Cleaning structure for grinding silicon wafer

Abstract

The utility model belongs to the technical field of silicon wafer cleaning, and discloses a cleaning structure for grinding a silicon wafer, which comprises a water tank, a driving structure, a cleaning structure, a bearing structure and a water conveying structure, and is characterized in that a stand column and a lower fixing plate are arranged at the top of the water tank, the driving structure is arranged on the stand column, an upper fixing plate is arranged on the driving structure, and the lower fixing plate is arranged on the upper fixing plate. The cleaning structures are arranged between the lower fixing plates and between the upper fixing plates, the bearing structure is movably arranged on the stand columns between the lower fixing plates and the upper fixing plates, and the water conveying structure is arranged on the outer wall of the water tank and sprays water to the cleaning structures through the water conveying structure. Water flow is injected into the inner cavities of the upper fixing plate and the lower fixing plate through the water conveying structure, the water flow is sprayed out from the nozzles on the inner walls of the upper fixing plate and the lower fixing plate, water is sprayed to the surfaces of the upper side and the lower side of the silicon wafer, the surfaces of the two sides of the silicon wafer are cleaned at the same time, and the cleaning efficiency of the silicon wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a cleaning structure for grinding silicon wafers. Background Art

[0002] In existing semiconductor technology, silicon wafers are an important material for making integrated circuits. Various semiconductor devices can be made through photolithography, ion implantation and other methods.

[0003] During the silicon wafer processing, the surface of the silicon wafer needs to be ground. In order to improve the cleanliness of the silicon wafer surface after grinding, the silicon wafer needs to be cleaned. After searching, the Chinese patent publication number CN206742270U discloses a solar silicon wafer cleaning rack, which mainly fixes and limits the silicon wafers placed on the special cleaning rack to avoid collision and damage to the silicon wafers during cleaning. The special cleaning rack equipped with silicon wafers in the above patent is placed in a cleaning machine. When the silicon wafers are rinsed, when the water flows between two silicon wafers, the water flows in one direction, which will cause the two adjacent silicon wafers to attract each other and stick together, affecting the cleaning of the silicon wafers and easily causing damage to the silicon wafers. In addition, the two sides of the silicon wafer cannot be cleaned at the same time, which reduces the cleaning efficiency of the silicon wafer. Utility Model Content

[0004] The utility model aims to provide a cleaning structure for polished silicon wafers with reasonable structural design, in which each silicon wafer is placed separately, and which can clean both sides of the silicon wafer at the same time and has high cleaning efficiency, in order to solve the problems of existing silicon wafer cleaning devices that silicon wafers are easily adsorbed together during the cleaning process, two sides of the silicon wafer cannot be cleaned simultaneously, and the cleaning efficiency is low.

[0005] The technical solution adopted by the utility model to solve the technical problem is:

[0006] A cleaning structure for grinding silicon wafers comprises a water tank, a driving structure, a cleaning structure, a bearing structure and a water delivery structure. A column and a lower fixed plate are arranged on the top of the water tank. The driving structure is arranged on the column, and an upper fixed plate is arranged on the driving structure. The cleaning structure is arranged between the lower fixed plate and the upper fixed plate respectively, and between the upper fixed plate and the upper fixed plate. The bearing structure is movably arranged on the column between the lower fixed plate and the upper fixed plate. The water delivery structure is arranged on the outer wall of the water tank, and the water delivery structure sprays water onto the cleaning structure.

[0007] Preferably, a transversely structured adsorption layer is provided in the water tank, and the adsorption layer can adsorb impurities in the water tank to prevent the impurities from being sucked out and sprayed onto the surface of the silicon wafer during the circulation of water, thereby improving the cleaning effect of the silicon wafer.

