Bending device for copper heat dissipation substrate production

Abstract

The utility model relates to the technical field of bending devices, in particular to a bending device for producing a copper heat dissipation substrate, which comprises a bottom plate, a supporting seat fixedly connected onto the bottom plate, a bending structure arranged on the supporting seat, a positioning structure arranged on the bottom plate, two connecting rods connected onto the bending structure, a guide shaft fixedly connected onto the connecting rods, and a positioning structure arranged on the positioning structure. Two sliding plates are slidably connected to the bottom plate, a vertical plate is fixedly connected to the sliding plates, a guide groove is formed in the vertical plate, a guide shaft penetrates through the guide groove and is slidably connected with the vertical plate, a connecting plate is fixedly connected to the vertical plate, two sliding columns are slidably connected to the connecting plate, and one ends of the two sliding columns are fixedly connected with the same positioning plate. The sliding columns are sleeved with reset springs, and a lower module is installed on the bottom plate. The copper heat dissipation substrate can be positioned before being bent, the situation that the position of the copper heat dissipation substrate deviates and inclines before being bent is avoided, and therefore the machining accuracy is effectively improved.

Description

Technical Field

[0001] The utility model relates to a bending device, in particular to a bending device for producing a copper heat dissipation substrate, belonging to the technical field of bending devices. Background Art

[0002] Copper is a metal material. Due to its high thermal conductivity, its heat dissipation performance is better than other metals, so it is widely used in the field of heat dissipation. In the production process of copper heat dissipation substrates, they need to be bent by a bending device.

[0003] However, the traditional bending device requires the copper heat dissipation substrate to be manually placed on the bending device before bending. Manual placement may cause the position of the substrate to be offset and skewed after placement, which will affect the quality of the copper heat dissipation substrate after bending and result in low processing accuracy. Utility Model Content

[0004] The purpose of the utility model is to provide a bending device for the production of copper heat dissipation substrates in order to solve the above-mentioned problems. The device can position the copper heat dissipation substrate before bending it, thereby avoiding position displacement and skewness of the copper heat dissipation substrate before bending, thereby effectively improving the processing accuracy.

[0005] The utility model achieves the above-mentioned purpose through the following technical scheme: a bending device for producing copper heat dissipation substrates, including a base plate, a support seat fixedly connected to the base plate, a bending structure provided on the support seat, a positioning structure provided on the base plate, and the positioning structure including a connecting rod and a guide shaft, two connecting rods are connected to the bending structure, the connecting rod is fixedly connected to the guide shaft, two slides are slidably connected to the base plate, a vertical plate is fixedly connected to the slide plate, a guide groove is provided on the vertical plate, the guide shaft passes through the guide groove and is slidably connected to the vertical plate, a connecting plate is fixedly connected to the vertical plate, two sliding columns are slidably connected to the connecting plate, one end of the two sliding columns is fixedly connected to the same positioning plate, a reset spring is provided on the outer sleeve of the sliding column, and a lower module is installed on the base plate.

[0006] Preferably, one end of the return spring abuts against the positioning plate, and the other end of the return spring abuts against the connecting plate.

[0007] Preferably, the two sliding posts are symmetrically distributed about the middle of the positioning plate, and a cross-section of one end of the sliding post is a T-shaped structure.

[0008] Preferably, the connecting plate is perpendicular to the vertical plate, and the vertical plate is perpendicular to the sliding plate.

[0009] Preferably, both ends of the guide groove are vertically arranged, and the middle portion of the guide groove is in a V-shaped structure.

[0010] Preferably, the two slide plates are symmetrically distributed about the middle of the bottom plate, and the end of the cross section of the support seat is L-shaped.

[0011] Preferably, the bending structure includes a hydraulic cylinder and a movable plate, the hydraulic cylinder is installed on the top of the support seat, the bottom end of the hydraulic cylinder is fixedly connected to the movable plate, four guide columns are fixedly connected to the support seat, the four guide columns are slidably connected to the movable plate, and a pressure block is installed at the bottom end of the movable plate.

[0012] Preferably, two connecting rods are fixedly connected to the movable plate, and the two connecting rods are symmetrically distributed about the middle part of the movable plate.

[0013] Preferably, the cross-section of the bottom end of the pressing block is V-shaped, and the pressing block is located directly above the lower module.

