Power semiconductor device and heat dissipation device
By adopting a dual heat dissipation structure with liquid-cooled heat dissipation components and fin heat dissipation structures in power semiconductor devices, the problem of insufficient heat dissipation of the device main body is solved, achieving a more efficient heat dissipation effect and a longer service life.
Patent Information
- Application Number
- CN202520155855.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2035-01-23
AI Technical Summary
In energy storage systems, changes in junction temperature of power semiconductor devices may lead to problems such as cracking of solder layer, breaking of bonded leads and chip failure. The prior art heat dissipation methods have the disadvantages of high cost, large volume, low thermal conductivity and poor long-term stability.
The dual heat dissipation structure of liquid-cooled heat dissipation assembly and fin heat dissipation structure is adopted. The liquid-cooled heat dissipation assembly is arranged on the first side of the device main body. The fin heat dissipation structure is installed in conjunction with the liquid-cooled heat dissipation assembly to achieve more effective heat dissipation through the heat dissipation plate and the leaf vein radiator.
It improves the heat dissipation effect of the device main body, achieves rapid and efficient heat dissipation, reduces the temperature of the device, extends the service life of the device, and saves refrigeration resources.
Smart Images
Figure CN222764192U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat dissipation technology, and in particular to a power semiconductor device and a heat dissipation device. Background Art
[0002] The energy storage system may include various devices. The parts that are most prone to failure are solder layer cracking, bonding wire breakage, chip failure, etc. These failures may be caused by changes in the junction temperature of the device. Utility Model Content
[0003] The purpose of the present application is to provide a power semiconductor device and a heat dissipation device, which can improve the heat dissipation effect of the device.
[0004] In a first aspect, the utility model provides a power semiconductor device, comprising: a device body; a first heat dissipation device arranged on a first side of the device body; wherein the first heat dissipation device comprises a liquid-cooled heat dissipation component and a fin heat dissipation structure; the liquid-cooled heat dissipation component and the fin heat dissipation structure are located on the first side of the device body, the fin heat dissipation structure and the liquid-cooled heat dissipation component are installed in coordination, and the device body and the fin heat dissipation structure are distributed on both sides of the liquid-cooled heat dissipation component; the fin heat dissipation structure comprises: a heat dissipation plate and a leaf vein heat sink; the liquid-cooled heat dissipation component is installed on the first side of the heat dissipation plate, and the leaf vein heat sink is installed on the second side of the heat dissipation plate.
[0005] In the above implementation, a dual heat dissipation structure of a liquid-cooled heat dissipation component and a fin heat dissipation structure can be combined to better dissipate heat for the device body. In addition, various heat dissipation structures can be directly distributed on one side of the device body, which can better contact the device body, thereby improving the heat dissipation effect. Furthermore, by setting a liquid-cooled heat dissipation component that can achieve rapid heat dissipation at a position closer to the device body, rapid heat dissipation is first achieved, and then a fin heat dissipation structure is set on the other side of the liquid-cooled heat dissipation component to achieve heat dissipation in a direction away from the device body. Specifically, the heat dissipation of the liquid-cooled heat dissipation component is received by the heat dissipation plate, and the heat is transferred to the leaf vein radiator, and the heat is dissipated to the surroundings through the leaf vein radiator, so that the heat dissipation effect of the device body is better.
[0006] In an optional embodiment, a first surface of the heat sink is provided with a plurality of first grooves for accommodating the liquid-cooled heat sink assembly.
[0007] In the above implementation, a first groove for accommodating the liquid-cooled heat dissipation component can be provided on the heat dissipation plate, so that the liquid-cooled heat dissipation component and the fin heat dissipation structure can be better matched and installed, and the overall structure can be relatively smaller.
[0008] In an optional embodiment, a second groove is provided on the leaf vein heat sink, wherein the first groove forms a protrusion on the second surface of the heat sink, and the protrusion on the second surface of the heat sink is embedded in the second groove.
[0009] In the above implementation, the leaf vein heat sink and the heat sink plate can be installed more tightly, which can make the overall structure of the power semiconductor device smaller.
[0010] In an optional embodiment, the leaf vein heat sink includes a plurality of leaf vein structures arranged in parallel; wherein the leaf vein structure includes a plurality of heat dissipation branch structures, and the heat dissipation branch structures form an angle with the heat dissipation plate.
[0011] In the above implementation, the heat dissipation branch structure may form an angle with the heat dissipation plate, so that the heat dissipation can be better extended outward, thereby improving the heat dissipation effect.