[0008] Preferably, the driving structure includes a top plate, a hydraulic cylinder, and a connecting plate. The top plate is arranged on the top of the column, the hydraulic cylinder is arranged on the top plate, a piston rod is arranged on the hydraulic cylinder, the connecting plate is connected with the piston rod, and an upper fixed plate is arranged on the connecting plate. The hydraulic cylinder and the piston rod push the connecting plate and the upper fixed plate on the connecting plate to move downward, so that the upper fixed plate drives the cleaning structure to move downward, and the cleaning structure between the upper fixed plates cleans the upper surface of the silicon wafer. The cleaning structure between the upper fixed plates pushes the silicon wafer and the supporting plate to descend, so that the bottom surface of the silicon wafer contacts the lower fixed plate and the cleaning structure between the lower fixed plate, and the bottom surface of the silicon wafer is cleaned, thereby achieving the purpose of cleaning the upper and lower surfaces of the silicon wafer at the same time, and improving the cleaning efficiency and cleaning effect of the silicon wafer.

[0009] Preferably, the upper fixed plate and the lower fixed plate are both provided with inner cavities, and nozzles and water pipes connected with the inner cavities are respectively provided on both sides of the upper fixed plate and the lower fixed plate, and bearings are provided on the side walls of the upper fixed plate and the lower fixed plate where the nozzles are located, and the water pipes are connected with the water delivery structure, and the water delivery structure injects water into the inner cavities of the upper fixed plate and the lower fixed plate respectively, and the water is sprayed from the nozzles on the inner walls of the upper fixed plate and the lower fixed plate respectively, and water is sprayed on the upper and lower surfaces of the silicon wafer to clean the surfaces of both sides of the silicon wafer at the same time, thereby improving the cleaning efficiency of the silicon wafer.

[0010] Preferably, the cleaning structure includes a motor, a rotating roller, and a conveyor belt. The motor is respectively arranged on the upper fixed plate and the lower fixed plate. Connecting shafts are arranged at both ends of the rotating roller. The connecting shafts are inserted into bearings on the upper fixed plate and the lower fixed plate. The conveyor belt is arranged between the rotating rollers, and a cleaning layer is arranged on the conveyor belt. The motor drives the rotating roller to rotate, and the rotating roller drives the conveyor belt and the cleaning layer on the conveyor belt to rotate, so that the cleaning layer can clean the upper and lower surfaces of the silicon wafer at the same time, thereby improving the cleaning efficiency of the silicon wafer.

[0011] Preferably, the rotation direction of the conveyor belt between the upper fixed plate and the upper fixed plate is set in the opposite direction to the rotation direction of the conveyor belt between the lower fixed plate and the lower fixed plate, and a leakage hole is set on the conveyor belt. The conveyor belts of the cleaning structure on the upper and lower sides of the silicon wafer rotate in the opposite direction, so that the conveyor belts on the upper and lower sides of the silicon wafer can clean both sides of the silicon wafer at the same time. The water after cleaning the silicon wafer carries impurities and flows into the water tank through the leakage hole on the conveyor belt, thereby realizing the recycling of water and reducing water waste.

[0012] Preferably, a filtering structure is arranged between the upper and lower fixed plates, the filtering structure comprises a bearing shaft and a filter membrane, two ends of the bearing shaft are inserted into bearings on the lower fixed plate, a driven wheel is arranged on a bearing shaft, two ends of the filter membrane are respectively placed on the bearing shaft, a driving wheel is arranged on the connecting shaft of the rotating roller, and the driving wheel is connected to the driven wheel through a belt, during the operation of the cleaning structure between the upper and lower fixed plates, a motor drives the rotating roller to rotate, the driving wheel on the connecting shaft of the rotating roller drives the bearing shaft to rotate through a belt, and the bearing shaft drives the filter membrane to move, so that the filter membrane filters and removes impurities from the water used to clean the silicon wafers, thereby preventing impurities from flowing into the water tank, thereby improving the purity of the cleaning water, and thus improving the cleaning quality of the silicon wafers.

[0013] Preferably, a guide plate is arranged on the inner wall of the lower fixed plate above the filter membrane, and the guide plate is arranged to be a downward inclined structure, so that the water carrying impurities falling from the leakage hole of the conveyor belt falls on the filter membrane, and the water carrying impurities can be guided to the filter membrane through the guide plate, thereby preventing the water carrying impurities from falling from both sides of the filter membrane, fully filtering the impurities and improving the filtering effect.

