Circuit board solder mask dry film forming device

Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board resistance welding dry film forming device which comprises a film sticking machine, an alternating assembly is arranged in the film sticking machine, a positioning assembly is arranged at the top end of the alternating assembly, and the alternating assembly comprises electromagnetic sliding rails a arranged on the two sides in the film sticking machine. The device has the beneficial effects that an electromagnetic sliding block a is driven to move through an electromagnetic sliding rail a, resistance welding dry film forming treatment is conducted on a circuit board on a first moving plate through a film pasting machine, and after the circuit board on the first moving plate is machined, a second moving plate drives a moving block to slide in a V-shaped groove through an electromagnetic sliding rail b; the first moving plate and the second moving plate can move alternately, the circuit boards are fed in a staggered mode through the first moving plate and the second moving plate, when one circuit board is subjected to dry film forming treatment, the next circuit board is prepared, the downtime is further shortened, and therefore the overall production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board solder resist dry film forming device. Background Art

[0002] The circuit board is a flexible circuit board made of PET film as the substrate. It has many advantages such as good flexibility, light weight, stable transmission performance, impact resistance, low price, and green environmental protection. Therefore, the circuit board is widely used in electronic machinery automation control, medical equipment, computers, communications and other fields. During the production and processing of circuit boards, a film laminating machine is required for laminating.

[0003] When laminating existing circuit boards, the circuit boards need to be sent to a laminating machine for laminating. After laminating is completed, the circuit boards need to be taken out before the next group of circuit boards can be laminating. This consumes a long time of downtime of the laminating machine, which will seriously affect the production efficiency of the entire device. Utility Model Content

[0004] The utility model aims to provide a circuit board solder resist dry film forming device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board solder mask dry film forming device, including a laminating machine, an alternating component is provided inside the laminating machine, a positioning component is provided on the top of the alternating component, the alternating component includes electromagnetic slide rails a provided on both sides of the laminating machine, two groups of the electromagnetic slide rails a are slidably connected to the top of electromagnetic sliders a, the top of the electromagnetic slider a is fixedly connected to a first movable plate, two groups of electromagnetic slide rails b are provided between the two groups of the electromagnetic slide rails a, the top of the two groups of the electromagnetic slide rails b are slidably connected to the electromagnetic slider b, and a vertical plate is provided between the electromagnetic slide rails b, a fixed plate is welded to the top of the electromagnetic slider b, circular shafts are slidably connected to both sides of the fixed plate, a fixed block is welded to the bottom end of the circular shaft, a moving block is fixedly connected to the side of the fixed block away from the circular shaft, and a second moving plate is fixedly connected to the top of the moving block.

[0006] Preferably, a stopper is fixedly connected to one side of the top end of the electromagnetic slide rail a and the electromagnetic slide rail b.

[0007] Preferably, V-shaped grooves are provided on both sides of the vertical plate, and the moving block is slidably connected to the V-shaped grooves.

[0008] Preferably, the positioning assembly includes a positioning plate fixedly connected to the top of the first movable plate and the second movable plate, and positioning blocks are slidably connected on both sides of the two groups of positioning plates, and grooves are formed on both sides of the positioning blocks.

[0009] Preferably, a card block is slidably connected inside the groove, a rope is fixedly connected to one side of the card block, two groups of guide shafts a for changing the extension direction of the rope are provided on the surface of the rope, a square plate fixedly connected to the surface of the rope is provided on the side of the guide shaft a away from the card block, a spring is fixedly connected to one side of the square plate, a guide shaft b for changing the secondary extension direction of the rope is provided on the surface of the rope, and an elastic protective plate is fixedly connected to one side of the positioning block.

[0010] Preferably, a plurality of groups of slots matching the card blocks are provided inside the positioning plate, a movable slot is provided inside the positioning block, and the square plate is slidably connected to the movable slot.

