Contact pin of test device for semiconductor device and test device
By designing the contact pins that form an angle at the connection between the locking flange and the intermediate body, the problem of unsolid fixation in the prior art is solved, and better fixation stability and test accuracy are achieved.
Patent Information
- Application Number
- CN202421540010.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-02
AI Technical Summary
In the prior art, the contact pin is not firmly fixed in the test device, resulting in rotation and position offset, reducing the rigidity and accuracy of the test.
A new contact pin is designed that creates an angle at the connection between the locking flange and the intermediate body to avoid the appearance of lower cuts, thus providing greater material surface area and better fixation stability.
Improve the stability and accuracy of tests by reducing secondary machining steps, reducing manufacturing costs, and improving the fixed stability of the contact pins.
Smart Images
Figure CN222800853U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a contact pin of a testing device for semiconductor devices and a testing device. Background Art
[0002] As part of the manufacturing process of semiconductor devices, a test device is required to test the semiconductor devices to evaluate their performance. During testing, device pins of a semiconductor device (eg, an integrated circuit, IC) must be electrically connected to a pair of contact pins of the test device.
[0003] A pair of contact pins forms a Kelvin connection, which allows for a Kelvin test. There are two main reasons for using the Kelvin test in IC testing: accurate resistance measurement and precise voltage drop measurement. The Kelvin test ensures accurate resistance measurement by eliminating errors caused by contact resistance and lead resistance.
[0004] Figure 1 FIG. 1 shows a cross-sectional view of a pair of contact pins in the prior art installed in an existing test device 13. Figure 1 As shown, a pair of contact pins includes a first contact pin 11 and a second contact pin 12, and the first contact pin 11 includes a cantilevered first upper body 111, a middle body 112, and a cantilevered lower body 113. A locking flange 114 is provided on the middle body 112 to ensure the balance and fixation of the first contact pin 11. The first contact pin 11 and the second contact pin 12 have similar structures.
[0005] Due to the limitation of manufacturing process, a wire cutting machine is usually used to form the locking flange 114, which will leave a radius at the connection between the locking flange 114 and the middle body 112, so that the first contact pin 11 is not fixed firmly in the test device 13. The current practice is to cut semicircular lower cuts 115a, 115b in the 90-degree area at the connection between the locking flange 114 and the middle body 112 to avoid the radius of the wire cutting that may cause engagement with the corresponding plastic housing groove. Similarly, lower cuts 116a, 116b are also formed on the second contact pin 12. This practice is practical in making the test device 13 work properly, but over time, these lower cuts will cause the first contact pin 11 and the second contact pin 12 to rotate and shift their test positions, thereby reducing rigidity and causing test failures. Utility Model Content
[0006] In order to solve the above problems in the prior art, in a first aspect, the utility model provides a contact pin for a test device of a semiconductor device, the contact pin comprising:
[0007] Cantilevered upper body;
[0008] an intermediate body connected to the upper body, wherein a locking flange is provided on the intermediate body; and
[0009] A cantilevered lower body connected to the intermediate body;
[0010] Wherein, the connection between the locking flange and the intermediate body forms an angle.
[0011] Preferably, the connection between the locking flange and the intermediate body is in a right angle shape.
[0012] Preferably, the upper body is in any one of an angular shape, an arched shape, a stepped shape, and a chamfered shape.
[0013] Preferably, the upper body has an upper end portion for contacting the semiconductor device, and the lower body has an extension portion connected to a load board of the test device.
[0014] In a second aspect, the utility model provides a testing device for a semiconductor device, the testing device comprising: a pair of contact pins according to the first aspect, the pair of contact pins being connected to the testing device.
[0015] Preferably, the testing device comprises a first holder and a second holder,
[0016] The first retainer is provided with a first fixing recess for receiving a locking flange on one of the pair of contact pins.
[0017] The second retainer is provided with a second fixing recess for receiving a locking flange on the other contact pin of the pair of contact pins.
