Precise BGA alignment structure for PCB resistance welding

Abstract

The utility model relates to an accurate BGA (ball grid array) alignment structure for PCB (printed circuit board) resistance welding. The accurate BGA alignment structure comprises a workbench, an X-axis sliding table, a Y-axis translation mechanism, a material sucking and transferring mechanism, an optical alignment device and a lower heating assembly, a shell of the material sucking and transferring mechanism is of an inverted-U-shaped structure, the inverted-U-shaped structure comprises a front side vertical shell and a rear side vertical shell, the top of the inverted-U-shaped structure is installed on an X-axis sliding table in a left-right sliding mode, and the X-axis sliding table is installed above the workbench in a front-back sliding mode through a Y-axis translation mechanism. The material sucking and transferring mechanism comprises a machine head, the machine head is arranged at the bottom of a front side vertical shell in a liftable mode, and a vertical line laser is arranged in the middle of the front side of the front side vertical shell. The beneficial effects of the utility model are that rapid alignment between the BGA chip and the corresponding bonding pad on the PCB can be realized, and the work efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA chip rework, and in particular to a PCB solder resist precision BGA alignment structure. Background Art

[0002] BGA (Ball Grid Array Package) is a packaging form that hides round or columnar solder joints under the package body. With the advancement of integration technology, BGA technology has developed rapidly, and high-density, high-performance, and high-frequency IC chips all use BGA packaging technology.

[0003] When repairing BGA chips, a BGA chip rework station is usually used to fix the PCB board to be mounted on the equipment fixture; the BGA chip is sucked up by heating the upper head and moving it downward; the welding position is adjusted and aligned through the optical system; because the sizes of PCB boards of different BGAs are different, the PCB board needs to be manually fixed on the BGA rework station, and the fixture position is adjusted so that the laser positioning point of the equipment is located at the center of the PCB pad. However, the existing technology is not convenient for quickly and accurately locking the position of the PCB board, so the efficiency is low and the human factor has a great influence.

[0004] Therefore, a PCB solder mask precise BGA alignment structure is proposed, which can facilitate the rapid alignment between the BGA chip and the corresponding pad on the PCB board, which is conducive to improving work efficiency. Utility Model Content

[0005] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a PCB solder mask precise BGA alignment structure, which can facilitate the rapid alignment between the BGA chip and the corresponding pad on the PCB board, thereby improving work efficiency.

[0006] The purpose of this utility model is achieved through the following technical solutions:

[0007] A PCB solder mask precision BGA alignment structure, comprising a workbench, an X-axis slide, a Y-axis translation mechanism, a material suction and transfer mechanism, an optical alignment device, and a lower heating assembly; the shell of the material suction and transfer mechanism is an inverted U-shaped structure, the inverted U-shaped structure comprises a front vertical shell and a rear vertical shell, the top of the inverted U-shaped structure can be slid left and right on the X-axis slide, the X-axis slide can be slid forward and backward on the top of the workbench through the Y-axis translation mechanism; the material suction and transfer mechanism comprises a machine head, the machine head can be raised and lowered, and the bottom of the front vertical shell is arranged A vertical line laser is provided in the middle of the front side of the front vertical shell; the machine head includes an upper heating component and a vacuum nozzle, and a horizontal line laser is provided in the middle of the right side of the front vertical shell, and the intersection of the lasers emitted by the vertical line laser and the horizontal line laser coincides with the center line of the vacuum nozzle; two clamping plates are provided on the workbench which can slide left and right, and the PCB board can be clamped on the workbench through the two clamping plates; the lower heating component can be installed under the two clamping plates which can be moved forward and backward, and the optical alignment device can be moved forward and backward on the rear vertical shell.

[0008] When fixing the PCB board, clamp the PCB board between the two clamping plates, and move the two clamping plates left and right so that the laser line emitted by the vertical line laser is located in the middle of the PCB pad, and then fix the two clamping plates to quickly achieve the rough positioning of the PCB board in the X-axis direction. In addition, in this solution, the Y-axis translation mechanism can be driven by a non-self-locking motor, and the X-axis slide table is driven by a self-locking motor. After the PCB board is roughly positioned in the X-axis direction, the operator can pull the suction and transfer mechanism to move forward and backward so that the laser line emitted by the horizontal line laser is located in the middle of the PCB pad, achieving the rough positioning of the PCB board in the Y-axis direction.

[0009] In a preferred embodiment of the present scheme, two longitudinal sliding bars are also parallelly provided on the workbench, and the longitudinal sliding bars are parallel to the Y-axis; the lower heating assembly is slidably installed on the two longitudinal sliding bars, the rear side of the lower heating assembly is connected to the rear vertical shell, and the lower heating assembly is arranged relative to the machine head up and down.