[0012] In an optional embodiment, the leaf vein structure also includes a connecting structure for connecting the heat dissipation branch structure.
[0013] In the above implementation, through the effect of the connection structure, each heat dissipation branch structure can be connected, and the relative position is more fixed, thereby achieving a better heat dissipation effect.
[0014] In an optional embodiment, the first heat dissipation device further includes: a fan disposed on one side of the fin heat dissipation structure.
[0015] In an optional embodiment, the number of the fans is at least two, including at least a first fan and a second fan; the first fan is arranged on a first side of the fin heat dissipation structure, and the second fan is arranged on a second side of the fin heat dissipation structure.
[0016] In an optional embodiment, the first fan is an axial flow fan; the second fan is a centrifugal fan.
[0017] In the above implementation, a fan may be provided to achieve multi-dimensional heat dissipation and improve the heat dissipation effect.
[0018] In an optional embodiment, it also includes: a temperature sensor arranged on the surface of the device body; a control module connected to the temperature sensor, used to control the liquid cooling heat dissipation component and / or the fan to dissipate heat for the device body according to the temperature sensor.
[0019] In the above implementation, the temperature control logic may be adaptively adjusted based on the detected temperature, so that better heat dissipation can be provided while saving cooling resources.
[0020] In an optional embodiment, it also includes: a second heat dissipation device arranged on the second side of the device body.
[0021] In the above implementation, heat dissipation devices can be provided on both sides of the device body, so that more heat dissipation methods can be provided and more flexible heat dissipation can be achieved. In addition, providing heat dissipation devices on both sides can also provide high-energy heat dissipation and improve the heat dissipation effect when the heat dissipation demand is higher.
[0022] In an optional embodiment, a third fan and a fourth fan are further included; the third fan is arranged at one end of the device body, and the fourth fan is arranged at the other end of the device body.
[0023] In the above implementation, in addition to providing heat dissipation devices on both sides of the device body, fans for heat dissipation are also provided at both ends of the device body, which can achieve all-round heat dissipation and improve the heat dissipation effect.
[0024] In the second aspect, the utility model provides a heat dissipation device, comprising: a liquid-cooled heat dissipation component and a fin heat dissipation structure, wherein the fin heat dissipation structure is installed in cooperation with the liquid-cooled heat dissipation component; the fin heat dissipation structure comprises: a heat dissipation plate and a leaf vein radiator; the liquid-cooled heat dissipation component is installed on the first surface of the heat dissipation plate, and the leaf vein radiator is installed on the second surface of the heat dissipation plate.
[0025] In an optional embodiment, a first surface of the heat sink is provided with a plurality of first grooves for accommodating the liquid-cooled heat sink assembly.
[0026] In an optional embodiment, a second groove is provided on the leaf vein heat sink, wherein the first groove forms a protrusion on the second surface of the heat sink, and the protrusion on the second surface of the heat sink is embedded in the second groove.
[0027] In an optional embodiment, the leaf vein heat sink includes a plurality of leaf vein structures arranged in parallel; wherein the leaf vein structure includes a plurality of heat dissipation branch structures, and the heat dissipation branch structures form an angle with the heat dissipation plate.
[0028] In an optional embodiment, the leaf vein structure also includes a connecting structure for connecting the heat dissipation branch structure.
[0029] In an optional embodiment, it further includes: a fan arranged on one side of the fin heat dissipation structure.
[0030] In an optional embodiment, the number of the fans is at least two, including at least a first fan and a second fan; the first fan is arranged on a first side of the fin heat dissipation structure, and the second fan is arranged on a second side of the fin heat dissipation structure.
[0031] In an optional embodiment, the first fan is an axial flow fan; the second fan is a centrifugal fan. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0033] Figure 1 A schematic diagram of the structure of a power semiconductor device provided in an embodiment of the present application;
[0034] Figure 2 A schematic diagram of another part of the structure of the fin heat dissipation structure in the power semiconductor device provided in an embodiment of the present application;
[0035] Figure 3 A schematic diagram of a portion of the structure of a fin heat dissipation structure in a power semiconductor device provided in an embodiment of the present application;
[0036] Figure 4 Another schematic diagram of the structure of a power semiconductor device provided in an embodiment of the present application;
[0037] Figure 5 A circuit diagram of the control module and temperature sensor of the power semiconductor device provided in an embodiment of the present application.
