Heat dissipation device for elastically clamping laser crystal

Abstract

The utility model relates to the technical field of semiconductor equipment, and provides a radiating device for elastically clamping a laser crystal, which comprises an immersion type heat sink, a semiconductor cooler and a radiator, a liquid immersion working medium is arranged in the immersion heat sink; a laser crystal to be cooled is arranged in the immersion working medium; the semiconductor cooler comprises a cooling end and a heat release end; the refrigeration end and the immersion type heat sink are connected in an attached mode and conduct heat exchange. The heat release end is connected with the radiator and exchanges heat with the radiator; the immersive heat sink comprises a shell and an upper cover; the laser crystal is directly or indirectly arranged on the shell; and the upper cover is provided with an extension connecting part which is used for clamping the laser crystal from the upper part.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a heat dissipation device for elastically clamping a laser crystal. Background Art

[0002] As one of the important devices for producing high-quality lasers, the working state of laser crystals affects the laser performance in real time. As a working material, laser crystals can convert the energy provided by the outside world into highly parallel and monochromatic lasers that are coherent in space and time through an optical resonant cavity. In this process, the crystal generates a large amount of heat energy, which will lead to adverse phenomena such as crystal efficiency fluctuations, thermal lens effects, uneven thermal stress, and even thermal stress cracking. Therefore, a heat dissipation device is required to dissipate the waste heat generated by the crystal in a timely and effective manner to ensure that the temperature of the crystal is controllable, the heat is evenly distributed, and the stress state is good during the working process.

[0003] In the prior art, there are two problems with the proposed laser crystal heat dissipation device: first, the way the crystal is clamped causes it to be subjected to great circumferential pressure, which can easily cause thermal stress cracking when the crystal expands due to heat; second, the crystal is clamped by using solid metal parts or filling with heat-conducting materials, which increases the thermal resistance of the crystal to transfer heat to the cold source and cannot dissipate heat more efficiently. In addition, due to the uneven heat generation of different parts of the crystal, the heat cannot be dispersed evenly and in time, causing uneven heating and affecting work efficiency. For example, application number 2015105932505 "A round rod-shaped laser crystal heat pipe heat sink type fastening cooling device and method" proposes a device and method for adding a heat pipe to the crystal heat sink and wrapping a thermal interface material on the crystal surface to improve the heat transfer coefficient. Although it is an improvement over the usual method of fastening and clamping the crystal with two metal heat sinks and then dissipating heat through circulating water cooling or semiconductor refrigeration, the heat transfer still needs to pass through multiple transfer devices such as thermal interface material-heat sink-heat pipe assembly-semiconductor refrigeration plate, especially there is still solid-state contact thermal resistance between the crystal and the heat sink; for example, application number 2021218384054 "A water-cooled heat dissipation temperature control device for laser crystals" proposes a heat dissipation device in which circulating water cooling is passed through the top shell and the fixing frame, the laser crystal is installed in the mounting grooves of the top shell and the fixing frame, and thermal conductive glue is filled along the groove wall to reduce the contact thermal resistance. This device has defects such as solid-state contact thermal resistance, easy contamination of the crystal by the flow or volatilization of the thermal conductive glue, and easy stress cracking of the crystal due to thermal expansion in the fixing hole installation method. Utility Model Content

[0004] The utility model aims to provide a heat dissipation device for elastically clamping a laser crystal, so as to solve at least one technical problem existing in the prior art.

[0005] In order to solve the above technical problems, the utility model provides a heat dissipation device for elastically clamping a laser crystal, comprising an immersed heat sink, a semiconductor refrigerator and a heat sink;

[0006] The immersion heat sink is provided with a liquid immersion medium;

[0007] The laser crystal to be cooled is arranged in the immersion medium;

[0008] The semiconductor refrigerator comprises a cooling end and a heat release end;

[0009] The cooling end is closely connected with the immersed heat sink to perform heat exchange;

[0010] The heat release end is connected to the radiator to perform heat exchange;

[0011] The immersion heat sink comprises a shell and an upper cover;

[0012] The laser crystal is directly or indirectly arranged on the housing;

[0013] The upper cover is provided with an extended connection portion for clamping the laser crystal from the top.

[0014] Furthermore, a top block is provided on the shell;

[0015] The top block is directly or indirectly connected to the shell;

[0016] The top block and the extended connecting portion are both provided with connecting surfaces;

[0017] The shape of the connecting surface matches the shape of the outer surface of the laser crystal;

[0018] The top block and the extended connection portion clamp the laser crystal from below and above respectively.

