Rectified semiconductor device

Abstract

The utility model discloses a rectification semiconductor device, which comprises four diode chips wrapped in a plastic package body and four pins extending out of the plastic package body, a first diode chip and a second diode chip are arranged on the upper surface of the first pin, a third diode chip and a fourth diode chip are arranged on the upper surface of the second pin, and the fourth diode chip is arranged on the upper surface of the second pin. The first conductive lap joint piece is connected with the third pin, the first diode chip and the fourth diode chip, and the second conductive lap joint piece is connected with the fourth pin, the second diode chip and the third diode chip. According to the utility model, the bending heights of the third pin and the fourth pin are increased, so that the pin is flush with the upper surface of the corresponding diode chip, the conductive lap joint sheet does not need to be bent and can be directly laid on the upper surfaces of the pin and the diode chip to realize connection, the lighter and thinner conductive lap joint sheet can be selected, the thickness of a packaged finished product is effectively reduced, and the production cost is reduced. And the processing procedure is simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, in particular to a rectifying semiconductor device. Background Art

[0002] Rectifier semiconductor devices have a rectifier bridge circuit structure and are used to convert alternating current into direct current. The basic principle of rectifier semiconductor devices is to use the special properties of semiconductor materials, especially the pn structure formed by the combination of p-type semiconductors and n-type semiconductors, to achieve unidirectional conduction of current.

[0003] With the continuous development of smart devices, the market has higher and higher requirements for the miniaturization and thinness of rectifier semiconductor devices. In the prior art, a structural design that can reduce the packaging volume has emerged. Usually, four diode chips are encapsulated inside a plastic package, and four pins extend from both sides of the plastic package. The diode chip is installed on the upper surface of the pins on one side, and the upper surface of the diode chip is connected to the pins on the other side through a connecting piece.

[0004] Due to the height difference between the upper surface of the diode chip and the pin on the other side, the connection piece can only be overlapped after being bent, which leads to an increase in the processing steps of the rectifier semiconductor device, and the connection piece must have a certain thickness to prevent breakage or deformation and other adverse conditions. The finished product after packaging is large in size, and the structural design of the existing overall semiconductor device cannot meet the market demand for lighter and thinner devices. Utility Model Content

[0005] In order to solve the defect of the existing rectifying semiconductor device being large in size, the utility model proposes a rectifying semiconductor device.

[0006] The technical solution adopted by the utility model is to design a rectifying semiconductor device, including: four diode chips wrapped in a plastic package and four pins extending out of the plastic package, the four pins are respectively a first pin, a second pin, a third pin and a fourth pin arranged at intervals from each other, the four diode chips are respectively a first diode chip and a second diode chip installed on the upper surface of the first pin, and a third diode chip and a fourth diode chip installed on the upper surface of the second pin.

[0007] The upper end of the third pin is bent to form a third connecting portion extending horizontally, so that the third connecting portion, the upper surfaces of the first diode chip and the fourth diode chip are highly flush, and the first conductive strap is laid flat on the upper surfaces of the third connecting portion, the first diode chip and the fourth diode chip. The upper end of the fourth pin is bent to form a fourth connecting portion extending horizontally, so that the fourth connecting portion, the upper surfaces of the second diode chip and the third diode chip are highly flush, and the second conductive strap is laid flat on the upper surfaces of the fourth connecting portion, the second diode chip and the third diode chip.

[0008] Furthermore, the four pins extend out of the plastic package in the horizontal direction, the four diode chips are staggered in the horizontal direction, and the first diode chip and the third diode chip are located between the second diode chip and the fourth diode chip in the horizontal direction; the second diode chip is located between the first pin and the second pin, and the fourth diode chip is located between the third pin and the fourth pin.

[0009] Furthermore, the first conductive strap and the second conductive strap are both L-shaped, the first end of the first conductive strap is connected to the first diode chip, the second end is connected to the fourth diode chip, and the corner portion is connected to the third pin, the first end of the second conductive strap is connected to the second diode chip, and the second end is connected to the fourth pin through the third diode chip.

[0010] Preferably, the thickness of the first conductive strap and the second conductive strap are both less than 0.1 mm.

[0011] Preferably, the first conductive strap and the second conductive strap are both made of metal sheets.

[0012] Compared with the prior art, the utility model increases the bending height of the pin on one side of the plastic package body so that the pin is flush with the upper surface of the diode chip. The conductive strap does not need to be bent and can be directly laid flat on the upper surface of the pin and the diode chip to achieve connection. A thinner conductive strap can be used, which effectively reduces the thickness of the finished product after packaging and simplifies the processing procedure.

