Anti-static fingerprint identification module

Abstract

The utility model discloses an antistatic fingerprint identification module comprising an identification main body and an FPC main body, the identification main body is electrically connected with the FPC main body, the identification main body comprises a chip main body and a cover plate, the cover plate is arranged on the upper surface of the chip main body, and the FPC main body is electrically connected with the chip main body. The lower surface of the chip main body is in welded connection with the FPC main body, the periphery of the identification main body is provided with a metal outer frame, the metal outer frame is in close contact with the cover plate, the lower surface of the metal outer frame is provided with a bonding surface, the bonding surface has preset roughness, and the bonding surface is provided with a bonding surface. And the bonding surface is bonded and fixed with the FPC main body through conductive silver paste. As the bonding surface on the lower surface of the metal outer frame has the preset roughness, the glue contact area is increased, and the bonding effect of the glue is improved. When a finger has static electricity, the static electricity is released to the FPC main body through the metal outer frame and the conductive silver paste, so that the damage of the static electricity to the chip is reduced.

Description

Technical Field

[0001] The utility model relates to a fingerprint recognition module, more specifically, to an anti-static fingerprint recognition module. Background Art

[0002] The chip, cover and other components of the fingerprint module are placed in its metal frame, and then the metal frame contacts the FPC through its bottom plane and is bonded with conductive silver paste. Since the FPC surface is generally treated with ink or exposed copper and is relatively smooth, the metal frame is easy to loosen or fall off, affecting the reliability of the fingerprint module.

[0003] Chinese invention patent document CN111126351B discloses a fingerprint recognition module, characterized in that it includes: a fingerprint recognition unit, having a recognition area, for recognizing and collecting the fingerprint of the finger contacting the fingerprint recognition unit; a flexible circuit board, electrically connected to the fingerprint recognition unit; an antistatic structure layer, electrically connected to the flexible circuit board, for releasing the static electricity generated by the finger through the flexible circuit board; the recognition area of ​​the fingerprint recognition unit is divided into a sub-recognition area located in the middle and an edge area surrounding the sub-recognition area, at least part of the antistatic structure layer is located in part of the edge area; the fingerprint recognition unit also has a connection area adjacent to the recognition area, and the antistatic structure layer is at least located in the edge area close to the connection area; an integrated circuit layer, located between the fingerprint recognition unit and the antistatic structure layer, and located in the connection area, for controlling the fingerprint recognition unit; an insulating layer, at least part of the insulating layer is located between the integrated circuit layer and the antistatic structure layer, for isolating the integrated circuit layer from the flexible circuit board and the antistatic structure layer. Obviously, the patent uses an anti-static structural layer to release the static electricity generated by the finger. This structure is too complicated and has a high manufacturing cost. Utility Model Content

[0004] Based on this, it is necessary to provide an anti-static fingerprint recognition module for the above technical problems. The anti-static fingerprint recognition module includes a recognition body and an FPC body. The recognition body is electrically connected to the FPC body. The recognition body includes a chip body and a cover plate. The cover plate is arranged on the upper surface of the chip body. The lower surface of the chip body is welded and connected to the FPC body. The periphery of the recognition body is provided with a metal outer frame. The metal outer frame is in close contact with the cover plate. The lower surface of the metal outer frame is provided with a bonding surface. The bonding surface has a preset roughness. The bonding surface is bonded and fixed to the FPC body through conductive silver paste. Since the bonding surface on the lower surface of the metal outer frame has a preset roughness, the contact area of ​​the glue is increased, and the bonding effect of the glue is increased. At the same time, after the roughness of the bottom surface of the metal outer frame is increased, the heat dissipation area is increased, and its heat dissipation effect is increased. In addition, after the bottom surface of the metal outer frame is coated with conductive silver paste, it is contacted and bonded with the FPC body to fix it on the FPC body. When the finger carries static electricity, the static electricity is released to the FPC body through the metal frame and conductive silver paste, reducing the damage of static electricity to the chip and effectively improving the reliability and stability of the fingerprint recognition module.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] An anti-static fingerprint recognition module, characterized in that the anti-static fingerprint recognition module includes an identification body and an FPC body, the identification body is electrically connected to the FPC body, the identification body includes a chip body and a cover plate, the cover plate is arranged on the upper surface of the chip body, the lower surface of the chip body is welded and connected to the FPC body, the periphery of the identification body is provided with a metal outer frame, the metal outer frame is in close contact with the cover plate, a bonding surface is provided on the lower surface of the metal outer frame, the bonding surface has a preset roughness, and the bonding surface is bonded and fixed to the FPC body through conductive silver paste.

