Metal interconnection structure, battery string and photovoltaic module
By adopting a metal interconnection structure in photovoltaic modules and directly connecting the cell with metal interconnection strips and connecting bumps, the short circuit and silver corrosion problems in traditional electrical connection methods are solved, and more efficient and stable photovoltaic module production is achieved.
Patent Information
- Application Number
- CN202420690311.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-04-07
AI Technical Summary
The electrical connection method of traditional photovoltaic modules has the problem of short circuit caused by contact between positive and negative electrodes during welding, and the hollowing of the connection points of the printing solder paste filling is complicated and may lead to silver corrosion.
The metal interconnect structure, including metal interconnect strips and connecting bumps, is used to directly connect the battery cells through mechanical devices, avoiding the use of printed solder paste, reducing the risk of silver corrosion, and simplifying the connection process.
It realizes convenient connection without cutting metal interconnect strips, reduces production costs, improves the quality stability of finished product of photovoltaic modules, and avoids the risks of leakage short circuits and silicon wafer laminated fractals.
Smart Images
Figure CN222764211U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaics, in particular to a metal interconnection structure, a battery string and a photovoltaic assembly. Background Art
[0002] A photovoltaic module is a component that converts solar energy into electrical energy. The positive and negative poles of a back-contact solar cell are both located on the back of the cell. If traditional electrical connection methods are used for welding, the positive and negative connection devices of the cell will come into contact with each other, causing a short circuit. The current solution is to print insulating glue on the positive or negative electrode area on the cell to prevent the positive and negative electrodes from contacting each other during welding, thereby avoiding a short circuit caused by the positive and negative electrodes coming into contact with each other during welding.
[0003] Since the glue is printed at a height of about 40μm behind the battery cell, this height will cause the solder ribbon to hang in the air on the pad and cannot be soldered. At this time, solder paste needs to be printed to fill the hanging problem between the pad and the glue. This method has many steps and the solder paste will corrode the silver when it melts, resulting in the silver solder joints needing to be thicker to avoid over-soldering. Utility Model Content
[0004] Based on this, it is necessary to provide a metal interconnection structure. The metal interconnection structure of the utility model does not need to print solder paste to solve the hollowing problem of the connection point, can be directly carried by a mechanical device, does not need to cut the metal interconnection strip head when in use, can be directly connected to the battery cell connection plate to form a silver-tin alloy, is convenient and quick to use, reduces the silver corrosion caused by secondary tin, avoids leakage short circuit, avoids silicon wafer lamination cracking, improves the quality stability of photovoltaic module finished products, and greatly reduces the production cost of photovoltaic modules.
[0005] An embodiment of the present application provides a metal interconnect structure.
[0006] A metal interconnect structure comprises a metal interconnect bar and a connection bump, wherein the connection bump is connected to the metal interconnect bar, and a plurality of the connection bumps are spaced apart along the length direction of the metal interconnect bar, and the metal interconnect bar is used to be connected to a battery cell, and when connected, the connection bump corresponds to the connection point position of a connection disk on the battery cell and is located in an area surrounded by insulating glue, and the maximum height L1 of the connection bump relative to the metal interconnect bar is greater than the maximum height L2 of the insulating glue relative to the connection disk, and the connection bump is used to be connected to the connection point.
[0007] In some of the embodiments, the metal interconnection strip is a tin soldering strip, an aluminum soldering strip or a lead soldering strip.
[0008] In some embodiments, a maximum height L1 of the connection bump relative to the metal interconnection strip and a maximum height L2 of the insulating glue relative to the connection pad satisfy the following relationship: L1=L2(1+3%~5%).
[0009] In some embodiments, a maximum height L1 of the connection bump relative to the metal interconnection strip is 100 μm-120 μm.
[0010] In some embodiments, the spacing between adjacent connecting bumps is 1 mm to 50 mm.
[0011] In some embodiments, a surface shape of the connection protrusion used for connecting with the connection point is the same as a shape of the connection point.
[0012] In some embodiments, the area of the surface of the connection bump for connecting with the connection point is smaller than the area of the connection point.
[0013] In some embodiments, the surface area of the connection bump used for connecting with the connection point is 3%-6% smaller than the area of the connection point.
[0014] In some embodiments, the connecting bump is a tin block, a lead block or an aluminum block.
[0015] An embodiment of the present application also provides a battery string.
