Integrally-formed chip inductor adopting condensation cooling

Abstract

The integrally-formed chip inductor comprises a chip base, an upper closing cover and a liquid inlet head, the two sides of the lower end of the chip base are fixedly connected with conductive contacts installed at preset positions of a target circuit board, the top of the upper end of the chip base is in interference connection with the upper closing cover, and the liquid inlet head is connected with the upper closing cover. A liquid inlet head is inserted into one side of the upper closing cover, the liquid inlet head is communicated with a condensing coil for heat exchange treatment along the middle of the upper closing cover, the output end of the condensing coil is communicated with a liquid outlet head, and through holes are formed in the patch base and the upper closing cover along the liquid outlet head and the liquid inlet head. When the integrally-formed chip inductor adopting condensation cooling is used, the whole sealing ring serves as a sealing protection part of the chip base and the upper closing cover, interference connection is adopted between the chip base and the upper closing cover, a gap between the chip base and the upper closing cover can be reduced, and the possibility that dust enters from the gap is prevented; and the rationality and the sealing performance of the whole structure are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of patch inductors, in particular to an integrated patch inductor that adopts condensation cooling. Background Art

[0002] Chip inductors, also known as power inductors, high current inductors and surface mount high power inductors. With the characteristics of miniaturization, high quality, high energy storage and low resistance, chip inductors are electromagnetic induction components wound with insulated wires. They are commonly used inductance components. The role of chip inductors: passing DC and blocking AC. This is a simple statement. It isolates AC signals, filters them, or forms a resonant circuit with capacitors, resistors, etc. Tuning and frequency selection inductors: The inductor coil and capacitor in parallel can form an LC tuning circuit.

[0003] The present application discloses a chip inductor (CN214505184U). The chip inductor comprises: a magnetic base, a magnetic cover, a magnetic core, a plurality of pads arranged on the bottom surface of the magnetic base, and a coil. The magnetic base comprises a body and an extension portion arranged on both sides of the body, the body and the extension portion form a first stepped structure; the magnetic cover and the horizontal step surface located on the extension portion and the vertical step surface located on the body in the first stepped structure are joined, and a receiving space is defined between the magnetic cover and the magnetic base; the magnetic core is arranged on the body and is located in the receiving space; the coil is wound on the outer surface of the magnetic core, and the two ends of the coil are welded on a plurality of pads. Therefore, the shielding effect and electrical characteristics of the chip inductor are enhanced by the full contact between the magnetic cover and the magnetic base. In addition, the magnetic cover and the magnetic base are easy to assemble, which can improve the production efficiency of the chip inductor. However, when the user installs it at a preset position on the target circuit board, the target circuit board is heated up due to the limited heat dissipation performance of the inductor during use, thereby affecting the use of various electronic components on the entire target circuit board.

[0004] To this end, we propose an integrated chip inductor that uses condensation cooling. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated molded chip inductor using condensation cooling to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated molded chip inductor using condensation cooling, comprising a chip base, an upper cover and a liquid inlet head, the lower end of the chip base is fixedly connected with conductive contacts installed at preset positions of the target circuit board on both sides, the upper end of the chip base is interference-connected with the upper cover, one side of the upper cover is inserted with a liquid inlet head, the liquid inlet head is connected with a condensing coil for heat exchange treatment along the middle of the upper cover, and the output end of the condensing coil is connected with a liquid outlet head, the chip base and the upper cover are provided with through holes along the liquid outlet head and the liquid inlet head, and the liquid outlet head and the liquid inlet head are respectively connected with sealing rings with the through holes on the chip base and the upper cover.

[0007] Furthermore, a sealing ring is attached to the connection between the patch base and the upper cover.

[0008] Furthermore, a heat sink is attached to the upper surface of the upper cover, and a ceramic column is fixed to the lower end of the center of the upper cover.

[0009] Furthermore, an inductor is sleeved on the outer wall of the ceramic column, and the pin end of the inductor is connected to the conductive contact.

[0010] Furthermore, the input end of the liquid inlet head is connected to a delivery pump, and the delivery pump delivers the cooling water in the coolant storage tank to the liquid inlet head.

