Light sensation IC touch screen with shielding cover

Abstract

The utility model discloses a light sensation IC touch screen with a shielding cover. The light sensation IC touch screen comprises a glass substrate and an ITO touch layer arranged on the lower surface of a display area of the glass substrate. The ITO touch layer is bonded with the glass substrate through OCA (Optical Clear Adhesive); an FPC is bound to a non-display area of the glass substrate, a light sensation IC is arranged on the lower surface of the FPC, and the FPC keeps away from the light sensation IC; an electromagnetic shielding cover is welded to the periphery of the light sensation IC. The electromagnetic shielding cover is low in cost and convenient to install, the service life of the light sensation IC can be effectively prolonged, the sensitivity of the light sensation IC can be effectively improved, and the production line manufacturing yield is improved.

Description

Technical Field

[0001] This utility model relates to the field of touch screen technology, and in particular to a photosensitive IC touch screen with a shielding cover. Background Art

[0002] Touchscreens with integrated optical sensors (ICs) are common electronic components that detect light intensity and adjust screen brightness accordingly. However, because these ICs are typically mounted close to the touchscreen surface, the electromagnetic signals generated by the touchscreen can interfere with the IC, thus affecting its sensitivity. Utility Model Content

[0003] To address the shortcomings of the prior art, the present invention provides a touch screen with a photosensitive IC and a shield. By providing an electromagnetic shield on the surface of the photosensitive IC, the shield offers excellent impact resistance and wear resistance, effectively protecting the photosensitive IC from electromagnetic interference from the touch screen. This electromagnetic shield is low-cost, easy to install, and effectively extends the lifespan and sensitivity of the photosensitive IC, thereby improving production line yield.

[0004] The technical problem to be solved by this utility model is achieved through the following technical solution: a photosensitive IC touch screen with a shielding cover, comprising a glass substrate and an ITO touch layer disposed on the lower surface of the display area of ​​the glass substrate;

[0005] The ITO touch layer is bonded to the glass substrate using OCA optical adhesive;

[0006] The non-display area of ​​the glass substrate is bonded with an FPC, and a photosensitive IC is disposed on the lower surface of the FPC, with the FPC avoiding the photosensitive IC.

[0007] The photosensitive IC is surrounded by an electromagnetic shielding cover.

[0008] In a preferred embodiment of the photosensitive IC touch screen with shielding provided by this utility model, a main black ink layer is provided on the lower surface of the glass substrate located in the non-display area, and an air gap is provided on the main black ink layer directly above the photosensitive IC.

[0009] A semi-transparent black ink layer is provided on the lower surface of the glass substrate at the void portion;

[0010] The lower surface of the main black ink layer is screen-printed with reverse-covered black opaque ink.

[0011] In a preferred embodiment of the shielded photosensitive IC touch screen provided by this utility model, a first PI reinforcing plate is provided on the upper surface of the FPC at the corresponding position of the photosensitive IC, and the first PI reinforcing plate avoids the photosensitive IC.

[0012] In a preferred embodiment of the photosensitive IC touch screen with shielding provided by this utility model, a black double-sided adhesive is pasted on the lower surface of the first PI reinforcing plate and the glass substrate, and the black double-sided adhesive avoids the photosensitive IC.

[0013] As a preferred embodiment of the light-sensing IC touch screen with a shielding cover provided by the present invention, the glass substrate is semi-transparent black tempered glass.

[0014] In a preferred embodiment of the shielded photosensitive IC touch screen provided by this utility model, a touch IC is disposed on the upper surface of the FPC, and a steel sheet reinforcing plate is disposed on the lower surface of the FPC located at the touch IC, the steel sheet reinforcing plate having a thickness of 0.2mm.

[0015] As a preferred embodiment of the light-sensing IC touch screen with a shielding cover provided by the present invention, the touch IC and the light-sensing IC are welded to the surface of the FPC using SMT technology.

[0016] As a preferred embodiment of the light-sensing IC touch screen with a shielding cover provided by the present invention, a double-sided tape is provided on the lower surface of the steel sheet reinforcement plate, and the thickness of the double-sided tape is 0.05 mm.

[0017] In a preferred embodiment of the shielded photosensitive IC touch screen provided by this utility model, one end of the FPC is provided with a plug-in terminal, and a second PI reinforcement plate is provided on the lower surface of the FPC located at the plug-in terminal.