[0010] In a preferred embodiment of the present solution, another transverse line laser is provided in the middle of the left side of the front vertical shell, and the lasers emitted by the two transverse line lasers are located in the same plane.

[0011] In a preferred embodiment of the present scheme, a transverse sliding bar is provided at the front and rear sides of the workbench respectively; the front and rear ends of the clamping plate are respectively mounted on the two transverse sliding bars through sliders 1 and 2; a locking clamp is provided on the left side of the slider 1, and a fastening nut 1 is provided on the ear plate of the locking clamp. When the fastening nut 1 is tightened, the slider 1 can be fixed on the transverse sliding bar through the fastening nut 1.

[0012] In a preferred embodiment of the present solution, the Y-axis translation mechanism includes two Y-axis slides, and the Y-axis slides are mounted above the workbench through a support frame.

[0013] In a preferred embodiment of the present scheme, a push-pull handle is provided on the front side of the material suction and transfer mechanism to facilitate manual movement of the material suction and transfer mechanism forward and backward.

[0014] In a preferred embodiment of the present scheme, the BGA alignment structure also includes a plurality of clamping rods, a strip-shaped through hole is opened in the middle of the clamping rod; a strip-shaped slide groove is provided in the middle of the clamping plate, a plurality of sliders are provided in the strip-shaped slide groove, and the sliders are equipped with fastening nuts, which can be passed downward through the strip-shaped through hole and then screwed onto the slider; a clamping portion is provided at the inner end of the clamping rod.

[0015] In a preferred embodiment of the present scheme, the BGA alignment structure also includes two groups of abutment components arranged on the front and rear sides of the platform; the abutment components include a first rod and a second rod hinged at their ends, and strip-shaped through holes are respectively opened in the middle of the first rod and the middle of the second rod; the first rod is provided with a step-like structure at one end adjacent to the hinge point; the first rod and the second rod are clamped on the clamping plate at one end away from the hinge point by a group of fastening nuts and sliders respectively.

[0016] The beneficial effects of the utility model are:

[0017] In this solution, the material suction and transfer mechanism can be installed on the X-axis slide table so as to slide left and right. The X-axis slide table can be installed above the workbench so as to slide forward and backward through the Y-axis translation mechanism. The PCB board can be clamped on the workbench through two clamping plates and located below the machine head. A vertical line laser and a horizontal line laser are provided on the material suction and transfer mechanism. The intersection point of the lasers emitted by the vertical line laser and the horizontal line laser coincides with the center line of the vacuum suction nozzle. When fixing the PCB board, the PCB board is clamped between the two clamping plates and the two clamping plates are moved left and right so that the laser lines emitted by the vertical line laser are located on the PCB. The middle of the PCB pad is fixed with two clamping plates to achieve the rough positioning of the PCB board in the X-axis direction; then, the operator pulls the suction and transfer mechanism to move forward and backward so that the laser line emitted by the horizontal line laser is located in the middle of the PCB pad, and the rough positioning of the PCB board in the Y-axis direction can be achieved. Therefore, this scheme can quickly achieve the preliminary positioning and installation of the PCB board, and there is no need to repeatedly adjust the front and back, left and right positions of the PCB and then fix and clamp it at one time. The operation is simple and fast, which is convenient for realizing the rapid alignment between the BGA chip and the corresponding pad on the PCB board, and is conducive to improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the utility model. DETAILED DESCRIPTION

[0019] The technical solution of the present utility model is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present utility model is not limited to the following.

[0020] like Figure 1 As shown, a PCB solder mask precision BGA alignment structure includes a workbench 1, an X-axis slide 201, a Y-axis translation mechanism, a material suction and transfer mechanism, an optical alignment device, and a lower heating component 6; the material suction and transfer mechanism can be slidably installed on the X-axis slide 201, and the X-axis slide 201 can be slidably installed above the workbench 1 front and back through the Y-axis translation mechanism, the material suction and transfer mechanism includes a head 3, the head 3 includes an upper heating component, a vacuum suction nozzle 301, and the vacuum suction nozzle 301 is arranged in the middle of the bottom end of the head 3, and two clamping plates 5 are slidably provided on the workbench 1, and the two clamping plates 5 are arranged in parallel, and the PCB board can be clamped on the workbench 1 through the two clamping plates 5; the BGA chip can be sucked up by heating the head 3 and moving downward.

[0021] At the same time, the material suction and transfer mechanism also includes a vertical line laser 401 and a horizontal line laser 402. The intersection of the lasers emitted by the vertical line laser 401 and the horizontal line laser 402 coincides with the center line of the vacuum nozzle 301. Therefore, this solution can clamp and position the PCB board through the lasers emitted by the vertical line laser 401 and the horizontal line laser 402.

