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0009] The utility model provides a chip with a plated alloy pin insert, comprising a chip body and pin inserts packaged around the chip body, wherein the pin inserts comprise a metal substrate and an Ag-graphene silver-infiltrated composite plated film obtained by plating the surface of the metal substrate.

[0010] According to any embodiment of the purpose of the present utility model, the film thickness of the Ag-graphene silver-infiltrated composite coating is 0.5-5.0µm.

[0011] According to any implementation scheme of the purpose of the present utility model, the material of the metal matrix of the pin plug is one of copper, copper alloy, iron, iron alloy, and stainless steel, especially copper alloy. The heat generated by the chip can be transferred or dissipated through the pin plug, thereby improving the heat dissipation effect of the chip.

[0012] According to any implementation scheme of the utility model, the thickness of the metal substrate of the pin insert is 0.02mm-0.07mm.

[0013] According to any embodiment of the first aspect of the purpose of the utility model, the size of graphene dispersed in the Ag-graphene silver-infiltrated composite coating is 0.05-6 μm, the content of graphene is 3.0-30 at%, and the orientation of graphene in the Ag-graphene silver-infiltrated composite coating is at least selected from a metal matrix that is perpendicular, parallel and inclined to the matrix.

[0014] According to any implementation scheme of the first aspect of the purpose of the utility model, an intermediate layer is provided between the metal substrate and the Ag-graphene silver-infiltrated composite coating, the intermediate layer is located between the metal substrate and the composite coating, and the intermediate layer has the following characteristics: a thickness of 0.01~10 µm.

[0015] According to any implementation scheme of the first aspect of the purpose of the utility model, the metal of the intermediate layer includes any one or two or more of tin, nickel and zinc.

[0016] 3. Beneficial effects

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The chip with the coated alloy pin insert of the utility model is coated with Ag-graphene silver-infiltrated composite coating on its surface. Under the premise of not affecting the welding or plugging of the pin insert, the coating can effectively improve the conductive performance and high-temperature wear resistance of the pin insert, thereby improving the service life of the chip. The chip with the coated alloy pin insert of the utility model has a simple structure and is easy to manufacture.

[0019] The technical solution of the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments, but it should be understood that these drawings are designed only for the purpose of explanation and are not intended to limit the scope of the utility model. In addition, unless otherwise specified, these drawings are only intended to conceptually illustrate the structural configurations described herein and are not necessarily drawn to scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of a chip with a coated alloy pin insert of the utility model;

[0021] Figure 2 It is a cross-sectional view of the utility model having a plated alloy pin insert;

[0022] Description of reference numerals:

[0023] 10. Chip body; 20. Pin insert; 21. Metal substrate; 22. Ag-graphene silver-infiltrated composite coating. DETAILED DESCRIPTION

[0024] The present disclosure may be more easily understood by reference to the following description in conjunction with the accompanying drawings and examples, all of which constitute a part of the present disclosure. It should be understood that the present disclosure is not limited to the specific products, methods, conditions or parameters described and / or shown herein. Further, the terms used herein are only used for the purpose of describing specific embodiments by way of example and are not intended to be limiting unless otherwise stated.

[0025] It should also be understood that, for the sake of clarity, certain features of the present disclosure may be described herein in the context of separate embodiments, but may also be provided in combination with each other in a single embodiment. That is, unless clearly incompatible or specifically not included, each separate embodiment is considered to be combinable with any other embodiment, and the combination is considered to represent another different embodiment. Conversely, for the sake of simplicity, the various features of the present disclosure described in the context of a single embodiment may also be provided individually or in any sub-combination. Finally, although a particular embodiment may be described as part of a series of steps or part of a more general structure, each step or substructure itself may also be considered to be an independent embodiment.

[0026] Unless otherwise indicated, it should be understood that each individual element in a list and each combination of individual elements in the list will be interpreted as a different embodiment. For example, a list of embodiments represented as "A, B, or C" should be interpreted to include embodiments "A", "B", "C", "A or B", "A or C", "B or C", or "A, B, or C".

[0027] In the present disclosure, the singular forms of the articles "a," "an," and "the" also include the corresponding plural references, and a reference to a specific value includes at least that specific value unless the context clearly indicates otherwise. Thus, for example, a reference to "a substance" is a reference to at least one of that substance and equivalents thereof.

[0028] The terms including ordinal numbers such as "first" and "second" can be used to explain various components or fluids, but these components and fluids are not limited by these terms. Therefore, without departing from the teachings of the present disclosure, these terms are only used to distinguish the component / fluid from another component / fluid.