[0018] In a preferred embodiment of the shielded photosensitive IC touchscreen provided by this utility model, the photosensitive IC includes a first TP / ALS_1V8 terminal, a first TP / ALS_SCL terminal, and a first TP / ALS_SDA terminal; the touch IC includes a second TP / ALS_1V8 terminal, a second TP / ALS_SCL terminal, and a second TP / ALS_SDA terminal.

[0019] The first TP / ALS_1V8 terminal and the second TP / ALS_1V8 terminal are collinear.

[0020] The first TP / ALS_SCL terminal and the second TP / ALS_SCL terminal are collinear,

[0021] The first TP / ALS_SDA terminal and the second TP / ALS_SDA terminal are collinear.

[0022] The utility model has the following beneficial effects:

[0023] 1. The present application sets a photosensitive IC on the lower surface of the glass substrate, and the main black ink layer, the reverse cover black shading ink and the FPC are all shielded from the photosensitive IC, and a semi-transparent black ink layer is set on the shielded portion. The semi-transparent black ink layer can achieve a black effect at ordinary times and allow light to pass through the front of the glass substrate through the semi-transparent black ink layer and then through the shielded portion of the FPC to enter the photosensitive IC, thereby making the OGS touch screen have a photosensitivity function. The photosensitive IC can be directly set on the lower surface of the FPC, and the backlight brightness can be adjusted by the intensity of external light, thereby achieving the effect of adjusting the screen brightness; further, an electromagnetic shielding cover is provided on the surface of the photosensitive IC to effectively protect the photosensitive IC from electromagnetic signal interference from the touch screen.

[0024] 2. This application uses semi-transparent black tempered glass, which reduces the transmittance of the viewing area. When the screen is not lit, the edge and the viewing area have a better integrated black effect, thereby improving the product competitiveness of OGS touch screen and meeting the growing quality requirements of enterprises. Attached Figure Description

[0025] To more clearly illustrate the solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the photosensitive IC touch screen with shielding provided by this utility model;

[0027] Figure 2 This is a schematic diagram of the stacking of the light-sensing IC touch screen with shielding cover provided by the utility model;

[0028] Figure 3 A side view of the photosensitive IC touch screen with shielding provided by this utility model;

[0029] Figure 4 This is a rear view of the photosensitive IC touchscreen with shielding provided by this utility model;

[0030] Figure 5 This is a pin diagram of the light sensing IC of the light sensing IC touch screen with shield provided by the utility model;

[0031] Figure 6This is a pin diagram of the touch IC of the photosensitive IC touch screen with shielding provided by this utility model.

[0032] 1. Glass substrate; 11. Non-display area; 12. Display area; 13. Main black ink layer; 14. Reverse cover black light-shielding ink; 15. Groove; 2. FPC; 21. Touch IC; 211. Second TP / ALS_1V8 terminal; 212. Second TP / ALS_SCL terminal; 213. Second TP / ALS_SDA terminal; 22. Steel sheet reinforcing plate; 23. Double-sided adhesive; 24. Second PI reinforcing plate; 25. First PI reinforcing plate; 26. Black double-sided adhesive; 3. ITO touch layer; 31. OCA optical adhesive; 4. Clearance area; 41. Semi-transparent black ink layer; 5. Photosensitive IC; 51. First TP / ALS_1V8 terminal; 52. First TP / ALS_SCL terminal; 53. First TP / ALS_SDA terminal; 6. Electromagnetic shielding cover. DETAILED DESCRIPTION

[0033] The present invention will now be described in detail with reference to the accompanying drawings and embodiments, examples of which are shown in the drawings. Throughout the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0034] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixing," and "setting," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] Example 1

[0038] like Figures 1 to 4 As shown, a light-sensitive IC touch screen with a shielding cover comprises a glass substrate 1 and an ITO touch layer 3 provided on the lower surface of the display area 12 of the glass substrate 1;

[0039] The ITO touch layer 3 is bonded to the glass substrate 1 via OCA optical adhesive 31;

[0040] The non-display area 11 of the glass substrate 1 is bound with an FPC 2, and a light sensing IC 5 is provided on the lower surface of the FPC 2, and the FPC 2 avoids the light sensing IC 5;

[0041] An electromagnetic shielding cover 6 is welded around the photosensitive IC 5 .

[0042] Among them, a main black ink layer 13 is provided on the lower surface of the glass substrate 1 located in the non-display area 11, and the main black ink layer 13 is provided with a space-avoiding portion 4 directly above the photosensitive IC 5; a semi-transparent black ink layer 41 is provided on the lower surface of the glass substrate 1 at the space-avoiding portion 4; and a reverse-cover black light-shielding ink 14 is silk-screened on the lower surface of the main black ink layer 13.

