Automatic processing device for semiconductor wafer

Abstract

The utility model discloses a semiconductor wafer automatic processing device, which comprises a rack, a crystal bar clamping mechanism, a rolling processing mechanism, a wafer orientation mechanism and a grinding and cutting mechanism, the wafer orientation mechanism is arranged at one end of the rack, the crystal bar clamping mechanism is arranged on the rack, the rolling processing mechanism is arranged on the rack and is parallel to the crystal bar clamping mechanism, and the grinding and cutting mechanism is arranged on the rack. The grinding and cutting mechanism is installed on the rolling machining mechanism, the rolling machining mechanism drives the grinding and cutting mechanism to be close to or far away from the crystal bar clamping mechanism, the wafer orientation mechanism stretches across the upper portion of the crystal bar clamping mechanism, and the semiconductor wafer automatic machining device is high in integration degree, low in use cost and long in service life, and improves machining precision.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing equipment, and more specifically to an automatic semiconductor wafer processing device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits, and its raw material is silicon.

[0003] According to the traditional requirements of the semiconductor industry, after a semiconductor single crystal is grown, it is generally necessary to undergo front-end processes such as rounding, crystal orientation, edge grinding, oriented groove cutting, grinding, and polishing to process the crystal rod into a single crystal substrate so that it can enter the back-end processing process of the wafer.

[0004] Currently, the semiconductor industry mainly relies on manual experience to center and clamp the crystal rods before subsequent processing. Different technicians are required to operate different equipment in sequence to complete each process. The operation is complicated and requires transportation, clamping, positioning... This results in high labor and equipment costs and low processing accuracy.

[0005] Specifically: For the front process of crystal rod rolling, the end face of the crystal rod that has just been grown is usually manually ground flat, and then manually clamped on the cylindrical grinding machine for processing. The crystal rod that has just been grown is generally an irregular cylindrical shape. Traditionally, it needs to be manually clamped and centered based on experience, which is labor-intensive and easily causes excessive centering deviation, leading to material waste. Traditional crystal orientation devices are generally carried out on a single crystal orientation positioning device, and rely on manual operation to judge the diffraction peak. This process is highly dependent on manual operation, and requires operators with rich experience and certain professional knowledge to manually judge whether the diffraction peak has reached the peak, which increases a lot of labor costs. In addition, manual judgment is prone to human errors and can easily reduce the orientation accuracy of the crystal. The orientation device integrated into the grinding machine equipment is extremely susceptible to the infiltration of water vapor when the grinder is working, resulting in contamination of the orientation device, excessive deviation in orientation accuracy and easy damage. Existing equipment that integrates external circle grinding, crystal orientation, and positioning edge grinding devices is mostly separately integrated, and the poor correlation between the devices leads to reduced processing accuracy. There is no device for cutting orientation grooves, and the devices for each process are arranged at different positions inside the equipment, resulting in large equipment space occupation, high cost and reduced processing accuracy. Utility Model Content

[0006] In order to solve the above problems, the purpose of the utility model is to provide a semiconductor wafer automatic processing device with high integration, improved processing accuracy, low use cost and long service life.

[0007] According to one aspect of the utility model, a semiconductor wafer automatic processing device is provided, including: a frame, a crystal rod clamping mechanism, a rounding mechanism, a wafer orientation mechanism and a grinding mechanism, a wafer orientation mechanism is arranged at one end of the frame, a crystal rod clamping mechanism is arranged on the frame, a rounding mechanism is arranged on the frame and parallel to the crystal rod clamping mechanism, a grinding mechanism is installed on the rounding mechanism, the rounding mechanism drives the grinding mechanism to approach or move away from the crystal rod clamping mechanism, and a wafer orientation mechanism spans over the crystal rod clamping mechanism. The crystal rod to be processed is fixed by the crystal rod clamping mechanism for subsequent processing, the outer circle of the crystal rod is processed by the rounding mechanism, the crystal that has completed the outer circle processing is oriented by the wafer orientation mechanism, and the positioning edge or positioning groove is ground out on the crystal rod by the grinding mechanism.