[0013] In addition, the four chips are staggered and the diagonal design is used rationally to ensure the isolation distance while reducing the overall length and width of the chip, reducing the volume of the finished product after packaging, and realizing the miniaturization and thinness of the rectifier semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is described in detail below with reference to the embodiments and drawings, wherein:

[0015] Figure 1 It is a top view schematic diagram of the internal structure of the rectifier semiconductor device of the utility model;

[0016] Figure 2 It is a schematic diagram of the arrangement of four diode chips and four pins of the utility model;

[0017] Figure 3 It is a side view schematic diagram of the internal structure of the rectifier semiconductor device of the utility model;

[0018] Figure 4 It is a schematic diagram of the arrangement of two conductive straps of the utility model;

[0019] Description of the drawings: 1. plastic package; 2. first pin; 21. first connecting part; 3. second pin; 31. second connecting part; 4. third pin; 41. third connecting part; 5. fourth pin; 51. fourth connecting part; 6. first diode chip; 7. second diode chip; 8. third diode chip; 9. fourth diode chip; 10. first conductive strap; 101. first end of the first conductive strap; 102. second end of the first conductive strap; 103. corner portion of the first conductive strap; 11. second conductive strap; 111. first end of the second conductive strap; 112. second end of the second conductive strap. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] like Figure 1 , 2 As shown, the rectifier semiconductor device proposed by the utility model comprises: a plastic package 1, four diode chips, four pins, and two conductive straps, wherein the four diode chips are encapsulated in the plastic package 1, and the inner ends of the four pins are encapsulated in the plastic package 1, and the outer ends extend out of the plastic package 1. Specifically, the four pins are respectively a first pin 2, a second pin 3, a third pin 4, and a fourth pin 5 which are arranged at intervals from each other, the four diode chips are respectively a first diode chip 6, a second diode chip 7, a third diode chip 8, and a fourth diode chip 9, and the two conductive straps are respectively a first conductive strap 10 and a second conductive strap 11.

[0022] The upper end of the first pin 2 is bent to form a horizontally extending first connecting portion 21. The first connecting portion 21 is composed of two base islands and a connecting rib located between the two base islands. The first diode chip 6 and the second diode chip 7 are installed on the upper surface of the first connecting portion 21. More precisely, the first diode chip 6 and the second diode chip 7 are respectively installed on the corresponding base islands.

[0023] The upper end of the second pin 3 is bent to form a horizontally extending second connecting portion 31, and the second connecting portion 31 is composed of two base islands and a connecting rib located between the two base islands. The third diode chip 8 and the fourth diode chip 9 are installed on the upper surface of the second pin 3. More precisely, the third diode chip 8 and the fourth diode chip 9 are respectively installed on the corresponding base islands.

[0024] The upper end of the third pin 4 is bent to form a horizontally extending third connecting portion 41. By increasing the bending height of the third pin 4, the upper surfaces of the third connecting portion 41, the first diode chip 6 and the fourth diode chip 9 are made flush with each other. The first conductive strap 10 does not need to be bent and can be directly laid flat on the upper surfaces of the third connecting portion 41, the first diode chip 6 and the fourth diode chip 9, thereby achieving electrical connection between the first diode chip 6, the fourth diode chip 9 and the third pin 4.

[0025] Similarly, the upper end of the fourth pin 5 is bent to form a horizontally extending fourth connecting portion 51. By increasing the bending height of the fourth pin 5, the upper surfaces of the fourth connecting portion 51, the second diode chip 7 and the third diode chip 8 are made flush with each other. The second conductive strap 11 does not need to be bent and can be directly laid flat on the upper surfaces of the fourth connecting portion 51, the second diode chip 7 and the third diode chip 8, thereby achieving electrical connection between the second diode chip 7, the third diode chip 8 and the fourth pin 5.

[0026] The packaging structure design of the utility model can select a lighter and thinner conductive overlap sheet, effectively reduce the thickness of the finished product after packaging, and simplify the processing procedure.

[0027] For ease of understanding, an application example of the present invention is used for illustration. Figure 1 , 2 As shown, the outer ends of the four pins extend out of the plastic package body 1 in parallel with each other, the direction in which the four pins extend out of the plastic package body 1 is the horizontal direction, and the direction perpendicular to the horizontal direction in the horizontal plane is the longitudinal direction, the first pin 2 and the second pin 3 extend out from the other side of the plastic package body 1, the third pin 4 and the fourth pin 5 extend out from the other side of the plastic package body 1, the outer ends of the first pin 2 and the third pin 4 are aligned in the longitudinal direction, and the outer ends of the second pin 3 and the fourth pin 5 are aligned in the longitudinal direction.

[0028] like Figure 3As shown, the lower surfaces of the four pins are flush, the upper ends of the first pin 2 and the second pin 3 are bent and extended horizontally, the bending height h1 of the first pin 2 and the second pin 3 are both 0.13mm, the thickness h2 is both 0.15mm, the thickness h3 of the four diode chips is 0.27mm, the first diode chip 6 and the second diode chip 7 are installed on the upper surface of the first pin 2 by soldering, the third diode chip 8 and the fourth diode chip 9 are installed on the upper surface of the second pin 3 by soldering, and the thickness h4 of the soldering is 0.05mm. The upper ends of the third pin 4 and the fourth pin 5 are bent and extended horizontally, the bending height h5 of the third pin 4 and the fourth pin 5 are both 0.45mm, and the thickness h6 is both 0.15mm. The upper surface height of any one of the four diode chips is h1+h2+h4+h3=0.6mm, and the upper surface height of any one of the third pin 4 and the fourth pin 5 is h6+h5=0.6mm.