[0018] Preferably, one of the pair of contact pins is used as a forcing pin, and the other contact pin is used as a sensing pin.
[0019] In the present invention, no undercut occurs at the connection between the locking flange on the contact pin and the middle body, so the middle body provided with the locking flange provides more material surface area, so that the contact pin has better fixed stability without rotation or functional problems of offset position. Further, due to the fixed stability of the contact pin, the test stability can be improved.
[0020] In the utility model, a pair of contact pins can be locked in appropriate positions in the test device by using respective locking flanges on the pair of contact pins, so that the Kelvin gap can be maintained between the upper ends of the upper bodies of the two contact pins and ensured to be in place together with the semiconductor device.
[0021] In the utility model, the locking flange is formed on the middle body by adopting processes such as electroforming, stamping, and molding, and no undercut will appear at the connection between the locking flange and the middle body. Therefore, it is not necessary to spend a lot of manpower and a long time on secondary processing to remove the undercut that appears in the prior art. Therefore, no additional secondary processing is required to increase the extra workload, thereby reducing the manufacturing cost.
[0022] In the present invention, the area of the locking flange is not reduced, so it has a stronger locking force. In this way, during the test process, when the semiconductor device begins to contact and compress the contact pins, the stronger locking force also helps to ensure the fixed position of the two contact pins, thereby maintaining the Kelvin gap between the upper ends of the upper bodies of the two contact pins.
[0023] Other objects and advantages will be more fully apparent from the following disclosure and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 A cross-sectional view showing a pair of contact pins installed in a test device in the prior art.
[0025] Figure 2 A three-dimensional view of an assembled testing device according to an embodiment of the present utility model is shown.
[0026] Figure 3 A top view of an assembled testing device according to an embodiment of the present invention is shown.
[0027] Figure 4 A disassembled diagram of a testing device according to an embodiment of the utility model is shown.
[0028] Figure 5 A schematic diagram of a first contact pin according to an embodiment of the utility model is shown.
[0029] Figure 6 A schematic diagram of a second contact pin according to an embodiment of the utility model is shown.
[0030] Figure 7 A schematic diagram of an assembled testing device according to an embodiment of the utility model is shown.
[0031] Figure 8 A schematic diagram of a first holder is shown.
[0032] Fig. 9 A schematic diagram of the second holder is shown.
[0033] Fig.10 A schematic diagram showing the first retainer and the second retainer being assembled together is shown.
[0034] Fig.11 Another schematic diagram of an assembled testing device according to an embodiment of the utility model is shown.
[0035] Fig.12 A schematic diagram of an arched upper body according to an embodiment of the utility model is shown.
[0036] Reference numerals
[0037] Existing test equipment 13
[0038] First contact pin 11
[0039] Second contact pin 12
[0040] The first upper body 111
[0041] Intermediate Subject 112
[0042] Lower body 113
[0043] Locking flange 114
[0044] Lower cutouts 115a, 115b, 116a, 116b
[0045] Test device 200
[0046] Device pin 110
[0047] Alignment Plate 201
[0048] Bottom shell 202
[0049] Cover 203
[0050] First retainer 204
[0051] Second holder 205
[0052] First contact pin 206
[0053] Second contact pin 207
[0054] Upper body 51, 61
[0055] Intermediate entities 52, 62
[0056] Lower body 53, 63
[0057] Locking flange 54, 64
[0058] First side 541, 641
[0059] Second side 541, 642
[0060] Inside edge 521, 621
[0061] Extension 531, 631
[0062] Upper end 511, 611
[0063] first fixing recess 81
[0064] Second fixing recess 82 DETAILED DESCRIPTION
[0065] The embodiments of the present utility model are described below with reference to the accompanying drawings.
[0066] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices consistent with some aspects of the present application as detailed in the appended claims.
[0067] The terms used in this application are only for the purpose of describing specific embodiments, and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in this article refers to and includes any or all possible combinations of one or more associated listed items. "Include" or "comprising" and similar words mean that the elements or objects appearing in front of "include" or "comprising" cover the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects.