[0008] In some embodiments, the crystal rod clamping mechanism includes: a clamping assembly and a first moving assembly, the clamping assembly is mounted on the first moving assembly and drives the clamping assembly to move back and forth. The first moving assembly facilitates the processing of the crystal rod.

[0009] In some embodiments, the first moving component includes: a first motor, a first screw rod, a first guide rail, and a first nut seat. The output end of the first motor is connected to the first screw rod, the first nut seat sleeve is set on the first screw rod, the first nut seat is fixedly connected to the clamping component, the clamping component cooperates with the first guide rail, the first motor drives the clamping component to reciprocate on the first guide rail, and the first signaling device and the second signaling device are set on both sides of the first guide rail.

[0010] In some embodiments, the clamping assembly includes: a headstock, a tailstock and a workbench, the headstock and the tailstock are mounted on the top of the workbench, the bottom of the workbench cooperates with the first guide rail and is fixedly connected to the first nut seat, one end of the headstock is connected to a second motor, and the other end of the headstock is installed with a rotary top, and the output end of the second motor is connected to the rotary top and drives the rotary top to rotate;

[0011] A movable top is installed at one end of the tailstock, and a hydraulic cylinder is connected to the other end of the tailstock. The telescopic end of the hydraulic cylinder is connected to the movable top and drives the movable top to move.

[0012] The movable top is arranged corresponding to the rotating top. The head frame and the rotating top are used to drive the crystal rod to rotate so as to realize the processing of the outer circle of the crystal rod. The movable top is convenient to resist the tail of the crystal rod so that the crystal rod rotates more smoothly.

[0013] In some embodiments, an auxiliary centering mechanism is provided above the movable top. The front clamping component of the auxiliary centering mechanism coincides with the axial center of the rotary top and the movable top, and the centering work is completed when the crystal rod is clamped. After centering, the head frame and the tail frame clamp the crystal rod and rotate and make axial reciprocating motion with the first guide rail of the workbench.

[0014] In some embodiments, the rounding mechanism includes: a base, a second moving assembly and a grinding wheel assembly, the second moving assembly is mounted on the frame and is vertically arranged with the first moving assembly, the base is mounted on the second moving assembly, the grinding wheel assembly and the grinding mechanism are mounted in parallel on the top of the base, and the second moving assembly drives the grinding wheel assembly and the grinding mechanism to approach or move away from the clamping assembly. The grinding wheel assembly is driven to move by the second moving assembly to control the amount of processing of the outer circle of the crystal rod.

[0015] In some embodiments, the second moving group includes: a third motor, a second screw rod, a second guide rail, and a second nut seat. The output end of the third motor is connected to the second screw rod, the second nut seat sleeve is set on the second screw rod, the second nut seat is fixedly connected to the base, the base cooperates with the second guide rail through a slider, and the third motor drives the base to reciprocate on the second guide rail.

[0016] In some embodiments, the grinding wheel assembly includes: a mounting frame, a rotating shaft, a grinding wheel and a fourth motor, wherein the bottom of the mounting frame is fixed to the top of the base, the rotating shaft is arranged on the mounting frame, the grinding wheel is fixed on the rotating shaft, and the fourth motor is connected to the rotating shaft and drives the rotating shaft to rotate. The grinding wheel is driven to rotate by the fourth motor to grind the outer circle of the crystal rod.

[0017] In some embodiments, the grinding and cutting mechanism includes: a mounting seat, a third moving assembly and a grinding and cutting assembly, which is mounted vertically on the base, the third moving assembly is arranged on the mounting seat, the grinding and cutting assembly is mounted on the third moving assembly and drives the grinding and cutting assembly to move up and down;

[0018] The third moving assembly includes: a fifth motor, a third screw rod, a third guide rail, and a third nut seat, wherein the output end of the fifth motor is connected to the third screw rod, the third nut seat sleeve is arranged on the third screw rod, the third nut seat is fixedly connected to the grinding and cutting assembly, the grinding and cutting assembly cooperates with the third guide rail through a slider, and the fifth motor drives the grinding and cutting assembly to move vertically back and forth on the third guide rail;

[0019] The grinding and cutting assembly includes: a first slide, an electric spindle, a bowl-shaped grinding wheel and a groove cutting grinding wheel. The first slide is fixedly connected to the third nut seat, the first slide cooperates with the third guide rail through a slider, and the bowl-shaped grinding wheel and the groove cutting grinding wheel are installed at the bottom of the electric spindle.