[0014] Preferably, the bearing structure includes a bearing plate, a connecting hole and a bearing groove are arranged on the bearing plate, the column vertically passes through the connecting hole, and a spring is sleeved on the column between the bearing plate and the water tank, a through hole penetrating the bearing plate is arranged on the bearing plate at the bottom of the bearing groove, and a ball bearing is arranged on the bearing plate at the bottom of the bearing hole, the silicon wafer is placed in the bearing groove, the upper fixed plate drives the cleaning structure to descend under the action of the hydraulic cylinder, and pushes the silicon wafer to move downward with the bearing plate, so that the bottom surface of the silicon wafer contacts the cleaning structure on the lower fixed plate, and the upper and lower surfaces of the silicon wafer are cleaned simultaneously, and a ball bearing is arranged on the bearing plate at the bottom of the bearing hole, so that the silicon wafer can roll in the bearing groove, which is convenient for fully cleaning different positions of the upper and lower surfaces of the silicon wafer, thereby enhancing the cleaning quality of the silicon wafer, and through the spring on the column, after the silicon wafer is cleaned, the upper fixed plate drives the cleaning structure to rise, and the elastic force of the spring pushes the bearing plate and the cleaned silicon wafer upward, so that the silicon wafer is quickly separated from the cleaning structure on the lower fixed plate, which is convenient for the staff to remove the cleaned silicon wafer, thereby improving the work efficiency.

[0015] Preferably, the water delivery structure includes a water delivery pump, which is arranged on the outer wall of the water tank. A water suction pipe and a water delivery pipe are arranged on the water delivery pump. The water suction pipe is connected to the bottom of the water tank, and the water delivery pipe is connected to the water passing pipe through a connecting pipe. The water delivery pump sucks water out of the water tank through the water suction pipe, and injects water into the inner cavity of the upper fixed plate and the lower fixed plate through the water delivery pipe, the connecting pipe and the water passing pipe. Water flows are respectively sprayed from nozzles on the inner walls of the upper fixed plate and the lower fixed plate to spray water on the upper and lower surfaces of the silicon wafer, and the surfaces on both sides of the silicon wafer are cleaned simultaneously. The cleaned water is filtered and adsorbed before being sucked out by the water delivery pump again, thereby realizing the recycling of water, which not only reduces water waste, but also improves the cleaning efficiency of the silicon wafer.

[0016] Beneficial effects:

[0017] 1. The water delivery structure injects water into the inner cavity of the upper fixed plate and the lower fixed plate respectively, and the water is sprayed out from the nozzles on the inner walls of the upper fixed plate and the lower fixed plate respectively, spraying water on the upper and lower surfaces of the silicon wafer, cleaning both sides of the silicon wafer at the same time, thereby improving the cleaning efficiency of the silicon wafer;

[0018] 2. Place the silicon wafer in the bearing tank, and the upper fixed plate drives the cleaning structure to descend under the action of the hydraulic cylinder, pushing the silicon wafer to move downward with the bearing plate, so that the bottom surface of the silicon wafer contacts the cleaning structure on the lower fixed plate, and the upper and lower surfaces of the silicon wafer are cleaned simultaneously. Ball bearings are arranged on the bearing plate at the bottom of the bearing hole, so that the silicon wafer can roll in the bearing tank, which is convenient for fully cleaning different positions of the upper and lower surfaces of the silicon wafer, thereby enhancing the cleaning quality of the silicon wafer;

[0019] 3. The motor drives the rotating roller to rotate, and the driving wheel on the connecting shaft of the rotating roller drives the bearing shaft to rotate through the belt, and the bearing shaft drives the filter membrane to move, so that the filter membrane filters and removes impurities from the water used to clean the silicon wafers, preventing impurities from flowing into the water tank, thereby improving the purity of the cleaning water and thus improving the cleaning quality of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the utility model.

[0021] Figure 2 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the water tank and the lower fixing plate.

[0022] Figure 3 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the lower fixing plate and the bearing shaft.

[0023] Figure 4 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the bearing plate and the bearing groove.

[0024] Figure 5It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the bearing groove and the ball.

[0025] Figure 6 It is another schematic diagram of the implementation structure of the utility model.