[0029] When items are described by using the conjunction terms "... and / or...," etc., the description should be understood to include any one of the associated listed items and all combinations of one or more thereof.

[0030] In general, the use of the term "about" indicates an approximate value that may vary depending on the desired properties obtained by the disclosed subject matter, and will be interpreted in a context-dependent manner based on function. Therefore, one of ordinary skill in the art will be able to interpret a certain degree of difference on a case-by-case basis. In some cases, the number of significant figures used when expressing a particular value can be a representative technique for determining the difference allowed by the term "about". In other cases, a gradient in a range of values ​​can be used to determine the range of differences allowed by the term "about". Further, all ranges in this disclosure are inclusive and combinable, and reference to the values ​​stated in the range includes each value within the range.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs; the terms used herein and / or include any and all combinations of one or more related listed items.

[0032] Example 1

[0033] like Figure 1 and Figure 2As shown, a chip with a coated alloy pin insert 20 of this embodiment includes a chip body 10 and a pin insert 20 packaged around the chip body 10, and the pin insert 20 includes a metal substrate 21 and an Ag-graphene silver-infiltrated composite coating 22 obtained by plating the surface thereof.

[0034] The “film coating” provided in this embodiment mainly contains silver and graphene as the main components (Ag-graphene silver-infiltrated composite film 22 ).

[0035] The “coating” described herein may also be referred to as a “plating” or a “contact coating”.

[0036] The "pin insert 20" provided in this embodiment mainly includes a metal substrate 21 and the "coating film" as described above;

[0037] The "metal substrate 21" described herein is mainly considered to have excellent weldability, thermal conductivity, electrical conductivity and machinability, and there are no special restrictions on other properties. Based on this, for example, copper, copper alloy, iron, iron alloy, stainless steel, etc. can be cited.

[0038] Based on the above, examples of the “pin insert 20” provided in this embodiment include:

[0039] a) A metal is used as a substrate, and a Ag-graphene silver-infiltrated composite coating 22 is provided on the surface of the substrate.

[0040] The "coating" of the "pin insert 20" provided in this embodiment usually optionally satisfies any one or more of the following conditions:

[0041] 1) The film thickness of the Ag-graphene silver-infiltrated composite coating 22 is 0.5-5.0 μm.

[0042] 2) The size of graphene dispersed in the Ag-graphene silver-infiltrated composite coating 22 is 0.05-6 μm, the content of graphene is 3.0-30 at%, and the orientation of graphene in the Ag-graphene silver-infiltrated composite coating 22 is at least selected from a metal substrate 21 that is perpendicular, parallel, and inclined to the substrate.

[0043] (3) The thickness of the metal substrate 21 of the pin insert 20 is 0.02 mm-0.07 mm.

[0044] The silver between the graphene sheets will increase the interlayer bonding force of the graphene sheets, and the interlayer bonding force of the graphene sheets will be further increased as the silver content increases, but it should be noted that too much silver will cause serious agglomeration of the graphene and make it unusable; therefore, in some embodiments of the utility model, according to the atoms of the "graphene infiltrated with silver" as the total number, the amount of silver between the graphene sheets is 0.1~50at%, and in some preferred embodiments of the utility model, according to the atomic percentage of the "graphene", the amount of silver between the graphene sheets is 0.1~45at%. It is further explained that the silver content in the "graphene infiltrated with silver" is in the value range of 0.1~50at%, and the conductivity trend line of the "composite coating" is obtained by fitting the experimental data, and the trend line changes basically linearly. In the following embodiments, the "graphene infiltrated with silver" with a silver content of 5at% is used to schematically illustrate the technical solution of the utility model.

[0045] The "composite coating" as described above is formed on the "metal substrate 21" by the method of "electroplating", and the "electroplating" includes the following steps 1) and 2):

[0046] 1) Prepare the plating solution and substrate

[0047] The plating solution includes components for forming a coating; for example, if the coating is a "coating", then the "components for forming a coating" at least include "graphene infiltrated with silver";

[0048] 2) Electroplating the substrate using the plating solution. The detailed operation of the electroplating for reference is as follows:

[0049] The plating solution is supplied approximately perpendicularly to the surface to be plated of the substrate, and convects approximately horizontally on the surface to be plated, or flows approximately horizontally on the surface to be plated; the metal substrate 21 is electroplated with the plating solution, and the plating solution is an industrial plating solution containing or not containing cyanide, preferably a plating solution not containing cyanide. The current density during electroplating can be between 0.1A / dm 2 ~100A / dm 2 The thickness of the "plating film" can be adjusted within a range of , and the thickness of the "plating film" can be adjusted by adjusting the current density and time. For example, when the current density is constant, the thickness of the obtained "plating film" can be increased by extending the electroplating time.