[0068] It should be noted that the following detailed description is directed to contact pins of a test apparatus for a semiconductor device and the test apparatus, and is not limited to any particular size or configuration, but rather a variety of sizes and configurations within the general range described below.
[0069] Figure 2 FIG. 2 shows a perspective view of an assembled test device 200 according to an embodiment of the present invention. Figure 3 FIG. 2 shows a top view of the assembled test device 200 according to an embodiment of the present invention. Figure 4 FIG. 2 shows a disassembled diagram of a test device 200 according to an embodiment of the present utility model. The test device 200 is used to test a device pin 110 ( Fig.11 As shown) for testing. Figures 2 to 4As shown, the testing device 200 includes an alignment plate 201, a bottom shell 202, a cover plate 203, a first retainer 204 and a second retainer 205 located between the cover plate 203 and the bottom shell 202, and a plurality of pairs of contact pins, each pair of contact pins including a first contact pin 206 and a second contact pin 207, all first contact pins 206 are mounted on the first retainer 204, and all second contact pins 207 are mounted on the second retainer 205.
[0070] Figure 5 FIG. 2 shows a schematic diagram of a first contact pin 206 according to an embodiment of the present utility model. Figure 6 FIG. 2 is a schematic diagram of a second contact pin 207 according to an embodiment of the present invention. The structures of the first contact pin 206 and the second contact pin 207 are substantially the same.
[0071] like Figure 5 As shown, the first contact pin 206 includes a cantilever upper body 51, a middle body 52 connected to the upper body 51, and a cantilever lower body 53 connected to the middle body 52. The upper body 51 and the lower body 53 are cantilevered, so by means of the elasticity (or flexibility) of the cantilever, the upper body 51 and the lower body 53 can be bent without breaking or deforming.
[0072] A locking flange 54 is provided on the middle body 52. The connection between the locking flange 54 and the middle body 52 forms an angle. Specifically, the locking flange 54 has a first side edge 541 and a second side edge 541 opposite to each other, and the middle body 52 has an inner side edge 521, and the locking flange 54 is provided on the inner side edge 521.
[0073] The intersection of the first side 541 and the inner side 521 is the connection between the locking flange 54 and the middle body 52, and an angle A1 is formed between the first side 541 and the inner side 521. Similarly, the intersection of the second side 542 and the inner side 521 is the connection between the locking flange 54 and the middle body 52, and an angle A2 is formed between the second side 542 and the inner side 521.
[0074] Preferably, the angle A1 plus A2 is generally 180 degrees, wherein the angles of A1 and A2 are not less than 50 degrees.
[0075] Preferably, the connection between the locking flange 54 and the middle body 52 is in a right angle shape, that is, the angle A1 and the angle A2 are both right angles. In other words, the connection between the locking flange 54 and the middle body 52 does not have the undercut (such as the undercut in the prior art) Figure 1 As shown in FIG. 1 , the intermediate body 52 provided with the locking flange 54 provides more material surface area, so that the first contact pin 206 has better fixing stability.
[0076] The locking flange 54 may be formed on the intermediate body 52 by, for example, electroforming, stamping, molding, or the like.
[0077] The upper body 51 may be in any one of an angular shape, an arched shape, a stepped shape, and a chamfered shape, for example. Fig.12 A schematic diagram of an arched upper body 51 according to an embodiment of the present utility model is shown.
[0078] like Figure 5 As shown, the upper body 51 has an upper end portion 511 for contacting the semiconductor device, and the lower body 53 has an extension portion 531 connected to a load board (not shown) of the test device 200 for establishing connection between the first contact pin 206 and the load board.
[0079] The lower body 53 is used for preloading function, and the flatness variation and warping of the load plate can be solved by the lower body 53. The extension part 531 extends from the bottom shell 202 for preloading, so as to provide sufficient contact insurance for the load plate.