[0022] More specifically, in this embodiment, the housing of the material suction and transfer mechanism is an inverted U-shaped structure, which includes a front vertical housing and a rear vertical housing. The top of the inverted U-shaped structure can be slid left and right on the X-axis slide 201; the head 3 can be raised and lowered at the bottom of the front vertical housing, and a vertical line laser 401 is provided in the middle of the front side of the front vertical housing; a horizontal line laser 402 is provided in the middle of the right side of the front vertical housing, the lower heating assembly 6 can be movably installed under the two clamping plates 5, and the optical alignment device can be movably installed on the rear vertical housing.

[0023] During the PCB solder mask process, the PCB board is clamped between the two clamping plates 5, and the two clamping plates 5 are moved left and right so that the laser line emitted by the vertical line laser 401 is located in the middle of the PCB board pad, and then the two clamping plates are locked, and the position of the PCB board in the X-axis direction can be preliminarily determined; then, the suction and transfer mechanism is pulled forward and backward to make the laser line emitted by the horizontal line laser 402 located in the middle of the PCB board pad, and the position of the PCB board in the Y-axis direction can be preliminarily determined, and thus this solution can quickly realize the preliminary positioning of the PCB board.

[0024] Furthermore, in the present embodiment, two longitudinal slide bars 7 are provided in parallel on the workbench 1, and the longitudinal slide bars 7 are parallel to the Y-axis; the lower heating assembly 6 is slidably mounted on the two longitudinal slide bars 7, and the rear side of the lower heating assembly 6 is connected to the rear vertical shell, and the lower heating assembly 6 and the machine head 3 are arranged opposite to each other up and down.

[0025] In this embodiment, a transverse slide bar 8 is respectively provided on the front and rear sides of the workbench 1; the front and rear ends of the clamp plate 5 are slidably installed on the two transverse slide bars 8 through sliders 1 and 2 respectively; a locking clamp 901 is provided on the left side of the slider 1, and a fastening nut 1 902 is provided on the ear plate of the locking clamp 901. The slider 1 9 can be locked on the transverse slide bar 8 by tightening the fastening nut 1 902.

[0026] In this embodiment, the rear transverse slide bar 8 includes two slide bar sections arranged on the same straight line. The two slide bar sections are respectively installed on the workbench 1 through a group of support seats so that there is a certain distance between the two slide bar sections to avoid the lower heating component 6.

[0027] Furthermore, in this solution, a push-pull handle 12 is provided on the front side of the material suction and transfer mechanism to facilitate manual movement of the material suction and transfer mechanism forward and backward; the Y-axis translation mechanism includes two Y-axis slides 202, and the Y-axis slides 202 are mounted above the workbench 1 through a support frame.

[0028] Optionally, in this embodiment, another horizontal line laser 402 (not shown in the figure) is provided in the middle of the left side of the front vertical shell. The lasers emitted by the two horizontal line lasers 402 are located in the same plane, so as to extend the horizontal laser lines and facilitate accurate and rapid positioning of the PCB board on the Y-axis.

[0029] Furthermore, in the present embodiment, the BGA alignment structure also includes a plurality of clamping rods 11, a strip-shaped through hole is provided in the middle of the clamping rod 11; a strip-shaped slide groove is provided in the middle of the clamping plate 5, a plurality of sliders are provided in the strip-shaped slide groove, and the sliders are equipped with fastening nuts, which can be passed downward through the strip-shaped through hole and then screwed onto the sliders; a clamping portion 1101 is provided at the inner end of the clamping rod 11, and the clamping portion 1101 is a stepped structure for supporting and clamping the PCB board.

[0030] In this embodiment, a plurality of control buttons are provided on the front of the workbench 1, including a power button, two buttons for controlling the switches of the vertical line laser 401 and the horizontal line laser 402, and buttons for independently adjusting the movement of the X-axis slide 201 and the Y-axis slide 202; wherein, during operation, when the optical alignment device is used for precise alignment, precise alignment adjustment can be performed by adjusting the buttons for moving the X-axis slide 201 and the Y-axis slide 202; the machine head 3, the optical alignment device, and the upper and lower heating components are all common structures in BGA rework equipment and will not be elaborated in detail in this scheme.

[0031] Further optionally, in the present embodiment, the BGA alignment structure also includes two groups of abutment components arranged on the front and rear sides of the platform; the abutment components include a first rod 1301 and a second rod 1302 which are hinged at their ends, and a strip through hole is respectively provided in the middle of the first rod 1301 and the middle of the second rod 1302; the first rod 1301 has a step-like structure at one end adjacent to the hinge point; the first rod 1301 and the second rod 1302 are respectively clamped on the clamping plate 5 at one end away from the hinge point by a group of fastening nuts and a slider, and the front and rear ends of the PCB can be tightened by the two groups of abutment components, so that the fixation of the PCB board is more stable.