[0020] In some embodiments, the wafer orientation mechanism includes: a column, a fourth moving component, and a positioning component, wherein the bottom of the column is fixed on a frame, the fourth moving component is vertically installed on the top of the frame, and the positioning component is arranged on the fourth moving component and drives the positioning component to reciprocate up and down;

[0021] The positioning assembly includes: a second slide and an orientation plate arranged on the second slide, and an X-ray transmitter and a diffraction light receiver are arranged on the orientation plate;

[0022] The fourth moving component includes: a sixth motor, a fourth screw rod, a fourth guide rail, and a fourth nut seat. The output end of the sixth motor is connected to the fourth screw rod, the fourth nut seat sleeve is set on the fourth screw rod, the fourth nut seat is fixedly connected to the second slide, the second slide cooperates with the fourth guide rail through the slider, and the sixth motor drives the second slide to move vertically back and forth on the fourth guide rail.

[0023] Compared with the prior art, the utility model has the beneficial effects of high degree of integration, improved processing accuracy, low use cost and long service life; the utility model integrates the positioning edge grinding and orientation groove cutting devices through ingenious design, and is highly centralized with the outer circle grinding device, which greatly saves manufacturing costs and improves processing accuracy and processing efficiency; a crystal rod auxiliary positioning device is arranged above the tail frame of the clamping device, which effectively realizes the automatic centering function of the crystal rod and enriches the use function of the equipment; an automatic orientation device is provided to realize the automatic orientation function of the wafer, reducing the error caused by manual operation, and it is arranged outside the cover of the clamping mechanism to prevent it from being contaminated by water vapor during other processes, which greatly improves the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the semiconductor wafer automatic processing device of the utility model;

[0025] Figure 2 It is a structural schematic diagram of a crystal rod clamping mechanism of a semiconductor wafer automatic processing device of the utility model;

[0026] Figure 3 It is a structural schematic diagram of a rounding processing mechanism of a semiconductor wafer automatic processing device of the utility model;

[0027] Figure 4 It is a structural schematic diagram of the grinding and cutting mechanism of the semiconductor wafer automatic processing device of the utility model;

[0028] Figure 5 The utility model is a schematic diagram of the structure of a wafer orientation mechanism of a semiconductor wafer automatic processing device. DETAILED DESCRIPTION

[0029] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0030] In the description of the present utility model, it should be noted that, unless otherwise specified and limited, the terms

[0031] "Installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meaning of the terms can be understood according to the specific circumstances.

[0032] like Figure 1 As shown, the semiconductor wafer automatic processing device described in the utility model comprises: a frame 1, a crystal rod clamping mechanism 2, a rounding mechanism 3, a wafer orientation mechanism 4 and a grinding mechanism 5. The wafer orientation mechanism 4 is arranged at one end of the frame 1, the crystal rod clamping mechanism 2 is arranged on the frame 1, the rounding mechanism 3 is arranged on the frame 1 and is arranged parallel to the crystal rod clamping mechanism 2, the grinding mechanism 5 is installed on the rounding mechanism 3, the rounding mechanism 3 drives the grinding mechanism 5 to approach or move away from the crystal rod clamping mechanism 2, and the wafer orientation mechanism 4 spans over the crystal rod clamping mechanism 2. The crystal rod to be processed is fixed by the crystal rod clamping mechanism 2 for subsequent processing, the outer circle of the crystal rod is processed by the rounding mechanism 3, the crystal after the outer circle processing is oriented by the wafer orientation mechanism 4, and the groove is opened on the crystal rod by the grinding mechanism 5.

[0033] like Figure 2 As shown, the crystal rod clamping mechanism 2 includes: a clamping assembly 21 and a first moving assembly 22. The clamping assembly 21 is mounted on the first moving assembly 22 and drives the clamping assembly 21 to move back and forth. The first moving assembly 22 facilitates the processing of the crystal rod.