[0080] like Figure 6 As shown, similar to the structure of the first contact pin 206, the second contact pin 207 includes a cantilevered upper body 61, an intermediate body 62 connected to the upper body 61, and a cantilevered lower body 63 connected to the intermediate body 62. The upper body 61 and the lower body 63 are cantilevered, so with the help of the elasticity (or flexibility) of the cantilever, the upper body 61 and the lower body 63 can be bent without breaking or deforming.
[0081] A locking flange 64 is provided on the middle body 62. The connection between the locking flange 64 and the middle body 62 forms an angle. Specifically, the locking flange 64 has a first side edge 641 and a second side edge 642 opposite to each other, and the middle body 62 has an inner side edge 621, and the locking flange 64 is provided on the inner side edge 621.
[0082] The intersection of the first side 641 and the inner side 621 is the connection between the locking flange 64 and the middle body 62, and an angle B1 is formed between the first side 641 and the inner side 621. Similarly, the intersection of the second side 642 and the inner side 621 is the connection between the locking flange 64 and the middle body 62, and an angle B2 is formed between the second side 642 and the inner side 621.
[0083] Preferably, the angle B1 plus B2 is generally 180 degrees, wherein the angles of B1 and B2 are not less than 50 degrees.
[0084] Preferably, the connection between the locking flange 64 and the middle body 62 is in a right angle shape, that is, the angle B1 and the angle B2 are both right angles. In other words, the connection between the locking flange 64 and the middle body 62 does not have the undercut (such as Figure 1As shown), the intermediate body 62 provided with the locking flange 64 provides more material surface area, so that the second contact pin 207 has better fixing stability.
[0085] Similarly, the locking flange 64 may be formed on the intermediate body 62 by processes such as electroforming, stamping, and molding.
[0086] The upper body 61 may be in any one of a square shape, an arch shape, a stepped shape, and a chamfered shape, for example. Fig.12 A schematic diagram of an arched upper body 61 according to an embodiment of the present utility model is shown.
[0087] like Figure 6 As shown, the upper body 61 has an upper end portion 611 for contacting the semiconductor device, and the lower body 63 has an extension portion 631 connected to a load board (not shown) of the test device 200 for establishing connection between the second contact pin 207 and the load board.
[0088] The lower body 63 is used for preloading function, and the flatness variation and warping of the load plate can be solved by the lower body 63. The extension part 631 extends from the bottom shell 202 for preloading, so as to provide sufficient contact insurance for the load plate.
[0089] Figure 7 A schematic diagram of an assembled test device 200 according to an embodiment of the present utility model is shown. Figure 7 As shown, the testing device 200 includes a first holder 204 and a second holder 205 , the first contact pins 206 are mounted on the first holder 204 , and the second contact pins 206 are mounted on the second holder 205 .
[0090] Figure 8 shows a schematic diagram of the first retainer 204, Fig. 9 shows a schematic diagram of the second holder 205, Fig.10 FIG. 2 is a schematic diagram showing the first retainer 204 and the second retainer 205 being assembled together.
[0091] like Figure 8 As shown, the first retainer 204 is provided with a first fixing recess 81 for receiving the locking flange 54 on the first contact pin 206 so as to install and fix the first contact pin 206 on the first retainer 204. It can be understood that the first retainer 204 is provided with a plurality of first fixing recesses 81, each of which receives one first contact pin 206.
[0092] like Fig. 9As shown, the second retainer 205 is provided with a second fixing recess 82 for receiving the locking flange 64 on the second contact pin 207 so as to install and fix the second contact pin 207 on the second retainer 205. It can be understood that the second retainer 205 is provided with a plurality of second fixing recesses 82, each of which receives a second fixing recess 82.
[0093] like Fig.10 As shown, the second retainer 205 is arranged (assembled) on the first retainer 204. Two second retainers 205 can be arranged on the first retainer 204. It can be understood that the multiple first fixing recesses 81 on the first retainer 204 and the multiple second fixing recesses 82 on the second retainer 205 correspond one to one.
