Multimedia display screen sealing and bonding structure capable of controlling thickness

By designing grooves on the adhesive substrate of the display screen and adding spherical gap particles to the silicone sealant, a sealant with controllable thickness is formed, and the bond thickness is precisely controlled by automatic dispensing equipment and pressure-keeping equipment, the problem of softening of the silicone sealant before curing and poor bond thickness control accuracy is solved, and high-precision bond thickness control is achieved.

CN222764128UActive Publication Date: 2025-04-15SHANGHAI RONGLE AUTOMOTIVE ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421360626.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-14
Publication Date
2025-04-15
Estimated Expiration
2034-06-14

AI Technical Summary

Technical Problem

In the prior art, silicone sealant is soft before curing, and the bond thickness control accuracy is poor during curing, which makes it difficult to accurately control the bond thickness between structural parts.

Method used

A multimedia display screen sealing and bonding structure with controllable thickness is designed. By designing grooves on the bonding substrate, spherical gap particles are added to the silicone sealant to form a silicone sealant of controllable thickness, and the bonding thickness is precisely controlled using automatic dispensing equipment and pressure-retaining equipment.

Benefits of technology

It realizes high-precision control of the bonding thickness of silicone sealant between structural parts, meets the needs of lean development in the industry, and improves the accuracy of bonding thickness of silicone sealant.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a multimedia display screen sealing and bonding structure capable of controlling the thickness. The multimedia display screen sealing and bonding structure mainly comprises a bonding substrate, gap particles, organic silicon sealant and a bonding upper plate. The bonding substrate is provided with a groove for accommodating the gap particles and the organic silicon sealant; the groove is used for accommodating and limiting the flowing track of the gap particles and the organic silicon sealant; and spraying the gap particles into the organic silicon sealant, and uniformly stirring to form the thickness-controllable organic silicon sealant. According to the utility model, the gap particles are added into the conventional organic silicon sealant and are uniformly stirred to form the organic silicon sealant with controllable thickness, and the grooves for accommodating and limiting the flowing of the gap particles and the organic silicon sealant are synchronously designed on the bonding substrate; the thickness-controllable organic silicon sealant flows into a groove in the bonding substrate through automatic dispensing equipment, and after the bonding upper plate is completely attached to the bonding substrate, the thickness-controllable organic silicon sealant between the bonding upper plate and the bonding substrate is compressed into a gap space of a single gap particle through pressure maintaining equipment.
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Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a sealing and bonding structure of a multimedia display screen with controllable thickness. Background Art

[0002] Display screens are currently widely used electronic display devices, such as in-vehicle instruments, mobile phones, computers, televisions, billboards, industrial control, medical equipment, and aerospace, etc. They allow us to clearly see images and text and convey various information to us.

[0003] With the development of the display industry, the full-bonding adhesive technology is being used more and more widely, and silicone sealants are being used more and more in adhesive technology applications. Since silicone sealants are soft before curing, the control accuracy of bonding thickness is poor during the curing process, which brings difficulties to the control of bonding thickness between structural parts. With the lean development of the industry, the development of a silicone sealant bonding technology with controllable thickness is an urgent desire of the industry in pursuit of precision improvement. Summary of the invention

[0004] In order to solve the technical problems that the silicone sealant is relatively soft before curing and the control accuracy of the bonding thickness is poor during the curing process in the application of the above-mentioned display full-bonding adhesive technology, the utility model provides a multimedia display sealing adhesive structure with controllable thickness, which can accurately control the bonding thickness between structural parts, meet the lean development of the industry, and improve the accuracy of the bonding thickness of the silicone sealant.

[0005] The utility model solves the technical problem by adopting the following technical solutions:

[0006] A sealing bonding structure of a multimedia display screen with controllable thickness mainly comprises a bonding substrate, gap particles, an organic silicon sealant and a bonding upper plate. The bonding substrate is designed with grooves for accommodating gap particles and the organic silicon sealant, and the grooves accommodate and limit the flow trajectories of the gap particles and the organic silicon sealant. The gap particles are sprinkled into the organic silicon sealant and stirred evenly to form an organic silicon sealant with controllable thickness.

[0007] Furthermore, the interstitial particles are designed to be spherical.

[0008] The controllable thickness organic silicon sealant is prepared by adding interstitial particles into conventional organic silicon sealant and uniformly stirring the mixture, and then using automatic dispensing equipment to flow the controllable thickness organic silicon sealant into the groove designed for bonding the substrate.

[0009] The bonding upper plate is fully bonded to the bonding substrate by using a full bonding device, and is bonded to the bonding substrate by a controllable thickness of the silicone sealant. Then, a pressure-maintaining device is used to compress the controllable thickness of the silicone sealant between the bonding upper plate and the bonding substrate into the gap space of a single gap particle, thereby achieving precise control of the bonding thickness of the silicone sealant between the structural parts.

[0010] Compared with the prior art, the technical advantages and beneficial effects of the preferred solution of the utility model are as follows:

[0011] The gap particles of the utility model are designed to be spherical, and the diameter of the gap particles is designed according to the gap control requirements of the bonding upper plate. The material is selected to be easy to bond with the silicone sealant and has a certain hardness, which can accurately control the bonding thickness of the silicone sealant between structural parts.