[0034] The first moving component 22 includes: a first motor 221, a first screw rod 222, a first guide rail 223, and a first nut seat 224. The output end of the first motor 221 is connected to the first screw rod 222. The first nut seat 224 is sleeved on the first screw rod 222. The first nut seat 224 is fixedly connected to the clamping component 21. The clamping component 21 cooperates with the first guide rail 223. The first motor 221 drives the clamping component 21 to reciprocate on the first guide rail 223. A first signaling device and a second signaling device are arranged on both sides of the first guide rail 223.

[0035] The clamping assembly 21 includes: a head frame 211, a tail frame 212 and a workbench 213. The head frame 211 and the tail frame 212 are installed on the top of the workbench 213. The bottom of the workbench 213 cooperates with the first guide rail 223 and is fixedly connected to the first nut seat 224. One end of the head frame 211 is connected to the second motor 214, and the other end of the head frame 211 is installed with a rotary top 215. The output end of the second motor 214 is connected to the rotary top 215 and drives the rotary top 215 to rotate.

[0036] A movable top 216 is installed at one end of the tailstock 212, and a hydraulic cylinder 217 is connected to the other end of the tailstock 212. The telescopic end of the hydraulic cylinder 217 is connected to the movable top 216 and drives the movable top 216 to move.

[0037] The movable top 216 is arranged corresponding to the rotating top 215. The head frame 211 and the rotating top 215 are used to drive the crystal rod to rotate so as to realize the processing of the outer circle of the crystal rod. The movable top 216 is convenient to resist the tail of the crystal rod to make the crystal rod rotate more smoothly.

[0038] An auxiliary centering mechanism 218 is provided above the movable top 216. The front end clamping part of the auxiliary centering mechanism 218 coincides with the axial center of the rotating top 215 and the movable top 216, and the centering work is completed when the crystal rod is clamped. After centering, the head frame 211 and the tail frame 212 clamp the crystal rod and rotate and make axial reciprocating motion with the first guide rail 223 of the workbench 213.

[0039] like Figure 3 As shown, the rounding mechanism 3 includes: a base 31, a second moving assembly 32 and a grinding wheel assembly 33. The second moving assembly 32 is mounted on the frame 1 and is vertically arranged with the first moving assembly 22. The base 31 is mounted on the second moving assembly 32. The grinding wheel assembly 33 and the grinding mechanism 5 are mounted in parallel on the top of the base 31. The second moving assembly 32 drives the grinding wheel assembly 33 and the grinding mechanism 5 to approach or move away from the clamping assembly 21. The grinding wheel assembly 33 is driven by the second moving assembly 32 to move, thereby controlling the amount of processing on the outer circle of the crystal rod.

[0040] The second moving group 32 includes: a third motor 321, a second screw rod 322, a second guide rail 323, and a second nut seat 324. The output end of the third motor 321 is connected to the second screw rod 322. The second nut seat 324 is sleeved on the second screw rod 322. The second nut seat 324 is fixedly connected to the base 31. The base 31 cooperates with the second guide rail 323 through a slider. The third motor 321 drives the base 31 to reciprocate on the second guide rail 323.

[0041] The grinding wheel assembly 33 includes: a mounting frame 331, a rotating shaft 332, a grinding wheel 333 and a fourth motor 334. The bottom of the mounting frame 331 is fixed to the top of the base 31, the rotating shaft 332 is arranged on the mounting frame 331, the grinding wheel 333 is fixed on the rotating shaft 332, and the fourth motor 334 is connected to the rotating shaft 332 and drives the rotating shaft 332 to rotate. The grinding wheel 333 is driven by the fourth motor 334 to rotate and grind the outer circle of the crystal rod.