[0026] In the figure: 1. water tank, 2. column, 3. lower fixed plate, 4. adsorption layer, 5. top plate, 6. hydraulic cylinder, 7. connecting plate, 8. piston rod, 9. upper fixed plate, 10. inner cavity, 11. nozzle, 12. bearing, 13. water pipe, 14. motor, 15. rotating roller, 16. transmission belt, 17. connecting shaft, 18. cleaning layer, 19. leakage hole, 20. bearing plate, 21. connecting hole, 22. bearing groove, 23. through hole, 24. ball, 25. spring, 26. bearing shaft, 27. filter membrane, 28. driven wheel, 29. belt, 30. driving wheel, 31. guide plate, 32. water pump, 33. suction pipe, 34. water pipe, 35. connecting pipe, 36. limiting ring. DETAILED DESCRIPTION

[0027] The present invention will be described in more detail below with reference to the accompanying drawings.

[0028] Embodiment 1:

[0029] As attached Figure 1-5 As shown: A cleaning structure for grinding silicon wafers, including a water tank 1, a driving structure, a cleaning structure, a bearing structure and a water supply structure. A column 2 and a lower fixed plate 3 are arranged on the top of the water tank 1. The driving structure is arranged on the column 2, and an upper fixed plate 9 is arranged on the driving structure. The cleaning structures are respectively arranged between the lower fixed plate 3 and the lower fixed plate 3 and between the upper fixed plate 9 and the upper fixed plate 9. The bearing structure is movably arranged on the column 2 between the lower fixed plate 3 and the upper fixed plate 9. The water supply structure is arranged on the outer wall of the water tank 1, and the water supply structure sprays water onto the cleaning structure.

[0030] Among them, a transversely structured adsorption layer 4 is provided in the water tank 1, and the adsorption layer 4 can adsorb impurities in the water tank 1 to prevent the water from sucking out impurities and spraying them onto the surface of the silicon wafer during circulation, thereby improving the cleaning effect of the silicon wafer.

[0031] The driving structure includes a top plate 5, a hydraulic cylinder 6, and a connecting plate 7. The top plate 5 is arranged at the top of the column 2, the hydraulic cylinder 6 is arranged on the top plate 5, a piston rod 8 is arranged on the hydraulic cylinder 6, the connecting plate 7 is connected to the piston rod 8, an upper fixed plate 9 is arranged on the connecting plate 7, an inner cavity 10 is arranged in the upper fixed plate 9 and the lower fixed plate 3, a nozzle 11 and a water pipe 13 connected with the inner cavity 10 are arranged on both sides of the upper fixed plate 9 and the lower fixed plate 3, a bearing 12 is arranged on the side walls of the upper fixed plate 9 and the lower fixed plate 3 where the nozzle 11 is located, and the water pipe 13 is connected with the water delivery structure. The hydraulic cylinder 6 and the piston rod 8 push the connecting plate 7 and the upper fixed plate 9 on the connecting plate 7 downward, so that the upper fixed plate 9 drives the cleaning structure to move downward, and the cleaning structure between the upper fixed plates 9 cleans the upper surface of the silicon wafer. The cleaning structure between the upper fixed plates 9 pushes the silicon wafer and the supporting plate 20 downward, so that the bottom surface of the silicon wafer contacts the lower fixed plate 3 and the cleaning structure between the lower fixed plate 3, and the bottom surface of the silicon wafer is cleaned, thereby achieving the purpose of cleaning the upper and lower surfaces of the silicon wafer at the same time, and improving the cleaning efficiency and cleaning effect of the silicon wafer.