[0016] A battery string comprises a plurality of battery cells and a metal interconnection structure, wherein the battery cells are connected via the metal interconnection structure, wherein the battery cells are provided with a plurality of connection pads, and the connection protrusions correspond to the connection point positions on the connection pads and are located in an area surrounded by insulating glue around the connection points.
[0017] An embodiment of the present application also provides a photovoltaic module.
[0018] A photovoltaic assembly comprises the battery string.
[0019] The above-mentioned metal interconnection structure does not need to print solder paste to solve the problem of hollow connection points. It can be directly transported by mechanical devices. There is no need to cut the metal interconnection strip head during use. It can be directly connected to the battery cell connection plate to form a silver-tin alloy. It is easy and quick to use, reduces silver corrosion caused by secondary tin, avoids leakage short circuit, avoids silicon wafer lamination cracking, improves the quality stability of finished photovoltaic modules, and greatly reduces the production cost of photovoltaic modules.
[0020] Compared with the conventional technology, the metal interconnect structure of the present application has the following beneficial effects:
[0021] (1) Solder paste can be printed without using a printer to reduce the cost of using the machine. After streamlining the process, the speed of connecting photovoltaic modules can be improved to a certain extent, thereby increasing the production capacity of photovoltaic modules.
[0022] (2) It can reduce some printing problems that occur during solder paste printing, such as missing solder paste printing, uneven solder paste surface height, and solder paste sintering and curing problems, thereby improving component reliability.
[0023] (3) The connecting bump is a tin block, a lead block or an aluminum block, and the material cost is lower.
[0024] (4) Using tin, lead or aluminum as the metal interconnection strip material can reduce the corrosion and oxidation risks of the copper soldering strip in the traditional technology. Compared with the copper soldering strip in the traditional technology that needs to be tinned on the surface, this application simplifies the tinning process.
[0025] (5) Metal interconnect strips can be used at any time without cutting, thus avoiding burrs caused by cutting. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.
[0027] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.
[0028] Figure 1 This is a schematic diagram of a metal interconnection structure according to an embodiment of the utility model;
[0029] Figure 2 It is a schematic diagram of the coordination of the metal interconnection structure and the connection points according to an embodiment of the present utility model.
[0030] Description of Reference Numerals
[0031] 10. Metal interconnection structure; 100. Metal interconnection strip; 200. Connection bump; 20. Connection plate; 21. Connection point; 22. Insulation glue. DETAILED DESCRIPTION
[0032] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0036] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0038] In the present application, when it comes to a numerical interval (i.e., a numerical range), unless otherwise specified, the distribution of the optional numerical values in the numerical interval is considered to be continuous, and includes the two numerical endpoints (i.e., the minimum and maximum values) of the numerical interval, and each numerical value between the two numerical endpoints. Unless otherwise specified, when the numerical interval only refers to an integer in the numerical interval, it includes the two endpoint integers of the numerical range, and each integer between the two endpoints, which is equivalent to directly listing each integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical range disclosed in the present application should be understood to include any and all sub-ranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. "Numerical interval" allows for a broad range of quantitative intervals such as percentage intervals, ratio intervals, and ratio intervals.
[0039] The embodiment of the present application provides a metal interconnect structure 10 to solve the problem that the insulating glue is printed on the positive or negative electrode area of the battery cell in the traditional technology to achieve the effect of non-contact between the positive and negative electrodes, and the glue is printed at a height of about 40μm behind the battery cell, which will cause the solder strip to be suspended on the pad and cannot be welded, and the problem that filling the suspension between the pad and the glue by printing solder paste has many steps and the solder paste will corrode the silver when it melts, so that the silver solder joint needs to be thicker to avoid over-welding. The metal interconnect structure 10 will be described below in conjunction with the accompanying drawings.
[0040] The metal interconnect structure 10 provided in the embodiment of the present application is exemplary, see Figure 1 As shown, Figure 1 The schematic diagram of the structure of the metal interconnection structure 10 provided in the embodiment of the present application is shown in FIG. The metal interconnection structure 10 of the present application can be used for the production of photovoltaic modules.
[0041] In order to more clearly illustrate the structure of the metal interconnect structure 10, the metal interconnect structure 10 will be introduced below in conjunction with the accompanying drawings. Figure 1 As shown, Figure 1 A schematic diagram of the structure of a metal interconnect structure 10 provided in an embodiment of the present application.