[0019] Furthermore, a spring is provided at the bottom of the housing;

[0020] One end of the spring is connected to the housing, and the other end is connected to the top block;

[0021] The top block is indirectly connected to the housing through the spring.

[0022] Furthermore, blind hole structures are correspondingly provided on the shell and the top block for installing the spring, so that the spring can elastically expand and contract along its axial direction in the blind hole structure.

[0023] Preferably, two or more springs are provided.

[0024] Furthermore, a first sealing gasket is provided at the contact point between the shell and the upper cover, for sealing the contact point between the shell and the upper cover.

[0025] Furthermore, an inner groove is provided at a position where the shell contacts the upper cover;

[0026] The first sealing gasket is arranged in the inner groove.

[0027] Furthermore, the immersion heat sink also includes a pressure cylinder and a window piece;

[0028] The pressing cylinder comprises an outer end and an inner end;

[0029] The inner end enters the interior of the shell through a through hole provided on the shell;

[0030] The outer end has a diameter larger than the through hole provided on the shell and is provided outside the shell;

[0031] One end of the window piece is connected to the inner end of the pressing cylinder, and the other end is connected to the laser crystal.

[0032] Preferably, the window piece is connected to the pressure cylinder by welding, bonding or threaded fastening to seal the connection surface and prevent the immersion medium from penetrating into the connection surface between the window piece and the pressure cylinder to affect the laser light path.

[0033] Furthermore, two of the pressing cylinder and two of the window pieces are provided, which are respectively arranged at two ends of the axial direction of the laser crystal and are coaxially arranged with the laser crystal.

[0034] Furthermore, a second sealing gasket is provided at the connection between the pressure cylinder and the shell, for sealing the connection between the shell and the pressure cylinder.

[0035] Furthermore, the inner wall of the shell is designed as a concave-convex structure to increase the contact area with the immersion medium.

[0036] Further, the heat sink includes a heat pipe and fins;

[0037] The heat conducting pipe is arranged on the fin.

[0038] Preferably, one or more heat conducting pipes are provided.

[0039] Preferably, the heat conducting pipe and the fin are connected by welding, crimping or embedding.

[0040] Furthermore, the heat sink also includes a substrate;

[0041] One end of the heat pipe is connected to the fin, and the other end is connected to the substrate;

[0042] The substrate is connected to the semiconductor refrigerator. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A three-dimensional structural diagram of the overall structure of the utility model;

[0045] Figure 2 This is a front view of the immersion heat sink of the utility model;

[0046] Figure 3 It is the BB cross-sectional view in the main view of the immersion heat sink of the utility model;

[0047] Figure 4 This is a schematic diagram of the explosion structure of the immersed heat sink of the utility model;

[0048] Figure 5 It is a three-dimensional structural schematic diagram of the housing of the utility model;

[0049] Figure 6 This is a schematic diagram of the structure of the radiator of the utility model;

[0050] Figure 7 This is a schematic diagram of the overall structural assembly corresponding to the radiator with a substrate of the utility model;

[0051] Figure 8 It is a three-dimensional structural schematic diagram of a heat sink with a substrate according to the utility model;

[0052] Fig. 9 It is a side cross-sectional schematic diagram of the trough body and the heat conducting pipe of the utility model.

[0053] Reference numerals:

[0054] 1-immersed heat sink; 10-housing; 11-upper cover; 111-extended connection portion; 12-first sealing gasket; 13-pressing cylinder; 14-second sealing gasket; 15-window piece; 16-laser crystal; 17-top block; 18-spring; 19-immersed working fluid; 2-semiconductor refrigerator; 3-radiator; 31-heat pipe; 32-fin; 33-substrate; 34-trough body; 341-accommodating portion; 342-locking portion. DETAILED DESCRIPTION

[0055] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0056] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The present invention will be further explained below in conjunction with specific implementation methods.

[0059] Example 1

[0060] like Figure 1-4 As shown, the present embodiment provides a heat dissipation device for elastically clamping a laser crystal, comprising an immersion heat sink 1, a semiconductor refrigerator 2 and a heat sink 3. A liquid immersion medium 19 is arranged in the immersion heat sink 1, and a laser crystal 16 to be cooled is arranged in the immersion medium 19. The immersion medium 19 is a liquid solution with a high specific heat capacity and does not damage the laser crystal 16. The laser crystal 16 can be in the shape of a round rod, a cone, a rectangular rod or a heterogeneous crystal. In the present embodiment, the laser crystal 16 is in the shape of a round rod.