[0038] Icons: 100-device body; 210-liquid cooling component; 220-fin cooling structure; 221-heat sink; 2211-first groove; 2212-protrusion; 222-vein structure; 2221-heat dissipation branch structure; 2222-connection structure; 22211-second groove; 230-fan; R1-first resistor; R2-second resistor; R3-third resistor; R4-fourth resistor; R5-fifth resistor; Q1-first transistor; Q2-second transistor; Comp1-first comparator; Comp2-second comparator; NTC-thermistor. DETAILED DESCRIPTION
[0039] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application.
[0040] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0041] In the description of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model products are usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be interpreted as a limitation of the present application.
[0042] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0043] As a key component in new energy conversion systems and high-voltage power switch devices, the insulated gate bipolar transistor (IGBT) power semiconductor module still occupies a dominant position in high-frequency medium and high-power applications. As a key component of high-power converters, the heat flux density of the insulated gate bipolar transistor tends to develop in high power and high integration. The power semiconductor module also continuously generates a large amount of heat due to its high-frequency conduction and opening and closing, and the performance of the power semiconductor module will also be affected in a large amount of thermal environment. Therefore, it is necessary to design a heat dissipation device with better heat conduction effect.
[0044] The current heat dissipation method for power semiconductor modules is usually to fill the phase change heat storage structure, which absorbs and stores the instantaneous large amount of heat generated by the short-term overload or fluctuation of the power semiconductor module to keep the temperature of the heat sink and the power semiconductor module stable. This technology also has some shortcomings: (1) The cost of phase change materials is usually high, and the use of this material will increase the overall cost of the system; (2) Phase change materials often require a large volume and weight to store enough heat, which is not conducive to lightweight design; (3) Many phase change materials have low thermal conductivity, which may lead to insufficient and uneven heat transfer. For different application scenarios, the choice of phase change materials is subject to certain restrictions; (4) Phase change materials may experience performance degradation after multiple cycles, affecting the long-term stability and efficiency of the system. Therefore, the heat dissipation of power semiconductor modules needs further improvement.
[0045] Based on the above research, an embodiment of the present application provides a power semiconductor device and a heat dissipation device, which achieves flexible heat dissipation by arranging a combination of some heat dissipation structures on the periphery of the device body.
[0046] Figure 1 This is a schematic diagram of the structure of a power semiconductor device provided in an embodiment of the present application. Figure 1 As shown, the power semiconductor device may include a device body 100 and a first heat sink.
[0047] The device body 100 may include structures such as a main terminal, an auxiliary terminal, a chip, etc. The device body 100 may be an IGBT module, and the IGBT module may be provided with an insulated gate bipolar transistor.
[0048] The power semiconductor device can be used in an energy storage system as a component of a power conversion system (PCS) in the energy storage system.
[0049] The first heat dissipation device includes a liquid cooling heat dissipation component 210 and a fin heat dissipation structure 220 ; the liquid cooling heat dissipation component 210 and the fin heat dissipation structure 220 are located on the first side of the device body 100 , and the fin heat dissipation structure 220 is installed in cooperation with the liquid cooling heat dissipation component 210 .
[0050] The device body 100 and the fin heat dissipation structure 220 are distributed on both sides of the liquid cooling heat dissipation component 210 .
[0051] Optionally, the liquid cooling heat dissipation component 210 may be disposed between the fin heat dissipation structure 220 and the device body 100 .
[0052] The liquid cooling heat dissipation assembly 210 may include a liquid cooling pipe disposed on the first side of the device body 100, and the liquid cooling pipe may be evenly arranged on the first side of the device body 100. The liquid cooling pipe may include a water inlet, which may be connected to a liquid cooling liquid supply device; the liquid cooling pipe may include a water outlet, which may be connected to a liquid cooling liquid recovery device.
[0053] The liquid cooling heat dissipation assembly 210 may include a liquid cooling plate disposed on the first side of the device body 100, and the liquid cooling plate may cover the first side of the device body 100. The liquid cooling plate may include a water inlet, which may be connected to a liquid cooling liquid supply device; the liquid cooling plate may include a water outlet, which may be connected to a liquid cooling liquid recovery device.