[0042] like Figure 4As shown, the grinding and cutting mechanism 5 includes: a mounting seat 51, a third moving assembly 52 and a grinding and cutting assembly 53, which are mounted vertically on the base 31, the third moving assembly 52 is arranged on the mounting seat 51, and the grinding and cutting assembly 53 is installed on the third moving assembly 52 and drives the grinding and cutting assembly 53 to move up and down;

[0043] The third moving assembly 52 includes: a fifth motor 521, a third screw rod 522, a third guide rail 523, and a third nut seat 524. The output end of the fifth motor 521 is connected to the third screw rod 522. The third nut seat 524 is sleeved on the third screw rod 522. The third nut seat 524 is fixedly connected to the grinding assembly 53. The grinding assembly 53 cooperates with the third guide rail 523 through a slider. The fifth motor 521 drives the grinding assembly 53 to reciprocate vertically on the third guide rail 523.

[0044] The grinding and cutting assembly 53 includes: a first slide 531, an electric spindle 532, a bowl-shaped grinding wheel 533 and a groove cutting grinding wheel 534. The first slide 531 is fixedly connected to the third nut seat 524. The first slide 531 cooperates with the third guide rail 523 through a slider. The bowl-shaped grinding wheel 533 and the groove cutting grinding wheel 534 are installed at the bottom of the electric spindle 532. After the crystal orientation is determined, the crystal rod moves axially to the edge grinding and groove cutting processing area. When the edge grinding process is adopted, the crystal rod is controlled to rotate 90°. When the groove cutting process is adopted, the crystal rod is controlled to rotate 180°. The position of the grinding wheel 333 is adjusted as needed, the required grinding wheel 333 is selected to process the crystal rod, the feeding of the grinding wheel 333 is controlled, and the electric spindle 532 is started to drive the groove cutting grinding wheel 534 to process the workpiece. The processed crystal rod moves back and forth axially until a positioning edge notch or plane that meets industrial requirements is ground out.

[0045] like Figure 5 As shown, the wafer orientation mechanism 4 includes: a column 41, a fourth moving assembly 42, and a positioning assembly 43. The bottom of the column 41 is fixed on the frame 1, and the fourth moving assembly 42 is vertically installed on the top of the frame 1. The positioning assembly 43 is arranged on the fourth moving assembly 42 and drives the positioning assembly 43 to reciprocate up and down;

[0046] The positioning assembly 43 includes: a second slide 431 and an orientation plate 432 disposed on the second slide 431, and an X-ray emitter 433 and a diffraction light receiver 434 are disposed on the orientation plate 432;

[0047] The fourth moving component 42 includes: a sixth motor 421, a fourth screw rod 422, a fourth guide rail 423, and a fourth nut seat 424. The output end of the sixth motor 421 is connected to the fourth screw rod 422. The fourth nut seat 424 is sleeved on the fourth screw rod 422. The fourth nut seat 424 is fixedly connected to the second slide 431. The second slide 431 cooperates with the fourth guide rail 423 through a slider. The sixth motor 421 drives the second slide 431 to move vertically back and forth on the fourth guide rail 423.

[0048] In the specific use process, follow the following steps:

[0049] Loading process: First, the crystal rod is placed on the auxiliary centering mechanism 218 for clamping, so that the center point of the crystal rod is located on the central axis of the rotating top 215 of the head frame 211 and the movable top 216 of the tail frame 212, and then the hydraulic cylinder 217 provides axial thrust to complete the centering and clamping of the crystal rod.

[0050] Crystal orientation process: After the rounding process is completed, crystal orientation is carried out. The head frame 211 and the tail frame 212 clamp the crystal rod and drive the first guide rail 223 through the first motor 221 to drive the workbench 213 to move axially to the left, so that the crystal rod is located below the crystal orientation mechanism. The crystal rod is controlled to rotate at a low speed, and the second slide 431 is driven by the sixth motor 421 to move vertically. When the transmitter 433 stops moving about 0.2 mm away from the crystal rod, the transmitter 433 emits X-rays, which are received by the receiver 434. The diffraction peak is displayed on the CNC system, and the highest point is automatically found, which corresponds to the target crystal direction. After the crystal direction is determined, the crystal rod stops rotating immediately.