[0011] Preferably, one end of the wire rope away from the clamping block is fixedly connected to a pull plate, and one side of the elastic protective plate is provided with an inclined surface.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model proposes a circuit board solder resist dry film forming device, which drives the electromagnetic slider a to move through the electromagnetic slide rail a, and performs solder resist dry film forming processing on the circuit board on the first movable plate through the film laminating machine. When the circuit board on the first movable plate is processed, the second movable plate drives the movable block to slide in the V-groove through the electromagnetic slide rail b, so that the first movable plate and the second movable plate can move alternately, and the circuit boards are staggered by the first movable plate and the second movable plate. When one circuit board is undergoing dry film forming processing, the next circuit board is ready, which further reduces the downtime and improves the overall production efficiency.

[0014] 2. The utility model proposes a circuit board solder mask dry film forming device, which can pull the pull plates on both sides to disengage the card block from the card slot and release the fixation between the positioning plate and the positioning block. The circuit board can be effectively protected by the elastic protective plate. The positioning blocks on both sides can be adjusted to quickly adapt to circuit boards of different sizes and shapes, thereby reducing the time for replacing and adjusting tools. Through precise positioning, the accurate fitting of the solder mask dry film can be ensured, and the occurrence of problems such as short circuit and leakage can be avoided, thereby improving the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional schematic diagram of the overall components of the utility model;

[0016] Figure 2 This is a three-dimensional schematic diagram of the interior of the film laminating machine of the utility model;

[0017] Figure 3 It is a three-dimensional schematic diagram of the alternating components of the utility model;

[0018] Figure 4 This is a schematic diagram of the interior of the fixing plate of the utility model;

[0019] Figure 5 It is a three-dimensional schematic diagram of the positioning component of the utility model;

[0020] Figure 6 It is a three-dimensional schematic diagram of the interior of the positioning block of the utility model.

[0021] In the figure: 100, film laminating machine;

[0022] 200, alternating assembly; 210, electromagnetic slide rail a; 220, electromagnetic slider a; 221, stopper; 230, first movable plate; 240, electromagnetic slide rail b; 250, electromagnetic slider b; 260, fixed plate; 270, vertical plate;

[0023] 271, V-shaped groove; 280, round shaft; 281, fixed block; 290, moving block; 2910, second moving plate;

[0024] 300, positioning assembly; 310, positioning plate; 320, positioning block; 330, clamping block; 331, groove; 332, clamping slot; 340, rope; 350, guide shaft a; 360, square plate; 361, movable slot; 370, spring; 380, guide shaft b; 390, pull plate; 3910, elastic protective plate; 3911, inclined plane. DETAILED DESCRIPTION

[0025] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Embodiment 1

[0027] See also Figure 1-Figure 6The utility model provides a technical solution: a circuit board solder mask dry film forming device, including a film laminating machine 100, an alternating component 200 is arranged inside the film laminating machine 100, a positioning component 300 is arranged at the top of the alternating component 200, the alternating component 200 includes electromagnetic slide rails a210 arranged on both sides of the film laminating machine 100, the tops of the two sets of electromagnetic slide rails a210 are slidably connected to electromagnetic sliders a220, the tops of the electromagnetic sliders a220 are fixedly connected to the first moving plate 230, two sets of electromagnetic slide rails b240 are arranged between the two sets of electromagnetic slide rails a210, and the tops of the two sets of electromagnetic slide rails b240 are slidably connected to electromagnetic sliders a220. A vertical plate 270 is provided between the slider b250 and the electromagnetic slide rail b240, a fixed plate 260 is welded on the top of the electromagnetic slider b250, a circular shaft 280 is slidably connected on both sides of the fixed plate 260, a fixed block 281 is welded on the bottom end of the circular shaft 280, a moving block 290 is fixedly connected on the side of the fixed block 281 away from the circular shaft 280, a second moving plate 2910 is fixedly connected on the top of the moving block 290, a stopper 221 is fixedly connected on one side of the top of the electromagnetic slide rail a210 and the electromagnetic slide rail b240, V-shaped grooves 271 are opened on both sides of the vertical plate 270, and the moving block 290 is slidably connected to the V-shaped grooves 271.