[0007] As a preferred implementation of the anti-static fingerprint recognition module provided by the utility model, the preset roughness is 0.1-3.2.

[0008] As a preferred implementation of the anti-static fingerprint recognition module provided by the utility model, the preset roughness is 2.

[0009] As a preferred implementation of the anti-static fingerprint recognition module provided by the utility model, the metal outer frame is ring-shaped.

[0010] As a preferred embodiment of the anti-static fingerprint recognition module provided by the utility model, the metal outer frame includes a first contact ring surface arranged transversely in an annular shape and a second contact ring surface arranged longitudinally.

[0011] As a preferred implementation of the anti-static fingerprint recognition module provided by the utility model, the top of the second contact ring surface is 0.2 mm to 1 mm higher than the cover plate.

[0012] As a preferred embodiment of the anti-static fingerprint recognition module provided by the utility model, an avoidance gap is provided at the junction of the first contact ring surface and the second contact ring surface.

[0013] As a preferred implementation of the anti-static fingerprint recognition module provided by the utility model, a plurality of second heat dissipation fins are provided on the second contact ring surface.

[0014] As a preferred implementation of the anti-static fingerprint recognition module provided by the utility model, a plurality of first heat dissipation fins are provided on the first contact ring surface.

[0015] As a preferred implementation of the anti-static fingerprint recognition module provided by the utility model, the height of the first heat dissipation fin is smaller than the height of the second contact annular surface.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The utility model provides an anti-static fingerprint recognition module. Since the bonding surface on the lower surface of the metal outer frame has a preset roughness, the contact area of ​​the glue is increased, and the bonding effect of the glue is increased. At the same time, after the roughness of the bottom surface of the metal outer frame is increased, the heat dissipation area is increased, and its heat dissipation effect is increased. In addition, after the bottom surface of the metal outer frame is coated with conductive silver paste, it is contacted and bonded with the FPC body to fix it on the FPC body. When the finger carries static electricity, the static electricity is released to the FPC body through the metal outer frame and the conductive silver paste, reducing the damage of static electricity to the chip, and effectively improving the reliability and stability of the fingerprint recognition module.

[0018] In addition, an avoidance gap can be provided at the junction of the first contact ring surface and the second contact ring surface. By utilizing the avoidance gap, when the metal outer frame is bonded to the FPC body, the conductive silver paste can be effectively prevented from contacting the chip body and the cover plate, thereby preventing a short circuit. The reliability is good.

[0019] In addition, the second contact annular surface may be provided with a plurality of second heat sink fins. The first contact annular surface may be provided with a plurality of first heat sink fins. The height of the first heat sink fins is less than the height of the second contact annular surface. The first heat sink fins and the second heat sink fins may be used to effectively improve the heat dissipation performance of the metal outer frame, and the reliability and stability of the fingerprint recognition module may be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the structure of the anti-static fingerprint recognition module of the utility model;

[0022] Figure 2 for Figure 1 The schematic diagram of the structure of the anti-static fingerprint recognition module in FIG. 1 is another perspective;

[0023] Figure 3 for Figure 1 The schematic diagram of the structure of the anti-static fingerprint recognition module in FIG. 1 is another perspective;

[0024] Figure 4 for Figure 3 A detailed enlarged schematic diagram of area A of the anti-static fingerprint recognition module;

[0025] Figure 5 for Figure 3 A schematic diagram of the structure of the metal frame of the anti-static fingerprint recognition module;

[0026] Figure 6 for Figure 5 A schematic diagram of the structure of the metal frame of the anti-static fingerprint recognition module, from another perspective;

[0027] Figure 7 for Figure 5 A structural schematic diagram of another embodiment of the metal outer frame of the anti-static fingerprint recognition module;