[0011] Furthermore, the output end of the liquid outlet head is connected to the coolant storage tank through a connecting nut, and a cooling fan is provided at the coolant storage tank, and the liquid inlet head, liquid outlet head, condensation coil and delivery pump, coolant storage tank and cooling fan constitute a condensation cooling system.

[0012] Compared with the prior art, the beneficial effect of the utility model is that when the one-piece molded chip inductor using condensation cooling is used, the entire sealing ring serves as a sealing protection component between the chip base and the upper cover, and adopts an interference fit connection between the chip base and the upper cover respectively, which can reduce the gap between the chip base and the upper cover, prevent the possibility of dust entering through the gap, and ensure the rationality and sealing of the overall structure.

[0013] The ceramic column is used as a fixed limiter for the inductor, which can effectively meet the need to firmly fix the inductor on the patch base. At the same time, the pin end of the entire inductor is connected to the conductive contact to ensure that when current flows through, a strong magnetic field will be formed at both ends of the inductor. Due to the effect of electromagnetic induction, it will hinder the change of current and meet the function of inductor filtering.

[0014] The entire liquid inlet head, liquid inlet head, connecting nut, sealing ring, condensing coil and liquid outlet head constitute a condensing cooling system. By pumping the coolant into the condensing coil through the coolant storage tank, the temperature inside the patch base and the upper cover is reduced by heat exchange, thereby achieving the demand for lowering the inductor temperature, satisfying the heat conduction of the inductor to the heating element, and ensuring that the entire inductor can effectively perform filtering operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the internal structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the three-dimensional structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the condensing coil and inductance distribution structure of the utility model;

[0018] Figure 4 It is a side structural schematic diagram of the utility model.

[0019] In the figure: 1. SMD base; 11. Sealing ring; 2. Conductive contact; 3. Upper cover; 31. Heat sink; 32. Ceramic column; 4. Liquid inlet head; 5. Inductor; 41. Connecting nut; 42. Sealing ring; 43. Condensation coil; 44. Liquid outlet head. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-4The utility model provides a technical solution: an integrated molded chip inductor using condensation cooling, comprising a chip base 1, an upper cover 3 and a liquid inlet head 4, the lower end of the chip base 1 is fixedly connected with conductive contacts 2 installed at preset positions of the target circuit board on both sides, the upper end of the chip base 1 is interference connected with the upper cover 3, one side of the upper cover 3 is inserted with the liquid inlet head 4, the liquid inlet head 4 is connected with a condensing coil 43 for heat exchange treatment along the middle of the upper cover 3, and the output end of the condensing coil 43 is connected with a liquid outlet head 44, the chip base 1 and the upper cover Through holes are provided along the liquid outlet head 44 and the liquid inlet head 4, and the liquid outlet head 44 and the liquid inlet head 4 are respectively sleeved with sealing rings 42 on the through holes on the patch base 1 and the upper cover 3. A sealing ring 11 is attached to the connection between the patch base 1 and the upper cover 3. The entire sealing ring 11 serves as a sealing protection component for the patch base 1 and the upper cover 3, and is respectively connected between the patch base 1 and the upper cover 3 by interference fit, which can reduce the gap between the patch base 1 and the upper cover 3, prevent the possibility of dust entering from the gap, and ensure the rationality and sealing of the overall structure.

[0022] The upper surface of the upper cover 3 is attached with a heat sink 31, and a ceramic column 32 is fixed at the lower end of the circle center of the upper cover 3. The outer wall of the ceramic column 32 is sleeved with an inductor 5, and the pin end of the inductor 5 is connected to the conductive contact 2. The ceramic column 32 is used as a fixed limit component of the inductor 5, which can effectively meet the requirement of firmly fixing the inductor 5 on the patch base 1. At the same time, the pin end of the entire inductor 5 is connected to the conductive contact 2 to ensure that when current flows, a strong magnetic field will be formed at both ends of the inductor 5. Due to the effect of electromagnetic induction, the change of current will be hindered, satisfying the filtering effect of the inductor 5.