[0061] like Figure 1 As shown, the immersion heat sink 1 is connected to the cooling end of the semiconductor refrigerator 2 and performs heat exchange, and the heat release end of the semiconductor refrigerator 2 is connected to the radiator 3 and performs heat exchange.

[0062] like Figure 2-4As shown, the immersion heat sink 1 includes a shell 10 and an upper cover 11 , and the shell 10 and the upper cover 11 clamp the laser crystal 16 .

[0063] The laser crystal 16 will generate a large amount of heat when working. Since it is immersed in the immersion medium 19, the heat it generates will be quickly conducted to the immersion medium 19. The heat of the immersion medium 19 is conducted to the shell 10, and the heat is dissipated through heat exchange between the shell 10 and the cooling end of the semiconductor refrigerator 2. At the same time, the heat of the heat release end of the semiconductor refrigerator 2 is dissipated to the environment through the radiator 3.

[0064] like Figure 3-4 As shown, in order to stably clamp the laser crystal 16, the present embodiment uses the top block 17 provided on the housing 10 and the extended connection portion 111 provided on the upper cover 11 to clamp the laser crystal 16. The top block 17 and the extended connection portion 111 are provided with a local arc groove that matches the shape of the outer surface of the laser crystal 16 on the contact surface for clamping the laser crystal 16, which can firmly clamp the laser crystal 16 with the minimum contact area, so that most of the surface area of ​​the laser crystal 16 can be immersed in the immersion medium 19.

[0065] like Figure 3-4 As shown, since the laser crystal 16 heats up during operation, thermal expansion and contraction will occur. In order to avoid damage to the laser crystal 16 and the entire device due to over-tight clamping, elastic support is required when clamping the laser crystal 16. To this end, a spring 18 is provided between the housing 10 and the top block 17 in this embodiment. When the top block 17 and the top plate clamp the laser crystal 16, the spring 18 will be compressed when the laser crystal 16 heats up and expands, thereby avoiding damage to the laser crystal 16 and the entire device due to over-tight clamping.

[0066] like Figure 3 and 5 As shown, in order to prevent the spring 18 from radially moving during the expansion and contraction process, blind hole structures are correspondingly provided on the housing 10 and the top block 17 in this embodiment to limit the spring 18. The spring 18 is arranged in the blind hole and elastically expands and contracts along its axial direction.

[0067] like Figure 3-4 As shown, as a further embodiment of the present application, in order to improve the stability of the spring 18, two or more springs 18 are provided.

[0068] like Figure 3-4 As shown, in order to seal the contact point between the shell 10 and the upper cover 11 , a first sealing gasket 12 is further provided at the contact point between the shell 10 and the upper cover 11 . The first sealing gasket 12 is provided in an inner groove provided at the position where the shell 10 contacts the upper cover 11 .

[0069] like Figure 1-4 As shown, the immersion heat sink 1 also includes a pressing cylinder 13 and a window piece 15 arranged opposite to each other on two sides. The pressing cylinder 13 is provided with a light-through hole in the axial direction for passing the laser. The pressing cylinder 13 includes an outer end with a larger diameter and an inner end with a smaller diameter. The inner end enters the interior of the shell 10 through a through hole with the same diameter as the inner end provided on the shell 10, and the side away from the outer end is connected to the window piece 15 by welding, bonding or threaded fastening, which is used to seal the connection surface to prevent the immersion medium 19 from being immersed in the connection surface between the window piece 15 and the pressing cylinder 13, thereby affecting the laser light path. One end of the window piece 15 away from the pressing cylinder 13 abuts against the laser crystal 16. The laser crystal 16, the window piece 15 and the pressing cylinder 13 are coaxially arranged.

[0070] like Figure 3-4 As shown, the outer end of the pressure cylinder 13 is pressed against the outer wall of the shell 10. In order to further improve the sealing effect of the connection between the shell 10 and the pressure cylinder 13, a second sealing gasket 14 is provided at the connection between the pressure cylinder 13 and the shell 10.

[0071] like Figure 5 As shown, in order to further enhance the thermal conductivity of the shell 10, the inner wall of the shell 10 is designed as a concave-convex structure. In this embodiment, a plurality of micro-sized column grooves and / or protrusion structures are provided on the inner wall of the shell 10 to increase the contact area with the immersed working medium 19 and thus improve the heat transfer performance.

[0072] like Figure 1 and 6 As shown, the heat sink 3 includes a heat pipe 31 and a fin 32, and one or more heat pipes 31 are arranged on the fin 32. The heat pipe 31 and the fin 32 are connected by welding, crimping or embedding.

