Die for laying bonding material at bottom of fiber soil plate

By designing a bonding material mold for fiber soil plates, the problem of cumbersome fixing process and prone to collapse and rainwater invasion of fiber soil plates is solved, and more efficient construction and better waterproofing effect are achieved.

CN222771477UActive Publication Date: 2025-04-18CHONGQING XINKE INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202421526488.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-01
Publication Date
2025-04-18
Estimated Expiration
2034-07-01

AI Technical Summary

Technical Problem

When using fiber soil slabs to green the slopes, slope protection, retaining walls, forts, and wall facades, the fixing method consumes materials, the process is cumbersome, and the metal keel skeleton collapses and rainwater invasion is prone to problems.

Method used

A mold is designed to lay bonding materials on the bottom of the fiber soil plate, including a mold frame with a rectangular cavity and a shield plate for blocking planting holes. It is connected to the mold frame through connecting ribs, leaving space to fill the bonding material, and a handle is provided on the mold for easy use.

Benefits of technology

The mold is simple in structure and easy to use. It can effectively lay bonding materials on the bottom of the fiber soil slab, improve construction efficiency, and avoid the collapse of the metal keel frame and rainwater invasion.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222771477U_ABST
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Abstract

A mold for laying a bonding material at the bottom of a fiber soil plate comprises a mold frame provided with a rectangular cavity, the rectangular cavity is a through cavity, a plurality of shielding plates used for shielding planting holes of the fiber soil plate are arranged in the rectangular cavity, the shielding plates are connected with a frame of the mold frame through connecting ribs, and the connecting ribs are connected with the mold frame. Each baffle plate corresponds to the planting hole of the fiber soil plate, so that a space for filling a bonding material is reserved between the border of the mold frame and each baffle plate, and a lifting handle is arranged at the upper end of the mold frame and is fixedly connected to the border of the mold frame. By means of the mold, the bonding material can be effectively laid at the bottom of the fiber soil plate and used for bonding the fiber soil plate to a side slope and a wall vertical face.
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Description

Technical Field

[0001] The utility model relates to the field of ecological protection and environmental restoration, and in particular to a mold for laying an adhesive material on the bottom of a fiber soil board. Background Art

[0002] Fiber soil board is a solidified and non-loose culture soil board made by mixing chemical fiber with various plant organic matter, humus and garden soil particles. The culture soil board has various conditions suitable for plant growth, such as suitable porosity, good air permeability and good water retention. Plants can be planted on the fiber soil board and survive for a long time. Multiple planting holes are set on this fiber soil board, and plants are planted in the planting holes. It can be used for ecological restoration, environmental protection, greening and landscaping in various slopes, slope protection, retaining walls, embankments, wall facades and other places. It can become an effective culture soil board for greening slopes, slope protection, retaining walls, embankments and wall facades.

[0003] The existing method of fixing fiber soil boards as soil for greening slopes, slope protection, retaining walls, embankments, and wall facades is usually to set a metal keel frame on the slope, slope protection, retaining walls, embankments, and wall facades, and fix the metal keel frame on the slope or wall facade with screws, and then use a stainless steel frame or a cloth bag or a plastic box to wrap the fiber soil board, and then fix it on the metal keel frame with screws. This fixing and installation method consumes materials, the process is cumbersome, and the construction efficiency is low. Especially when fiber soil boards are set on the wall facade, once the screws fixing the metal keel frame rust and break, it is easy to cause the metal keel frame to collapse. In addition, in areas with heavy rain, rainwater on the wall surface will also invade the wall through the gaps in the screws, causing the wall to be damp, affecting the living environment in the house.

[0004] How to fix the fiber soil slabs on the slopes and wall facades has long been a problem without a better solution. Summary of the invention

[0005] The utility model aims to provide a mold for laying adhesive material on the bottom of a fiber soil board to address the corresponding deficiencies of the prior art. Through this mold, adhesive material can be effectively laid on the bottom of the fiber soil board to paste the fiber soil board on a slope or a wall facade.

[0006] The purpose of the utility model is achieved by adopting the following scheme: a mold for laying adhesive material on the bottom of a fiber soil board, comprising a mold frame provided with a rectangular cavity, wherein the rectangular cavity is a through cavity, and a plurality of shielding plates for shielding the planting holes of the fiber soil board are arranged in the rectangular cavity, wherein the shielding plates are connected to the frame of the mold frame through connecting ribs, and each shielding plate corresponds to the planting hole of the fiber soil board respectively, so that space for filling the adhesive material is left between the frame of the mold frame and each shielding plate, and a handle is arranged on the upper end of the mold frame, and the handle is fixedly connected to the frame of the mold frame.

[0007] There is one handle, which spans the rectangular cavity of the mold frame and is fixedly connected to the frames on both sides of the mold frame by bolts; or there are two handles, which are fixedly connected to the frames on both sides of the mold frame by bolts respectively.

[0008] The area of ​​the rectangular cavity of the mold frame is 300cm 2 ~3200cm 2 .