[0043] This invention features a photosensitive IC 5 mounted on the lower surface of a glass substrate 1. The photosensitive IC 5 is partially obscured by a black ink layer 13, a black light-blocking ink layer 14, and an FPC 2. A semi-transparent black ink layer 41 is mounted on the obscured portion 4. This semi-transparent black ink layer 41 allows light to pass through the front of the glass substrate 1, through the semi-transparent black ink layer 41, and then through the obscured portion 4 of the FPC 2 to reach the photosensitive IC 5. This enables the OGS touchscreen to have a photosensitive function. The photosensitive IC 5 can be directly mounted on the lower surface of the FPC 2, adjusting the backlight brightness based on the intensity of external light, ultimately regulating the screen brightness. An electromagnetic shielding cover 6 is mounted on the surface of the photosensitive IC 5, possessing good impact resistance and wear resistance, effectively protecting the photosensitive IC 5 from electromagnetic signal interference from the touchscreen. The electromagnetic shielding cover 6 is low-cost, easy to install, and effectively improves the lifespan and sensitivity of the photosensitive IC 5, increasing production yield.

[0044] The electromagnetic shielding cover 6 may be a metal cover, such as made of metal materials such as stainless steel, copper, and iron, or a non-metal cover coated with electromagnetic shielding paint.

[0045] Furthermore, a first PI reinforcing plate 25 is provided on the upper surface of the FPC2 at the corresponding position of the photosensitive IC5, and the first PI reinforcing plate 25 avoids the photosensitive IC5.

[0046] Furthermore, a black double-sided adhesive 26 is attached to the lower surface of the first PI reinforcing plate 25 and the glass substrate 1, and the black double-sided adhesive 26 avoids the light-sensing IC5.

[0047] Example 2

[0048] As a further optimization of Example 1, in this embodiment, the glass substrate 1 is translucent black tempered glass. Using translucent black tempered glass reduces the transmittance of the viewing area. When the screen is off, the edges and the viewing area appear black, creating a more pronounced effect. This enhances the competitiveness of OGS touch screens and helps meet the growing quality demands of businesses.

[0049] Furthermore, a touch IC 21 is provided on the upper surface of the FPC2, and a steel sheet reinforcing plate 22 is provided on the lower surface of the FPC2 located at the touch IC 21. The thickness of the steel sheet reinforcing plate 22 is 0.2 mm.

[0050] Furthermore, the touch IC21 and the light-sensing IC5 are soldered to the surface of the FPC2 using SMT technology.

[0051] It's important to note that SMT, or surface mount technology, is an electronic component assembly technique used to solder electronic components directly to the surface of a printed circuit board (PCB), rather than through traditional plug-in assembly. SMT technology is widely used in the electronics manufacturing industry because it improves production efficiency, reduces circuit board size, lowers costs, and enables higher density and performance.

[0052] The main steps of SMT (Surface Mount Technology) involve precisely attaching surface mount components such as resistors, capacitors, and integrated circuits onto the surface of a PCB using automated equipment. Then, through processes like reflow soldering or wave soldering, the attached components are soldered to the PCB surface to form a reliable connection. Finally, various testing equipment is used to inspect and verify the soldering quality and the accuracy of component mounting. The advantages of SMT technology include high density, high reliability, space saving, cost reduction, and increased production efficiency. Therefore, it has become one of the mainstream assembly technologies in the electronics manufacturing industry and is widely used in the manufacturing process of various electronic products.

[0053] In another preferred implementation manner of this embodiment, a double-sided tape 23 is provided on the lower surface of the steel sheet reinforcement plate 22 , and the thickness of the double-sided tape 23 is 0.05 mm.

[0054] Furthermore, one end of the FPC2 is provided with a plug-in end, and a second PI reinforcing plate 24 is provided on the lower surface of the FPC2 located at the plug-in end to strengthen the plug-in end and facilitate plugging and unplugging of the plug-in end.

[0055] Example 3

[0056] like Figure 5 and Figure 6 As shown, in this embodiment, the light sensor IC5 includes a first TP / ALS_1V8 terminal 51, a first TP / ALS_SCL terminal 52 and a first TP / ALS_SDA terminal 53;

[0057] The touch IC 21 includes a second TP / ALS_1V8 terminal 211, a second TP / ALS_SCL terminal 212, and a second TP / ALS_SDA terminal 213.