[0073] Example 2

[0074] like Figure 7-8 The second embodiment of the present application is shown. Different from the first embodiment, the heat sink 3 in the second embodiment further includes a substrate 33, and the substrate 33 is connected to the semiconductor refrigerator 2. The substrate 33 and the fins 32 are arranged at different positions, and one end of the heat pipe 31 is connected to the fins 32, and the other end is connected to the substrate 33. The heat pipe 31 can conduct the heat at the substrate 33 to the fins 32 for release. In actual work, the fins 32 can be arranged at a distance from the substrate 33, and can even be arranged outdoors. When the fins 32 release the heat to the external environment, it will not affect other equipment.

[0075] Example 3

[0076] In this embodiment, a slot 34 is provided on the fin 32 or the base plate 33 for accommodating the heat pipe 31. Fig. 9The figure shows a side cross-sectional schematic diagram of the slot body 34 and the heat pipe 31. The slot body 34 includes a receiving portion 341 and a clamping portion 342. The receiving portion 341 has the same shape as the heat pipe 31, and its inner diameter is the same as the outer diameter of the heat pipe 31. The clamping portion 342 is arranged on the outer side of the receiving portion 341, and its height is slightly smaller than the outer diameter of the heat pipe 31, so that the heat pipe 31 can enter the receiving portion 341 through the clamping portion 342 through the slight elastic deformation of the heat pipe 31 and the slot body 34. After the heat pipe 31 is embedded in the receiving portion 341, the clamping portion 342 can clamp the heat pipe 31 to prevent it from falling out of the slot body 34. After the heat pipe 31 enters the slot body 34, its part close to the clamping portion 342 will be exposed outside the slot body 34. In order to make the side of the entire fin 32 or the substrate 33 in a flat state for easy connection with other components, the exposed pipe body is flattened or cut to be flat.

[0077] By adopting the above technical solution, the utility model has the following beneficial effects:

[0078] 1. The utility model discloses a heat dissipation device and method for elastically clamping laser crystals. It proposes to immerse the laser crystal 16 directly in a liquid working medium. On the one hand, it realizes all-round heat dissipation of the laser crystal 16 and improves the heat dissipation efficiency. On the other hand, it avoids the solid-state contact thermal resistance and directly transfers heat through the liquid working medium crystal with large specific heat capacity, which reduces the heat transfer path components and improves the heat transfer efficiency. In addition, due to the high fluidity and molecular motion intensity of the liquid working medium, the temperature rise of the unevenly heated crystal will be uniform, thereby improving the efficiency of the laser crystal 16.

[0079] 2. The utility model is a heat dissipation device and method for elastically clamping laser crystals. The laser crystal 16 is installed through a local arc groove, and the elastic clamping method of spring 18 plus top block 17 is adopted to enable the crystal to expand almost freely under heat, reduce the generation of thermal stress, and reduce the thermal stress cracking of the crystal. The blind hole structure and the arrangement of multiple springs 18 further enhance the stability and reliability of the structure.

[0080] 3. The cooling end of the semiconductor cooler 2 is connected to the immersed heat sink 1 to remove the heat from the heat sink through heat exchange, while the heat release end is connected to the radiator 3 to dissipate the heat to the external environment. This active cooling method has higher heat dissipation efficiency and can better meet the heat dissipation requirements of the laser crystal 16 during high power and long-term operation.

[0081] 4. The sealing design in the device effectively prevents leakage of the immersed working fluid 19 and ensures the durability of the heat dissipation effect. The application of the first sealing gasket 12 and the second sealing gasket 14 enables the device to maintain good sealing performance during long-term operation and avoid the degradation of heat dissipation performance due to leakage.

[0082] 5. The design of the radiator 3 also fully considers the heat dissipation efficiency and practicality. The combination of the heat pipe 31 and the fin 32 increases the heat dissipation area and improves the heat dissipation speed. The connection between the substrate 33 and the semiconductor refrigerator 2 ensures that the heat can be quickly transferred from the cooling end to the radiator 3, thereby achieving an efficient heat dissipation effect.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A heat dissipation device for elastically clamping a laser crystal, characterized in that: It includes an immersed heat sink (1), a semiconductor cooler (2) and a heat sink (3); The immersion heat sink (1) is provided with a liquid immersion medium (19); The laser crystal (16) to be cooled is arranged in the immersion working medium (19); The semiconductor refrigerator (2) comprises a cooling end and a heat release end; The cooling end is closely connected to the immersed heat sink (1) to perform heat exchange; The heat release end is connected to the radiator (3) to perform heat exchange; The immersion heat sink (1) comprises a shell (10) and an upper cover (11); The laser crystal (16) is directly or indirectly arranged on the housing (10); The upper cover (11) is provided with an extended connection portion (111) for clamping the laser crystal (16) from above.