[0054] In this embodiment, based on different actual needs, the liquid cooling and heat dissipation component 210 can provide liquid cooling liquids of different temperatures to achieve heat dissipation of the device body 100. For example, when the temperature of the device body 100 is relatively high, the liquid cooling and heat dissipation component 210 can provide liquid cooling liquids with lower temperatures; for another example, when the temperature of the device body 100 is high but not particularly high, the liquid cooling and heat dissipation component 210 can provide liquid cooling liquids with a specified temperature lower than the temperature of the device body 100. For example, the specified temperature can be a temperature between 5°C and 15°C. The specified temperature can be 5°C, 10°C, 15°C, etc.
[0055] The material of the fin heat dissipation structure 220 can be a heat absorbing and heat conducting material. The material of the fin heat dissipation structure 220 can be metal. For example, the material of the fin heat dissipation structure 220 can be steel.
[0056] Optionally, the fin heat dissipation structure 220 may be provided with some concave and convex surfaces to achieve better heat dissipation by increasing the surface area of the fin heat dissipation structure 220 .
[0057] Through the above implementation, since the device body 100 is configured with a dual heat dissipation structure of a liquid cooling heat dissipation component 210 and a fin heat dissipation structure 220, dual heat dissipation is achieved through two sets of heat dissipation structures, which can improve the heat dissipation effect of the device body 100. Furthermore, by arranging the liquid cooling heat dissipation component 210 that can achieve rapid heat dissipation at a position closer to the device body, rapid heat dissipation is first achieved, and then arranging the fin heat dissipation structure 220 on the other side of the liquid cooling heat dissipation component 210 can achieve heat dissipation in a direction away from the device body, so that the heat dissipation effect of the device body 100 is better.
[0058] Optionally, the fin heat dissipation structure 220 may include: a heat dissipation plate 221 and a leaf vein heat sink.
[0059] The liquid cooling heat dissipation component 210 is installed on the first surface of the heat dissipation plate 221 , and the leaf vein heat sink is installed on the second surface of the heat dissipation plate 221 .
[0060] Optionally, some concave and convex curved surfaces are provided on the surface of the heat dissipation plate 221 to increase the surface area of the heat dissipation plate 221 .
[0061] In this embodiment, the liquid-cooling heat dissipation component 210 may include a liquid cooling pipe, and the liquid cooling pipe may be arranged on the first surface of the heat dissipation plate 221 .
[0062] Alternatively, if Figure 2 As shown, a first surface of the heat sink 221 is provided with a plurality of first grooves 2211 for accommodating the liquid-cooled heat sink assembly 210 .
[0063] Taking the example that the liquid-cooled heat dissipation component 210 includes a liquid-cooling pipe, the first surface of the heat sink 221 can be provided with a first groove 2211 that matches the shape of the liquid-cooling pipe. Exemplarily, the liquid-cooling pipe can be arranged in a serpentine shape, and the first groove 2211 on the first surface of the heat sink 221 can be a serpentine groove. Exemplarily, the liquid-cooling pipe can be a plurality of strip-shaped liquid-cooling pipes, and the first groove 2211 on the first surface of the heat sink 221 can be a plurality of strip-shaped grooves. Of course, when the portion providing heat exchange in the liquid-cooled heat dissipation component 210 is of other shapes, the first groove 2211 can be of other matching shapes.
[0064] In this embodiment, a second groove 22211 may be provided on the leaf vein heat sink, and the protrusion 2212 on the second surface of the heat sink 221 is embedded in the second groove 22211. Figure 3 As described above, the second groove 22211 can be set at one end of the heat dissipation branch structure 2221 and one end of the connection structure 2222 .
[0065] In order to improve the heat dissipation effect, the leaf vein heat sink includes multiple groups of leaf vein structures 222 arranged in parallel. Exemplarily, the leaf vein heat sink includes three groups of leaf vein structures 222, four groups of leaf vein structures 222, five groups of leaf vein structures 222, six groups of leaf vein structures 222, etc. Figure 3 As shown, the leaf vein structure 222 includes a plurality of heat dissipation branch structures 2221, and the heat dissipation branch structures 2221 form an angle with the heat dissipation plate 221. The angle may be between 0° and 90°.
[0066] The heat dissipation branch structure 2221 may be in the shape of a tree branch. Figure 3 As shown, each heat dissipation branch structure 2221 may be provided with three groups of tree-branch-shaped structures. The branches on the tree-branch-shaped structures may form an acute angle with the heat dissipation plate 221. The branch structures on the tree-branch-shaped structures may form different or the same angles with the heat dissipation plate 221.
[0067] Optionally, a second groove 22211 may be provided on the leaf vein heat sink and may be provided at one end of the leaf vein structure 222 .