[0032] The cleaning structure includes a motor 14, a rotating roller 15, and a conveyor belt 16. The motor 14 is respectively arranged on the upper fixed plate 9 and the lower fixed plate 3. Connecting shafts 17 are arranged at both ends of the rotating roller 15. The connecting shaft 17 is inserted into the bearings 12 on the upper fixed plate 9 and the lower fixed plate 3. The conveyor belt 16 is arranged between the rotating rollers 15 and the rotating rollers 15, and a cleaning layer 18 is arranged on the conveyor belt 16. The rotation direction of the conveyor belt 16 between the upper fixed plate 9 and the upper fixed plate 9 is set in the opposite direction to the rotation direction of the conveyor belt 16 between the lower fixed plate 3 and the lower fixed plate 3, and the conveyor belt 16 is arranged between the upper fixed plate 9 and the upper fixed plate 9. A leakage hole 19 is provided on 16, and the motor 14 drives the rotating roller 15 to rotate, and the rotating roller 15 drives the conveyor belt 16 and the cleaning layer 18 on the conveyor belt 16 to rotate, so that the cleaning layer 18 can clean the upper and lower surfaces of the silicon wafer at the same time, thereby improving the cleaning efficiency of the silicon wafer. The conveyor belts 16 of the cleaning structure on the upper and lower sides of the silicon wafer rotate in the opposite direction, so that the conveyor belts 16 on the upper and lower sides of the silicon wafer clean both sides of the silicon wafer at the same time, and the water after cleaning the silicon wafer carries impurities through the leakage hole 19 on the conveyor belt 16 and flows into the water tank 1, thereby realizing the recycling of water and reducing water waste.

[0033] Among them, a filtering structure is arranged between the lower fixed plates 3 and the lower fixed plates 3, and the filtering structure includes a bearing shaft 26 and a filtering membrane 27. Both ends of the bearing shaft 26 are inserted into the bearings 12 on the lower fixed plates 3, and a driven wheel 28 is arranged on one bearing shaft 26. Both ends of the filtering membrane 27 are respectively placed on the bearing shaft 26. A driving wheel 30 is arranged on the connecting shaft 17 of the rotating roller 15, and the driving wheel 30 is connected to the driven wheel 28 through a belt 29. A guide plate 31 is arranged on the inner wall of the lower fixed plate 3 above the filtering membrane 27, and the guide plate 31 is arranged to be inclined downward. During the operation of the cleaning structure between the lower fixed plates 3 and the lower fixed plates 3, the electric The machine 14 drives the rotating roller 15 to rotate, and the driving wheel 30 on the connecting shaft 17 of the rotating roller 15 drives the bearing shaft 26 to rotate through the belt 29, and the bearing shaft 26 drives the filter membrane 27 to move, so that the filter membrane 27 filters and removes impurities from the water used to clean the silicon wafers, thereby preventing impurities from flowing into the water tank 1, improving the purity of the cleaning water, and further improving the cleaning quality of the silicon wafers. The water carrying impurities falling from the leakage hole 19 of the conveyor belt 16 falls on the filter membrane 27, and the water carrying impurities can be guided to the filter membrane 27 through the guide plate 31, thereby preventing the water carrying impurities from falling from both sides of the filter membrane 27, and fully filtering the impurities to improve the filtering effect.

[0034] The bearing structure includes a bearing plate 20, on which a connection hole 21 and a bearing groove 22 are arranged. The column 2 vertically passes through the connection hole 21, and a spring 25 is sleeved on the column 2 between the bearing plate 20 and the water tank 1. A through hole 23 penetrating the bearing plate 20 is arranged on the bearing plate 20 at the bottom of the bearing groove 22, and a ball 24 is arranged on the bearing plate 20 at the bottom of the bearing hole. The silicon wafer is placed in the bearing groove 22, and the upper fixed plate 9 drives the cleaning structure to descend under the action of the hydraulic cylinder 6, pushing the silicon wafer to move downward with the bearing plate 20, so that the bottom surface of the silicon wafer is in contact with the cleaning structure on the lower fixed plate 3. The upper and lower surfaces of the silicon wafer are cleaned simultaneously by the spring 25 on the column 2. The spring 25 on the column 2 allows the upper and lower surfaces of the silicon wafer to be cleaned at the same time. A ball 24 is provided on the bearing plate 20 at the bottom of the bearing hole, so that the silicon wafer can roll in the bearing groove 22, which is convenient for fully cleaning different positions of the upper and lower surfaces of the silicon wafer and enhancing the cleaning quality of the silicon wafer. After the silicon wafer is cleaned, the upper fixed plate 9 drives the cleaning structure to rise, and the elastic force of the spring 25 pushes the bearing plate 20 and the cleaned silicon wafer upward, so that the silicon wafer can be quickly separated from the cleaning structure on the lower fixed plate 3, which is convenient for the staff to remove the cleaned silicon wafer and improves the work efficiency.