2. The heat dissipation device for elastically clamping a laser crystal according to claim 1, characterized in that: A top block (17) is provided on the housing (10); The top block (17) is directly or indirectly connected to the shell (10); The top block (17) and the extended connection portion (111) are both provided with connection surfaces; The shape of the connecting surface matches the shape of the outer surface of the laser crystal (16); The top block (17) and the extended connection portion (111) clamp the laser crystal (16) from below and above respectively.

3. The heat dissipation device for elastically clamping a laser crystal according to claim 2, characterized in that: A spring (18) is provided at the bottom of the housing (10); One end of the spring (18) is connected to the housing (10), and the other end is connected to the top block (17); The top block (17) is indirectly connected to the housing (10) via the spring (18).

4. The heat dissipation device for elastically clamping a laser crystal according to claim 3, characterized in that: Blind hole structures are correspondingly provided on the housing (10) and the top block (17) for mounting the spring (18), so that the spring (18) elastically expands and contracts along its axial direction in the blind hole structure.

5. The heat dissipation device for elastically clamping a laser crystal according to claim 4, characterized in that: The number of the springs (18) is two or more.

6. The heat dissipation device for elastically clamping a laser crystal according to claim 1, characterized in that: A first sealing gasket (12) is also provided at the contact point between the shell (10) and the upper cover (11), for sealing the contact point between the shell (10) and the upper cover (11).

7. The heat dissipation device for elastically clamping a laser crystal according to claim 6, characterized in that: An inner groove is also provided at a position where the shell (10) contacts the upper cover (11); The first sealing gasket (12) is arranged in the inner groove.

8. The heat dissipation device for elastically clamping a laser crystal according to claim 1, characterized in that: The immersion heat sink (1) further comprises a pressing cylinder (13) and a window sheet (15); The pressing cylinder (13) comprises an outer end and an inner end; The inner end enters the interior of the shell (10) through a through hole provided on the shell (10); The outer end has a diameter greater than the through hole provided on the shell (10), and is provided outside the shell (10); One end of the window sheet (15) is connected to the inner end of the pressing cylinder (13), and the other end is connected to the laser crystal (16).

9. The heat dissipation device for elastically clamping a laser crystal according to claim 8, characterized in that: The window piece (15) is connected to the pressure cylinder (13) by welding, bonding or threaded fastening, and is used to seal the connection surface, thereby preventing the immersion medium (19) from penetrating into the connection surface between the window piece (15) and the pressure cylinder (13) and affecting the laser light path.

10. The heat dissipation device for elastically clamping a laser crystal according to claim 8, characterized in that: The pressing cylinder (13) and the window sheet (15) are both provided in pairs, and are respectively arranged at two ends of the axial direction of the laser crystal (16), and are coaxially arranged with the laser crystal (16).

11. The heat dissipation device for elastically clamping a laser crystal according to claim 8, characterized in that: A second sealing gasket (14) is provided at the connection between the pressure cylinder (13) and the shell (10), and is used to seal the connection between the shell (10) and the pressure cylinder (13).

12. The heat dissipation device for elastically clamping a laser crystal according to claim 1, characterized in that: The inner wall of the shell (10) is designed as a concave-convex structure, so as to increase the contact area with the immersion medium (19).

13. The heat dissipation device for elastically clamping a laser crystal according to claim 1, characterized in that: The heat sink (3) comprises a heat conducting pipe (31) and fins (32); The heat conducting pipe (31) is arranged on the fin (32).

14. The heat dissipation device for elastically clamping a laser crystal according to claim 13, characterized in that: One or more heat conduction pipes (31) are provided.

15. The heat dissipation device for elastically clamping a laser crystal according to claim 13, characterized in that: The heat conducting pipe (31) and the fin (32) are connected by welding, crimping or embedding.

16. The heat dissipation device for elastically clamping a laser crystal according to claim 13, characterized in that: The heat sink (3) also includes a substrate (33); One end of the heat conducting pipe (31) is connected to the fin (32), and the other end is connected to the base plate (33); The substrate (33) is connected to the semiconductor refrigerator (2).

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