[0050] On the basis of the aforementioned "electroplating" steps 1) and 2), the preparation of the "plating" is further described as a schematic and detailed explanation:

[0051] During the electroplating process, the plating solution (i.e., the plating solution) contains "graphene infiltrated with silver", or contains other metals besides silver. Among them, the "graphene infiltrated with silver" also has a layered structure formed by stacked graphene sheets, and there are gaps between the layers, and the gaps form an effective space inside the graphene. The "silver between the graphene sheets" can be understood as silver ions and / or nanosilver particles filled / dispersed in the effective space. Generally, silver ions and nanosilver particles (also called particles) will exist at the same time. The "filling / dispersion" can be a small amount of local filling, or a large part of the filling, or all of the filling. Based on this, the "graphene infiltrated with silver" includes a body composed of stacked graphene sheets, and silver ions and / or nanosilver particles located between the graphene sheets. Among them, the silver ions and nanosilver particles existing between the graphene sheets can accelerate the movement speed of the "graphene infiltrated with silver" under the electric field, thereby facilitating the rapid formation of the coating, and is particularly suitable for local small-scale electroplating and high-speed electroplating of the substrate.

[0052] Regarding the main body of the "laminated graphene sheet" constituting the "silver-infiltrated graphene" used in the electroplating process, it is preferably a sheet-shaped or laminated graphene with a size of 6 µm or less; in some preferred embodiments of the present embodiment, it mainly refers to a sheet-shaped or laminated graphene with a size of 0.01 to 6 µm or less; in further preferred embodiments of the present embodiment, it mainly refers to a sheet-shaped or laminated graphene with a size of 0.01 to 5 µm or less;

[0053] Regarding the preparation method of the body of the "laminated graphene sheet" of the "silver-infiltrated graphene" used in the electroplating process, it can be carried out by electrolytic stripping as shown below. The specific electrolytic stripping conditions that can be referred to are as follows: Graphite is immersed in an aqueous solution and decomposed into layers by a strong electric field and an electrochemical reaction. The decomposed layered graphene is classified into the following graphene sizes. The graphene size is a mixture of 1µm or less, 1 to 3µm, 3 to 5µm, and 6µm or less. In addition, the size of the graphene is classified according to the mesh size of the filter paper used for filtration.

[0054] The "silver-infiltrated graphene" used in the electroplating process can be obtained by commercial means, or by methods such as self-assembly, chemical reduction, hydrothermal, electrochemical deposition, and thermal evaporation. For example, the self-assembly method is to mix the graphene dispersion with pre-prepared or commercially available silver nanopowder or silver ion solution, and combine them through covalent bonds or non-covalent bonds (van der Waals forces, electrostatic forces, intermolecular forces, and hydrogen bonds, etc.) to obtain "silver-infiltrated graphene". Based on the self-assembly method, graphene nanocomposites with simple and controllable silver loading and highly uniform distribution can be prepared. Therefore, in the actual preparation process, functionalized graphene can be first used as a raw material, modified with n-octadecyl mercaptan, then added to an ethanol solution, dispersed by ultrasound, added with silver chloride, and prepared by photochemical reduction to obtain a composite material. The interaction between n-octadecyl mercaptan molecules and silver can effectively control the arrangement and orientation of silver on the graphene surface, so that specific nano-Ag particles are generated, thereby controlling the preparation of graphene / silver nanocomposite materials, which can be used as "silver-infiltrated graphene" in the electroplating process of this embodiment.

[0055] As a pretreatment of the copper alloy substrate, alkaline electrolytic degreasing and pickling are performed, but the treatment conditions are not particularly limited; on the other hand, electrolytic exfoliation is performed as follows. The layered graphene nanosheets are made by immersing graphite in an aqueous solution and decomposing the graphite into layers through a strong electric field and an electrochemical reaction. In addition, depending on the crystal state of the graphite as a raw material, the thickness of the electrolytically exfoliated graphene is about 6 μm or less.

[0056] The graphene was fractionated by filtration using filters with pore sizes of 5 μm, 3 μm, and 1 μm, respectively. In addition, all operations were performed in an aqueous solution, and the obtained graphene was not oxidized but became reduced graphene.

[0057] Various Cu alloy substrates (Cu-Ni-Si, Cu-Be, Cu-Zn, Cu-Te, Cu-Sn, Cu-TC) were used as starting materials, and electrolytic degreasing and pickling were performed as pretreatment. Graphene was produced by electrolytic stripping of graphite; the Ag plating solution used was a commercially available cyanide-free Ag plating solution.