[0042] A metal interconnect structure 10 includes a metal interconnect bar 100 and a connection bump 200. The connection bump 200 is connected to the metal interconnect bar 100. A plurality of connection bumps 200 are spaced apart along the length of the metal interconnect bar 100. The metal interconnect bar 100 is used to be connected to a battery cell. When connected, the connection bump 200 corresponds to the position of the connection point 21 of the connection pad 20 on the battery cell and is located in the area surrounded by the insulating glue 22. The maximum height L1 of the connection bump 200 relative to the metal interconnect bar 100 is greater than the maximum height L2 of the insulating glue relative to the connection pad 20, and the connection bump 200 is used to be connected to the connection point 21.
[0043] The above-mentioned metal interconnection structure 10 does not need to print solder paste to solve the hollowing problem of the connection point 21, can be directly transported by a mechanical device, and does not need to cut the metal interconnection strip 100 head when in use. It can be directly connected to the connection plate 20 on the battery cell. It is convenient and quick to use, reduces the silver corrosion caused by secondary tin, avoids leakage short circuit, avoids silicon wafer lamination cracking, improves the quality stability of finished photovoltaic modules, and greatly reduces the production cost of photovoltaic modules.
[0044] In some embodiments, the metal interconnection strip 100 may be a solder strip, and correspondingly, the connection pad 20 is a solder pad, and the connection point 21 is a solder point.
[0045] In some embodiments, the metal interconnection strip 100 may be a tin soldering strip, an aluminum soldering strip, or a lead soldering strip.
[0046] In some embodiments, the material of the connection bump 200 may be tin, aluminum or lead. That is, the connection bump 200 may be a tin block, an aluminum block or a lead block.
[0047] In some of these embodiments, see Figure 2 As shown, Figure 2 This is a schematic diagram of the metal interconnection structure 10 and the connection point 21 of an embodiment of the utility model. The maximum height L1 of the connection bump 200 relative to the metal interconnection strip 100 and the maximum height L2 of the insulating glue relative to the connection plate 20 satisfy the following relationship: L1=L2(1+3%~5%). It should be noted that L1 is about 3%~5% higher than L2. On the one hand, it can ensure that the connection bump 200 is located at the connection point 21 and is interference-fitted in height within the area surrounded by the insulating glue 22, so that the connection between the connection bump 200 and the connection point 21 can be easily achieved. On the other hand, L1 should not be too large, so as to save the material of the connection bump 200 and save costs.
[0048] In some embodiments, a maximum height L1 of the connection bump 200 relative to the metal interconnection bar 100 is 100 μm-120 μm.
[0049] In some embodiments, the spacing between adjacent connection bumps 200 is 1 mm to 50 mm. The spacing between adjacent connection bumps 200 should be the same as the spacing between adjacent connection pads 20 on the battery cell during preparation. Since the spacing between connection pads 20 of different types of battery cells is different, the connection bumps 200 must be completely centered with the corresponding battery cell connection pads 20 during preparation to avoid abnormal phenomena such as cold soldering.
[0050] In some embodiments, the surface shape of the connection bump 200 used for connecting with the connection point 21 is the same as the shape of the connection point 21. It should be noted that the connection point 21 of the present application refers to the area on the connection disk that is connected to the connection bump 200.
[0051] In some embodiments, the surface area of the connection bump 200 for connecting with the connection point 21 is smaller than the area of the connection point 21. The area of the connection bump 200 should be smaller than the area of the connection point 21 on the battery cell connection pad 20 to achieve full combination of the connection bump 200 and the connection pad 20.
[0052] Preferably, in some embodiments, the surface area of the connection protrusion 200 used for connecting with the connection point 21 is 3% to 6% smaller than the area of the connection point 21. This arrangement can ensure that the connection protrusion 200 is located in the area of the connection point 21 as a whole when placed, which is convenient for subsequent connection.
[0053] In some embodiments, the connection bump 200 has a copper plated layer, or is electrochemically treated to enable it to wet solder.
[0054] An embodiment of the present application also provides a battery string.
