Ultra-thin low-temperature hysteresis thermosensitive crystal resonator

Abstract

The utility model relates to an ultra-thin low-temperature hysteresis thermosensitive crystal resonator, which comprises a base and an upper cover fixedly arranged on the base, the base is formed by stacking a thermistor assembly and a ceramic wall up and down, the thermistor assembly comprises a thermistor and a ceramic block wrapped outside the thermistor, and the ceramic block is arranged on the upper cover. The upper surface of the ceramic block, the ceramic wall and the upper cover jointly form an inner cavity, a quartz crystal is arranged in the inner cavity, and external electrodes correspondingly communicated with the thermistor and the quartz crystal are arranged on the lower surface of the ceramic block. According to the utility model, the hysteresis capability of the thermosensitive crystal resonator can be improved, and the thin and low-temperature hysteresis product design can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of quartz crystal frequency components, in particular to an ultra-thin low-temperature hysteresis thermistor crystal resonator. Background Art

[0002] Thermistor crystal resonator is usually composed of piezoelectric quartz chip, thermistor, conductive glue, base and cover. The piezoelectric quartz chip is usually rectangular or circular, and the package base usually needs to reserve a groove for thermistor. The piezoelectric quartz chip is plated with electrodes on the upper and lower sides and fixed in the package shell by conductive glue. The electrodes are connected to the base pins of the package shell through the leads of the sealed package. The AC voltage is connected to the upper and lower electrodes of the quartz chip through the pins, causing the quartz chip to produce an inverse piezoelectric effect, thereby generating oscillation. At the same time, the thermistor senses the surrounding temperature and transmits the temperature signal to the IC. The IC adjusts the frequency output of the crystal oscillation circuit in time through the internal circuit to stabilize it within a controllable range.

[0003] With the continuous development of microelectronic products, higher requirements are also put forward for thermistor crystal resonators. Since thermistors and bases are designed separately, it is difficult to make the products thinner. In addition, the existing separate design makes thermistor sense temperature and quartz chip have a certain hysteresis. Therefore, it is necessary to develop an ultra-thin low temperature hysteresis thermistor crystal resonator, so that the thermistor senses temperature closer to the quartz chip, improve the hysteresis ability of thermistor crystal resonator, and achieve thin and low temperature hysteresis product design. Summary of the invention

[0004] The technical problem to be solved by the utility model is to provide an ultra-thin low temperature hysteresis thermistor crystal resonator, which can improve the hysteresis capability of the thermistor crystal resonator and achieve a product design with thinness and low temperature hysteresis.

[0005] The utility model solves the technical problem by adopting the following technical solution: providing an ultra-thin low-temperature hysteresis thermistor crystal resonator, comprising a base and an upper cover fixed on the base, wherein the base is formed by stacking a thermistor assembly and a ceramic wall up and down, wherein the thermistor assembly comprises a thermistor block and a ceramic block wrapped outside the thermistor block, wherein the upper surface of the ceramic block, the ceramic wall and the upper cover together form an inner chamber, wherein a quartz crystal is arranged in the inner chamber, and wherein the lower surface of the ceramic block is provided with external electrodes respectively connected to the thermistor block and the quartz crystal.

[0006] As a supplement to the technical solution described in the utility model, the upper end of the ceramic block is located inside the ceramic wall and has two internal electrodes. The quartz crystal is mounted on the two internal electrodes. There are four external electrodes, namely the first electrode, the second electrode, the third electrode and the fourth electrode. The four electrodes are sequentially arranged at the four corners of the lower end of the ceramic block. The two internal electrodes are respectively conductive with the first electrode and the third electrode, and the two ends of the thermistor block are respectively conductive with the second electrode and the fourth electrode.

[0007] As a supplement to the technical solution described in the utility model, the quartz crystal is mounted on the internal electrode through conductive silver glue.

[0008] As a supplement to the technical solution described in the utility model, the quartz crystal is provided with an electrode surface and two electrode pins connected to the electrode surface, each electrode pin is provided with a through hole, and the internal electrode is provided with a protrusion inserted into the through hole, which is connected to the internal electrode through conductive silver glue.

[0009] As a supplement to the technical solution of the utility model, the shape of the protrusion is conical, cylindrical or hemispherical.

[0010] As a supplement to the technical solution described in the utility model, the internal electrode is in a "'" shaped structure, and a boss that is interlocked with the internal electrode is provided on one side of the lower end of the quartz crystal, and the quartz crystal and the boss form a "'" shaped structure.