[0028] Figure 8 for Figure 5 A structural schematic diagram of another embodiment of the metal outer frame of the antistatic fingerprint recognition module;

[0029] The markings in the figure are as follows: 1. Identification body; 11. Cover plate; 12. Chip body; 13. Conductive silver paste; 14. Metal frame; 141. Bonding surface; 142. First contact ring surface; 143. Second contact ring surface; 144. Avoidance gap; 145. Second heat sink fin; 146. First heat sink fin; 2. FPC body; S, preset roughness. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0031] As described in the background technology, in the prior art, for fingerprint modules, the chip, cover plate and other components of the fingerprint module are placed in a metal frame, and then the metal frame contacts the FPC through its bottom plane and is bonded with conductive silver paste. Since the surface of the FPC is generally treated with ink or exposed copper and is relatively smooth, the metal frame is easy to loosen or fall off, affecting the reliability of the fingerprint module.

[0032] In order to solve this technical problem, the utility model provides an anti-static fingerprint recognition module, comprising an identification body 1 and an FPC body 2, wherein the identification body 1 is electrically connected to the FPC body 2, the identification body 1 comprises a chip body 12 and a cover plate 11, the cover plate 11 is arranged on the upper surface of the chip body 12, the lower surface of the chip body 12 is welded to the FPC body 2, the periphery of the identification body 1 is provided with a metal outer frame 14, the metal outer frame 14 is in close contact with the cover plate 11, and a bonding surface 141 is provided on the lower surface of the metal outer frame 14, the bonding surface 141 has a preset roughness S, and the bonding surface 141 is bonded and fixed to the FPC body 2 through a conductive silver paste 13. The preset roughness S is 0.1 to 3.2. Preferably, the preset roughness S is 2.

[0033] Through the above structural design, since the bonding surface 141 on the lower surface of the metal outer frame 14 has a preset roughness S, the contact area of ​​the glue is increased, and the bonding effect of the glue is increased. At the same time, after the roughness of the bottom surface of the metal outer frame 14 is increased, the heat dissipation area is increased and its heat dissipation effect is increased. In addition, after the bottom surface of the metal outer frame 14 is coated with conductive silver paste 13, it is contacted and bonded with the FPC body 2 to fix it on the FPC body 2. When the finger carries static electricity, the static electricity is released to the FPC body 2 through the metal outer frame 14 and the conductive silver paste 13, reducing the damage of static electricity to the chip, and effectively improving the reliability and stability of the fingerprint recognition module.

[0034] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0035] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] like Figures 1 to 4 As shown, the anti-static fingerprint recognition module includes an identification body 1 and an FPC body 2, the identification body 1 is electrically connected to the FPC body 2, the identification body 1 includes a chip body 12 and a cover plate 11, the cover plate 11 is arranged on the upper surface of the chip body 12, the lower surface of the chip body 12 is welded to the FPC body 2, the periphery of the identification body 1 is provided with a metal outer frame 14, the metal outer frame 14 is in close contact with the cover plate 11, and a bonding surface 141 is provided on the lower surface of the metal outer frame 14, the bonding surface 141 has a preset roughness S, and the bonding surface 141 is bonded and fixed to the FPC body 2 through a conductive silver paste 13.

[0038] It should be noted that the preset roughness S is 0.1 to 3.2. Preferably, the preset roughness S is 2.

[0039] like Figure 5 As shown, the metal outer frame 14 is annular and includes an annular first contact annular surface 142 disposed transversely and a second contact annular surface 143 disposed longitudinally.

[0040] It should be noted that the top of the second contact annular surface 143 is higher than the cover plate by 110.2 mm to 1 mm.

[0041] The working mode of this embodiment is described below.

[0042] Since the bonding surface 141 on the lower surface of the metal outer frame 14 has a preset roughness S, the contact area of ​​the glue is increased, and the bonding effect of the glue is increased. At the same time, after the roughness of the bottom surface of the metal outer frame 14 is increased, the heat dissipation area is increased and its heat dissipation effect is increased. In addition, after the bottom surface of the metal outer frame 14 is coated with conductive silver paste 13, it is contacted and bonded with the FPC body 2 to fix it on the FPC body 2. When the finger carries static electricity, the static electricity is released to the FPC body 2 through the metal outer frame 14 and the conductive silver paste 13, reducing the damage of static electricity to the chip and effectively improving the reliability and stability of the fingerprint recognition module.