[0068] The first groove 2211 on the first surface of the heat dissipation plate 221 may form a protrusion 2212 on the second surface of the heat dissipation plate 221. Figure 2 The protrusion 2212 shown can be embedded in Figure 3 In the second groove 22211 shown, each protrusion 2212 can be located in the second groove 22211 at the end of each branch-shaped structure on a heat dissipation branch structure 2221 .
[0069] Optionally, the leaf vein structure 222 further includes a connection structure 2222 for connecting the heat dissipation branch structure 2221 . The connection structure 2222 may be connected to a side of the leaf vein structure 222 away from the heat dissipation plate 221 .
[0070] exist Figure 3 In the example shown, the connection structure 2222 may be in an arc shape. Of course, based on different actual needs, the connection structure 2222 may also be in other shapes. For example, if the overall structure of the power semiconductor device needs to be able to be placed stably, the connection structure 2222 may also be a frame structure formed by three sides of a rectangle.
[0071] In order to improve the flexibility of heat dissipation for the device body 100, more structures for heat dissipation for the device body 100 may be provided. Figure 4 As shown, the first heat dissipation device may further include: a fan 230 disposed on one side of the fin heat dissipation structure 220. Figure 4 In the example shown, there is only one fan 230 . Based on different actual needs, more fans 230 may be provided. For example, fans 230 may be provided on both sides of the fin heat dissipation structure 220 .
[0072] In this embodiment, the number of the fans 230 is at least two, including at least a first fan and a second fan.
[0073] The first fan is disposed on a first side of the fin heat dissipation structure 220 , and the second fan is disposed on a second side of the fin heat dissipation structure 220 .
[0074] Among them, the gas of the axial flow fan 230 enters the rotating blade channel axially and is pressurized and then discharged axially from the other side, which can make the wind more concentrated and better focus on local heat dissipation. The airflow of the centrifugal fan 230 flows axially into the rotating blade channel, is thrown to the outer edge of the impeller under the action of centrifugal force, and is discharged from the air outlet, which can make the wind cover a wider area and better achieve large-scale heat dissipation. Based on different actual needs, the types of the first fan and the second fan can be designed.
[0075] Optionally, the first fan may be an axial flow fan 230 ; and the second fan may be a centrifugal fan 230 . Optionally, the first fan and the second fan may both be axial flow fans 230 . Optionally, the first fan and the second fan may both be centrifugal fans 230 .
[0076] In order to achieve multi-directional heat dissipation of the device body 100 , a second heat dissipation device may be provided on the second side of the device body 100 .
[0077] The second heat dissipation device may also include a liquid cooling component 210 and a fin cooling structure 220 ; the liquid cooling component 210 and the fin cooling structure 220 are located on the second side of the device body 100 , and the fin cooling structure 220 is installed in cooperation with the liquid cooling component 210 .
[0078] The second heat dissipation device provided in this embodiment has a similar structure to the first heat dissipation device. For other details about the second heat dissipation device, please refer to the aforementioned description about the first heat dissipation device, which will not be repeated here.
[0079] In an optional embodiment, the fans 230 may not be provided on both sides of the fin heat dissipation structure 220, and larger fans 230 may be provided at both ends of the device body 100. The fans 230 may act on the device body 100 and the first heat dissipation device and the second heat dissipation device distributed on both sides of the device body 100. Exemplarily, the power semiconductor device may further include a third fan and a fourth fan 230.
[0080] The third fan is disposed at one end of the device body 100, and the fourth fan 230 is disposed at the other end of the device body 100. Optionally, the third fan may cover the end surfaces of the device body 100, the first heat sink, and the second heat sink. The fourth fan may also cover the end surfaces of the device body 100, the first heat sink, and the second heat sink. The wind force of the third fan and the fourth fan may act on the device body 100, the first heat sink, and the second heat sink.
[0081] Optionally, the third fan and the fourth fan 230 may be fans 230 of the same type, for example, the third fan and the fourth fan 230 may both be axial flow fans 230, or may both be centrifugal fans 230. Optionally, the third fan and the fourth fan 230 may also be fans 230 of different types, for example, the third fan may be an axial flow fan 230, and the fourth fan 230 may be a centrifugal fan 230.