[0011] As a supplement to the technical solution described in the utility model, the two ends of the thermistor block are respectively connected to the second electrode and the fourth electrode through internal leads, and the two internal electrodes are respectively connected to the first electrode and the third electrode through internal leads.

[0012] As a supplement to the technical solution described in the utility model, the thermistor assembly is formed by sintering a thermistor block and a ceramic block.

[0013] As a supplement to the technical solution described in the utility model, the thickness of the thermistor assembly is 100-120 um, and the thickness of the ceramic wall is 100-150 um.

[0014] As a supplement to the technical solution described in the utility model, the base and the upper cover are sealed by welding with a gold-tin alloy, the thickness of the gold-tin alloy is 10 to 12 um, and the overall thickness of the resonator is 250 to 300 um.

[0015] As a supplement to the technical solution described in the utility model, the upper cover is a Kovar alloy plate, the thickness of the upper cover is 40 to 50 um, and the Ni plating thickness of the surface of the upper cover is 2 to 4 um.

[0016] Beneficial effects: The utility model relates to an ultra-thin low-temperature hysteresis thermistor resonator, in which the thermistor is directly built into the base, which can greatly reduce the thickness of the base; through the optimization of the internal electrode structure, the internal electrode is in a "'"-shaped structure, which can effectively reduce the sagging of the quartz crystal; the raised portion added to the internal electrode cooperates with the through hole in the center of the quartz crystal electrode foot, and then is connected through conductive silver glue, which can better increase the chip structure stability and thermal conductivity, greatly improve the temperature hysteresis characteristics of the thermistor resonator, and make the customer's temperature compensation more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a cross-sectional view of the utility model;

[0018] Figure 2 It is a top view of the utility model after removing the upper cover;

[0019] Figure 3 It is a bottom view of the utility model;

[0020] Figure 4 It is a top view of the utility model after removing the upper cover and the quartz crystal;

[0021] Figure 5 It is a top view of the quartz crystal described in the utility model;

[0022] Figure 6 It is a top view of the circuit on the upper end of the base described in the utility model;

[0023] Figure 7 It is a bottom view of the internal circuit of the base described in the utility model.

[0024] Illustration: 1. base, 2. upper cover, 3. quartz crystal, 4. conductive glue, 5. metal film, 6. thermistor assembly, 61. thermistor block, 62. ceramic block, 7. ceramic wall, 8. internal electrode, 81. protrusion, 9a. first electrode, 9b. second electrode, 9c. third electrode, 9d. fourth electrode, 51. electrode surface, 52. electrode pin, 53. electrode foot, 54. through hole. DETAILED DESCRIPTION

[0025] The present invention is further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the claims attached to this application.

[0026] The embodiment of the utility model relates to an ultra-thin low temperature hysteresis thermistor crystal resonator, such as Figure 1-7 As shown, it includes a base 1 and an upper cover 2 installed and fixed on the base 1, the base 1 is formed by stacking a thermistor component 6 and a ceramic wall 7 up and down, the thermistor component 6 includes a thermistor block 61 and a ceramic block 62 wrapped outside the thermistor block 61, the upper surface of the ceramic block 62 and the ceramic wall 7 and the upper cover 2 together form an inner chamber, a quartz crystal 3 is arranged in the inner chamber, and the lower surface of the ceramic block 62 is provided with external electrodes respectively connected to the thermistor block 61 and the quartz crystal 3.

[0027] The upper end of the ceramic block 62 is located inside the ceramic wall 7 and is provided with two internal electrodes 8. The quartz crystal 3 is mounted on the two internal electrodes 8. There are four external electrodes, namely the first electrode 9a, the second electrode 9b, the third electrode 9c and the fourth electrode 9d. The four electrodes are sequentially arranged at the four corners of the lower end of the ceramic block 62. The two internal electrodes 8 are respectively conductively connected to the first electrode 9a and the third electrode 9c. The two ends of the thermistor block 61 are respectively conductively connected to the second electrode 9b and the fourth electrode 9d.

[0028] The ceramic block 62 is made of alumina ceramic block.

[0029] The quartz crystal 3 is mounted on the internal electrode 8 via the conductive silver paste 4 .