[0012] The utility model forms an organic silicone sealant with controllable thickness by adding gap particles into a conventional organic silicone sealant and uniformly stirring the mixture, and simultaneously designs grooves on a bonding substrate for accommodating the gap particles and the organic silicone sealant. The organic silicone sealant with controllable thickness flows into the designed groove on the bonding substrate by using an automatic dispensing device, and after the bonding upper plate is aligned with the bonding substrate and bonded, the organic silicone sealant with controllable thickness between the bonding upper plate and the bonding substrate is compressed into the gap space of a single gap particle by using a pressure holding device, thereby achieving accurate control of the bonding thickness of the organic silicone sealant between structural parts.

[0013] The utility model can be embedded in various fields of application to become a part of electronic display equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the structure of the utility model and constitute a part of the specification. Together with the following specific implementation methods, they are used to explain the utility model, but do not constitute a containment and limitation of the utility model.

[0015] Figure 1 It is a cross-sectional view of the adhesive structure of the organic silicon sealant with controllable thickness of the display screen of the utility model.

[0016] Figure 2 It is an exploded view of the adhesive structure of the silicone sealant with controllable thickness of the display screen of the utility model.

[0017] Figure 3 The utility model is a schematic diagram of the structure of the organic silicon sealant with controllable thickness.

[0018] The reference numerals are as follows: 1. bonding substrate, 2. gap particles, 3. silicone sealant, 4. bonding upper plate. 1-1. bonding substrate groove, 2-3. silicone sealant with controllable thickness. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the examples of the utility model to clearly and completely describe the technical structure scheme in the embodiment of the utility model. The described embodiment is only a part of the embodiment of the structure of the utility model, not all embodiments. The additional technical features and advantages of the utility model will be more clearly explained in the following description, or can be understood through the specific practice of the utility model.

[0020] like Figure 1 , 2 As shown in Figure 3, the utility model is mainly composed of 4 main parts, and the direct position, connection and functional relationship of each part are as follows:

[0021] The interstitial particles 2 are sprinkled into the organic silicon sealant 3 and stirred evenly to form an organic silicon sealant 2-3 with controllable thickness. The organic silicon sealant 2-3 with controllable thickness is flowed into the bonding substrate groove 1-1 of the bonding substrate 1 by using an automatic dispensing device. The bonding upper plate 4 is fully bonded to the bonding substrate 1 by using a full bonding device.

[0022] The assembly process of the embodiment is as follows:

[0023] refer to Figure 2 and Figure 3 , sprinkle the gap particles 2 into the silicone sealant 3 and stir evenly to form a silicone sealant 2-3 with controllable thickness. Use automatic dispensing equipment to flow the silicone sealant 2-3 with controllable thickness into the bonding substrate groove 1-1 of the bonding substrate 1. Use full bonding equipment to fully bond the bonding upper plate 4 to the bonding substrate 1. Then use pressure holding equipment to compress the silicone sealant 2-3 with controllable thickness between the bonding upper plate 4 and the bonding substrate 1 to the gap space of a single gap particle. After holding the pressure for a certain period of time, the silicone sealant 2-3 with controllable thickness is cured, and the high-precision silicone sealant thickness control bonding technology is completed.

[0024] The above-mentioned embodiment adopts an unconventionally designed bonding substrate, and the bonding substrate is designed with grooves for accommodating gap particles and silicone sealant, and the grooves can accommodate and limit the flow trajectory of gap particles and silicone sealant. Spherical gap particles are designed, and the diameter of the gap particles is designed according to the gap control requirements of the bonding upper plate. The material is selected to be easy to bond with the silicone sealant and has a certain hardness, which can accurately control the bonding thickness of the silicone sealant between the structural parts. The silicone sealant with controllable thickness is formed by adding gap particles to the conventional silicone sealant and stirring evenly. The silicone sealant with controllable thickness is flowed into the groove designed on the bonding substrate by automatic dispensing equipment. After the bonding upper plate is fully attached to the bonding substrate, the silicone sealant with controllable thickness between the bonding upper plate and the bonding substrate is compressed to the gap space of a single gap particle by a pressure-maintaining device, thereby accurately controlling the bonding thickness of the silicone sealant between the structural parts.

[0025] To sum up, the specific embodiments of the utility model mainly adopt an unconventionally designed bonding substrate, design gap particles that meet the requirements according to the gap control needs of the bonding upper plate, add them into a conventional silicone sealant and stir them evenly to form a silicone sealant with controllable thickness. Through automatic dispensing process, full bonding process, and pressure holding process, it solidifies and solidifies over time, and can accurately control the bonding thickness of the silicone sealant between structural parts, meet the lean development of the industry, and improve the accuracy of the bonding thickness of the silicone sealant.

Claims

1. A sealing bonding structure of a multimedia display screen with controllable thickness, mainly comprising a bonding substrate, gap particles, an organic silicon sealant and a bonding upper plate, characterized in that: The bonding substrate is designed with grooves for accommodating gap particles and organic silicon sealant; the grooves accommodate and limit the flow tracks of gap particles and organic silicon sealant; the gap particles are sprinkled into the organic silicon sealant and stirred evenly to form organic silicon sealant with controllable thickness.

2. The sealing and bonding structure of a multimedia display screen with controllable thickness according to claim 1 is characterized in that: The interstitial particles are designed to be spherical.