[0035] The water delivery structure includes a water delivery pump 32, which is arranged on the outer wall of the water tank 1. A water suction pipe 33 and a water delivery pipe 34 are arranged on the water delivery pump 32. The water suction pipe 33 is connected to the bottom of the water tank 1, and the water delivery pipe 34 is connected to the water pipe 13 through a connecting pipe 35. The water delivery pump 32 sucks water out of the water tank 1 through the water suction pipe 33, and injects water into the inner cavity 10 of the upper fixed plate 9 and the lower fixed plate 3 through the water delivery pipe 34, the connecting pipe 35, and the water pipe 13. The water flow is sprayed from the nozzles 11 on the inner walls of the upper fixed plate 9 and the lower fixed plate 3 respectively, and water is sprayed on the upper and lower surfaces of the silicon wafer to clean the surfaces of both sides of the silicon wafer at the same time. The cleaned water is filtered and adsorbed and then sucked out by the water delivery pump 32 again, thereby realizing the recycling of water flow, reducing water waste, and improving the cleaning efficiency of the silicon wafer.

[0036] Embodiment 2:

[0037] This embodiment is further described on the basis of the first embodiment. Figure 6 As shown: a cleaning structure for grinding silicon wafers, limit rings 36 are set at both ends of the connecting plate 7, and the column 2 is vertically passed through the limit ring 36. The connecting plate 7 drives the upper connecting plate 7 and the upper fixed plate 9 and the cleaning structure between the upper fixed plate 9 to move vertically under the action of the hydraulic cylinder 6. The column 2 and the limit ring 36 can limit the connecting plate 7 during the vertical movement process, avoiding lateral shaking of the connecting plate 7 during the vertical movement, thereby improving the stability of the cleaning structure during the silicon wafer cleaning process and enhancing the cleaning quality of the silicon wafer.

[0038] Working principle: Check whether the water pump 32, the motor 14 and the hydraulic cylinder 6 can work normally. After confirming that all parts can work normally, pour clean water into the water tank 1, place the silicon wafer to be cleaned in the bearing groove 22 on the bearing plate 20, start the water pump 32, and the water pump 32 sucks water out of the water tank 1 through the suction pipe 33, and injects water into the inner cavity 10 of the upper fixed plate 9 and the lower fixed plate 3 through the water pipe 34, the connecting pipe 35 and the water pipe 13. The water flows out from the nozzles 11 on the inner walls of the upper fixed plate 9 and the lower fixed plate 3, respectively, and sprays water on the upper and lower surfaces of the silicon wafer. Start the motor 14, and the motor 14 drives the rotating roller 15 to rotate. The rotating roller 15 drives the conveyor belt 16 and the cleaning layer 18 on the conveyor belt 16 to rotate. The conveyor belt 16 between the upper fixed plate 9 and the upper fixed plate 9 rotates in the same direction as the conveyor belt 1 between the lower fixed plate 3 and the lower fixed plate 3. 6 The rotation direction is reversed, and the hydraulic cylinder 6 is started. The hydraulic cylinder 6 and the piston rod 8 push the connecting plate 7 and the upper fixed plate 9 on the connecting plate 7 downward to move downward, so that the upper fixed plate 9 drives the cleaning structure to move downward, and the cleaning structure between the upper fixed plate 9 cleans the upper surface of the silicon wafer. The cleaning structure between the upper fixed plate 9 and the upper fixed plate 9 pushes the silicon wafer and the carrying plate 20 to descend, so that the bottom surface of the silicon wafer contacts the lower fixed plate 3 and the cleaning structure between the lower fixed plate 3, and the bottom surface of the silicon wafer is cleaned, so as to achieve the purpose of cleaning the upper and lower surfaces of the silicon wafer at the same time. After the silicon wafer is cleaned, the upper fixed plate 9 drives the cleaning structure to rise, and the elastic force of the spring 25 pushes the carrying plate 20 and the cleaned silicon wafer upward, so that the silicon wafer is quickly separated from the cleaning structure on the lower fixed plate 3, so that the staff can take out the cleaned silicon wafer conveniently to complete the cleaning of the silicon wafer.