[0030] The quartz crystal 3 is an L-shaped chip formed by semiconductor etching. The quartz crystal 3 is provided with an electrode surface 51 and two electrode pins 53 connected to the electrode surface 51. Each electrode pin 53 is provided with a through hole 54 with a diameter of 40 to 60 um. The internal electrode 8 is provided with a protrusion 81 inserted into the through hole 54; the electrode pin 53 is connected to the electrode surface 51 through the electrode pin 52; the electrode surface 51, the electrode pin 52 and the electrode pin 53 together constitute a metal film 5.

[0031] The shape of the protrusion 81 is conical, cylindrical or hemispherical.

[0032] The internal electrode 8 is in a "'" shape. A boss 10 interlocked with the internal electrode 8 is provided on one side of the lower end of the quartz crystal 3. The quartz crystal 3 and the boss 10 form a "'" shape.

[0033] The two ends of the thermistor block 61 are connected to the second electrode 9b and the fourth electrode 9d respectively through the inner lead 63, and the two internal electrodes 8 are connected to the first electrode 9a and the third electrode 9c respectively through the inner lead 63; the inner lead 63 is arranged inside the ceramic block 62.

[0034] The thermistor assembly 6 is formed by sintering a thermistor block 61 and a ceramic block 62; the thickness of the thermistor assembly 6 is 100-120 um, and the thickness of the ceramic wall 7 is 100-150 um.

[0035] The base 1 and the upper cover 2 are sealed by welding with a gold-tin alloy, the thickness of the gold-tin alloy is 10-12 um, and the overall thickness of the resonator is 250-300 um.

[0036] The upper cover 2 is a Kovar alloy plate, the thickness of the upper cover 2 is 40-50 um, and the Ni plating thickness on the surface of the upper cover 2 is 2-4 um.

[0037] The ultra-thin low temperature hysteresis thermistor crystal resonator of the utility model can be used in various electronic devices or mobile bodies. For example, the ultra-thin low temperature hysteresis thermistor crystal resonator of the utility model is used in a smart phone for radio frequency transmission and satellite navigation function modules. For example, the ultra-thin low temperature hysteresis thermistor crystal resonator of the utility model is used in a satellite navigation function module in a car. As mentioned above, by using the ultra-thin low temperature hysteresis thermistor crystal resonator of the utility model, high-precision positioning can be achieved in different temperature environments.

[0038] A method for preparing an ultra-thin low temperature hysteresis thermistor crystal resonator comprises the following steps:

[0039] S1: The production of the base 1 is divided into four steps:

[0040] S1.1: First, the thermistor block 61 is manufactured by weighing and mixing the main raw material and the additive powder material respectively, pressing them into a strip, printing the internal circuit of the resistor, laminating the multiple layers, pressing them together, and cutting and separating them into individual resistor blocks;

[0041] S1.2: Secondly, the ceramic block 62 is manufactured by weighing and mixing the main raw material and the additive powder material respectively, pressing them into strips, cutting and separating them, attaching them to the frame, and punching them;

[0042] S1.3: Again, the thermistor block 61 is installed into the hole of the ceramic block 62, and then the hole is filled and the upper and lower circuits are printed;

[0043] S1.4: Finally, the ceramic wall 7 and the thermistor assembly 6 are stacked, sintered together, Ni-plated, a sealing ring is installed, sintered again, gold-plated, and cut and separated into individual bases 1;

[0044] S2: The production of quartz crystal 3 is divided into two steps:

[0045] S2.1: First, a film is plated on the quartz crystal 3, a photoresist is applied, a mask is exposed, the photoresist is removed, and the quartz is etched, so that a "'"-shaped structure is formed on one side of the quartz crystal 3, and a through hole 54 with a diameter of 40 to 60 um is formed at the electrode foot of the quartz crystal 3;

[0046] S2.2: Then, based on the structural formation of the quartz crystal 3, it is cut and separated into single quartz crystals 3, and then etched, cleaned, dried, screened, and packaged;

[0047] S3: The production of thermistor crystal resonator is divided into four steps:

[0048] S3.1: Coating. Coating is performed by sputtering, where high-energy particles collide with the surface of the metal target. The atoms on the metal surface exchange momentum with these high-energy particles, are ejected from the surface and transferred to the surface of the quartz crystal 3 through the action of an electric field to form a metal film 5. The quartz crystal 3 is installed in an electrode mask during sputtering, and the shape and size of the electrode surface 51, electrode foot 53 and electrode lead 52 of the metal film 5 are determined by the electrode mask.