[0023] The input end of the liquid inlet head 4 is connected to a delivery pump, and the delivery pump delivers the cooling water in the coolant storage tank to the liquid inlet head 4, the output end of the liquid outlet head 44 is connected to the coolant storage tank through a connecting nut 41, and a cooling fan is provided at the coolant storage tank, and the liquid inlet head 4, the liquid outlet head 44, the condensing coil 43 and the delivery pump, the coolant storage tank and the cooling fan constitute a condensation cooling system. The entire liquid inlet head 4, the liquid inlet head 4, the connecting nut 41, the sealing ring 42, the condensing coil 43 and the liquid outlet head 44 constitute a condensation cooling system. By pumping the coolant into the coolant through the coolant storage tank In the condensation coil 43, the temperature in the patch base 1 and the upper cover 3 is reduced by heat exchange, so as to meet the requirement of reducing the temperature of the inductor 5 and ensure that the entire inductor 5 can effectively perform filtering operations. At the same time, the sealing ring 42, as a connecting sealing component of the condensation and cooling system, can effectively ensure the sealing strength of the entire condensation and cooling system, reduce the possibility of condensate seepage during use, and improve the rationality of the entire equipment. At the same time, the condensation and cooling system is a single component, which is connected to the condensation pipe through the connecting nut 41, so as to meet the needs of users and perform replacement and maintenance, providing convenience for users.

[0024] Working principle: For this type of one-piece molded chip inductor that uses condensation cooling, the chip inductor is first connected to the preset position of the target circuit board through the conductive contact 2. At this time, when the condensation cooling system needs to be started, it is only necessary to control the delivery pump to start, and the liquid in the coolant storage tank is delivered to the condensation coil 4 from the liquid inlet head 4 through pump pressure. The inductor 5 is cooled through heat energy exchange. At the same time, the sealing ring 42 serves as a connecting sealing component of the condensation cooling system, which can effectively ensure the sealing strength of the entire condensation cooling system and reduce the possibility of condensate seepage during use. At the same time, a sealing ring 11 is attached to the connection between the chip base 1 and the upper cover 3. The entire sealing ring 11 serves as a sealing protection component between the chip base 1 and the upper cover 3. It is connected between the chip base 1 and the upper cover 3 using an interference fit, which can reduce the gap between the chip base 1 and the upper cover 3 and prevent dust from entering through the gap.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated chip inductor using condensation cooling, comprising a chip base (1), an upper cover (3) and a liquid inlet head (4), characterized in that: Conductive contacts (2) mounted at preset positions on the target circuit board are fixedly connected to both sides of the lower end of the patch base (1); an upper cover (3) is interference-connected to the top of the upper end of the patch base (1); a liquid inlet head (4) is inserted into one side of the upper cover (3); the liquid inlet head (4) is connected to a condensing coil (43) for heat exchange treatment along the middle of the upper cover (3); and the output end of the condensing coil (43) is connected to a liquid outlet head (44); the patch base (1) and the upper cover (3) are provided with through holes along the liquid outlet head (44) and the liquid inlet head (4); and the liquid outlet head (44) and the liquid inlet head (4) are respectively sleeved with sealing rings (42) on the through holes on the patch base (1) and the upper cover (3).

2. The one-piece molded chip inductor using condensation cooling according to claim 1, characterized in that: A sealing ring (11) is attached to the connection between the patch base (1) and the upper cover (3).

3. The one-piece molded chip inductor using condensation cooling according to claim 1, characterized in that: A heat dissipation plate (31) is attached to the upper surface of the upper cover (3), and a ceramic column (32) is fixed to the lower end at the center of the upper cover (3).

4. The one-piece molded chip inductor using condensation cooling according to claim 3, characterized in that: An inductor (5) is sleeved on the outer wall of the ceramic column (32), and a pin end of the inductor (5) is connected to a conductive contact (2).

5. The one-piece molded chip inductor using condensation cooling according to claim 1, characterized in that: The input end of the liquid inlet head (4) is connected to a delivery pump, and the delivery pump delivers the cooling water in the coolant storage tank to the liquid inlet head (4).

6. The one-piece molded chip inductor using condensation cooling according to claim 1, characterized in that: The output end of the liquid outlet head (44) is connected to the coolant storage tank through a connecting nut (41), and a cooling fan is provided at the coolant storage tank. The liquid inlet head (4), the liquid outlet head (44), the condensing coil (43), the delivery pump, the coolant storage tank and the cooling fan form a condensation cooling system.

Images