GOA output wiring structure, array substrate and display device

Abstract

The utility model discloses a GOA output wiring structure, an array substrate and a display device. The GOA output wiring structure comprises a GIP output signal line, a test line and a lap joint structure. The lap joint structure comprises a first connecting end and a second connecting end; the GIP output signal line and the test line are insulated from each other; the first connecting end is in lap joint with a GIP output signal line or a test line; during testing, the second connecting end is in lap joint with the testing line or the GIP output signal line so that the testing line can be connected with the GIP output signal line, signal testing is carried out, and after testing is completed, the lap joint structure is fused so that connection between the testing line and the GIP output signal line can be disconnected. According to the utility model, the problem that the test PAD of the existing display screen can only test a GOA signal of a certain level is solved, and the bad analysis period of a product is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of display screen testing, and in particular to a GOA output wiring structure, an array substrate and a display device. Background Art

[0002] Thin Film Transistor Liquid Crystal Display (TFT LCD) is the mainstream display device in the current market due to its advantages such as light weight and low power consumption. The preparation process of the display panel usually includes an array substrate process, a color film substrate process and a cell process of the array substrate and the color film substrate.

[0003] At present, various mura often occurs in display screens due to the influence of process level and production fluctuations. At this time, it is often necessary to detect the output signal waveform of the GOA circuit to determine whether the GOA circuit is working properly. However, the previous GOA test PAD is often only connected to a certain level of GOA (usually the first or last level), or it can detect any level of GOA but only a certain level and cannot repeatedly detect the GOA signal output of other levels. For some horizontal mura appearing in a fixed position, it is impossible to accurately locate it, which greatly prolongs the defect analysis cycle. Summary of the invention

[0004] The existing display screen test PAD can only test a certain level of GOA signal, which prolongs the product failure analysis cycle.

[0005] In view of the above problems, a GOA output wiring structure, an array substrate and a display device are proposed. A overlap structure is set between a GIP output signal line and a test line, and the overlap structure is overlapped with one of them first. During testing, the test line is connected to the GIP output signal line by laser melting, and after the test is completed, the connection between the test line and the GIP output signal line is disconnected by laser melting. The tester can arbitrarily select the GIP output signal line to be tested, which solves the problem that the test PAD of the existing display screen can only test a certain level of GOA signal, and shortens the product defect analysis cycle.

[0006] In a first aspect, a GOA output wiring structure includes:

[0007] GIP output signal line;

[0008] Test line;

[0009] Overlap structure;

[0010] The overlapping structure comprises:

[0011] a first connection end;

[0012] a second connection terminal;

[0013] The GIP output signal line and the test line are insulated from each other;

[0014] The first connection end is connected to the GIP output signal line or the test line;

[0015] During testing, the second connection end is overlapped with the test line or the GIP output signal line to connect the test line with the GIP output signal line for signal testing, and after the test is completed, the overlap structure is fused to disconnect the test line from the GIP output signal line.

[0016] In combination with the GOA output wiring structure described in the utility model, in a first possible implementation manner, the overlap structure is an inverted L-shaped structure;

[0017] The first connection end and the second connection end are respectively two ends of the inverted L-shaped structure.

[0018] In combination with the first possible implementation of the utility model, in a second possible implementation, the overlapping structure further includes:

[0019] Connecting part;

[0020] The connecting portion is connected between the first connecting end and the second connecting end.

[0021] In combination with the second possible implementation manner of the utility model, in a third possible implementation manner, the first connection end of the overlap structure is overlapped on the GIP output signal line, the second connection end overlaps with the test line and is insulated from the test line, and during testing, the second connection end is connected to the test line by laser melting.

[0022] In combination with the third possible implementation manner of the present invention, in a fourth possible implementation manner, the connecting portion is suspended between the test line and the GIP output signal line.

[0023] In combination with the second possible implementation manner of the utility model, in a fifth possible implementation manner, the first connection end of the overlap structure is overlapped on the test line, the second connection end overlaps with the GIP output signal line and is insulated from the GIP output signal line, and during testing, the second connection end is connected to the GIP output signal line by laser melting.

[0024] In combination with the fifth possible implementation manner of the present invention, in a sixth possible implementation manner, the connecting portion is suspended between the test line and the GIP output signal line.

[0025] In a second aspect, an array substrate adopts the GOA output wiring structure described in the first aspect.