[0009] The frame thickness of the mold frame is 0.2 cm to 0.5 cm, and the thickness of the shielding plate and the connecting ribs is the same as the frame thickness.

[0010] The diameter of the shielding plate is 5 cm to 10 cm.

[0011] The number of the shielding plates is 2 to 16.

[0012] The mold frame is formed by laser cutting.

[0013] The utility model has the advantages of simple mold structure, convenient use, low production cost, and can effectively lay adhesive materials on the bottom of the fiber soil board for pasting the fiber soil board on the slope and the wall facade. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a top view of the utility model;

[0016] Figure 3 Schematic diagram of bonding material laying. DETAILED DESCRIPTION

[0017] like Figures 1 to 3As shown, a mold for laying adhesive material at the bottom of a fiber soil board comprises a mold frame 2 with a rectangular cavity, wherein the rectangular cavity is a through cavity, and a plurality of shielding plates 4 for shielding the planting holes of the fiber soil board are arranged in the rectangular cavity, wherein the shielding plates 4 are connected to the frame 2-1 of the mold frame 2 through connecting ribs 3, and each shielding plate 4 corresponds to the planting hole of the fiber soil board, so that a space for filling adhesive material is left between the frame 2-1 of the mold frame 2 and each shielding plate 4, and a handle 1 is arranged at the upper end of the mold frame 2, and the handle 1 is fixedly connected to the frame 2-1 of the mold frame 2. There is one handle 1, which spans the rectangular cavity of the mold frame 2 and is fixedly connected to the frame 2-1 on both sides of the mold frame 2 by bolts; or, there are two handles 1, and the two handles 1 are fixedly connected to the frame 2-1 on both sides of the mold frame 2 by bolts. The area of ​​the rectangular cavity of the mold frame 2 is 300cm 2 ~3200cm 2 , according to the fiber soil board materials of different specifications, the mold frame 2 with different inner cavity areas is selected. The thickness of the frame 2-1 of the mold frame 2 is 0.2cm to 0.5cm, and the thickness of the shielding plate 4 and the connecting rib 3 is the same as the thickness of the frame 2-1. The diameter of the shielding plate 4 is 5cm to 10cm, and the diameter of the shielding plate 4 is larger than the diameter of the planting hole 7 of the fiber soil board 6 by 0.2cm. The number of the shielding plates 4 is 2 to 16. The mold frame is formed by laser cutting.

[0018] When filling the bottom of the fiber soil board with adhesive material, first lay the fiber soil board flat, then place the mold above the fiber soil board 6, so that the fiber soil board is completely placed in the inner wall of the rectangular filling frame 2, and the shielding plate 4 completely covers the planting holes 7 on the fiber soil board 6, and then pour the adhesive material into the mold frame 2, so that the adhesive material 5 completely fills the space between the rectangular filling frame 2 and the shielding plate 4, finally grab the handle 1 of the mold, lift the mold upwards, and remove the mold.

[0019] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification made to the present invention by those skilled in the art without departing from the spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. A mold for laying adhesive material at the bottom of a fiber soil board, characterized in that: The invention comprises a mold frame (2) provided with a rectangular cavity, wherein the rectangular cavity is a through cavity, and a plurality of shielding plates (4) for shielding planting holes of a fiber soil board are arranged in the rectangular cavity, wherein the shielding plates (4) are connected to a frame (2-1) of the mold frame (2) via a connecting rib (3), and each shielding plate (4) corresponds to a planting hole of the fiber soil board, so that a space for filling an adhesive material is left between the frame (2-1) of the mold frame (2) and each shielding plate (4), and a handle (1) is arranged at the upper end of the mold frame (2), and the handle (1) is fixedly connected to the frame (2-1) of the mold frame (2).

2. The mold for laying adhesive material at the bottom of the fiber soil board according to claim 1, characterized in that: There is one handle (1), which spans the rectangular cavity of the mold frame (2) and is fixedly connected to the frames (2-1) on both sides of the mold frame (2) by bolts; or there are two handles (1), which are respectively fixedly connected to the frames (2-1) on both sides of the mold frame (2) by bolts.

3. The mold for laying adhesive material at the bottom of the fiber soil board according to claim 1, characterized in that: The area of ​​the rectangular cavity of the mold frame (2) is 300 cm 2 ~3200cm 2 .

4. The mold for laying adhesive material at the bottom of the fiber soil board according to claim 1, characterized in that: The frame (2-1) of the mold frame (2) has a thickness of 0.2 cm to 0.5 cm, and the thickness of the shielding plate (4) and the connecting rib (3) is the same as the thickness of the frame (2-1).

5. The mold for laying adhesive material at the bottom of the fiber soil board according to claim 1, characterized in that: The diameter of the shielding plate (4) is 5 cm to 10 cm.

6. The mold for laying adhesive material at the bottom of the fiber soil board according to claim 1 or 5, characterized in that: The number of the shielding plates (4) is 2 to 16.

7. The mold for laying adhesive material at the bottom of the fiber soil board according to claim 1, characterized in that: The mold frame (2) is formed by laser cutting.