[0028] After the circuit board is fixed, the electromagnetic slide a220 is driven to move by the electromagnetic slide rail a210, and the electromagnetic slide a220 drives the first movable plate 230 to move into the film laminating machine 100, and the circuit board on the first movable plate 230 is subjected to a solder resist dry film forming process by the film laminating machine 100. When the first movable plate 230 is subjected to the film laminating process, the staff can fix the circuit board to be filmed on the second movable plate 2910. When the circuit board on the first movable plate 230 is processed, the electromagnetic slide rail b240 drives the electromagnetic slide b250 to carry The movable fixed plate 260 moves, and the fixed plate 260 drives the second movable plate 2910 to move through the circular shaft 280, and the second movable plate 2910 drives the movable block 290 to slide in the V-shaped groove 271, so that the first movable plate 230 and the second movable plate 2910 can move alternately, and the circuit boards are fed alternately through the first movable plate 230 and the second movable plate 2910. When one circuit board is undergoing dry film forming processing, the next circuit board is ready, which further reduces downtime and improves overall production efficiency.

[0029] Embodiment 2

[0030] On the basis of the first embodiment, the positioning assembly 300 includes a positioning plate 310 fixedly connected to the top of the first movable plate 230 and the second movable plate 2910, and the two groups of positioning plates 310 are slidably connected with positioning blocks 320 on both sides inside. Grooves 331 are provided on both sides inside the positioning blocks 320, and a card block 330 is slidably connected inside the groove 331. A wire rope 340 is fixedly connected to one side of the card block 330, and two groups of guide shafts a350 for changing the extension direction thereof are provided on the surface of the wire rope 340. The side of the guide shaft a350 away from the card block 330 is provided with a fixed connection to the surface of the wire rope 340. A square plate 360 ​​is provided on the surface of the square plate 360, a spring 370 is fixedly connected to one side of the square plate 360, a guide shaft b380 for changing the secondary extension direction of the rope 340 is provided on the surface of the rope 340, an elastic protective plate 3910 is fixedly connected to one side of the positioning block 320, a plurality of groups of card slots 332 for matching the card block 330 are provided inside the positioning plate 310, a movable slot 361 is provided inside the positioning block 320, the square plate 360 ​​is slidably connected to the movable slot 361, a pull plate 390 is fixedly connected to the end of the rope 340 away from the card block 330, and a slope 3911 is provided on one side of the elastic protective plate 3910.

[0031] By pulling the pull plates 390 on both sides, the pull plates 390 drive the wire rope 340 to move, and the wire rope 340 drives the square plate 360 ​​to slide in the moving groove 361 and squeeze the spring 370. At the same time, the wire rope 340 drives the block 330 to move into the groove 331, so that the block 330 is disengaged from the groove 332, and the fixation between the positioning plate 310 and the positioning block 320 is released, and then the positioning blocks 320 on both sides are moved to the required position according to the size of the circuit board, and the pull plates 390 are released. Under the action of the spring 370, the block 330 is re-embedded in the groove 332 to complete the fixation of the positioning plate 310. The circuit board can be effectively protected by the elastic protective plate 3910. By adjusting the positioning blocks 320 on both sides, it can quickly adapt to circuit boards of different sizes and shapes, thereby reducing the time for replacing and adjusting tools. Through precise positioning, the accurate fitting of the solder resist dry film can be ensured, and the occurrence of problems such as short circuit and leakage can be avoided, thereby improving the reliability of the product.