[0051] Edge grinding and grooving process: After the crystal orientation is completed, the headstock 211 and the tailstock 212 clamp the crystal rod and drive the first guide rail 223 through the first motor 221 to drive the workbench 213 to move axially to the right to the edge grinding and grooving processing area. When the edge grinding process is adopted, the crystal rod is controlled to rotate 90°, and the fifth motor 521 is controlled to drive the first slide 531 to move so that the bowl-shaped grinding wheel 533 is in the required processing position. The cover is controlled to be closed to prevent water stains from contaminating the orientation equipment, and the electric spindle 532 is started to drive the bowl-shaped grinding wheel 533 to rotate and process the workpiece, and then the third motor 321 is controlled to drive the single longitudinal feed amount of the base 31, and at the same time, the workbench 213 moves axially back and forth to perform an axial cycle. Grinding, until the required positioning edge plane size is ground out, and the cover is controlled to open; when the grooving process is adopted, the crystal rod is controlled to rotate 180°, the fifth motor 521 is controlled to drive the first slide 531 to move, and the third motor 321 is controlled to drive the base 31 to move, so that the grooving grinding wheel 534 is in the required processing position, and the cover is controlled to close to prevent water stains from contaminating the directional equipment, and the electric spindle 532 is started to drive the grooving grinding wheel 534 to rotate and process the workpiece, and then the third motor 321 is controlled to drive the base 31 to move a single longitudinal feed amount, and at the same time, the workbench 213 moves back and forth axially, and performs axial cycle grinding, until the positioning groove notch size that meets the requirements is ground out, and the cover is controlled to open;

[0052] In summary, by integrating the edge grinding and grooving mechanisms and placing them above the grinding wheel 333, the processing structure is optimized, the processing cost is greatly reduced, the use functions are enriched, and the processing accuracy and processing efficiency are improved. At the same time, the auxiliary centering mechanism 218 is used to confirm the position of the center point of the target size crystal rod, which is conducive to the overall rolling processing of the crystal rod with irregular outer diameter, and the crystal rod clamping process and the center line between the rotating top 215 and the movable top 216 coincide, without the need for manual experience to judge and adjust, optimize the processing method, reduce material loss and processing time, and isolate the orientation mechanism by designing the cover shell outside the clamping mechanism, preventing water stains from contaminating the precision equipment and improving the service life of the equipment.

[0053] To sum up, the whole process flow has reliable connections between processes and a compact structure, which can not only ensure high efficiency and high precision, but also reduce the labor costs and human errors of technical workers. It has strong reusability and improves the input-output ratio of the entire production line.

[0054] The above are only some embodiments of the present invention. It should be pointed out that for ordinary technicians in this field, other modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A semiconductor wafer automatic processing device, characterized in that: include: A frame, a crystal rod clamping mechanism, a rounding mechanism, a wafer orienting mechanism and a grinding mechanism. The wafer orienting mechanism is arranged at one end of the frame, the crystal rod clamping mechanism is arranged on the frame, the rounding mechanism is arranged on the frame and parallel to the crystal rod clamping mechanism, the grinding mechanism is installed on the rounding mechanism, the rounding mechanism drives the grinding mechanism to approach or move away from the crystal rod clamping mechanism, and the wafer orienting mechanism spans over the crystal rod clamping mechanism.

2. The semiconductor wafer automatic processing device according to claim 1, characterized in that: The crystal rod clamping mechanism comprises: a clamping assembly and a first moving assembly, wherein the clamping assembly is mounted on the first moving assembly and drives the clamping assembly to move back and forth.

3. The semiconductor wafer automatic processing device according to claim 2, characterized in that: The first moving component includes: a first motor, a first screw rod, a first guide rail, and a first nut seat. The output end of the first motor is connected to the first screw rod. The first nut seat sleeve is set on the first screw rod. The first nut seat is fixedly connected to the clamping component. The clamping component cooperates with the first guide rail. The first motor drives the clamping component to reciprocate on the first guide rail. A first signal transmitting device and a second signal transmitting device are set on both sides of the first guide rail.