[0032] The above is only a preferred embodiment of the utility model. It should be understood that the utility model is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not deviate from the spirit and scope of the utility model, and should be within the scope of protection of the claims attached to the utility model.

Claims

1. A PCB solder mask precision BGA alignment structure, characterized by: It comprises a workbench (1), an X-axis slide table (201), a Y-axis translation mechanism, a material suction and transfer mechanism, an optical alignment device, and a lower heating component (6); The housing of the material suction and transfer mechanism is an inverted U-shaped structure, which includes a front vertical housing and a rear vertical housing. The top of the inverted U-shaped structure can be slid left and right on an X-axis slide table (201), and the X-axis slide table (201) can be slid forward and backward on the top of the workbench (1) through a Y-axis translation mechanism. The material suction and transfer mechanism comprises a machine head (3), the machine head (3) is movably arranged at the bottom of the front vertical shell, and a vertical line laser (401) is arranged in the middle of the front side of the front vertical shell; The machine head (3) comprises an upper heating component and a vacuum suction nozzle (301), and a transverse line laser (402) is provided in the middle of the right side of the front vertical shell, and the intersection point of the lasers emitted by the vertical line laser (401) and the transverse line laser (402) coincides with the center line of the vacuum suction nozzle (301); The workbench (1) is provided with two clamping plates (5) which can slide left and right, and the PCB board can be clamped on the workbench (1) via the two clamping plates (5); The lower heating assembly (6) is installed below the two clamping plates (5) so as to be movable forward and backward, and the optical alignment device is installed on the rear vertical housing so as to be movable forward and backward.

2. A PCB solder mask precision BGA alignment structure according to claim 1, characterized in that: The workbench (1) is also provided with two longitudinal slide bars (7) in parallel, and the longitudinal slide bars (7) are parallel to the Y axis; The lower heating assembly (6) is slidably mounted on two longitudinal slide bars (7), the rear side of the lower heating assembly (6) is connected to the rear vertical shell, and the lower heating assembly (6) and the machine head (3) are arranged opposite to each other up and down.

3. A PCB solder mask precision BGA alignment structure according to claim 1, characterized in that: Another transverse line laser (402) is also provided in the middle of the left side of the front vertical shell, and the lasers emitted by the two transverse line lasers (402) are located in the same plane.

4. A PCB solder mask precision BGA alignment structure according to any one of claims 2 or 3, characterized in that: The workbench (1) is provided with a transverse sliding rod (8) on the front and rear sides respectively; The front and rear ends of the clamping plate (5) are respectively mounted on two transverse sliding bars (8) via a sliding block 1 (9) and a sliding block 2; The left side of the slider 1 (9) is provided with a locking hoop (901), and the ear plate of the locking hoop (901) is provided with a fastening nut 1 (902).

5. The PCB solder mask precision BGA alignment structure according to claim 1, characterized in that: The Y-axis translation mechanism comprises two Y-axis slides (202), and the Y-axis slides (202) are mounted above the workbench (1) via a support frame.

6. The PCB solder mask precision BGA alignment structure according to claim 1, characterized in that: A push-pull handle (12) is provided on the front side of the material suction and transfer mechanism to facilitate manual movement of the material suction and transfer mechanism forward and backward.

7. The PCB solder mask precision BGA alignment structure according to claim 1, characterized in that: The BGA alignment structure further comprises a plurality of clamping rods (11), and a strip-shaped through hole is provided in the middle of the clamping rods (11); A strip-shaped slide groove is provided in the middle of the clamping plate (5), a plurality of slide blocks are provided in the strip-shaped slide groove, and the slide blocks are equipped with fastening nuts, which can pass through the strip-shaped through holes downwards and then be screwed onto the slide blocks; The inner end of the clamping rod (11) is provided with a clamping portion (1101).

8. A PCB solder mask precision BGA alignment structure according to claim 7, characterized in that: The BGA alignment structure also includes two sets of abutment components arranged on the front and rear sides of the platform; The abutment assembly comprises a first rod (1301) and a second rod (1302) whose ends are hinged, and a strip-shaped through hole is respectively provided in the middle of the first rod (1301) and the middle of the second rod (1302); The first rod (1301) has a step-shaped structure at one end thereof adjacent to the hinge point; The ends of the first rod (1301) and the second rod (1302) away from the hinge point are clamped on the clamping plate (5) through a set of fastening nuts and a sliding block respectively.

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