[0026] In a third aspect, a display device comprises the array substrate described in the second aspect.

[0027] The GOA output wiring structure, array substrate and display device described in the utility model are implemented by setting an overlap structure between the GIP output signal line and the test line, and overlapping the overlap structure with one of them first. During testing, the test line is connected to the GIP output signal line by laser melting, and after the test is completed, the connection between the test line and the GIP output signal line is disconnected by laser melting. The tester can arbitrarily select the GIP output signal line to be tested, which solves the problem that the test PAD of the existing display screen can only test a certain level of GOA signal, and shortens the product defect analysis cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 This is a schematic diagram of the existing GOA output wiring structure;

[0030] Figure 2 It is a schematic diagram of the test structure in the existing GOA output wiring structure;

[0031] Figure 3 This is a schematic diagram of the GOA output wiring structure of the utility model;

[0032] Figure 4 It is a schematic diagram of the test structure in the GOA output wiring structure of the utility model;

[0033] Figure 5 It is a schematic diagram of the overlapping structure in the test structure in the GOA output wiring structure of the present utility model. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the utility model to clearly and completely describe the technical solution in the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the utility model.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0037] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0039] The existing display screen test PAD can only test a certain level of GOA signal, which prolongs the product failure analysis cycle. Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the existing GOA output wiring structure. Figure 2 It is a schematic diagram of the test structure in the existing GOA output wiring structure.

[0040] refer to Figure 1 , G1 is the GIP output signal Gate1, and G2 is the GIP output signal Gate2. The GIP output signal line 200 and the test line 300 are made of different layers of metal materials, and the different metal layers are separated by an insulating layer. To collect signals, the test line 300 needs to be short-circuited with the GIP output signal line 200 to collect the signal waveforms of Gate1, Gate2, Gate3, ...

[0041] refer to Figure 2By laser fusing the GIP output signal line 200 and the test line 300, the test output of each level of GIP signal is realized. When the overlapping metal at G1 is fused, the signal waveform of G1 can be tested. However, this structure can only test the output signal of a certain level.

[0042] In view of the above problems, a GOA output wiring structure, an array substrate and a display device are proposed.

[0043] Example 1

[0044] First, as Figure 3 , Figure 3 The schematic diagram of the GOA output wiring structure of the utility model; a GOA output wiring structure, including a GIP output signal line 200, a test line 300, and a lap structure 100; the lap structure 100 includes a first connection end 110 and a second connection end 130; the GIP output signal line 200 and the test line 300 are insulated from each other; the first connection end 110 is lapped with the GIP output signal line 200 or the test line 300; during testing, Figure 4 , Figure 4 It is a schematic diagram of the test structure in the GOA output routing structure of the utility model; the second connection end 130 is overlapped with the test line 300 or the GIP output signal line 200 to connect the test line 300 with the GIP output signal line 200 to perform a signal test, and after the test is completed, the overlap structure 100 is fused to disconnect the test line 300 from the GIP output signal line 200.

[0045] Furthermore, if Figure 5 , Figure 5 The schematic diagram of the overlap structure 100 in the test structure of the GOA output wiring structure of the present invention is shown in FIG. The overlap structure 100 is an inverted L-shaped structure; the first connection end 110 and the second connection end 130 are the two ends of the inverted L-shaped structure. The overlap structure 100 also includes: a connecting portion 120; the connecting portion 120 is connected between the first connection end 110 and the second connection end 130.

[0046] The connection part 120 is suspended between the test line 300 and the GIP output signal line 200 . After the test is completed, the connection part 120 can be melted by laser melting to disconnect the connection between the test line 300 and the GIP output signal line 200 .

[0047] In this embodiment, the first connection end 110 of the overlap structure 100 is overlapped on the GIP output signal line 200, and the second connection end 130 overlaps on the test line 300 and is insulated from the test line 300. During the test, the second connection end 130 is connected to the test line 300 by laser melting. The connection part 120 is suspended between the test line 300 and the GIP output signal line 200. After the test is completed, the connection part 120 can be melted by laser melting to disconnect the connection.

[0048] This embodiment can realize the collection of multi-level signals to achieve multiple collections of GIP signals for multiple tests.

[0049] When testing the waveform of G3, the first connection end 110 is melted by laser to short-circuit the G3 signal line and the test signal line. If it is necessary to test the signal waveform at other places, the connection part 120 of the overlap structure 100 is blown, and at the same time, the first connection end 110 corresponding to the other GIP output signal line 200 is melted, so that the waveform of other signal lines can be collected again.