[0058] In fact, the graphene used in the preparation of the coating provided in this embodiment is pre-treated graphene, and the treatment includes: using a solution containing silver ions for dispersion treatment. This is also the reason why the Raman spectrum of the coating has a value of 500±30cm -1One of the key reasons for the peak. The binding force between graphene layers is the van der Waals force, and the carbon atoms in the layer are bonded by covalent bonds. Therefore, compared with the thermal conductivity within the layer, the electrical conductivity between layers is poor. Finally, the coating provided in this embodiment has silver ions "infiltrated" between the stacked graphene sheets and sheet structures, based on which the two-dimensional structure can be converted into a three-dimensional structure, which not only improves the problem of poor electrical conductivity between graphene layers in the prior art, but also facilitates the rapid formation of the coating, and is particularly suitable for local small-scale electroplating and high-speed electroplating of the metal substrate 21.

[0059] The pin insert 20 obtained above was tested. During the test, it not only had excellent conductivity and could withstand a typical test temperature of 150°C, but also maintained good dimensional stability, thereby improving test accuracy. In addition, the high temperature wear resistance of the pin insert 20 was improved compared to the prior art.

[0060] Example 2

[0061] In this embodiment, an intermediate coating mainly composed of metal Ni is prepared on the surface of the copper alloy metal substrate by electroplating (the "intermediate coating" can also be called an intermediate layer, transition layer, transition film, diffusion prevention layer). There is no special requirement for its thickness, which can be tens of nanometers and several microns. For example, it can be selected from any numerical range within the range of 0.01~10µm, or any numerical value. For example, the thickness of the "intermediate layer" can be 0.5µm, 1µm, 3µm or 5µm. Here, Ni intermediate coatings with a thickness of 30nm and 3µm are mainly prepared, and then Ag-Gr (Ag) coatings with a thickness of 5µm are prepared on the Ni intermediate coatings, which are respectively recorded as Ni-03 / Ag-Gr (Ag) and Ni-3 / Ag-Gr (Ag) coatings.

[0062] The "intermediate layer" described in the utility model is mainly a "metal intermediate coating", one of the main functions of which is diffusion prevention; the second main function is to improve the bonding force between the "composite coating" and the "substrate"; the third main function is to reduce the induced influence of the "substrate" on the crystal structure of the "composite coating" and improve the all-plating ability of the coating. Therefore, in this case, the "metal intermediate coating" can prevent the elements (such as copper, iron, stainless steel, etc.) on the metal surface of the "substrate" in contact with it from entering the "composite coating" or diffusing to the surface of the "composite coating" under high temperature conditions to form an oxide film, resulting in an increase in contact resistance or a decrease in conductivity, that is, to improve the heat resistance of the "composite coating". At the same time, it can enhance the bonding strength between the "substrate" and the "composite coating" and improve the uniformity of the "composite coating". Especially when it comes to the situation where the metal surface of the "substrate" is easy to produce a stable metal oxide film, such as the surface of the connecting part of the "substrate" is a copper alloy, stainless steel, iron alloy, etc., which are easy to passivate metal surfaces.

[0063] In addition, the composite coating can prevent the oxidation of the tin-containing intermediate layer, while maintaining the weldability of the metal substrate and ensuring the properties such as the fixing strength and contact resistance after welding, and is therefore preferred.

[0064] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A chip with a coated alloy pin insert, comprising a chip body (10) and a pin insert (20) packaged around the chip body (10), characterized in that: The pin insert (20) comprises a metal substrate (21) and an Ag-graphene silver-infiltrated composite coating (22) obtained by coating the surface of the metal substrate; an intermediate layer is provided between the metal substrate (21) and the Ag-graphene silver-infiltrated composite coating (22), and the intermediate layer has the following characteristics: Thickness ranges from 0.01 to 10 µm.

2. The chip with a plated alloy pin insert according to claim 1, characterized in that: The Ag-graphene silver-infiltrated composite coating (22) has a film thickness of 0.5-5.0 µm.

3. The chip with a plated alloy pin insert according to claim 2, characterized in that: The material of the metal base (21) of the pin insert (20) is one of copper, copper alloy, iron, iron alloy and stainless steel.

4. The chip with the plated alloy pin insert according to claim 3, characterized in that: The thickness of the metal base (21) of the pin insert (20) is 0.02 mm-0.07 mm.

5. The chip with the plated alloy pin insert according to claim 4, characterized in that: The metal of the intermediate layer is one of tin, nickel and zinc.

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