[0029] As preferred, in some embodiments of the present invention, Figure 2 As shown, the four diode chips are staggered in the transverse direction, the first diode chip 6 and the third diode chip 8 are located between the second diode chip 7 and the fourth diode chip 9 in the transverse direction, the second diode chip 7 is located between the first pin 2 and the second pin 3, and the fourth diode chip 9 is located between the third pin 4 and the fourth pin 5. That is, among the four diode chips, the second diode chip 7 is located on the side close to the first pin 2 and the second pin 3, the fourth diode chip 9 is located on the side close to the third pin 4 and the fourth pin 5, and the second diode chip 7 and the fourth diode chip 9 are roughly aligned in the longitudinal direction.

[0030] The chips on different pins are arranged at intervals with tilts in the vertical and horizontal directions, and the diagonal design is reasonably utilized to ensure the isolation distance while reducing the overall length and width of the chip, reducing the volume of the finished product after packaging, and realizing the miniaturization and thinness of the rectifier semiconductor device.

[0031] On this basis, an L-shaped conductive strap is designed according to the arrangement of the diode chip and pins, such as Figure 1 , 4 As shown, the first end 101 of the first conductive strap 10 is connected to the first diode chip 6, the second end 102 of the first conductive strap 10 is connected to the fourth diode chip 9, the corner portion 103 of the first conductive strap 10 is connected to the third connection portion 41 of the third pin 4, the first end 111 of the second conductive strap 11 is connected to the second diode chip 7, and the second end 112 of the second conductive strap 11 is connected to the fourth connection portion 51 of the fourth pin 5 via the third diode chip 8.

[0032] The rectifying semiconductor device proposed in the present invention can use conductive straps with a thickness of less than 0.1 mm, and the first conductive strap 10 and the second conductive strap 11 are preferably made of metal sheets.

[0033] It should be noted that the terms used above are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present utility model. When the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or their combinations.

[0034] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. Rectifier semiconductor devices, including: Four diode chips encapsulated in a plastic package (1) and four pins extending out of the plastic package, the four pins being respectively a first pin (2), a second pin (3), a third pin (4) and a fourth pin (5) arranged at intervals from each other, the four diode chips being respectively a first diode chip (6) and a second diode chip (7) mounted on the upper surface of the first pin (2), and a third diode chip (8) and a fourth diode chip (9) mounted on the upper surface of the second pin (3); The invention is characterized in that the upper end of the third pin (4) is bent to form a third connecting portion (41) extending horizontally, so that the upper surfaces of the third connecting portion (41), the first diode chip (6) and the fourth diode chip (9) are highly flush, and the first conductive strap (10) is laid flat on the upper surfaces of the third connecting portion (41), the first diode chip (6) and the fourth diode chip (9); The upper end of the fourth pin (5) is bent to form a fourth connecting portion (51) extending horizontally, so that the upper surfaces of the fourth connecting portion (51), the second diode chip (7) and the third diode chip (8) are flush with each other, and the second conductive strap (11) is laid flat on the upper surfaces of the fourth connecting portion (51), the second diode chip (7) and the third diode chip (8).

2. The rectifying semiconductor device according to claim 1, characterized in that: The direction in which the four pins extend out of the plastic package (1) is transverse, the four diode chips are staggered in the transverse direction, and the first diode chip (6) and the third diode chip (8) are located between the second diode chip (7) and the fourth diode chip (9) in the transverse direction; The second diode chip (7) is located between the first pin (2) and the second pin (3), and the fourth diode chip (9) is located between the third pin (4) and the fourth pin (5).

3. The rectifying semiconductor device according to claim 2, characterized in that: The first conductive strap (10) and the second conductive strap (11) are both L-shaped; the first end (101) of the first conductive strap is connected to the first diode chip (6); the second end (102) of the first conductive strap is connected to the fourth diode chip (9); the corner portion (103) of the first conductive strap is connected to the third pin (4); the first end (111) of the second conductive strap is connected to the second diode chip (7); and the second end (112) of the second conductive strap is connected to the fourth pin (5) via the third diode chip (8).

4. The rectifying semiconductor device according to any one of claims 1 to 3, characterized in that: The thickness of the first conductive strap (10) and the second conductive strap (11) are both less than 0.1 mm.

5. The rectifying semiconductor device according to any one of claims 1 to 3, characterized in that: The first conductive strap (10) and the second conductive strap (11) are both made of metal sheets.

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