[0050] Example 2

[0051] In this embodiment, the first connection end 110 of the overlap structure 100 is overlapped on the test line 300, and the second connection end 130 overlaps on the GIP output signal line 200 and is insulated from the GIP output signal line 200. During the test, the second connection end 130 is connected to the GIP output signal line 200 by laser melting. The connection part 120 is suspended between the test line 300 and the GIP output signal line 200. After the test is completed, the connection part 120 can be melted by laser melting to disconnect the connection. By setting a lap joint structure 100 between the GIP output signal line 200 and the test line 300, and lap jointing the lap joint structure 100 with one of them first, the test line 300 is connected to the GIP output signal line 200 by laser melting during testing, and after the test is completed, the connection between the test line 300 and the GIP output signal line 200 is disconnected by laser melting. The tester can arbitrarily select the GIP output signal line 200 to be tested, which solves the problem that the test PAD of the existing display screen can only test a certain level of GOA signal, and shortens the product defect analysis cycle.

[0052] This embodiment can also realize the collection of multi-level signals to achieve multiple collections of GIP signals for multiple tests.

[0053] When testing the waveform of G3, the second connection end 130 is melted by laser to short-circuit the G3 signal line and the test signal line. If it is necessary to test the signal waveform at other places, the connection part 120 of the overlap structure 100 is blown, and at the same time, the second connection end 130 corresponding to the other GIP output signal line 200 is melted, so that the waveform of other signal lines can be collected again.

[0054] It is worth noting that after the test is completed, a fuse may be blown at a certain connection end of the bonding structure 100 to disconnect the connection between the test line 300 and the GIP output signal line 200 .

[0055] Example 3

[0056] In a second aspect, an array substrate adopts the GOA output wiring structure of the first aspect.

[0057] In a third aspect, a display device comprises the array substrate of the second aspect.

[0058] The GOA output wiring structure, array substrate and display device of the utility model are implemented by setting a lap joint structure 100 between the GIP output signal line 200 and the test line 300, and lap jointing the lap joint structure 100 with one of them first. During the test, the test line 300 is connected to the GIP output signal line 200 by laser melting, and after the test is completed, the connection between the test line 300 and the GIP output signal line 200 is disconnected by laser melting. The tester can arbitrarily select the GIP output signal line 200 to be tested, thereby solving the problem that the test PAD of the existing display screen can only test a certain level of GOA signal, thereby shortening the product defect analysis cycle.

[0059] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A GOA output wiring structure, characterized in that: include: GIP output signal line; Test line; Overlap structure; The overlapping structure comprises: a first connection end; a second connection terminal; The GIP output signal line and the test line are insulated from each other; The first connection end is connected to the GIP output signal line or the test line; During testing, the second connection end is overlapped with the test line or the GIP output signal line to connect the test line with the GIP output signal line for signal testing, and after the test is completed, the overlap structure is fused to disconnect the test line from the GIP output signal line.

2. The GOA output wiring structure according to claim 1, characterized in that: The overlapping structure is an inverted L-shaped structure; The first connection end and the second connection end are respectively two ends of the inverted L-shaped structure.

3. The GOA output wiring structure according to claim 2, characterized in that: The overlapping structure also includes: Connecting part; The connecting portion is connected between the first connecting end and the second connecting end.

4. The GOA output wiring structure according to claim 3, characterized in that: The first connection end of the overlap structure is overlapped on the GIP output signal line, and the second connection end overlaps with the test line and is insulated from the test line. During testing, the second connection end is connected to the test line by laser melting.

5. The GOA output wiring structure according to claim 4, characterized in that: The connection portion is suspended between the test line and the GIP output signal line.

6. The GOA output wiring structure according to claim 3, characterized in that: The first connection end of the overlap structure is overlapped on the test line, the second connection end overlaps with the GIP output signal line and is insulated from the GIP output signal line. During testing, the second connection end is connected to the GIP output signal line by laser melting.

7. The GOA output wiring structure according to claim 6, characterized in that: The connection portion is suspended between the test line and the GIP output signal line.

8. An array substrate, characterized in that: The GOA output wiring structure according to any one of claims 1 to 7 is adopted.

9. A display device, characterized in that: Comprising the array substrate as claimed in claim 8.

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