[0082] In order to achieve flexibility in heat dissipation of the device body 100, heat dissipation can also be adjusted based on the problem of the device body 100. Based on this, the power semiconductor device can also have a temperature sensor and a control module. The temperature sensor can be set on the surface of the device body 100; the control module can be a control module connected to the temperature sensor, and is used to control the liquid cooling and heat dissipation component 210 and / or the fan 230 according to the temperature sensor to dissipate heat for the device body 100.
[0083] Exemplarily, two temperature thresholds may be preset, namely a first temperature threshold and a second temperature threshold, wherein the first temperature threshold is smaller than the second temperature threshold.
[0084] When the temperature of the device body 100 is lower than the first temperature threshold, it can be understood that it does not affect the performance and service life of the device body 100 and is an optimal working temperature; when the temperature of the device body 100 is between the first temperature threshold and the second temperature threshold, the temperature range begins to accelerate the loss of the device body 100; when the temperature of the device body 100 is higher than the second temperature threshold, the temperature will rapidly accelerate the degradation of the device life.
[0085] In this embodiment, when the device body 100 is in working state, the generated heat can be transferred vertically downward, and the main heat dissipation structure liquid cooling heat dissipation component 210 and fin heat dissipation structure 220 are first used to realize active heat dissipation. Among them, the heat dissipation method of the liquid cooling heat dissipation component 210 and the fin heat dissipation structure 220 is as follows: the liquid in the liquid cooling heat dissipation component 210 is flowed horizontally to realize rapid heat dissipation, and at the same time, the fins of the fin heat dissipation structure 220 are longitudinally heat transferred to transfer the heat to the surrounding environment to increase the heat dissipation. In addition, when the temperature sensor detects that the device body 100 is in an abnormal working condition (for example, continuous overvoltage, overcurrent, continuous abnormal temperature increase, etc.), the auxiliary heat dissipation structure fan 230 can be turned on to realize auxiliary heat dissipation. The way to turn on the auxiliary fan 230 to dissipate heat is as follows: the first fan for air supply and the second fan for exhaust are controlled by the closed-loop algorithm based on the temperature sensor to increase the heat dissipation to realize auxiliary heat dissipation.
[0086] The heat dissipation process of the control module body can be as follows: after the device body 100 is running, the liquid cooling heat dissipation component 210 can be turned on for heat dissipation; the junction temperature of the device body 100 can be obtained through the temperature sensor; when the temperature of the device body 100 is greater than the first temperature threshold, the fan 230 can be turned on to assist in heat dissipation, and a warning message can also be output in this case; when the temperature of the device body 100 is greater than the second temperature threshold, the device body 100 can be shut down.
[0087] In one example, if Figure 5 As shown, the control module can be Figure 5The temperature sensor can be Figure 5 The thermistor shown is NTC. Figure 5 The example shown includes two branches, which are used to control the opening and closing of the fan 230 and the opening and closing of the device body 100 respectively.
[0088] exist Figure 5 The first branch shown includes a first comparator Comp1, a first resistor R1, a second resistor R2, a third resistor R3 and a first transistor Q1. Figure 5 The second branch shown includes a second comparator Comp2, a fourth resistor R4, a fifth resistor R5 and a second transistor Q2. The thermistor NTC is connected to both the first branch and the second branch. The first branch is connected to the fan 230 to control the opening and closing of the fan 230; the second branch is connected to the device body 100 to control the opening or closing of the device body 100.
[0089] The thermistor NTC can monitor the temperature of the device body 100. The resistance value of the thermistor NTC can be different at different temperatures.
[0090] When the temperature monitored by the thermistor NTC is greater than the first temperature threshold, the first branch can be turned on to start the fan 230. When the temperature monitored by the thermistor NTC is greater than the second temperature threshold, the device body 100 on the second branch can be disconnected from the power supply to shut down the device body 100.
[0091] Optionally, the fan 230 can be used as an auxiliary heat dissipation device, that is, it is turned on only when the temperature of the device body 100 is abnormal.
[0092] Of course, a more precise heat dissipation control can also be pre-set, and the control module can control the working conditions of each heat dissipation structure based on the real-time temperature of the device body 100. For example, when the device body 100 is working, the temperature of the device body 100 can be monitored in real time, and the required heat dissipation strategy can be determined based on the temperature of the device body 100.
[0093] The heat dissipation strategy may include the startup type of the heat dissipation structure, the number of fans 230 started, the temperature of the liquid coolant in the liquid cooling heat dissipation component 210, the startup time of the heat dissipation structure, etc.