[0049] S3.2: Glue dispensing. An internal electrode 8 is arranged in the inner cavity of the base 1. The internal electrode 8 is in an L-shaped structure, and a protrusion 81 is added to the internal electrode 8. The quartz crystal 3 is adhered to the internal electrode 8 of the base 1 by means of a conductive silver glue 4. The internal electrode 8 is set in a ""-shaped structure, which can effectively reduce the sagging of the quartz crystal 3, so that the tail of the quartz crystal 3 is suspended in the air, thereby reducing the resistance of the quartz crystal 3 during the vibration process and reducing the power consumption of the oscillation. At the same time, a through hole 54 is opened in the center of the electrode foot 53, and the through hole 54 of the quartz crystal 3 is sleeved on the protrusion 81, which can better increase the chip structure stability and thermal conductivity. Please refer to Figure 5 and Figure 6 ;

[0050] S3.3: Fine-tuning. Fine-tuning is performed by dry etching. Ion beams bombard the surface of the metal film 5 to adjust the frequency of the quartz crystal vibrator to the target range by reducing the metal atoms on the surface.

[0051] S3.4: Welding and sealing. Welding and sealing is to seal the upper cover 2 and the base 1 together so that the quartz crystal 3 is in a vacuum sealed cavity, which can prevent the metal film 5 from being oxidized and reduce the resistance of the quartz vibrator, thereby ensuring the long-term frequency stability of the product.

[0052] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or component referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0053] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0054] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0055] The above is a detailed introduction to an ultra-thin low-temperature hysteresis thermistor crystal resonator provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technicians in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An ultra-thin low temperature hysteresis thermistor crystal resonator, comprising a base (1) and an upper cover (2) mounted and fixed on the base (1), characterized in that: The base (1) is formed by stacking a thermistor assembly (6) and a ceramic wall (7) up and down. The thermistor assembly (6) includes a thermistor block (61) and a ceramic block (62) wrapped outside the thermistor block (61). The upper surface of the ceramic block (62) and the ceramic wall (7) and the upper cover (2) together form an inner chamber. A quartz crystal (3) is arranged in the inner chamber. The lower surface of the ceramic block (62) is provided with external electrodes respectively connected to the thermistor block (61) and the quartz crystal (3).

2. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 1, characterized in that: The upper end of the ceramic block (62) is located inside the ceramic wall (7) and is provided with two internal electrodes (8). The quartz crystal (3) is mounted on the two internal electrodes (8). There are four external electrodes, namely a first electrode (9a), a second electrode (9b), a third electrode (9c) and a fourth electrode (9d). The four electrodes are sequentially arranged at the four corners of the lower end of the ceramic block (62). The two internal electrodes (8) are respectively connected to the first electrode (9a) and the third electrode (9c). The two ends of the thermistor block (61) are respectively connected to the second electrode (9b) and the fourth electrode (9d).

3. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 2, characterized in that: The quartz crystal (3) is mounted on the internal electrode (8) via a conductive silver paste (4).

4. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 3, characterized in that: The quartz crystal (3) is provided with an electrode surface (51) and two electrode pins (53) connected to the electrode surface (51), each electrode pin (53) is provided with a through hole (54), and the internal electrode (8) is provided with a protrusion (81) inserted into the through hole (54).

5. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 4, characterized in that: The shape of the protrusion (81) is conical, cylindrical or hemispherical.

6. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 3, characterized in that: The internal electrode (8) is in a ""-shaped structure, and a boss (10) interlocking with the internal electrode (8) is provided on one side of the lower end of the quartz crystal (3), so that the quartz crystal (3) and the boss (10) form a "『"-shaped structure.

7. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 2, characterized in that: The two ends of the thermistor block (61) are respectively connected to the second electrode (9b) and the fourth electrode (9d) through the inner lead wires (63), and the two internal electrodes (8) are respectively connected to the first electrode (9a) and the third electrode (9c) through the inner lead wires (63).

8. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 1, characterized in that: The thermistor assembly (6) is formed by sintering a thermistor block (61) and a ceramic block (62).

9. The ultra-thin low temperature hysteresis thermistor crystal resonator according to claim 1, characterized in that: The base (1) and the upper cover (2) are sealed by welding with a gold-tin alloy, and the thickness of the gold-tin alloy is 10 to 12 um.

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