[0014] The beneficial effect of the utility model is that when the copper heat dissipation substrate needs to be bent, the copper heat dissipation substrate can be placed on the top of the lower module, and then the bending structure will move toward the copper heat dissipation substrate, and during the movement of the bending structure, the two connecting rods will be driven to move together, and the movement of the connecting rod will drive the guide shaft to move inside the guide groove, and when the guide shaft moves in the upper V-shaped part in the middle of the guide groove, the vertical plate will move toward the copper heat dissipation substrate, and the movement of the vertical plate will cause the slide plate to slide inside the bottom plate, and at the same time, the connecting plate will move toward the copper heat dissipation substrate, and the movement of the connecting plate will cause the positioning plate to move toward the copper heat dissipation substrate, so that the two positioning plates can be bent to the copper heat dissipation substrate The interference positioning avoids the copper heat dissipation substrate from being skewed and offset during bending, thereby improving the processing accuracy. During the positioning process, if the size of the copper heat dissipation substrate is slightly larger, the positioning plate will drive the two slide columns to slide on the connecting plate, and the reset spring will contract, thereby avoiding the copper heat dissipation substrate from being clamped and damaged, effectively improving the safety of use. When the guide shaft moves in the V-shaped lower part of the guide groove, the two positioning plates will move away from the copper heat dissipation substrate, so that the two positioning plates will not resist the copper heat dissipation substrate during the bending process, so that the bending work of the copper heat dissipation substrate can proceed smoothly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 for Figure 1 An enlarged schematic diagram of part A is shown;

[0017] Figure 3 It is a schematic diagram of the connection structure between the bottom plate and the slide plate of the utility model;

[0018] Figure 4This is a schematic diagram of the connection structure between the connecting rod and the movable plate of the utility model;

[0019] Figure 5 It is a schematic diagram of the connection structure of the connecting rod and the guide shaft of the utility model.

[0020] In the figure: 1. bottom plate; 2. support seat; 3. bending structure; 301. hydraulic cylinder; 302. moving plate; 303. guide column; 304. pressure block; 4. positioning structure; 401. connecting rod; 402. guide shaft; 403. guide groove; 404. vertical plate; 405. slide plate; 406. connecting plate; 407. positioning plate; 408. slide column; 409. return spring; 5. lower module. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, a bending device for producing a copper heat dissipation substrate comprises a base plate 1, a support seat 2 is fixedly connected to the base plate 1, a bending structure 3 is provided on the support seat 2, a positioning structure 4 is provided on the base plate 1, and the positioning structure 4 comprises a connecting rod 401 and a guide shaft 402, two connecting rods 401 are connected to the bending structure 3, and the connecting rod 401 is fixedly connected to the guide shaft 402, two slide plates 405 are slidably connected to the base plate 1, a vertical plate 404 is fixedly connected to the slide plate 405, a guide groove 403 is provided on the vertical plate 404, the guide shaft 402 passes through the guide groove 403 and is slidably connected to the vertical plate 404, a connecting plate 406 is fixedly connected to the vertical plate 404, two sliding columns 408 are slidably connected to the connecting plate 406, one end of the two sliding columns 408 is fixedly connected to the same positioning plate 407, and a return spring 409 is sleeved on the outside of the sliding column 408, and a lower module 5 is installed on the base plate 1.

[0023] As a technical optimization solution of the utility model, Figure 2As shown, one end of the return spring 409 abuts against the positioning plate 407, and the other end of the return spring 409 abuts against the connecting plate 406. The two sliding posts 408 are symmetrically distributed about the middle of the positioning plate 407, and the cross-section of one end of the sliding post 408 is a T-shaped structure, so that the sliding post 408 and the connecting plate 406 can be prevented from being separated under the action of the elastic force of the return spring 409.

[0024] As a technical optimization solution of the utility model, Figure 2 and Figure 3 As shown, the two slide plates 405 are symmetrically distributed about the middle part of the base plate 1, the end of the cross section of the support seat 2 is L-shaped, the connecting plate 406 is perpendicular to the vertical plate 404, the vertical plate 404 is perpendicular to the slide plate 405, the two ends of the guide groove 403 are vertically arranged, and the middle part of the guide groove 403 is V-shaped. Therefore, when the guide shaft 402 moves at the V-shaped structure in the middle of the guide groove 403, the two positioning plates 407 can move toward the copper heat dissipation substrate to realize the positioning of the copper heat dissipation substrate.

[0025] As a technical optimization solution of the utility model, Figure 1 , Figure 3 and Figure 4 As shown, the bending structure 3 includes a hydraulic cylinder 301 and a movable plate 302, the hydraulic cylinder 301 is installed on the top of the support seat 2, the bottom end of the hydraulic cylinder 301 is fixedly connected to the movable plate 302, four guide columns 303 are fixedly connected to the support seat 2, the four guide columns 303 are slidingly connected to the movable plate 302, a pressing block 304 is installed at the bottom end of the movable plate 302, two connecting rods 401 are fixedly connected to the movable plate 302, the two connecting rods 401 are symmetrically distributed about the middle of the movable plate 302, the cross-section of the bottom end of the pressing block 304 is a V-shaped structure, and the pressing block 304 is located directly above the lower module 5, so that the copper heat dissipation substrate can be bent.