[0094] The activation categories of the heat dissipation structure may include: only activating the liquid cooling heat dissipation component 210 for heat dissipation, only activating the fan 230 for heat dissipation, and activating both the liquid cooling heat dissipation component 210 and the fan 230 for heat dissipation.
[0095] Through the above-implemented logic control, the heat dissipation of the device body 100 can better adapt to the problem of the device body 100. Furthermore, the device body 100 can be closed based on the temperature of the device body 100 to improve the safety of the device body 100 and the life of the device body 100.
[0096] The embodiment of the present application further provides a heat dissipation device, which may include: a liquid-cooled heat dissipation component 210 and a fin heat dissipation structure 220 , wherein the fin heat dissipation structure 220 is installed in cooperation with the liquid-cooled heat dissipation component 210 .
[0097] The fin heat dissipation structure 220 may include: a heat dissipation plate 221 and a leaf vein heat sink.
[0098] The liquid cooling heat dissipation component 210 is installed on the first surface of the heat dissipation plate 221 , and the leaf vein heat sink is installed on the second surface of the heat dissipation plate 221 .
[0099] The first surface of the heat dissipation plate 221 is provided with a plurality of first grooves 2211 for accommodating the liquid cooling heat dissipation assembly 210. The first grooves 2211 form protrusions 2212 on the second surface of the heat dissipation plate 221.
[0100] A second groove 22211 is provided on the leaf vein heat sink, and the protrusion 2212 on the second surface of the heat sink 221 is embedded in the second groove 22211 .
[0101] In this embodiment, the leaf vein heat sink includes a plurality of leaf vein structures 222 arranged in parallel, wherein the leaf vein structure 222 includes a plurality of heat dissipation branch structures 2221 , and the heat dissipation branch structures 2221 form an angle with the heat dissipation plate 221 .
[0102] The leaf vein structure 222 further includes a connection structure 2222 for connecting the heat dissipation branch structure 2221. The connection structure 2222 can be connected to an end of the heat dissipation branch structure 2221 away from the heat dissipation plate 221.
[0103] In this embodiment, the heat dissipation device may further include a fan 230 disposed on one side of the fin heat dissipation structure 220 .
[0104] Optionally, the number of fans 230 is at least two, including at least a first fan and a second fan.
[0105] The first fan is disposed on a first side of the fin heat dissipation structure 220 , and the second fan is disposed on a second side of the fin heat dissipation structure 220 .
[0106] Optionally, the first fan is an axial flow fan 230 , and the second fan is a centrifugal fan 230 . Of course, both fans 230 may be axial flow fans 230 , and both fans 230 may be centrifugal fans 230 .
[0107] The heat dissipation device provided in the embodiment of the present application is similar to the first heat dissipation device and the second heat dissipation device provided in the aforementioned embodiment. For other details about the heat dissipation device of this embodiment, please refer to the description of the first heat dissipation device in the aforementioned embodiment, which will not be repeated here.
[0108] In the embodiment of the present application, the main heat dissipation structures include a liquid cooling heat dissipation component 210 and a fin heat dissipation structure 220. When the device body 100 is working, effective heat dissipation can be mainly performed through the liquid cooling heat dissipation component 210 and the fin heat dissipation structure 220. First, the liquid cooling liquid in the liquid cooling heat dissipation component 210 closest to the device body 100 can flow quickly to quickly transfer heat to avoid local overheating caused by instantaneous heat accumulation, and then the heat flow is guided and optimized longitudinally through the fin heat dissipation structure 220, which helps to transfer heat to the surrounding environment faster and improve cooling efficiency.
[0109] Furthermore, since the fin heat dissipation structure 220 provided in the embodiment of the present application can have a structure extending to multiple angles, it can be customized according to different application requirements, adapt to heat dissipation requirements of various shapes and sizes within a limited space, and maximize the heat dissipation efficiency through reasonable leaf vein fin design.
[0110] In addition, a fan 230 is included as an auxiliary heat dissipation, which can further improve the heat dissipation efficiency. When the device body 100 has abnormal working conditions such as continuous over-temperature, high power and high current, resulting in low heat dissipation efficiency, the fan 230 can be turned on to achieve auxiliary heat dissipation. The operation of the fan 230 to pump air increases the wind flow disturbance between the blades, reduces the temperature difference between the leaf veins, and thus improves the heat dissipation efficiency.