[0032] In actual use, by pulling the pull plates 390 on both sides, the card block 330 is disengaged from the card slot 332, and the fixation between the positioning plate 310 and the positioning block 320 is released. The circuit board can be effectively protected by the elastic protective plate 3910, and the positioning blocks 320 on both sides can be adjusted to quickly adapt to circuit boards of different sizes and shapes, thereby reducing the time for replacing and adjusting tools. Through precise positioning, the accurate fitting of the solder resist dry film can be ensured, and the occurrence of problems such as short circuit and leakage can be avoided, thereby improving the reliability of the product. When the circuit board is fixed, the electromagnetic slide rail a210 drives the electromagnetic slider a220 to move, and through The laminating machine 100 performs solder mask dry film forming processing on the circuit board on the first movable plate 230. After the processing of the circuit board on the first movable plate 230 is completed, the second movable plate 2910 drives the movable block 290 to slide in the V-groove 271 through the electromagnetic slide rail b240, so that the first movable plate 230 and the second movable plate 2910 can move alternately. The circuit boards are fed alternately through the first movable plate 230 and the second movable plate 2910. When one circuit board is undergoing dry film forming processing, the next circuit board is ready, which further reduces downtime and improves overall production efficiency.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board solder mask dry film forming device, comprising a film laminating machine (100), characterized in that: The film laminating machine (100) is provided with an alternating component (200) inside, and a positioning component (300) is provided at the top of the alternating component (200). The alternating component (200) includes electromagnetic slide rails a (210) arranged on both sides inside the film laminating machine (100), and the tops of the two groups of electromagnetic slide rails a (210) are slidably connected to electromagnetic sliders a (220), and the tops of the electromagnetic sliders a (220) are fixedly connected to a first movable plate (230), and two groups of electromagnetic slide rails b (240) are provided between the two groups of electromagnetic slide rails a (210), and the two groups of electromagnetic slide rails The top of the rail b (240) is slidably connected to an electromagnetic slider b (250), and a vertical plate (270) is provided between the electromagnetic slide rails b (240). A fixed plate (260) is welded to the top of the electromagnetic slider b (250), and a circular shaft (280) is slidably connected to both sides of the fixed plate (260). A fixed block (281) is welded to the bottom of the circular shaft (280), and a moving block (290) is fixedly connected to the side of the fixed block (281) away from the circular shaft (280), and a second moving plate (2910) is fixedly connected to the top of the moving block (290).

2. A circuit board solder resist dry film forming device according to claim 1, characterized in that: A stopper (221) is fixedly connected to one side of the top end of the electromagnetic slide rail a (210) and the electromagnetic slide rail b (240).

3. A circuit board solder resist dry film forming device according to claim 1, characterized in that: V-shaped grooves (271) are formed on both sides of the vertical plate (270), and the moving block (290) is slidably connected to the V-shaped grooves (271).

4. A circuit board solder resist dry film forming device according to claim 1, characterized in that: The positioning assembly (300) comprises a positioning plate (310) fixedly connected to the top of the first movable plate (230) and the second movable plate (2910), and positioning blocks (320) are slidably connected on both sides of the two sets of positioning plates (310), and grooves (331) are provided on both sides of the positioning blocks (320).

5. A circuit board solder resist dry film forming device according to claim 4, characterized in that: A block (330) is slidably connected inside the groove (331), a wire rope (340) is fixedly connected to one side of the block (330), two groups of guide shafts a (350) for changing the extension direction of the wire rope (340) are provided on the surface of the wire rope (340), a square plate (360) fixedly connected to the surface of the wire rope (340) is provided on the side of the guide shaft a (350) away from the block (330), a spring (370) is fixedly connected to one side of the square plate (360), a guide shaft b (380) for changing the secondary extension direction of the wire rope (340) is provided on the surface of the wire rope (340), and an elastic protective plate (3910) is fixedly connected to one side of the positioning block (320).

6. A circuit board solder resist dry film forming device according to claim 5, characterized in that: The positioning plate (310) is provided with a plurality of groups of card slots (332) that match the card block (330), the positioning block (320) is provided with a moving slot (361), and the square plate (360) is slidably connected to the moving slot (361).

7. A circuit board solder resist dry film forming device according to claim 6, characterized in that: One end of the wire rope (340) away from the clamping block (330) is fixedly connected to a pull plate (390), and one side of the elastic protective plate (3910) is provided with an inclined surface (3911).

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