[0094] Fig.11 FIG. 2 shows another schematic diagram of the assembled test device 200 according to an embodiment of the present invention. Figure 7 , Fig.10 and Fig.11 The first contact pin 206 is located on the inner side of the second contact pin 207, so the first contact pin 206 is also called an inner contact pin, and the second contact pin 207 is also called an outer contact pin.
[0095] It is understood that in some configurations of the test apparatus 200, it is necessary to connect the device pins 110 ( Fig.11 Two separate electrical connections are established between the first and second contact pins 206 and 207, also known as Kelvin connections. The Kelvin connection includes a force pin and a sense pin. The force pin is used to transmit a high current (or voltage) to the device pin 110, and then the sense pin measures the feedback current (or voltage) from the semiconductor device. It can be understood that the force pin and the sense pin can be implemented by a pair of contact pins in the utility model. For example, the force pin is implemented by the first contact pin 206, and the sense pin is implemented by the second contact pin 207.
[0096] In the present invention, the locking flange on the contact pin forms an angle with the connection of the middle body without an undercut, so the middle body provided with the locking flange provides more material surface area, so that the contact pin has better fixed stability without rotation or functional problems of offset position. Further, due to the fixed stability of the contact pin, the test stability can be improved.
[0097] In the utility model, a pair of contact pins can be locked in appropriate positions in the test device by using respective locking flanges on the pair of contact pins, so that the Kelvin gap can be maintained between the upper ends of the upper bodies of the two contact pins and ensured to be in place together with the semiconductor device.
[0098] In the utility model, the locking flange is formed on the middle body by adopting processes such as electroforming, stamping, and molding, and no undercut will appear at the connection between the locking flange and the middle body. Therefore, it is not necessary to spend a lot of manpower and a long time on secondary processing to remove the undercut that appears in the prior art. Therefore, no additional secondary processing is required to increase the extra workload, thereby reducing the manufacturing cost.
[0099] In the present invention, the area of the locking flange is not reduced, so it has a stronger locking force. In this way, during the test process, when the semiconductor device begins to contact and compress the contact pins, the stronger locking force also helps to ensure the fixed position of the two contact pins, thereby maintaining the Kelvin gap between the upper ends of the upper bodies of the two contact pins.
[0100] Although several particularly preferred embodiments of the present invention have been described and illustrated, it is obvious to those skilled in the art that various changes and modifications can be made without departing from the scope of the present invention. Therefore, the following claims are intended to include such changes, modifications and application areas within the scope of the present invention.
Claims
1. A contact pin for a test device of a semiconductor device, characterized in that: The contact pins include: Cantilevered upper body; an intermediate body connected to the upper body, wherein a locking flange is provided on the intermediate body; and A cantilevered lower body connected to the intermediate body; Wherein, the connection between the locking flange and the intermediate body forms an angle.
2. The contact pin according to claim 1, characterized in that: The connection between the locking flange and the intermediate body is in a right angle shape.
3. The contact pin according to claim 1, characterized in that: The upper body is in any shape of an angle, an arch, a step, or a chamfer.
4. The contact pin according to claim 1, characterized in that: The upper body has an upper end portion for contacting the semiconductor device, and the lower body has an extension portion connected to a load board of the test device.
5. A testing device for a semiconductor device, characterized in that: The testing device comprises: A pair of contact pins according to any one of claims 1 to 4, the pair of contact pins being connected to the testing device.
6. The testing device according to claim 5, characterized in that: The testing device comprises a first holder and a second holder, The first retainer is provided with a first fixing recess for receiving a locking flange on one of the pair of contact pins. The second retainer is provided with a second fixing recess for receiving a locking flange on the other contact pin of the pair of contact pins.
7. The testing device according to claim 5 or 6, characterized in that: One of the pair of contact pins is used as a forcing pin, and the other contact pin is used as a sensing pin.