[0039] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0041] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.

Claims

1. A cleaning structure for polishing silicon wafers, comprising a water tank, a driving structure, a cleaning structure, a bearing structure and a water delivery structure, characterized in that: The top of the water tank is provided with a column and a lower fixed plate, the driving structure is arranged on the column, and an upper fixed plate is arranged on the driving structure, the cleaning structure is respectively arranged between the lower fixed plate and the lower fixed plate and between the upper fixed plate and the upper fixed plate, the bearing structure is movably arranged on the column between the lower fixed plate and the upper fixed plate, the water delivery structure is arranged on the outer wall of the water tank, and the water delivery structure sprays water onto the cleaning structure.

2. The cleaning structure for polishing silicon wafer according to claim 1, characterized in that: An adsorption layer with a transverse structure is arranged in the water tank.

3. The cleaning structure for polishing silicon wafer according to claim 1, characterized in that: The driving structure includes a top plate, a hydraulic cylinder, and a connecting plate. The top plate is arranged on the top of the column, the hydraulic cylinder is arranged on the top plate, a piston rod is arranged on the hydraulic cylinder, the connecting plate is connected to the piston rod, and an upper fixing plate is arranged on the connecting plate.

4. The cleaning structure for polishing silicon wafer according to claim 1, characterized in that: The upper and lower fixed plates are both provided with inner cavities, and nozzles and water pipes connected to the inner cavities are respectively provided on both sides of the upper and lower fixed plates. Bearings are provided on the side walls of the upper and lower fixed plates where the nozzles are located, and the water pipes are connected to the water delivery structure.

5. The cleaning structure for polishing silicon wafer according to claim 1, characterized in that: The cleaning structure includes a motor, a rotating roller, and a transmission belt. The motor is respectively arranged on an upper fixed plate and a lower fixed plate. Connecting shafts are arranged at both ends of the rotating roller. The connecting shafts are inserted into bearings on the upper fixed plate and the lower fixed plate. The transmission belt is arranged between the rotating rollers, and a cleaning brush layer is arranged on the transmission belt.

6. The cleaning structure for polishing silicon wafer according to claim 5, characterized in that: The rotation direction of the conveyor belt between the upper fixing plates is set opposite to the rotation direction of the conveyor belt between the lower fixing plates, and a leakage hole is set on the conveyor belt.

7. The cleaning structure for polishing silicon wafer according to claim 5, characterized in that: A filtering structure is arranged between the lower fixed plate and the lower fixed plate, and the filtering structure includes a bearing shaft and a filtering membrane. Both ends of the bearing shaft are inserted into the bearings on the lower fixed plate, and a driven wheel is arranged on a bearing shaft. Both ends of the filtering membrane are respectively placed on the bearing shaft. A driving wheel is arranged on the connecting shaft of the rotating roller, and the driving wheel is connected to the driven wheel through a belt.

8. The cleaning structure for polishing silicon wafer according to claim 7, characterized in that: A guide plate is arranged on the inner wall of the lower fixed plate above the filter membrane, and the guide plate is arranged to be a downwardly inclined structure.

9. The cleaning structure for polishing silicon wafer according to claim 1, characterized in that: The bearing structure includes a bearing plate, on which a connecting hole and a bearing groove are arranged. The column vertically passes through the connecting hole, and a spring is sleeved on the column between the bearing plate and the water tank. A through hole penetrating the bearing plate is arranged on the bearing plate at the bottom of the bearing groove, and a ball bearing is arranged on the bearing plate at the bottom of the bearing hole.

10. The cleaning structure for polishing silicon wafer according to claim 1, characterized in that: The water delivery structure comprises a water delivery pump, which is arranged on the outer wall of the water tank. The water delivery pump is provided with a water suction pipe and a water delivery pipe, the water suction pipe is connected to the bottom of the water tank, and the water delivery pipe is connected to the water pipe through a connecting pipe.

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