[0058] The first TP / ALS_1V8 terminal 51 and the second TP / ALS_1V8 terminal 211 are in the same line.

[0059] The first TP / ALS_SCL terminal 52 and the second TP / ALS_SCL terminal 212 are collinear.

[0060] The first TP / ALS_SDA terminal 53 and the second TP / ALS_SDA terminal 213 are collinear.

[0061] In this embodiment, since the photosensitive IC5 and the touch IC21 share a 1.8V power supply line, an SCL clock signal line, and an SDA data signal line, the module connector connecting to the motherboard can have three fewer pins, resulting in a smaller size and a more competitive price. Reducing the number of peripheral electronic components and interface connector pins lowers module costs and allows for a more compact overall design.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention rather than to limit them. Although the embodiments of the present invention are described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solutions of the embodiments of the present invention can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A light-sensitive IC touch screen with a shield, characterized in that: Comprising a glass substrate (1) and an ITO touch layer (3) arranged on the lower surface of a display area (12) of the glass substrate (1); The ITO touch layer (3) is bonded to the glass substrate (1) via an OCA optical adhesive (31); The non-display area (11) of the glass substrate (1) is bound with an FPC (2), a light sensing IC (5) is arranged on the lower surface of the FPC (2), and the FPC (2) is spaced from the light sensing IC (5); An electromagnetic shielding cover (6) is welded around the photosensitive IC (5).

2. The light-sensitive IC touch screen with a shielding cover according to claim 1, characterized in that: A main black ink layer (13) is provided on the lower surface of the glass substrate (1) located in the non-display area (11), and a space-avoiding portion (4) is provided on the main black ink layer (13) directly above the photosensitive IC (5); A semi-transparent black ink layer (41) is provided on the lower surface of the glass substrate (1) at the air-avoiding portion (4); The lower surface of the main black ink layer (13) is screen-printed with reverse-cover black light-shielding ink (14).

3. The light-sensitive IC touch screen with shielding cover according to claim 1, characterized in that: A first PI reinforcing plate (25) is provided on the upper surface of the FPC (2) at a position corresponding to the photosensitive IC (5), and the first PI reinforcing plate (25) avoids the photosensitive IC (5).

4. The light-sensitive IC touch screen with shielding cover according to claim 3, characterized in that: A black double-sided adhesive (26) is adhered to the lower surface of the first PI reinforcing plate (25) and the glass substrate (1), and the black double-sided adhesive (26) avoids the light-sensing IC (5).

5. The light-sensitive IC touch screen with shielding cover according to claim 1, characterized in that: The glass substrate (1) is semi-transparent black tempered glass.

6. The light-sensitive IC touch screen with shielding cover according to claim 1, characterized in that: A touch IC (21) is arranged on the upper surface of the FPC (2), and a steel sheet reinforcement plate (22) is arranged on the lower surface of the FPC (2) located at the touch IC (21), wherein the thickness of the steel sheet reinforcement plate (22) is 0.2 mm.

7. The light-sensitive IC touch screen with shielding cover according to claim 6, characterized in that: The touch control IC (21) and the light sensing IC (5) are welded to the surface of the FPC (2) using SMT technology.

8. The light-sensitive IC touch screen with shielding cover according to claim 6, characterized in that: The lower surface of the steel sheet reinforcement plate (22) is provided with a double-sided adhesive tape (23), and the thickness of the double-sided adhesive tape (23) is 0.05 mm.

9. The light-sensitive IC touch screen with shielding cover according to claim 1, characterized in that: One end of the FPC (2) is provided with a plug-in end, and a second PI reinforcing plate (24) is provided on the lower surface of the FPC (2) located at the plug-in end.

10. The light-sensitive IC touch screen with shielding cover according to claim 6, characterized in that: The light sensing IC (5) comprises a first TP / ALS_1V8 terminal (51), a first TP / ALS_SCL terminal (52) and a first TP / ALS_SDA terminal (53); The touch control IC (21) comprises a second TP / ALS_1V8 terminal (211), a second TP / ALS_SCL terminal (212) and a second TP / ALS_SDA terminal (213). The first TP / ALS_1V8 terminal (51) and the second TP / ALS_1V8 terminal (211) are in the same line. The first TP / ALS_SCL terminal (52) and the second TP / ALS_SCL terminal (212) are in the same line. The first TP / ALS_SDA terminal (53) and the second TP / ALS_SDA terminal (213) are collinear.

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