4. The semiconductor wafer automatic processing device according to claim 3, characterized in that: The clamping assembly includes: a headstock, a tailstock and a workbench, wherein the headstock and the tailstock are mounted on the top of the workbench, the bottom of the workbench cooperates with the first guide rail and is fixedly connected to the first nut seat, one end of the headstock is connected to a second motor, the other end of the headstock is mounted with a rotary top, the output end of the second motor is connected to the rotary top and drives the rotary top to rotate; A movable top is installed at one end of the tailstock, and a hydraulic cylinder is connected to the other end of the tailstock. The telescopic end of the hydraulic cylinder is connected to the movable top and drives the movable top to move. The movable top and the rotary top are arranged correspondingly.

5. The semiconductor wafer automatic processing device according to claim 4, characterized in that: An auxiliary centering mechanism is arranged above the movable top.

6. The semiconductor wafer automatic processing device according to claim 5, characterized in that: The rounding processing mechanism includes: a base, a second movable component and a grinding wheel assembly, the second movable component is installed on the frame and is vertically arranged with the first movable component, the base is installed on the second movable component, the grinding wheel assembly and the grinding and cutting mechanism are installed in parallel on the top of the base, and the second movable component drives the grinding wheel assembly and the grinding and cutting mechanism to approach or move away from the clamping component.

7. The semiconductor wafer automatic processing device according to claim 6, characterized in that: The second moving group includes: a third motor, a second screw rod, a second guide rail, and a second nut seat. The output end of the third motor is connected to the second screw rod. The second nut seat sleeve is set on the second screw rod. The second nut seat is fixedly connected to the base. The base cooperates with the second guide rail through a slider. The third motor drives the base to reciprocate on the second guide rail.

8. The semiconductor wafer automatic processing device according to claim 7, characterized in that: The grinding wheel assembly includes: a mounting frame, a rotating shaft, a grinding wheel and a fourth motor. The bottom of the mounting frame is fixed to the top of the base, the rotating shaft is arranged on the mounting frame, the grinding wheel is fixed on the rotating shaft, and the fourth motor is connected to the rotating shaft and drives the rotating shaft to rotate.

9. The semiconductor wafer automatic processing device according to claim 8, characterized in that: The grinding and cutting mechanism comprises: a mounting seat, a third moving assembly and a grinding and cutting assembly, wherein the mounting seat is vertically mounted on the base, the third moving assembly is arranged on the mounting seat, the grinding and cutting assembly is installed on the third moving assembly and drives the grinding and cutting assembly to move up and down; The third moving assembly comprises: a fifth motor, a third screw rod, a third guide rail, and a third nut seat, wherein the output end of the fifth motor is connected to the third screw rod, the third nut seat sleeve is arranged on the third screw rod, the third nut seat is fixedly connected to the grinding and cutting assembly, the grinding and cutting assembly cooperates with the third guide rail through a slider, and the fifth motor drives the grinding and cutting assembly to move vertically back and forth on the third guide rail; The grinding and cutting assembly includes: a first slide, an electric spindle, a bowl-shaped grinding wheel and a groove cutting grinding wheel. The first slide is fixedly connected to the third nut seat. The first slide cooperates with the third guide rail through a slider. The bowl-shaped grinding wheel and the groove cutting grinding wheel are installed at the bottom of the electric spindle.

10. The semiconductor wafer automatic processing device according to any one of claims 1 to 9, characterized in that: The wafer orientation mechanism comprises: a column, a fourth moving assembly, and a positioning assembly, wherein the bottom of the column is fixed on a frame, the fourth moving assembly is vertically installed on the top of the frame, and the positioning assembly is arranged on the fourth moving assembly and drives the positioning assembly to reciprocate up and down; The positioning assembly comprises: a second slide and an orienting plate arranged on the second slide, wherein an X-ray transmitter and a diffraction light receiver are arranged on the orienting plate; The fourth moving assembly includes: a sixth motor, a fourth screw rod, a fourth guide rail, and a fourth nut seat. The output end of the sixth motor is connected to the fourth screw rod. The fourth nut seat sleeve is arranged on the fourth screw rod. The fourth nut seat is fixedly connected to the second slide. The second slide cooperates with the fourth guide rail through a slider. The sixth motor drives the second slide to move vertically back and forth on the fourth guide rail.

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