[0026] When the utility model is in use, when the copper heat dissipation substrate needs to be bent, the copper heat dissipation substrate can be placed on the top of the lower module 5, and by starting the hydraulic cylinder 301, the extension of the hydraulic cylinder 301 will drive the movable plate 302 to move, and the four guide columns 303 play a role in guiding the movable plate 302. The movement of the movable plate 302 will drive the pressing block 304 to move toward the copper heat dissipation substrate. At the same time, during the movement of the movable plate 302, the two connecting rods 401 will be driven to move together. The movement of the connecting rod 401 will drive the guide shaft 402 to move inside the guide groove 403. When the guide shaft 402 moves in the upper V-shaped part in the middle of the guide groove 403, the vertical plate 404 will move toward the copper heat dissipation substrate. The movement of the vertical plate 404 will cause the slide plate 405 to slide inside the bottom plate 1, and at the same time, the connecting plate 406 will move toward the copper heat dissipation substrate. The movement of the connecting plate 406 will cause the positioning plate 407 to move toward the copper heat dissipation substrate. , so that the two positioning plates 407 can resist and position the copper heat dissipation substrate, avoiding the situation that the copper heat dissipation substrate is skewed and offset during bending, thereby improving the processing accuracy. During the positioning process, if the size of the copper heat dissipation substrate is slightly larger, the positioning plates 407 will drive the two sliding columns 408 to slide on the connecting plate 406, and the return spring 409 will contract, thereby avoiding the situation that the copper heat dissipation substrate is clamped and damaged, effectively improving the safety of use. When the guide shaft 402 moves in the lower V-shaped part of the middle part of the guide groove 403, the two positioning plates 407 will move away from the copper heat dissipation substrate, so that the two positioning plates 407 can not resist the copper heat dissipation substrate during the bending process, so that the bending work of the copper heat dissipation substrate can proceed smoothly. Next, the hydraulic cylinder 301 continues to extend to make the pressing block 304 resist the copper heat dissipation substrate to achieve the bending of the copper heat dissipation substrate.

[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A bending device for producing a copper heat dissipation substrate, comprising a bottom plate (1), characterized in that: The bottom plate (1) is fixedly connected to a support seat (2), the support seat (2) is provided with a bending structure (3), the bottom plate (1) is provided with a positioning structure (4), the positioning structure (4) comprises a connecting rod (401) and a guide shaft (402), the bending structure (3) is connected to two connecting rods (401), the connecting rod (401) is fixedly connected to the guide shaft (402), the bottom plate (1) is slidably connected to two slide plates (405), the slide plates (405) are fixedly connected to a vertical plate (404), The vertical plate (404) is provided with a guide groove (403), the guide shaft (402) passes through the guide groove (403) and is slidably connected to the vertical plate (404), the vertical plate (404) is fixedly connected with a connecting plate (406), the connecting plate (406) is slidably connected with two sliding columns (408), one end of the two sliding columns (408) is fixedly connected with the same positioning plate (407), the outer sleeve of the sliding column (408) is provided with a return spring (409), and the bottom plate (1) is installed with a lower module (5).

2. A bending device for producing a copper heat dissipation substrate according to claim 1, characterized in that: One end of the return spring (409) abuts against the positioning plate (407), and the other end of the return spring (409) abuts against the connecting plate (406).

3. A bending device for producing a copper heat dissipation substrate according to claim 1, characterized in that: The two sliding columns (408) are symmetrically distributed about the middle of the positioning plate (407), and the cross-section of one end of the sliding column (408) is a T-shaped structure.

4. A bending device for producing a copper heat dissipation substrate according to claim 1, characterized in that: The connecting plate (406) is perpendicular to the vertical plate (404), and the vertical plate (404) is perpendicular to the sliding plate (405).

5. A bending device for producing a copper heat dissipation substrate according to claim 1, characterized in that: Both ends of the guide groove (403) are arranged vertically, and the middle part of the guide groove (403) is in a V-shaped structure.

6. A bending device for producing a copper heat dissipation substrate according to claim 1, characterized in that: The two slide plates (405) are symmetrically distributed about the middle of the bottom plate (1), and the end of the cross section of the support seat (2) is in an L-shaped structure.

7. A bending device for producing a copper heat dissipation substrate according to claim 1, characterized in that: The bending structure (3) comprises a hydraulic cylinder (301) and a movable plate (302); the hydraulic cylinder (301) is installed at the top of the support seat (2); the movable plate (302) is fixedly connected to the bottom of the hydraulic cylinder (301); four guide columns (303) are fixedly connected to the support seat (2); the four guide columns (303) are slidably connected to the movable plate (302); and a pressure block (304) is installed at the bottom of the movable plate (302).

8. A bending device for producing a copper heat dissipation substrate according to claim 7, characterized in that: Two connecting rods (401) are fixedly connected to the movable plate (302), and the two connecting rods (401) are symmetrically distributed about the middle of the movable plate (302).

9. A bending device for producing a copper heat dissipation substrate according to claim 7, characterized in that: The cross-section of the bottom end of the pressing block (304) is in a V-shaped structure, and the pressing block (304) is located directly above the lower module (5).

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