[0055] A battery string includes a plurality of battery cells and a metal interconnection structure 10, wherein the battery cells are connected via the metal interconnection structure 10. The battery cells are provided with a plurality of connection plates 20, and insulating glue 22 is printed around the connection point 21 on the connection plate 20, and the area surrounded by the insulating glue 22 around the connection point 21 is used to accommodate the connection bump 20. When connected, the connection bump 200 corresponds to the connection point 21 on the connection plate 20 and is located in the area surrounded by the insulating glue 22 around the connection point 21. When the connection bump 200 is located on the connection point 21, the connection point 21 and the connection bump 200 can be connected, and the connection method can be welding or the like.
[0056] An embodiment of the present application also provides a photovoltaic module.
[0057] A photovoltaic module includes a battery string.
[0058] In summary, compared with the conventional technology, the metal interconnect structure 10 of the present application has the following beneficial effects:
[0059] (1) Solder paste can be printed without using a printer to reduce the cost of using the machine. After streamlining the process, the speed of connecting photovoltaic modules can be improved to a certain extent, thereby increasing the production capacity of photovoltaic modules.
[0060] (2) It can reduce some printing problems that occur during solder paste printing, such as missing solder paste printing, uneven solder paste surface height, and solder paste sintering and curing problems, thereby improving the reliability of photovoltaic modules.
[0061] (3) The connecting bump 200 is a tin block, a lead block or an aluminum block, and the material cost is lower.
[0062] (4) Using tin, lead or aluminum as the material of the metal interconnection strip 100 can reduce the corrosion and oxidation risks of the copper soldering strip in the traditional technology. Compared with the copper soldering strip in the traditional technology that needs to be tinned on the surface, the present application simplifies the tinning process.
[0063] (5) The metal interconnection strip 100 can be used at any time without cutting, thus avoiding burrs generated after cutting.
[0064] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0065] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0066] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A metal interconnect structure (10), characterized in that: The invention comprises a metal interconnection bar (100) and a connection bump (200), wherein the connection bump (200) is connected to the metal interconnection bar (100), and a plurality of the connection bumps (200) are spaced apart on the metal interconnection bar (100) along its length direction, and the metal interconnection bar (100) is used to be connected to a battery cell, and when connected, the connection bump (200) corresponds to the position of a connection point (21) of a connection plate (20) on the battery cell and is located in an area surrounded by an insulating glue (22), and a maximum height L1 of the connection bump (200) relative to the metal interconnection bar (100) is greater than a maximum height L2 of the insulating glue (22) relative to the connection plate (20), and the connection bump (200) is used to be connected to the connection point (21).
2. The metal interconnect structure (10) according to claim 1, characterized in that: The metal interconnection strip (100) is a tin solder strip, an aluminum solder strip or a lead solder strip.
3. The metal interconnect structure (10) according to claim 1, characterized in that: The maximum height L1 of the connection protrusion (200) relative to the metal interconnection strip (100) and the maximum height L2 of the insulating glue (22) relative to the connection plate (20) satisfy the following relationship: L1=L2 (1+3%~5%).
4. The metal interconnect structure (10) according to claim 3, characterized in that: The maximum height L1 of the connection bump (200) relative to the metal interconnection bar (100) is 100 μm to 120 μm.
5. The metal interconnect structure (10) according to any one of claims 1 to 4, characterized in that: The distance between adjacent connecting protrusions (200) is 1 mm to 50 mm.
6. The metal interconnect structure (10) according to any one of claims 1 to 4, characterized in that: The surface shape of the connection protrusion (200) used for connecting with the connection point (21) is the same as the shape of the connection point (21).
7. The metal interconnect structure (10) according to any one of claims 1 to 4, characterized in that: The area of the surface of the connection protrusion (200) used for connecting with the connection point (21) is smaller than the area of the connection point (21).
8. The metal interconnect structure (10) according to claim 7, characterized in that: The area of the surface of the connection protrusion (200) used for connecting with the connection point (21) is 3% to 6% smaller than the area of the connection point (21).
9. A battery string, characterized in that: The invention comprises a plurality of battery cells and a metal interconnection structure (10) as claimed in any one of claims 1 to 8, wherein the battery cells are connected via the metal interconnection structure (10), wherein the battery cells have a plurality of connection pads (20), and the connection bumps (200) correspond to the positions of connection points (21) on the connection pads (20) and are located in an area surrounded by an insulating glue (22) around the connection points (21).
10. A photovoltaic module, characterized in that: Comprising the battery string as claimed in claim 9.