[0111] The above description is only an optional embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0112] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A power semiconductor device, characterized in that: include: Device body; a first heat sink disposed on a first side of the device body; Wherein, the first heat dissipation device comprises a liquid cooling heat dissipation component and a fin heat dissipation structure; the liquid cooling heat dissipation component and the fin heat dissipation structure are located on a first side of the device body, the fin heat dissipation structure is installed in cooperation with the liquid cooling heat dissipation component, and the device body and the fin heat dissipation structure are distributed on both sides of the liquid cooling heat dissipation component; The fin heat dissipation structure comprises: a heat dissipation plate and a leaf vein heat sink; The liquid cooling heat dissipation component is installed on the first surface of the heat dissipation plate, and the leaf vein heat sink is installed on the second surface of the heat dissipation plate.
2. The power semiconductor device according to claim 1, characterized in that: The first surface of the heat sink is provided with a plurality of first grooves for accommodating the liquid cooling heat sink assembly.
3. The power semiconductor device according to claim 2, characterized in that: A second groove is arranged on the leaf vein heat sink, wherein the first groove forms a protrusion on the second surface of the heat sink, and the protrusion on the second surface of the heat sink is embedded in the second groove.
4. The power semiconductor device according to claim 1, characterized in that: The leaf vein heat sink comprises a plurality of groups of leaf vein structures arranged in parallel; Wherein, the leaf vein structure includes a plurality of heat dissipation branch structures, and the heat dissipation branch structures form an angle with the heat dissipation plate.
5. The power semiconductor device according to claim 4, characterized in that: The leaf vein structure also includes a connection structure for connecting the heat dissipation branch structure.
6. The power semiconductor device according to claim 1, characterized in that: The first heat dissipation device also includes: A fan is arranged on one side of the fin heat dissipation structure.
7. The power semiconductor device according to claim 6, characterized in that: The number of the fans is at least two, including at least a first fan and a second fan; The first fan is disposed on a first side of the fin heat dissipation structure, and the second fan is disposed on a second side of the fin heat dissipation structure.
8. The power semiconductor device according to claim 7, characterized in that: The first fan is an axial flow fan; the second fan is a centrifugal fan.
9. The power semiconductor device according to claim 6, characterized in that: Also includes: A temperature sensor disposed on the surface of the device body; The control module connected to the temperature sensor is used to control the liquid cooling heat dissipation component and / or the fan to dissipate heat for the device body according to the temperature sensor.
10. The power semiconductor device according to claim 1, characterized in that: Also includes: A second heat sink is disposed on a second side of the device body.
11. The power semiconductor device according to claim 10, characterized in that: Also included is a third fan and a fourth fan; The third fan is arranged at one end of the device body, and the fourth fan is arranged at the other end of the device body.
12. A heat dissipation device, characterized in that: include: A liquid cooling heat dissipation component and a fin heat dissipation structure, wherein the fin heat dissipation structure is installed in cooperation with the liquid cooling heat dissipation component; The fin heat dissipation structure comprises: a heat dissipation plate and a leaf vein heat sink; The liquid cooling heat dissipation component is installed on the first surface of the heat dissipation plate, and the leaf vein heat sink is installed on the second surface of the heat dissipation plate.
13. The heat dissipation device according to claim 12, characterized in that: The first surface of the heat sink is provided with a plurality of first grooves for accommodating the liquid cooling heat sink assembly.
14. The heat dissipation device according to claim 13, characterized in that: A second groove is arranged on the leaf vein heat sink, wherein the first groove forms a protrusion on the second surface of the heat sink, and the protrusion on the second surface of the heat sink is embedded in the second groove.
15. The heat dissipation device according to claim 12, characterized in that: The leaf vein heat sink comprises a plurality of groups of leaf vein structures arranged in parallel; Wherein, the leaf vein structure includes a plurality of heat dissipation branch structures, and the heat dissipation branch structures form an angle with the heat dissipation plate.
16. The heat dissipation device according to claim 15, characterized in that: The leaf vein structure also includes a connection structure for connecting the heat dissipation branch structure.
17. The heat dissipation device according to claim 12, characterized in that: Also includes: A fan is arranged on one side of the fin heat dissipation structure.
18. The heat dissipation device according to claim 17, characterized in that: The number of the fans is at least two, including at least a first fan and a second fan; The first fan is disposed on a first side of the fin heat dissipation structure, and the second fan is disposed on a second side of the fin heat dissipation structure.
19. The heat dissipation device according to claim 18, characterized in that: The first fan is an axial flow fan; the second fan is a centrifugal fan.