[0043] like Figure 6 As shown, the anti-static fingerprint recognition module provided in Example 1 is further optimized. Specifically, an avoidance notch 144 is provided at the junction of the first contact annular surface 142 and the second contact annular surface 143 .

[0044] The working mode of this embodiment is described below.

[0045] By utilizing the avoidance notch 144, when the metal outer frame 14 is bonded to the FPC body 2, the conductive silver paste 13 can be effectively prevented from contacting the chip body 12 and the cover plate 11, thereby preventing a short circuit.

[0046] like Figure 7 and Figure 8 As shown, the anti-static fingerprint recognition module provided by Embodiment 1 or 2 is further optimized. Specifically, a plurality of second heat dissipation fins 145 are provided on the second contact annular surface 143 .

[0047] A plurality of first heat dissipation fins 146 are disposed on the first contact annular surface 142 .

[0048] It should be noted that the height of the first heat dissipation fin 146 is smaller than the height of the second contact annular surface 143 .

[0049] The working mode of this embodiment is described below.

[0050] By using the first heat dissipation fins 146 and the second heat dissipation fins 145 , the heat dissipation performance of the metal outer frame 14 can be effectively improved, and the reliability and stability of the fingerprint recognition module can be effectively improved.

[0051] In addition, the transistor is a field effect transistor or a triode. When these crystals are field effect transistors, they can be N-type transistors (such as metal-oxide-semiconductor field effect transistors (N-Metal-Oxide-Semiconductor, NMOS)), or P-type metal-oxide-semiconductor field effect transistors, complementary metal-oxide-semiconductor field effect transistors, and other circuit structure types.

[0052] The terms "coupling" and "coupling" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. An anti-static fingerprint recognition module, characterized in that: The anti-static fingerprint recognition module comprises an identification body (1) and an FPC body (2), wherein the identification body (1) is electrically connected to the FPC body (2), wherein the identification body (1) comprises a chip body (12) and a cover plate (11), wherein the cover plate (11) is arranged on the upper surface of the chip body (12), and the lower surface of the chip body (12) is welded to the FPC body (2), and the periphery of the identification body (1) is provided with a metal outer frame (14), wherein the metal outer frame (14) is in close contact with the cover plate (11), and an adhesive surface (141) is provided on the lower surface of the metal outer frame (14), wherein the adhesive surface (141) has a preset roughness (S), and wherein the adhesive surface (141) is bonded and fixed to the FPC body (2) by means of a conductive silver paste (13).

2. The anti-static fingerprint recognition module according to claim 1, characterized in that: The preset roughness (S) is 0.1-3.

2.

3. The anti-static fingerprint recognition module according to claim 2, characterized in that: The preset roughness (S) is 2.

4. The anti-static fingerprint recognition module according to claim 1, characterized in that: The metal outer frame (14) is ring-shaped.

5. The anti-static fingerprint recognition module according to claim 4, characterized in that: The metal outer frame (14) comprises a first annular contact ring surface (142) arranged transversely and a second contact ring surface (143) arranged longitudinally.

6. The anti-static fingerprint recognition module according to claim 5, characterized in that: The top of the second contact annular surface (143) is higher than the cover plate (11) by 0.2 mm to 1 mm.

7. The anti-static fingerprint recognition module according to claim 5, characterized in that: An avoidance notch (144) is provided at the junction of the first contact annular surface (142) and the second contact annular surface (143).

8. The anti-static fingerprint recognition module according to claim 5, characterized in that: A plurality of second heat dissipation fins (145) are provided on the second contact annular surface (143).

9. The anti-static fingerprint recognition module according to claim 5, characterized in that: A plurality of first heat dissipation fins (146) are provided on the first contact annular surface (142).

10. The anti-static fingerprint recognition module according to claim 9, characterized in that: The height of the first heat dissipation fin (146) is smaller than the height of the second contact annular surface (143).

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